WO2008114374A1 - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- WO2008114374A1 WO2008114374A1 PCT/JP2007/055474 JP2007055474W WO2008114374A1 WO 2008114374 A1 WO2008114374 A1 WO 2008114374A1 JP 2007055474 W JP2007055474 W JP 2007055474W WO 2008114374 A1 WO2008114374 A1 WO 2008114374A1
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- semiconductor device
- wirings
- die pad
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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Abstract
本発明に係る半導体装置は、ダイパッドやインナーリードを有するリードフレームと、ダイパッド上に搭載され、複数の配線が形成された中継部材と、中継部材上に平置きに搭載され、複数の配線に接続された第1,第2チップと、複数の配線と複数のインナーリードとの間をそれぞれ接続する複数の金属ワイヤと、これらを封止する樹脂とを備える。そして、ダイパッドの外形寸法は、中継部材の外形寸法よりも小さい。これにより、耐リフロー性を向上させ、かつ製造コストを低減することができる。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/055474 WO2008114374A1 (ja) | 2007-03-19 | 2007-03-19 | 半導体装置及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2007/055474 WO2008114374A1 (ja) | 2007-03-19 | 2007-03-19 | 半導体装置及びその製造方法 |
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Publication Number | Publication Date |
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WO2008114374A1 true WO2008114374A1 (ja) | 2008-09-25 |
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PCT/JP2007/055474 WO2008114374A1 (ja) | 2007-03-19 | 2007-03-19 | 半導体装置及びその製造方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100109148A1 (en) * | 2008-10-31 | 2010-05-06 | Renesas Technology Corp. | Semiconductor device |
JP2021015936A (ja) * | 2019-07-16 | 2021-02-12 | Tdk株式会社 | 電子部品パッケージ |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5056161A (ja) * | 1973-09-14 | 1975-05-16 | ||
JPS59172755A (ja) * | 1983-03-22 | 1984-09-29 | Toshiba Corp | リ−ドフレ−ム |
JPH0316162A (ja) * | 1989-03-31 | 1991-01-24 | Hitachi Ltd | 半導体装置およびその製造方法 |
JPH06132444A (ja) * | 1992-10-20 | 1994-05-13 | Hitachi Ltd | 半導体装置 |
JPH06216303A (ja) * | 1992-03-27 | 1994-08-05 | Hitachi Ltd | リードフレーム、その製造方法およびそれを用いた半導体集積回路装置の製造方法 |
JPH09260575A (ja) * | 1996-03-22 | 1997-10-03 | Mitsubishi Electric Corp | 半導体装置及びリードフレーム |
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2007
- 2007-03-19 WO PCT/JP2007/055474 patent/WO2008114374A1/ja active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5056161A (ja) * | 1973-09-14 | 1975-05-16 | ||
JPS59172755A (ja) * | 1983-03-22 | 1984-09-29 | Toshiba Corp | リ−ドフレ−ム |
JPH0316162A (ja) * | 1989-03-31 | 1991-01-24 | Hitachi Ltd | 半導体装置およびその製造方法 |
JPH06216303A (ja) * | 1992-03-27 | 1994-08-05 | Hitachi Ltd | リードフレーム、その製造方法およびそれを用いた半導体集積回路装置の製造方法 |
JPH06132444A (ja) * | 1992-10-20 | 1994-05-13 | Hitachi Ltd | 半導体装置 |
JPH09260575A (ja) * | 1996-03-22 | 1997-10-03 | Mitsubishi Electric Corp | 半導体装置及びリードフレーム |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100109148A1 (en) * | 2008-10-31 | 2010-05-06 | Renesas Technology Corp. | Semiconductor device |
JP2010109234A (ja) * | 2008-10-31 | 2010-05-13 | Renesas Technology Corp | 半導体装置 |
JP2021015936A (ja) * | 2019-07-16 | 2021-02-12 | Tdk株式会社 | 電子部品パッケージ |
JP7192688B2 (ja) | 2019-07-16 | 2022-12-20 | Tdk株式会社 | 電子部品パッケージ |
US11721618B2 (en) | 2019-07-16 | 2023-08-08 | Tdk Corporation | Electronic component package |
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