JP3971434B2 - 半導体集積回路装置 - Google Patents
半導体集積回路装置 Download PDFInfo
- Publication number
- JP3971434B2 JP3971434B2 JP2005260074A JP2005260074A JP3971434B2 JP 3971434 B2 JP3971434 B2 JP 3971434B2 JP 2005260074 A JP2005260074 A JP 2005260074A JP 2005260074 A JP2005260074 A JP 2005260074A JP 3971434 B2 JP3971434 B2 JP 3971434B2
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- Prior art keywords
- die pad
- semiconductor chip
- lead
- lead frame
- integrated circuit
- Prior art date
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Description
(a)半導体チップを搭載可能な搭載面を有するダイパッドと、
(b)前記ダイパッドと一体に形成され、前記ダイパッドを支持する4本の吊りリードと、
(c)前記ダイパッドを囲むように配置され、前記4本の吊りリード間に配置された複数のインナーリードと、
(d)前記複数のインナーリードとそれぞれ一体に形成された複数のアウターリードと、
(e)集積回路と複数のボンディングパッドとが形成された主面と、前記主面と反対側の裏面とを有し、前記裏面が前記ダイパッドの搭載面に接着するように前記ダイパッドの搭載面上に搭載された四角形状の半導体チップと、
(f)前記半導体チップの複数のボンディングパッドと前記複数のインナーリードの先端部をそれぞれ電気的に接続する複数のワイヤと、
(g)前記半導体チップ、前記ダイパッド、前記複数のインナーリード及び前記複数のワイヤを封止する樹脂体と、を有し、
前記ダイパッドは、前記4本の吊りリードが交差する部分の幅を広くすることによって形成された4個の幅広部分からなるクロス形状を有し、
前記半導体チップは、前記4個の幅広部分のそれぞれに塗布された接着剤を介して前記ダイパッドの搭載面上に搭載され、
前記4個の幅広部分の各々の先端部は、前記ダイパッドの中心よりも前記半導体チップの角部側に位置し、前記半導体チップの裏面における周辺部よりも内側の領域において終端していることを特徴とするものである。
(1).本発明によれば、リフロー・クラック耐性の向上したLSIパッケージを提供することができる。
(2).本発明によれば、LSIパッケージの少量多品種化に対応したリードフレームを提供することができるので、LSIパッケージの製造コストを低減することができる。
1a リードフレーム
1b リードフレーム
2 半導体チップ
2b 半導体チップ
3 ダイパッド(チップ搭載部)
4 吊りリード
5 リード
5a インナーリード部
5b アウターリード部
6 テープ
6a フィルム
6b 接着剤
7 ダムバー
8 外枠
9 内枠
10 ガイド孔
11 バリ
12 プレス型
13 ヒートステージ
14 ツール
15 接着剤
16 ステージ
17 ディスペンサ
18 ノズル
19 シリンジ
20 小パッド
21 コレット
22 V溝
23 突起
24 ヒートステージ
25 ボンディングパッド
26 ワイヤ
27 ヒートステージ
28 逃げ溝
29 パッケージ本体
30 表面実装型半導体集積回路装置(QFP)
31 貫通孔
32 ワイヤボンディング領域(Agメッキ部)
33 ランドパッド
34 配線基板
36 半田
Claims (5)
- (a)半導体チップを搭載可能な搭載面を有するダイパッドと、
(b)前記ダイパッドと一体に形成され、前記ダイパッドを支持する4本の吊りリードと、
(c)前記ダイパッドを囲むように配置され、前記4本の吊りリード間に配置された複数のインナーリードと、
(d)前記複数のインナーリードとそれぞれ一体に形成された複数のアウターリードと、
(e)集積回路と複数のボンディングパッドとが形成された主面と、前記主面と反対側の裏面とを有し、前記裏面が前記ダイパッドの搭載面に接着するように前記ダイパッドの搭載面上に搭載された四角形状の半導体チップと、
(f)前記半導体チップの複数のボンディングパッドと前記複数のインナーリードの先端部をそれぞれ電気的に接続する複数のワイヤと、
(g)前記半導体チップ、前記ダイパッド、前記複数のインナーリード及び前記複数のワイヤを封止する樹脂体と、を有し、
前記ダイパッドは、前記4本の吊りリードが交差する部分の幅を広くすることによって形成された4個の幅広部分からなるクロス形状を有し、
前記半導体チップは、前記4個の幅広部分のそれぞれに塗布された接着剤を介して前記ダイパッドの搭載面上に搭載され、
前記4個の幅広部分の各々の先端部は、前記ダイパッドの中心よりも前記半導体チップの角部側に位置し、前記半導体チップの裏面における周辺部よりも内側の領域において終端していることを特徴とする半導体集積回路装置。 - 請求項1において、前記ダイパッドから平面的に露出する前記半導体チップの裏面は、前記樹脂体の一部と接触していることを特徴とする半導体集積回路装置。
- 請求項2において、前記4個の幅広部分の各々の先端部の外側において、前記半導体チップの裏面と前記樹脂体の一部が接触していることを特徴とする半導体集積回路装置。
- 請求項1において、前記複数のインナーリードの先端より下側に前記ダイパットが位置するように、前記4本の吊りリードの各々の所定個所にダウンセット加工が施されていることを特徴とする半導体集積回路装置。
- 請求項1において、前記幅広部分の先端部は、前記ダイパッドの中心よりも前記半導体チップの4角部側に位置する部分であることを特徴とする半導体集積回路装置。
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JP2005260074A JP3971434B2 (ja) | 1992-03-27 | 2005-09-08 | 半導体集積回路装置 |
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JP7111692 | 1992-03-27 | ||
JP32009892 | 1992-11-30 | ||
JP2005260074A JP3971434B2 (ja) | 1992-03-27 | 2005-09-08 | 半導体集積回路装置 |
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JP18526198A Division JP3730412B2 (ja) | 1992-03-27 | 1998-06-30 | 半導体集積回路装置およびその製造方法 |
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JP3971434B2 true JP3971434B2 (ja) | 2007-09-05 |
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JP5065784A Expired - Lifetime JP2891607B2 (ja) | 1992-03-27 | 1993-03-25 | 半導体集積回路装置の製造方法 |
JP18526198A Expired - Lifetime JP3730412B2 (ja) | 1992-03-27 | 1998-06-30 | 半導体集積回路装置およびその製造方法 |
JP10333269A Pending JPH11224928A (ja) | 1992-03-27 | 1998-11-24 | 半導体集積回路装置 |
JP33327098A Expired - Lifetime JP3710633B2 (ja) | 1992-03-27 | 1998-11-24 | 半導体集積回路装置 |
JP10333271A Pending JPH11224930A (ja) | 1992-03-27 | 1998-11-24 | 半導体集積回路装置 |
JP2000073486A Pending JP2000286374A (ja) | 1992-03-27 | 2000-03-16 | 半導体集積回路装置 |
JP2002128665A Expired - Lifetime JP3718181B2 (ja) | 1992-03-27 | 2002-04-30 | 半導体集積回路装置およびその製造方法 |
JP2002128666A Pending JP2002329830A (ja) | 1992-03-27 | 2002-04-30 | 半導体集積回路装置およびその製造方法 |
JP2002128664A Pending JP2002329832A (ja) | 1992-03-27 | 2002-04-30 | リードフレーム |
JP2003207142A Expired - Lifetime JP3685793B2 (ja) | 1992-03-27 | 2003-08-11 | 半導体集積回路装置の製造方法 |
JP2003207141A Expired - Lifetime JP3685792B2 (ja) | 1992-03-27 | 2003-08-11 | リードフレームの製造方法 |
JP2003207140A Expired - Lifetime JP3679101B2 (ja) | 1992-03-27 | 2003-08-11 | 半導体集積回路装置の製造方法 |
JP2005260074A Expired - Lifetime JP3971434B2 (ja) | 1992-03-27 | 2005-09-08 | 半導体集積回路装置 |
JP2005260075A Expired - Lifetime JP3971435B2 (ja) | 1992-03-27 | 2005-09-08 | 半導体集積回路装置 |
JP2005260073A Expired - Lifetime JP3971433B2 (ja) | 1992-03-27 | 2005-09-08 | 半導体集積回路装置の製造方法及び半導体集積回路装置 |
JP2007017962A Withdrawn JP2007110173A (ja) | 1992-03-27 | 2007-01-29 | 半導体集積回路装置 |
JP2007219888A Expired - Lifetime JP4246243B2 (ja) | 1992-03-27 | 2007-08-27 | 半導体集積回路装置 |
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JP5065784A Expired - Lifetime JP2891607B2 (ja) | 1992-03-27 | 1993-03-25 | 半導体集積回路装置の製造方法 |
JP18526198A Expired - Lifetime JP3730412B2 (ja) | 1992-03-27 | 1998-06-30 | 半導体集積回路装置およびその製造方法 |
JP10333269A Pending JPH11224928A (ja) | 1992-03-27 | 1998-11-24 | 半導体集積回路装置 |
JP33327098A Expired - Lifetime JP3710633B2 (ja) | 1992-03-27 | 1998-11-24 | 半導体集積回路装置 |
JP10333271A Pending JPH11224930A (ja) | 1992-03-27 | 1998-11-24 | 半導体集積回路装置 |
JP2000073486A Pending JP2000286374A (ja) | 1992-03-27 | 2000-03-16 | 半導体集積回路装置 |
JP2002128665A Expired - Lifetime JP3718181B2 (ja) | 1992-03-27 | 2002-04-30 | 半導体集積回路装置およびその製造方法 |
JP2002128666A Pending JP2002329830A (ja) | 1992-03-27 | 2002-04-30 | 半導体集積回路装置およびその製造方法 |
JP2002128664A Pending JP2002329832A (ja) | 1992-03-27 | 2002-04-30 | リードフレーム |
JP2003207142A Expired - Lifetime JP3685793B2 (ja) | 1992-03-27 | 2003-08-11 | 半導体集積回路装置の製造方法 |
JP2003207141A Expired - Lifetime JP3685792B2 (ja) | 1992-03-27 | 2003-08-11 | リードフレームの製造方法 |
JP2003207140A Expired - Lifetime JP3679101B2 (ja) | 1992-03-27 | 2003-08-11 | 半導体集積回路装置の製造方法 |
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JP2005260073A Expired - Lifetime JP3971433B2 (ja) | 1992-03-27 | 2005-09-08 | 半導体集積回路装置の製造方法及び半導体集積回路装置 |
JP2007017962A Withdrawn JP2007110173A (ja) | 1992-03-27 | 2007-01-29 | 半導体集積回路装置 |
JP2007219888A Expired - Lifetime JP4246243B2 (ja) | 1992-03-27 | 2007-08-27 | 半導体集積回路装置 |
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1993
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