ATE550672T1 - Anordnungen für einen integrierten sensor - Google Patents
Anordnungen für einen integrierten sensorInfo
- Publication number
- ATE550672T1 ATE550672T1 AT10195143T AT10195143T ATE550672T1 AT E550672 T1 ATE550672 T1 AT E550672T1 AT 10195143 T AT10195143 T AT 10195143T AT 10195143 T AT10195143 T AT 10195143T AT E550672 T1 ATE550672 T1 AT E550672T1
- Authority
- AT
- Austria
- Prior art keywords
- arrangements
- substrate
- integrated sensor
- substrates
- base substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 6
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
- G01R15/207—Constructional details independent of the type of device used
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/07—Hall effect devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/82—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of the magnetic field applied to the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N52/00—Hall-effect devices
- H10N52/101—Semiconductor Hall-effect devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N52/00—Hall-effect devices
- H10N52/80—Constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/08—Circuits for altering the measuring range
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Measuring Magnetic Variables (AREA)
- Hall/Mr Elements (AREA)
- Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/335,944 US7768083B2 (en) | 2006-01-20 | 2006-01-20 | Arrangements for an integrated sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE550672T1 true ATE550672T1 (de) | 2012-04-15 |
Family
ID=38194995
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT10195147T ATE550673T1 (de) | 2006-01-20 | 2007-01-04 | Anordnungen für einen integrierten sensor |
AT10195145T ATE551609T1 (de) | 2006-01-20 | 2007-01-04 | Anordnungen für einen integrierten sensor |
AT10195143T ATE550672T1 (de) | 2006-01-20 | 2007-01-04 | Anordnungen für einen integrierten sensor |
AT07716253T ATE550671T1 (de) | 2006-01-20 | 2007-01-04 | Anordnungen für einen integrierten sensor |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT10195147T ATE550673T1 (de) | 2006-01-20 | 2007-01-04 | Anordnungen für einen integrierten sensor |
AT10195145T ATE551609T1 (de) | 2006-01-20 | 2007-01-04 | Anordnungen für einen integrierten sensor |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT07716253T ATE550671T1 (de) | 2006-01-20 | 2007-01-04 | Anordnungen für einen integrierten sensor |
Country Status (6)
Country | Link |
---|---|
US (6) | US7768083B2 (de) |
EP (4) | EP2290381B1 (de) |
JP (8) | JP5748393B2 (de) |
KR (1) | KR101366007B1 (de) |
AT (4) | ATE550673T1 (de) |
WO (1) | WO2007087121A2 (de) |
Families Citing this family (148)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7259545B2 (en) * | 2003-02-11 | 2007-08-21 | Allegro Microsystems, Inc. | Integrated sensor |
US7768083B2 (en) | 2006-01-20 | 2010-08-03 | Allegro Microsystems, Inc. | Arrangements for an integrated sensor |
US7687882B2 (en) * | 2006-04-14 | 2010-03-30 | Allegro Microsystems, Inc. | Methods and apparatus for integrated circuit having multiple dies with at least one on chip capacitor |
US7573112B2 (en) * | 2006-04-14 | 2009-08-11 | Allegro Microsystems, Inc. | Methods and apparatus for sensor having capacitor on chip |
US20070279053A1 (en) * | 2006-05-12 | 2007-12-06 | Taylor William P | Integrated current sensor |
US20080013298A1 (en) | 2006-07-14 | 2008-01-17 | Nirmal Sharma | Methods and apparatus for passive attachment of components for integrated circuits |
US7816772B2 (en) * | 2007-03-29 | 2010-10-19 | Allegro Microsystems, Inc. | Methods and apparatus for multi-stage molding of integrated circuit package |
US7564237B2 (en) * | 2007-10-23 | 2009-07-21 | Honeywell International Inc. | Integrated 3-axis field sensor and fabrication methods |
US8009442B2 (en) * | 2007-12-28 | 2011-08-30 | Intel Corporation | Directing the flow of underfill materials using magnetic particles |
US9823090B2 (en) | 2014-10-31 | 2017-11-21 | Allegro Microsystems, Llc | Magnetic field sensor for sensing a movement of a target object |
US7816905B2 (en) * | 2008-06-02 | 2010-10-19 | Allegro Microsystems, Inc. | Arrangements for a current sensing circuit and integrated current sensor |
US8093670B2 (en) * | 2008-07-24 | 2012-01-10 | Allegro Microsystems, Inc. | Methods and apparatus for integrated circuit having on chip capacitor with eddy current reductions |
US20100052424A1 (en) * | 2008-08-26 | 2010-03-04 | Taylor William P | Methods and apparatus for integrated circuit having integrated energy storage device |
US8486755B2 (en) * | 2008-12-05 | 2013-07-16 | Allegro Microsystems, Llc | Magnetic field sensors and methods for fabricating the magnetic field sensors |
US9222992B2 (en) | 2008-12-18 | 2015-12-29 | Infineon Technologies Ag | Magnetic field current sensors |
US20100188078A1 (en) * | 2009-01-28 | 2010-07-29 | Andrea Foletto | Magnetic sensor with concentrator for increased sensing range |
US20100193906A1 (en) * | 2009-02-05 | 2010-08-05 | Northern Lights Semiconductor Corp. | Integrated Circuit Package for Magnetic Capacitor |
US20110133732A1 (en) * | 2009-12-03 | 2011-06-09 | Allegro Microsystems, Inc. | Methods and apparatus for enhanced frequency response of magnetic sensors |
US20110210956A1 (en) * | 2010-02-26 | 2011-09-01 | Dev Alok Girdhar | Current sensor for a semiconductor device and system |
US8384183B2 (en) * | 2010-02-19 | 2013-02-26 | Allegro Microsystems, Inc. | Integrated hall effect element having a germanium hall plate |
US20110210411A1 (en) * | 2010-02-26 | 2011-09-01 | Sound Design Technologies, Ltd. | Ultra thin flip-chip backside device sensor package |
JP5067676B2 (ja) * | 2010-03-12 | 2012-11-07 | 株式会社デンソー | センサユニット及び、集磁モジュール |
US8760149B2 (en) | 2010-04-08 | 2014-06-24 | Infineon Technologies Ag | Magnetic field current sensors |
US20120007597A1 (en) * | 2010-07-09 | 2012-01-12 | Invensense, Inc. | Micromachined offset reduction structures for magnetic field sensing |
JP5964299B2 (ja) * | 2010-07-30 | 2016-08-03 | コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ | 磁気抵抗に基づき電圧又は電流を測定する集積化センサ |
DE102010047128A1 (de) * | 2010-09-30 | 2012-04-05 | Infineon Technologies Ag | Hallsensoranordnung zum redundanten Messen eines Magnetfeldes |
US8339134B2 (en) * | 2010-10-08 | 2012-12-25 | Allegro Microsystems, Inc. | Apparatus and method for reducing a transient signal in a magnetic field sensor |
JP5794777B2 (ja) | 2010-12-22 | 2015-10-14 | 三菱電機株式会社 | 半導体装置 |
US8975889B2 (en) | 2011-01-24 | 2015-03-10 | Infineon Technologies Ag | Current difference sensors, systems and methods |
US8963536B2 (en) | 2011-04-14 | 2015-02-24 | Infineon Technologies Ag | Current sensors, systems and methods for sensing current in a conductor |
US8907437B2 (en) * | 2011-07-22 | 2014-12-09 | Allegro Microsystems, Llc | Reinforced isolation for current sensor with magnetic field transducer |
US8952686B2 (en) | 2011-10-25 | 2015-02-10 | Honeywell International Inc. | High current range magnetoresistive-based current sensor |
US8629539B2 (en) | 2012-01-16 | 2014-01-14 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensor having non-conductive die paddle |
US8791533B2 (en) * | 2012-01-30 | 2014-07-29 | Broadcom Corporation | Semiconductor package having an interposer configured for magnetic signaling |
US10234513B2 (en) | 2012-03-20 | 2019-03-19 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with integral ferromagnetic material |
US9494660B2 (en) | 2012-03-20 | 2016-11-15 | Allegro Microsystems, Llc | Integrated circuit package having a split lead frame |
US9812588B2 (en) | 2012-03-20 | 2017-11-07 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with integral ferromagnetic material |
US9666788B2 (en) | 2012-03-20 | 2017-05-30 | Allegro Microsystems, Llc | Integrated circuit package having a split lead frame |
JP6243602B2 (ja) * | 2012-03-22 | 2017-12-06 | 旭化成エレクトロニクス株式会社 | 磁場方向計測装置及び回転角度計測装置 |
US10215550B2 (en) | 2012-05-01 | 2019-02-26 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensors having highly uniform magnetic fields |
US9588134B2 (en) * | 2012-05-10 | 2017-03-07 | Infineon Technologies Ag | Increased dynamic range sensor |
US9817078B2 (en) | 2012-05-10 | 2017-11-14 | Allegro Microsystems Llc | Methods and apparatus for magnetic sensor having integrated coil |
US9372242B2 (en) * | 2012-05-11 | 2016-06-21 | Memsic, Inc. | Magnetometer with angled set/reset coil |
CN102809665B (zh) * | 2012-06-04 | 2016-08-03 | 江苏多维科技有限公司 | 一种磁电阻齿轮传感器 |
JP5911065B2 (ja) * | 2012-06-12 | 2016-04-27 | 公立大学法人大阪市立大学 | 漏電検出装置 |
US20140005527A1 (en) * | 2012-06-29 | 2014-01-02 | General Electric Company | Method and system for dynamic referencing and registration used with surgical and interventional procedures |
US9482700B2 (en) * | 2013-01-20 | 2016-11-01 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Current detector to sense current without being in series with conductor |
US9164155B2 (en) | 2013-01-29 | 2015-10-20 | Infineon Technologies Ag | Systems and methods for offset reduction in sensor devices and systems |
CH707687B1 (de) * | 2013-03-08 | 2016-09-15 | Melexis Technologies Nv | Stromsensor. |
US10345343B2 (en) | 2013-03-15 | 2019-07-09 | Allegro Microsystems, Llc | Current sensor isolation |
US9190606B2 (en) * | 2013-03-15 | 2015-11-17 | Allegro Micosystems, LLC | Packaging for an electronic device |
US10725100B2 (en) | 2013-03-15 | 2020-07-28 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensor having an externally accessible coil |
US9411025B2 (en) | 2013-04-26 | 2016-08-09 | Allegro Microsystems, Llc | Integrated circuit package having a split lead frame and a magnet |
EP2997390B1 (de) | 2013-05-24 | 2017-09-06 | Allegro Microsystems, LLC | Magnetfeldsensor zum erfassen eines magnetfeldes in jeder richtung über schwellwerten |
US9733106B2 (en) | 2013-05-24 | 2017-08-15 | Allegro Microsystems, Llc | Magnetic field sensor to detect a magnitude of a magnetic field in any direction |
JP6116061B2 (ja) * | 2013-07-16 | 2017-04-19 | 横河電機株式会社 | 電流センサ |
US10495699B2 (en) | 2013-07-19 | 2019-12-03 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensor having an integrated coil or magnet to detect a non-ferromagnetic target |
US10145908B2 (en) | 2013-07-19 | 2018-12-04 | Allegro Microsystems, Llc | Method and apparatus for magnetic sensor producing a changing magnetic field |
US9810519B2 (en) | 2013-07-19 | 2017-11-07 | Allegro Microsystems, Llc | Arrangements for magnetic field sensors that act as tooth detectors |
JP5945976B2 (ja) * | 2013-12-06 | 2016-07-05 | トヨタ自動車株式会社 | バスバモジュール |
JP6123687B2 (ja) * | 2014-01-29 | 2017-05-10 | 株式会社デンソー | 磁気センサ |
US9605983B2 (en) | 2014-06-09 | 2017-03-28 | Infineon Technologies Ag | Sensor device and sensor arrangement |
US9823168B2 (en) | 2014-06-27 | 2017-11-21 | Infineon Technologies Ag | Auto tire localization systems and methods utilizing a TPMS angular position index |
US10091594B2 (en) | 2014-07-29 | 2018-10-02 | Cochlear Limited | Bone conduction magnetic retention system |
US9720054B2 (en) | 2014-10-31 | 2017-08-01 | Allegro Microsystems, Llc | Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element |
US10712403B2 (en) | 2014-10-31 | 2020-07-14 | Allegro Microsystems, Llc | Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element |
US9719806B2 (en) | 2014-10-31 | 2017-08-01 | Allegro Microsystems, Llc | Magnetic field sensor for sensing a movement of a ferromagnetic target object |
US9823092B2 (en) | 2014-10-31 | 2017-11-21 | Allegro Microsystems, Llc | Magnetic field sensor providing a movement detector |
US9857398B2 (en) | 2015-01-30 | 2018-01-02 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Inter-circuit board connector with current sensor |
JP6934815B2 (ja) | 2015-04-10 | 2021-09-15 | アレグロ・マイクロシステムズ・エルエルシー | ホール効果検出素子 |
DE102015007190B4 (de) * | 2015-06-09 | 2017-03-02 | Micronas Gmbh | Magnetfeldmessvorrichtung |
US10130807B2 (en) | 2015-06-12 | 2018-11-20 | Cochlear Limited | Magnet management MRI compatibility |
US20160381473A1 (en) | 2015-06-26 | 2016-12-29 | Johan Gustafsson | Magnetic retention device |
US10917730B2 (en) * | 2015-09-14 | 2021-02-09 | Cochlear Limited | Retention magnet system for medical device |
US10411498B2 (en) | 2015-10-21 | 2019-09-10 | Allegro Microsystems, Llc | Apparatus and methods for extending sensor integrated circuit operation through a power disturbance |
US9976876B2 (en) | 2015-11-24 | 2018-05-22 | Allegro Microsystems, Llc | Methods and apparatus for phase selection in ring magnet sensing |
US10145906B2 (en) | 2015-12-17 | 2018-12-04 | Analog Devices Global | Devices, systems and methods including magnetic structures |
US10283699B2 (en) | 2016-01-29 | 2019-05-07 | Avago Technologies International Sales Pte. Limited | Hall-effect sensor isolator |
US10114085B2 (en) | 2016-03-04 | 2018-10-30 | Allegro Microsystems, Llc | Magnetic field sensor with improved response immunity |
US9910087B2 (en) * | 2016-03-14 | 2018-03-06 | Allegro Microsystems, Llc | Integrated circuit and method for detecting a stress condition in the integrated circuit |
US10041810B2 (en) | 2016-06-08 | 2018-08-07 | Allegro Microsystems, Llc | Arrangements for magnetic field sensors that act as movement detectors |
US10012518B2 (en) | 2016-06-08 | 2018-07-03 | Allegro Microsystems, Llc | Magnetic field sensor for sensing a proximity of an object |
US10260905B2 (en) | 2016-06-08 | 2019-04-16 | Allegro Microsystems, Llc | Arrangements for magnetic field sensors to cancel offset variations |
US10036785B2 (en) * | 2016-07-18 | 2018-07-31 | Allegro Microsystems, Llc | Temperature-compensated magneto-resistive sensor |
US10114044B2 (en) | 2016-08-08 | 2018-10-30 | Allegro Microsystems, Llc | Current sensor |
EP3293889B1 (de) | 2016-09-13 | 2019-02-27 | Allegro MicroSystems, LLC | Signalisolator mit bidirektionalem diagnostischem signalaustausch |
KR200483900Y1 (ko) | 2016-11-10 | 2017-07-07 | 한윤식 | 자연대류와 난방이 되는 조립식 돔 하우스 |
US10760981B2 (en) * | 2016-11-18 | 2020-09-01 | Asahi Kasei Microdevices Corporation | Hall sensor |
US10352969B2 (en) | 2016-11-29 | 2019-07-16 | Allegro Microsystems, Llc | Systems and methods for integrated shielding in a current sensor |
US11595768B2 (en) | 2016-12-02 | 2023-02-28 | Cochlear Limited | Retention force increasing components |
US9958482B1 (en) * | 2016-12-20 | 2018-05-01 | Allegro Microsystems, Llc | Systems and methods for a high isolation current sensor |
US10324144B2 (en) | 2016-12-20 | 2019-06-18 | Infineon Technologies Austria Ag | Lateral transmission of signals across a galvanic isolation barrier |
US9941999B1 (en) * | 2017-03-08 | 2018-04-10 | Allegro Microsystems, Llc | Methods and apparatus for communication over an isolation barrier with monitoring |
US10481181B2 (en) * | 2017-04-25 | 2019-11-19 | Allegro Microsystems, Llc | Systems and methods for current sensing |
US10641842B2 (en) | 2017-05-26 | 2020-05-05 | Allegro Microsystems, Llc | Targets for coil actuated position sensors |
US11428755B2 (en) | 2017-05-26 | 2022-08-30 | Allegro Microsystems, Llc | Coil actuated sensor with sensitivity detection |
US10310028B2 (en) | 2017-05-26 | 2019-06-04 | Allegro Microsystems, Llc | Coil actuated pressure sensor |
US10324141B2 (en) | 2017-05-26 | 2019-06-18 | Allegro Microsystems, Llc | Packages for coil actuated position sensors |
US10996289B2 (en) | 2017-05-26 | 2021-05-04 | Allegro Microsystems, Llc | Coil actuated position sensor with reflected magnetic field |
US10837943B2 (en) | 2017-05-26 | 2020-11-17 | Allegro Microsystems, Llc | Magnetic field sensor with error calculation |
US10692362B2 (en) | 2017-06-14 | 2020-06-23 | Allegro Microsystems, Llc | Systems and methods for comparing signal channels having different common mode transient immunity |
US10636285B2 (en) | 2017-06-14 | 2020-04-28 | Allegro Microsystems, Llc | Sensor integrated circuits and methods for safety critical applications |
US10380879B2 (en) | 2017-06-14 | 2019-08-13 | Allegro Microsystems, Llc | Sensor integrated circuits and methods for safety critical applications |
US10622549B2 (en) | 2017-08-29 | 2020-04-14 | Allegro Microsystems, Llc | Signal isolator having interposer |
US10718825B2 (en) * | 2017-09-13 | 2020-07-21 | Nxp B.V. | Stray magnetic field robust magnetic field sensor and system |
US10257974B1 (en) | 2017-09-22 | 2019-04-16 | Cnh Industrial America Llc | Seed meter with multiple sensors for seed cell status monitoring |
DE102017124542B4 (de) | 2017-10-20 | 2023-12-21 | Infineon Technologies Ag | Magnetfeldsensoranordnung und verfahren zum messen eines externen magnetfelds |
US10236932B1 (en) | 2017-11-02 | 2019-03-19 | Allegro Microsystems, Llc | Signal isolator having magnetic signal latching |
US10509058B2 (en) * | 2018-01-12 | 2019-12-17 | Allegro Microsystems, Llc | Current sensor using modulation of or change of sensitivity of magnetoresistance elements |
US11112230B2 (en) * | 2018-02-23 | 2021-09-07 | Allegro Microsystems, Llc | Angle sensor using eddy currents |
US10753968B2 (en) | 2018-02-27 | 2020-08-25 | Allegro Microsystems, Llc | Integrated circuit having insulation breakdown detection |
US10866117B2 (en) | 2018-03-01 | 2020-12-15 | Allegro Microsystems, Llc | Magnetic field influence during rotation movement of magnetic target |
US10978897B2 (en) | 2018-04-02 | 2021-04-13 | Allegro Microsystems, Llc | Systems and methods for suppressing undesirable voltage supply artifacts |
US11255700B2 (en) | 2018-08-06 | 2022-02-22 | Allegro Microsystems, Llc | Magnetic field sensor |
US10605874B2 (en) | 2018-08-06 | 2020-03-31 | Allegro Microsystems, Llc | Magnetic field sensor with magnetoresistance elements having varying sensitivity |
US10921391B2 (en) | 2018-08-06 | 2021-02-16 | Allegro Microsystems, Llc | Magnetic field sensor with spacer |
US10935612B2 (en) | 2018-08-20 | 2021-03-02 | Allegro Microsystems, Llc | Current sensor having multiple sensitivity ranges |
US10823586B2 (en) | 2018-12-26 | 2020-11-03 | Allegro Microsystems, Llc | Magnetic field sensor having unequally spaced magnetic field sensing elements |
US10816366B2 (en) | 2019-01-23 | 2020-10-27 | Allegro Microsystems, Llc | Magnetic field sensor for detecting an absolute position of a target object |
US10866122B2 (en) * | 2019-01-23 | 2020-12-15 | Allegro Microsystems, Llc | Magnetic field sensor for detecting an absolute position of a target object |
US11112465B2 (en) | 2019-02-05 | 2021-09-07 | Allegro Microsystems, Llc | Integrated circuit having insulation monitoring with frequency discrimination |
US11061084B2 (en) | 2019-03-07 | 2021-07-13 | Allegro Microsystems, Llc | Coil actuated pressure sensor and deflectable substrate |
US10955306B2 (en) | 2019-04-22 | 2021-03-23 | Allegro Microsystems, Llc | Coil actuated pressure sensor and deformable substrate |
US11029373B2 (en) | 2019-07-16 | 2021-06-08 | Allegro Microsystems, Llc | Magnetic field sensors having a magnetic anti-aliasing filter |
US10914765B1 (en) | 2019-07-31 | 2021-02-09 | Allegro Microsystems, Llc | Multi-die integrated current sensor |
US10991644B2 (en) | 2019-08-22 | 2021-04-27 | Allegro Microsystems, Llc | Integrated circuit package having a low profile |
US11115244B2 (en) | 2019-09-17 | 2021-09-07 | Allegro Microsystems, Llc | Signal isolator with three state data transmission |
US11237020B2 (en) | 2019-11-14 | 2022-02-01 | Allegro Microsystems, Llc | Magnetic field sensor having two rows of magnetic field sensing elements for measuring an angle of rotation of a magnet |
US11280637B2 (en) | 2019-11-14 | 2022-03-22 | Allegro Microsystems, Llc | High performance magnetic angle sensor |
WO2021120060A1 (zh) * | 2019-12-18 | 2021-06-24 | 上海麦歌恩微电子股份有限公司 | 一种基于垂直霍尔和各向异性磁阻的传感器及其使用方法 |
US11600498B2 (en) * | 2019-12-31 | 2023-03-07 | Texas Instruments Incorporated | Semiconductor package with flip chip solder joint capsules |
US11183436B2 (en) | 2020-01-17 | 2021-11-23 | Allegro Microsystems, Llc | Power module package and packaging techniques |
US11150273B2 (en) | 2020-01-17 | 2021-10-19 | Allegro Microsystems, Llc | Current sensor integrated circuits |
EP4090979A4 (de) * | 2020-02-21 | 2024-03-06 | Elemental Machines, Inc. | Verfahren und vorrichtung zur nicht-invasiven nutzungsbestimmung |
US11604058B2 (en) | 2020-02-25 | 2023-03-14 | Allegro Microsystems, Llc | Reducing stray magnetic field effect on an angle sensor |
US11262422B2 (en) | 2020-05-08 | 2022-03-01 | Allegro Microsystems, Llc | Stray-field-immune coil-activated position sensor |
US11346688B2 (en) | 2020-07-06 | 2022-05-31 | Allegro Microsystems, Llc | Magnetic field sensors for detecting absolute position of multi-track targets |
US11422167B2 (en) * | 2020-07-17 | 2022-08-23 | Texas Instruments Incorporated | Integrated current sensor with magnetic flux concentrators |
US11408945B2 (en) | 2020-11-18 | 2022-08-09 | Allegro Microsystems, Llc | Magnetic field sensor with stacked transducers and capacitive summing amplifier |
US11366141B1 (en) | 2021-01-28 | 2022-06-21 | Allegro Microsystems, Llc | Multipath wide bandwidth current sensor |
US11493361B2 (en) | 2021-02-26 | 2022-11-08 | Allegro Microsystems, Llc | Stray field immune coil-activated sensor |
US11567108B2 (en) | 2021-03-31 | 2023-01-31 | Allegro Microsystems, Llc | Multi-gain channels for multi-range sensor |
US11578997B1 (en) | 2021-08-24 | 2023-02-14 | Allegro Microsystems, Llc | Angle sensor using eddy currents |
US11644485B2 (en) | 2021-10-07 | 2023-05-09 | Allegro Microsystems, Llc | Current sensor integrated circuits |
US11768230B1 (en) | 2022-03-30 | 2023-09-26 | Allegro Microsystems, Llc | Current sensor integrated circuit with a dual gauge lead frame |
US11994541B2 (en) | 2022-04-15 | 2024-05-28 | Allegro Microsystems, Llc | Current sensor assemblies for low currents |
US11719769B1 (en) | 2022-06-14 | 2023-08-08 | Allegro Microsystems, Llc | Method and apparatus for sensor signal path diagnostics |
DE102022120256A1 (de) | 2022-08-11 | 2024-02-22 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Verfahren und Vorrichtung zu einer In-situ-AC-Strommessung an Stromschienen zwischen Pulswechselrichter und Verbraucher |
Family Cites Families (230)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4283643A (en) * | 1979-05-25 | 1981-08-11 | Electric Power Research Institute, Inc. | Hall sensing apparatus |
CH651151A5 (de) * | 1979-11-27 | 1985-08-30 | Landis & Gyr Ag | Messwandler zum messen eines insbesondere von einem messstrom erzeugten magnetfeldes. |
JPS5687273A (en) | 1979-12-17 | 1981-07-15 | Sanyo Electric Co Ltd | Automatic head leading device |
US4343026A (en) * | 1980-07-09 | 1982-08-03 | Spin Physics, Inc. | Magnetoresistive head employing field feedback |
JPS6311672Y2 (de) * | 1980-12-22 | 1988-04-05 | ||
JPS57105977A (en) | 1980-12-23 | 1982-07-01 | Toshiba Corp | Air cell |
CH651671A5 (de) * | 1980-12-24 | 1985-09-30 | Landis & Gyr Ag | Anordnung zur messung elektrischer leistung oder energie. |
CH651701A5 (de) * | 1980-12-24 | 1985-09-30 | Landis & Gyr Ag | Kompensierter messwandler. |
JPS57187671A (en) | 1981-05-15 | 1982-11-18 | Nec Corp | Magnetism sensor |
JPS629970Y2 (de) | 1981-05-25 | 1987-03-09 | ||
JPS5879430A (ja) | 1981-11-06 | 1983-05-13 | 株式会社東芝 | 変圧器の内部部分放電自動監視装置 |
JPS58155761A (ja) * | 1982-03-10 | 1983-09-16 | Sharp Corp | ホ−ル効果半導体集積回路 |
JPS58155761U (ja) | 1982-04-13 | 1983-10-18 | 三洋電機株式会社 | 筒型電池 |
JPS58187004U (ja) | 1982-06-04 | 1983-12-12 | 松下電器産業株式会社 | スロツトイン式磁気記録再生装置 |
JPS59132091U (ja) | 1983-02-22 | 1984-09-04 | 京都機械株式会社 | 布帛の連続染色用乾燥装置 |
DE3426784A1 (de) | 1984-07-20 | 1986-01-30 | Bosch Gmbh Robert | Magnetoresistiver sensor zur abgabe von elektrischen signalen |
CA1248222A (en) * | 1984-08-27 | 1989-01-03 | Yutaka Souda | Magnetic transducer head utilizing magnetoresistance effect |
JPH0627150B2 (ja) | 1985-07-08 | 1994-04-13 | 三菱油化株式会社 | 電気絶縁用エチレン共重合物架橋体 |
JPS6243260A (ja) | 1985-08-20 | 1987-02-25 | Canon Inc | フアクシミリ装置 |
DE3632624C1 (de) * | 1986-09-25 | 1988-03-10 | Balluff Gebhard Feinmech | Stoerfeldunempfindlicher Naeherungsschalter |
CH669852A5 (de) * | 1986-12-12 | 1989-04-14 | Lem Liaisons Electron Mec | |
JPS63150384A (ja) | 1986-12-15 | 1988-06-23 | Hitachi Ltd | 潤滑剤 |
US4772929A (en) * | 1987-01-09 | 1988-09-20 | Sprague Electric Company | Hall sensor with integrated pole pieces |
JPS63150384U (de) * | 1987-03-24 | 1988-10-04 | ||
KR910004261B1 (ko) * | 1987-04-09 | 1991-06-25 | 후지쓰 가부시끼가이샤 | 자전 변환 소자를 이용한 검지기 |
JPS63263782A (ja) | 1987-04-22 | 1988-10-31 | Hitachi Ltd | 磁電変換素子 |
EP0300635B1 (de) * | 1987-07-07 | 1995-09-13 | Nippondenso Co., Ltd. | Stromdetektoranordnung mit ferromagnetischem Magnetwiderstandselement |
JPS6475969A (en) | 1987-09-17 | 1989-03-22 | Mitsubishi Electric Corp | Measuring device of current |
US4823075A (en) * | 1987-10-13 | 1989-04-18 | General Electric Company | Current sensor using hall-effect device with feedback |
CH674089A5 (de) * | 1987-10-16 | 1990-04-30 | Lem Liaisons Electron Mec | |
GB8725467D0 (en) * | 1987-10-30 | 1987-12-02 | Honeywell Control Syst | Making current sensor |
DE3843087C2 (de) * | 1987-12-21 | 2001-09-13 | Tdk Corp | Magnetfeldsensor |
US5227721A (en) * | 1987-12-25 | 1993-07-13 | Sharp Kabushiki Kaisha | Superconductive magnetic sensor having self induced magnetic biasing |
JPH01251763A (ja) | 1988-03-31 | 1989-10-06 | Res Dev Corp Of Japan | 縦型ホール素子と集積化磁気センサ |
JPH0216475A (ja) | 1988-07-04 | 1990-01-19 | Sharp Corp | 超電導磁気測定装置 |
US5041780A (en) * | 1988-09-13 | 1991-08-20 | California Institute Of Technology | Integrable current sensors |
US4847584A (en) * | 1988-10-14 | 1989-07-11 | Honeywell Inc. | Magnetoresistive magnetic sensor |
US4926116A (en) * | 1988-10-31 | 1990-05-15 | Westinghouse Electric Corp. | Wide band large dynamic range current sensor and method of current detection using same |
JPH02170061A (ja) | 1988-12-23 | 1990-06-29 | Fujitsu Ltd | 電力検知装置 |
JPH02212789A (ja) * | 1989-02-13 | 1990-08-23 | Nec Corp | 磁気センサ |
JPH02238372A (ja) | 1989-03-13 | 1990-09-20 | Fujitsu Ltd | 電流検出器 |
JP2796391B2 (ja) * | 1990-01-08 | 1998-09-10 | 株式会社日立製作所 | 物理量検出方法および物理量検出装置あるいはこれらの方法あるいは装置を利用したサーボモータおよびこのサーボモータを使用したパワーステアリング装置 |
JPH03214783A (ja) * | 1990-01-19 | 1991-09-19 | Aichi Tokei Denki Co Ltd | 積層型センサ |
JPH03263383A (ja) * | 1990-03-13 | 1991-11-22 | Fujitsu Ltd | 磁気抵抗素子 |
JPH0627150Y2 (ja) | 1990-12-28 | 1994-07-27 | 陽 小川 | 足踏み健康器 |
JPH04290979A (ja) * | 1991-03-20 | 1992-10-15 | Hitachi Ltd | 磁気センサ、磁気センサを持つ位置検出装置および磁気センサを利用したトルク検出装置、モータ制御装置、あるいはこのトルク検出装置を有する電動パワーステアリング装置 |
JP3093813B2 (ja) * | 1991-03-29 | 2000-10-03 | 科学技術振興事業団 | 磁気センサ |
JP3206027B2 (ja) | 1991-07-05 | 2001-09-04 | 株式会社村田製作所 | 微小電流センサ |
EP0537419A1 (de) * | 1991-10-09 | 1993-04-21 | Landis & Gyr Business Support AG | Anordnung mit einem integrierten Magnetfeldsensor sowie einem ferromagnetischen ersten und zweiten Magnetfluss-Konzentrator und Verfahren zum Einbau einer Vielzahl von Anordnungen in je einem Kunststoffgehäuse |
JPH05126865A (ja) * | 1991-10-22 | 1993-05-21 | Hitachi Ltd | 電流検出装置あるいは電流検出方法 |
JPH05264701A (ja) * | 1992-01-23 | 1993-10-12 | Fujitsu Ltd | 磁気センサ |
DE4212737C1 (en) | 1992-04-16 | 1993-07-08 | Leica Mikroskopie Und Systeme Gmbh | Compact bridge-connected sensor - has thin-film resistors on substrate |
CH683469A5 (de) | 1992-07-03 | 1994-03-15 | Landis & Gyr Business Support | Anordnung mit einem einen Magnetfeldsensor enthaltenden Halbleiterplättchen zwischen einem ersten und einem zweiten Polschuh und Verfahren zur Herstellung einer Vielzahl der Anordnungen. |
JPH0627150A (ja) * | 1992-07-07 | 1994-02-04 | Honda Motor Co Ltd | ホール素子型電流センサ |
US5402064A (en) | 1992-09-02 | 1995-03-28 | Santa Barbara Research Center | Magnetoresistive sensor circuit with high output voltage swing and temperature compensation |
JPH06177454A (ja) * | 1992-12-04 | 1994-06-24 | Fujitsu Ltd | 強磁性薄膜磁気抵抗素子とそれを用いた磁気センサ |
DE4243358A1 (de) * | 1992-12-21 | 1994-06-23 | Siemens Ag | Magnetowiderstands-Sensor mit künstlichem Antiferromagneten und Verfahren zu seiner Herstellung |
DE4300605C2 (de) * | 1993-01-13 | 1994-12-15 | Lust Electronic Systeme Gmbh | Sensorchip |
US5442283A (en) * | 1993-09-03 | 1995-08-15 | Allegro Microsystems, Inc. | Hall-voltage slope-activated sensor |
JP3234394B2 (ja) * | 1994-02-04 | 2001-12-04 | 株式会社日本自動車部品総合研究所 | 電流測定装置 |
US6002553A (en) | 1994-02-28 | 1999-12-14 | The United States Of America As Represented By The United States Department Of Energy | Giant magnetoresistive sensor |
US5583725A (en) | 1994-06-15 | 1996-12-10 | International Business Machines Corporation | Spin valve magnetoresistive sensor with self-pinned laminated layer and magnetic recording system using the sensor |
US5500590A (en) * | 1994-07-20 | 1996-03-19 | Honeywell Inc. | Apparatus for sensing magnetic fields using a coupled film magnetoresistive transducer |
JP3214783B2 (ja) | 1994-07-25 | 2001-10-02 | 本田技研工業株式会社 | 燃料タンクの支持構造 |
DE4436876A1 (de) * | 1994-10-15 | 1996-04-18 | Lust Antriebstechnik Gmbh | Sensorchip |
JPH08130338A (ja) * | 1994-10-31 | 1996-05-21 | Nec Corp | 薄膜磁気センサ |
US5561368A (en) | 1994-11-04 | 1996-10-01 | International Business Machines Corporation | Bridge circuit magnetic field sensor having spin valve magnetoresistive elements formed on common substrate |
US5570034A (en) * | 1994-12-29 | 1996-10-29 | Intel Corporation | Using hall effect to monitor current during IDDQ testing of CMOS integrated circuits |
US5488294A (en) | 1995-01-18 | 1996-01-30 | Honeywell Inc. | Magnetic sensor with means for retaining a magnet at a precise calibrated position |
FR2734058B1 (fr) * | 1995-05-12 | 1997-06-20 | Thomson Csf | Amperemetre |
US5717327A (en) * | 1995-09-22 | 1998-02-10 | Bradford; Melvin J. | Current sensor |
EP0772046B1 (de) * | 1995-10-30 | 2002-04-17 | Sentron Ag | Magnetfeldsensor und Strom- oder Energiesensor |
JPH09166612A (ja) | 1995-12-18 | 1997-06-24 | Nissan Motor Co Ltd | 磁気センサ |
JPH09257835A (ja) | 1996-03-22 | 1997-10-03 | Toshiba Corp | 電流検出装置 |
US5929636A (en) * | 1996-05-02 | 1999-07-27 | Integrated Magnetoelectronics | All-metal giant magnetoresistive solid-state component |
DE19619806A1 (de) * | 1996-05-15 | 1997-11-20 | Siemens Ag | Magnetfeldempfindliche Sensoreinrichtung mit mehreren GMR-Sensorelementen |
FR2749664B1 (fr) | 1996-06-05 | 1998-07-24 | Chauvin Arnoux | Dispositif de mesure de courants faibles par pince amperemetrique |
FR2750769B1 (fr) | 1996-07-05 | 1998-11-13 | Thomson Csf | Capteur de champ magnetique en couche mince |
US5831426A (en) * | 1996-08-16 | 1998-11-03 | Nonvolatile Electronics, Incorporated | Magnetic current sensor |
US5896030A (en) * | 1996-10-09 | 1999-04-20 | Honeywell Inc. | Magnetic sensor with components attached to transparent plate for laser trimming during calibration |
DE19650078A1 (de) | 1996-12-03 | 1998-06-04 | Inst Mikrostrukturtechnologie | Sensorelement zur Bestimmung eines Magnetfeldes oder eines Stromes |
JPH10293141A (ja) | 1997-04-18 | 1998-11-04 | Yasusuke Yamamoto | 電流センサー |
EP0874244B1 (de) | 1997-04-19 | 2002-01-30 | LUST ANTRIEBSTECHNIK GmbH | Verfahren zum Messen von elektrischen Strömen in n Leitern sowie Vorrichtung zur Durchführung des Verfahrens |
US5877705A (en) * | 1997-04-22 | 1999-03-02 | Nu-Metrics, Inc. | Method and apparatus for analyzing traffic and a sensor therefor |
WO1998057188A1 (en) * | 1997-06-13 | 1998-12-17 | Koninklijke Philips Electronics N.V. | Sensor comprising a wheatstone bridge |
US6404191B2 (en) * | 1997-08-08 | 2002-06-11 | Nve Corporation | Read heads in planar monolithic integrated circuit chips |
US5952825A (en) * | 1997-08-14 | 1999-09-14 | Honeywell Inc. | Magnetic field sensing device having integral coils for producing magnetic fields |
EP0944839B1 (de) * | 1997-09-15 | 2006-03-29 | AMS International AG | Eine stromüberwachungseinrichtung und ein verfahren zu ihrer herstellung |
US5883567A (en) * | 1997-10-10 | 1999-03-16 | Analog Devices, Inc. | Packaged integrated circuit with magnetic flux concentrator |
US6094330A (en) * | 1998-01-14 | 2000-07-25 | General Electric Company | Circuit interrupter having improved current sensing apparatus |
US6300617B1 (en) * | 1998-03-04 | 2001-10-09 | Nonvolatile Electronics, Incorporated | Magnetic digital signal coupler having selected/reversal directions of magnetization |
JP3544141B2 (ja) * | 1998-05-13 | 2004-07-21 | 三菱電機株式会社 | 磁気検出素子および磁気検出装置 |
JP3623367B2 (ja) * | 1998-07-17 | 2005-02-23 | アルプス電気株式会社 | 巨大磁気抵抗効果素子を備えたポテンショメータ |
JP3623366B2 (ja) | 1998-07-17 | 2005-02-23 | アルプス電気株式会社 | 巨大磁気抵抗効果素子を備えた磁界センサおよびその製造方法と製造装置 |
US6809515B1 (en) * | 1998-07-31 | 2004-10-26 | Spinix Corporation | Passive solid-state magnetic field sensors and applications therefor |
WO2004075311A1 (ja) * | 1998-10-02 | 2004-09-02 | Sanken Electric Co., Ltd. | ホール効果素子を有する半導体装置 |
TW434411B (en) | 1998-10-14 | 2001-05-16 | Tdk Corp | Magnetic sensor apparatus, current sensor apparatus and magnetic sensing element |
TW534999B (en) | 1998-12-15 | 2003-06-01 | Tdk Corp | Magnetic sensor apparatus and current sensor apparatus |
JP3414292B2 (ja) | 1998-12-25 | 2003-06-09 | 株式会社豊田中央研究所 | 磁界検出装置及び磁界検出素子 |
DE69920890T2 (de) * | 1999-01-21 | 2005-02-03 | Tdk Corp. | Stromsensor |
EP1031844A3 (de) * | 1999-02-25 | 2009-03-11 | Liaisons Electroniques-Mecaniques Lem S.A. | Verfahren zur Herstellung eines elektrischen Stromsensors |
US6331773B1 (en) | 1999-04-16 | 2001-12-18 | Storage Technology Corporation | Pinned synthetic anti-ferromagnet with oxidation protection layer |
JP3583649B2 (ja) * | 1999-04-27 | 2004-11-04 | Tdk株式会社 | 薄膜磁気ヘッドおよびその製造方法ならびに磁気抵抗効果装置 |
DE10017374B4 (de) | 1999-05-25 | 2007-05-10 | Siemens Ag | Magnetische Koppeleinrichtung und deren Verwendung |
GB2352522B (en) | 1999-05-28 | 2003-08-06 | Caithness Dev Ltd | A sensor |
US6501678B1 (en) | 1999-06-18 | 2002-12-31 | Koninklijke Philips Electronics N.V. | Magnetic systems with irreversible characteristics and a method of manufacturing and repairing and operating such systems |
JP3696448B2 (ja) * | 1999-09-02 | 2005-09-21 | 矢崎総業株式会社 | 電流検出器 |
JP2001084535A (ja) | 1999-09-16 | 2001-03-30 | Tdk Corp | 薄膜磁気ヘッドの製造方法および磁気抵抗効果装置の製造方法 |
US6583629B1 (en) * | 1999-10-01 | 2003-06-24 | Nve Corporation | Magnetic digital signal coupler monitor |
US6445171B2 (en) * | 1999-10-29 | 2002-09-03 | Honeywell Inc. | Closed-loop magnetoresistive current sensor system having active offset nulling |
US6462541B1 (en) * | 1999-11-12 | 2002-10-08 | Nve Corporation | Uniform sense condition magnetic field sensor using differential magnetoresistance |
JP3852554B2 (ja) | 1999-12-09 | 2006-11-29 | サンケン電気株式会社 | ホール素子を備えた電流検出装置 |
JP2001165963A (ja) * | 1999-12-09 | 2001-06-22 | Sanken Electric Co Ltd | ホール素子を備えた電流検出装置 |
JP4164615B2 (ja) * | 1999-12-20 | 2008-10-15 | サンケン電気株式会社 | ホ−ル素子を備えた電流検出装置 |
US6433981B1 (en) * | 1999-12-30 | 2002-08-13 | General Electric Company | Modular current sensor and power source |
JP4216984B2 (ja) | 2000-02-14 | 2009-01-28 | パナソニック株式会社 | 部品振り分け制御装置、部品振り分け方法、および部品振り分けシステム。 |
JP2001227902A (ja) * | 2000-02-16 | 2001-08-24 | Mitsubishi Electric Corp | 半導体装置 |
DE10028640B4 (de) * | 2000-06-09 | 2005-11-03 | Institut für Physikalische Hochtechnologie e.V. | Wheatstonebrücke, beinhaltend Brückenelemente, bestehend aus einem Spin-Valve-System, sowie ein Verfahren zu deren Herstellung |
JP2002082136A (ja) | 2000-06-23 | 2002-03-22 | Yazaki Corp | 電流センサ |
JP2002026419A (ja) * | 2000-07-07 | 2002-01-25 | Sanken Electric Co Ltd | 磁電変換装置 |
US6429640B1 (en) * | 2000-08-21 | 2002-08-06 | The United States Of America As Represented By The Secretary Of The Air Force | GMR high current, wide dynamic range sensor |
JP2002107382A (ja) | 2000-09-27 | 2002-04-10 | Asahi Kasei Corp | 半導体装置およびその製造方法、並びに電流センサ |
JP2002131342A (ja) | 2000-10-19 | 2002-05-09 | Canon Electronics Inc | 電流センサ |
DE20018538U1 (de) | 2000-10-27 | 2002-03-07 | Mannesmann Vdo Ag | Sensormodul |
JP2002163808A (ja) * | 2000-11-22 | 2002-06-07 | Tdk Corp | 磁気抵抗効果装置およびその製造方法ならびに薄膜磁気ヘッドおよびその製造方法 |
GB0029815D0 (en) | 2000-12-06 | 2001-01-17 | Pace Micro Tech Plc | Voltage measuring apparatus |
US6833615B2 (en) * | 2000-12-29 | 2004-12-21 | Intel Corporation | Via-in-pad with off-center geometry |
US20020093332A1 (en) | 2001-01-18 | 2002-07-18 | Thaddeus Schroeder | Magnetic field sensor with tailored magnetic response |
DE10108640A1 (de) | 2001-02-22 | 2002-09-19 | Infineon Technologies Ag | Sensoranordnung zur kontaktlosen Strommessung |
US6661083B2 (en) | 2001-02-27 | 2003-12-09 | Chippac, Inc | Plastic semiconductor package |
DE10159607B4 (de) | 2001-03-09 | 2010-11-18 | Siemens Ag | Analog/Digital-Signalwandlereinrichtung mit galvanischer Trennung in ihrem Singalübertragungsweg |
DE10120408B4 (de) | 2001-04-25 | 2006-02-02 | Infineon Technologies Ag | Elektronisches Bauteil mit einem Halbleiterchip, elektronische Baugruppe aus gestapelten Halbleiterchips und Verfahren zu deren Herstellung |
JP3260740B1 (ja) * | 2001-04-25 | 2002-02-25 | ティーディーケイ株式会社 | 磁気抵抗効果装置の製造方法および薄膜磁気ヘッドの製造方法 |
JP3284130B1 (ja) | 2001-04-25 | 2002-05-20 | ティーディーケイ株式会社 | 磁気抵抗効果装置およびその製造方法、薄膜磁気ヘッドおよびその製造方法、ヘッドジンバルアセンブリならびにハードディスク装置 |
US6563629B2 (en) | 2001-05-18 | 2003-05-13 | Redc Optical Networks Ltd. | Method and apparatus for full C-band amplifier with high dynamic gain range |
US6946834B2 (en) | 2001-06-01 | 2005-09-20 | Koninklijke Philips Electronics N.V. | Method of orienting an axis of magnetization of a first magnetic element with respect to a second magnetic element, semimanufacture for obtaining a sensor, sensor for measuring a magnetic field |
DE10128150C1 (de) | 2001-06-11 | 2003-01-23 | Siemens Ag | Magnetoresistives Sensorsystem |
US6542375B1 (en) * | 2001-06-14 | 2003-04-01 | National Semiconductor Corporation | Hybrid PCB-IC directional coupler |
EP1267173A3 (de) * | 2001-06-15 | 2005-03-23 | Sanken Electric Co., Ltd. | Hall-Effektstromdetektor |
JP4164626B2 (ja) * | 2001-06-15 | 2008-10-15 | サンケン電気株式会社 | ホ−ル素子を備えた電流検出装置 |
EP1273921A1 (de) * | 2001-07-06 | 2003-01-08 | Sanken Electric Co., Ltd. | Hall-Effekt-Stromdetektor |
JP2003043074A (ja) * | 2001-07-26 | 2003-02-13 | Asahi Kasei Corp | 電流検出装置及びその製造方法 |
DE10140043B4 (de) | 2001-08-16 | 2006-03-23 | Siemens Ag | Schichtensystem mit erhöhtem magnetoresistiven Effekt sowie Verwendung desselben |
US6949927B2 (en) | 2001-08-27 | 2005-09-27 | International Rectifier Corporation | Magnetoresistive magnetic field sensors and motor control devices using same |
DE10142114C1 (de) | 2001-08-30 | 2003-02-13 | Infineon Technologies Ag | Elektronisches Bauteil mit wenigstens zwei Halbleiterchips sowie Verfahren zu seiner Herstellung |
DE10142120A1 (de) | 2001-08-30 | 2003-03-27 | Infineon Technologies Ag | Elektronisches Bauteil mit wenigstens zwei gestapelten Halbleiterchips sowie Verfahren zu seiner Herstellung |
DE10142118B4 (de) | 2001-08-30 | 2007-07-12 | Infineon Technologies Ag | Elektronisches Bauteil mit wenigstens zwei gestapelten Halbleiterchips sowie Verfahren zu seiner Herstellung |
DE10143437A1 (de) | 2001-09-05 | 2003-03-27 | Hella Kg Hueck & Co | Vorrichtung zur Ermittlung der Position eines Schaltstocks oder eines Wählhebels eines Fahrzeuggetriebes |
TWI273266B (en) | 2001-11-01 | 2007-02-11 | Asahi Kasei Emd Corp | Current sensor and current sensor manufacturing method |
DE10155423B4 (de) | 2001-11-12 | 2006-03-02 | Siemens Ag | Verfahren zur homogenen Magnetisierung eines austauschgekoppelten Schichtsystems eines magneto-resistiven Bauelements, insbesondere eines Sensor-oder Logikelements |
US6667682B2 (en) | 2001-12-26 | 2003-12-23 | Honeywell International Inc. | System and method for using magneto-resistive sensors as dual purpose sensors |
DE10202287C1 (de) | 2002-01-22 | 2003-08-07 | Siemens Ag | Verfahren zur Herstellung einer monolithischen Brückenschaltung bestehend aus mehreren, als magneto-resistive Elemente ausgebildeten Brückengliedern und eine hiernach hergestellte monolithische Brückenschaltung |
US6815944B2 (en) * | 2002-01-31 | 2004-11-09 | Allegro Microsystems, Inc. | Method and apparatus for providing information from a speed and direction sensor |
US6984978B2 (en) * | 2002-02-11 | 2006-01-10 | Honeywell International Inc. | Magnetic field sensor |
DE10222395B4 (de) | 2002-05-21 | 2010-08-05 | Siemens Ag | Schaltungseinrichtung mit mehreren TMR-Sensorelementen |
WO2003107018A1 (ja) | 2002-06-18 | 2003-12-24 | 旭化成株式会社 | 電流測定方法および電流測定装置 |
DE10228764B4 (de) | 2002-06-27 | 2006-07-13 | Infineon Technologies Ag | Anordnung zum Testen von Halbleitereinrichtungen |
JP4180321B2 (ja) * | 2002-07-30 | 2008-11-12 | 旭化成エレクトロニクス株式会社 | 磁気センサおよび磁気センサの製造方法 |
US6781359B2 (en) * | 2002-09-20 | 2004-08-24 | Allegro Microsystems, Inc. | Integrated current sensor |
JP3896590B2 (ja) * | 2002-10-28 | 2007-03-22 | サンケン電気株式会社 | 電流検出装置 |
JP2004158668A (ja) * | 2002-11-07 | 2004-06-03 | Asahi Kasei Corp | ハイブリッド磁気センサ及びその製造方法 |
JP4200358B2 (ja) * | 2002-12-13 | 2008-12-24 | サンケン電気株式会社 | ホール素子を備えた電流検出装置 |
FI114854B (fi) | 2003-02-11 | 2005-01-14 | Liekki Oy | Menetelmä nesteen syöttämiseksi liekkiruiskutuslaitteistoon |
US7259545B2 (en) | 2003-02-11 | 2007-08-21 | Allegro Microsystems, Inc. | Integrated sensor |
US6995957B2 (en) * | 2003-03-18 | 2006-02-07 | Hitachi Global Storage Technologies Netherland B.V. | Magnetoresistive sensor having a high resistance soft magnetic layer between sensor stack and shield |
DE10314602B4 (de) | 2003-03-31 | 2007-03-01 | Infineon Technologies Ag | Integrierter differentieller Magnetfeldsensor |
JP2004356338A (ja) | 2003-05-28 | 2004-12-16 | Res Inst Electric Magnetic Alloys | 薄膜磁気センサ及びその製造方法 |
WO2004109725A1 (en) | 2003-06-11 | 2004-12-16 | Koninklijke Philips Electronics N.V. | Method of manufacturing a device with a magnetic layer-structure |
US7166807B2 (en) * | 2003-08-26 | 2007-01-23 | Allegro Microsystems, Inc. | Current sensor |
US7709754B2 (en) * | 2003-08-26 | 2010-05-04 | Allegro Microsystems, Inc. | Current sensor |
US20060219436A1 (en) | 2003-08-26 | 2006-10-05 | Taylor William P | Current sensor |
US7075287B1 (en) * | 2003-08-26 | 2006-07-11 | Allegro Microsystems, Inc. | Current sensor |
FR2860592B1 (fr) | 2003-10-06 | 2006-01-21 | Michel Remy Jean Combier | Dispositif de mesure de courant sans contact, a grande dynamique, robuste et a bas cout. |
JP5197961B2 (ja) | 2003-12-17 | 2013-05-15 | スタッツ・チップパック・インコーポレイテッド | マルチチップパッケージモジュールおよびその製造方法 |
JP2005195427A (ja) | 2004-01-06 | 2005-07-21 | Asahi Kasei Electronics Co Ltd | 電流測定装置、電流測定方法および電流測定プログラム |
DE102004003369A1 (de) | 2004-01-22 | 2005-08-18 | Siemens Ag | Magnetisches Bauelement mit hoher Grenzfrequenz |
EP1720027B1 (de) | 2004-02-19 | 2010-11-17 | Mitsubishi Electric Corporation | Magnetfelddetektor und stromdetektionseinrichtung, positionsdetektionseinrichtung und rotationsdetektionseinrichtung mit dem magnetfelddetektor |
JP4433820B2 (ja) * | 2004-02-20 | 2010-03-17 | Tdk株式会社 | 磁気検出素子およびその形成方法ならびに磁気センサ、電流計 |
DE102004009267B3 (de) | 2004-02-26 | 2005-09-22 | Siemens Ag | Ausleseeinrichtung wenigstens eines magnetoresistiven Elementes |
US7422930B2 (en) | 2004-03-02 | 2008-09-09 | Infineon Technologies Ag | Integrated circuit with re-route layer and stacked die assembly |
JP4511219B2 (ja) | 2004-03-04 | 2010-07-28 | 三洋電機株式会社 | モータ駆動回路 |
DE102004062474A1 (de) * | 2004-03-23 | 2005-10-13 | Siemens Ag | Vorrichtung zur potenzialfreien Strommessung |
DE102004017191B4 (de) | 2004-04-07 | 2007-07-12 | Infineon Technologies Ag | Vorrichtung und Verfahren zur Ermittlung einer Richtung eines Objekts |
US20050246114A1 (en) | 2004-04-29 | 2005-11-03 | Rannow Randy K | In-line field sensor |
DE102004021862B4 (de) | 2004-05-04 | 2014-08-07 | Infineon Technologies Ag | Stromsenor |
US7961431B2 (en) | 2004-05-04 | 2011-06-14 | Illinois Tool Works Inc. | Additive-free fiber for metal texture of hard disk drives |
JP2005331437A (ja) * | 2004-05-21 | 2005-12-02 | Nsk Ltd | 多極磁石エンコーダの出力検査方法 |
DE102004027273A1 (de) | 2004-06-04 | 2005-12-29 | Infineon Technologies Ag | Halbleiterbaustein mit einer ersten und mindestens einer weiteren Halbleiterschaltung und Verfahren |
US20080249165A1 (en) | 2004-08-05 | 2008-10-09 | Ivax Drug Research Institute Ltd. | Glycosides and Salts Thereof |
DE102004038847B3 (de) | 2004-08-10 | 2005-09-01 | Siemens Ag | Einrichtung zur potenzialfreien Messung eines in einer elektrischen Leiterbahn fließenden Stromes |
DE102004040079B3 (de) | 2004-08-18 | 2005-12-22 | Siemens Ag | Magnetfeldsensor |
DE102005037905A1 (de) | 2004-08-18 | 2006-03-09 | Siemens Ag | Magnetfeldsensor zum Messen eines Gradienten eines magnetischen Feldes |
DE102004043737A1 (de) * | 2004-09-09 | 2006-03-30 | Siemens Ag | Vorrichtung zum Erfassen des Gradienten eines Magnetfeldes und Verfahren zur Herstellung der Vorrichtung |
JP4360998B2 (ja) * | 2004-10-01 | 2009-11-11 | Tdk株式会社 | 電流センサ |
US7777607B2 (en) | 2004-10-12 | 2010-08-17 | Allegro Microsystems, Inc. | Resistor having a predetermined temperature coefficient |
JP4105142B2 (ja) * | 2004-10-28 | 2008-06-25 | Tdk株式会社 | 電流センサ |
DE102004053551A1 (de) | 2004-11-05 | 2006-05-18 | Siemens Ag | Vorrichtung zum Erfassen eines beweglichen oder bewegbaren elektrisch und/oder magnetisch leitenden Teiles |
JP4105145B2 (ja) * | 2004-11-30 | 2008-06-25 | Tdk株式会社 | 電流センサ |
JP4105147B2 (ja) * | 2004-12-06 | 2008-06-25 | Tdk株式会社 | 電流センサ |
JP4131869B2 (ja) * | 2005-01-31 | 2008-08-13 | Tdk株式会社 | 電流センサ |
US7476953B2 (en) * | 2005-02-04 | 2009-01-13 | Allegro Microsystems, Inc. | Integrated sensor having a magnetic flux concentrator |
ATE381024T1 (de) | 2005-02-15 | 2007-12-15 | Fiat Ricerche | Oberflächenmontierter integrierter stromsensor |
DE102006008257B4 (de) | 2005-03-22 | 2010-01-14 | Siemens Ag | Magnetoresistives Mehrschichtensystem vom Spin Valve-Typ mit einer magnetisch weicheren Elektrode aus mehreren Schichten und dessen Verwendung |
CN103545332B (zh) | 2005-05-04 | 2016-08-10 | 盛投资有限责任公司 | 传感器模块以及包括传感器模块的装置的制造方法 |
US7358724B2 (en) | 2005-05-16 | 2008-04-15 | Allegro Microsystems, Inc. | Integrated magnetic flux concentrator |
JP2007003237A (ja) | 2005-06-21 | 2007-01-11 | Denso Corp | 電流センサ |
DE102006021774B4 (de) | 2005-06-23 | 2014-04-03 | Siemens Aktiengesellschaft | Stromsensor zur galvanisch getrennten Strommessung |
JP4466487B2 (ja) | 2005-06-27 | 2010-05-26 | Tdk株式会社 | 磁気センサおよび電流センサ |
US7541804B2 (en) | 2005-07-29 | 2009-06-02 | Everspin Technologies, Inc. | Magnetic tunnel junction sensor |
DE102005038655B3 (de) | 2005-08-16 | 2007-03-22 | Siemens Ag | Magnetfeldsensitive Sensoreinrichtung |
DE102005040539B4 (de) | 2005-08-26 | 2007-07-05 | Siemens Ag | Magnetfeldsensitive Sensoreinrichtung |
JP2007064851A (ja) * | 2005-08-31 | 2007-03-15 | Tdk Corp | コイル、コイルモジュールおよびその製造方法、ならびに電流センサおよびその製造方法 |
JP4298691B2 (ja) * | 2005-09-30 | 2009-07-22 | Tdk株式会社 | 電流センサおよびその製造方法 |
JP4415923B2 (ja) * | 2005-09-30 | 2010-02-17 | Tdk株式会社 | 電流センサ |
JP4224483B2 (ja) * | 2005-10-14 | 2009-02-12 | Tdk株式会社 | 電流センサ |
DE102005052688A1 (de) | 2005-11-04 | 2007-05-24 | Siemens Ag | Magnetfeldsensor mit einer Messbrücke mit MR-Sensor |
US7768083B2 (en) * | 2006-01-20 | 2010-08-03 | Allegro Microsystems, Inc. | Arrangements for an integrated sensor |
JP2007218700A (ja) * | 2006-02-15 | 2007-08-30 | Tdk Corp | 磁気センサおよび電流センサ |
DE102006007770A1 (de) | 2006-02-20 | 2007-08-30 | Siemens Ag | Sensoreinrichtung zur Erfassung einer Magnetfeldgröße |
US20070279053A1 (en) | 2006-05-12 | 2007-12-06 | Taylor William P | Integrated current sensor |
DE202006020504U1 (de) | 2006-06-06 | 2008-09-25 | Insta Elektro Gmbh | Elektrisches/elektronisches Gerät |
DE102006028250A1 (de) | 2006-06-20 | 2007-12-27 | Carl Zeiss Microimaging Gmbh | Verfahren zur Überwachung von Laserbearbeitungsprozessen |
DE102006028698B3 (de) | 2006-06-22 | 2007-12-13 | Siemens Ag | OMR-Sensor und Anordnung aus solchen Sensoren |
KR101279116B1 (ko) | 2006-06-30 | 2013-06-26 | 엘지디스플레이 주식회사 | 듀얼 뷰 디스플레이 장치 및 듀얼 뷰 액정 디스플레이 장치 |
DE102006046739B4 (de) | 2006-09-29 | 2008-08-14 | Siemens Ag | Verfahren zum Betreiben eines Magnetfeldsensors und zugehöriger Magnetfeldsensor |
DE102006046736B4 (de) | 2006-09-29 | 2008-08-14 | Siemens Ag | Verfahren zum Betreiben eines Magnetfeldsensors und zugehöriger Magnetfeldsensor |
US7816905B2 (en) | 2008-06-02 | 2010-10-19 | Allegro Microsystems, Inc. | Arrangements for a current sensing circuit and integrated current sensor |
US8203332B2 (en) | 2008-06-24 | 2012-06-19 | Magic Technologies, Inc. | Gear tooth sensor (GTS) with magnetoresistive bridge |
AT508554B1 (de) | 2009-08-26 | 2011-02-15 | Univ Wien Tech | Chalkon-hydroxylase |
DE102012012759A1 (de) | 2012-06-27 | 2014-01-02 | Sensitec Gmbh | Anordnung zur Strommessung |
-
2006
- 2006-01-20 US US11/335,944 patent/US7768083B2/en active Active
-
2007
- 2007-01-04 JP JP2008551281A patent/JP5748393B2/ja active Active
- 2007-01-04 AT AT10195147T patent/ATE550673T1/de active
- 2007-01-04 KR KR1020087018642A patent/KR101366007B1/ko active IP Right Grant
- 2007-01-04 EP EP10195147A patent/EP2290381B1/de not_active Revoked
- 2007-01-04 AT AT10195145T patent/ATE551609T1/de active
- 2007-01-04 AT AT10195143T patent/ATE550672T1/de active
- 2007-01-04 EP EP10195145A patent/EP2290380B1/de not_active Revoked
- 2007-01-04 AT AT07716253T patent/ATE550671T1/de active
- 2007-01-04 WO PCT/US2007/000093 patent/WO2007087121A2/en active Application Filing
- 2007-01-04 EP EP07716253A patent/EP1974223B1/de not_active Revoked
- 2007-01-04 EP EP10195143A patent/EP2290379B1/de not_active Revoked
-
2010
- 2010-06-02 US US12/792,245 patent/US8629520B2/en active Active
-
2011
- 2011-12-02 JP JP2011264267A patent/JP5635966B2/ja active Active
-
2013
- 2013-04-16 JP JP2013085409A patent/JP2013178259A/ja not_active Withdrawn
- 2013-06-14 US US13/918,075 patent/US9082957B2/en active Active
- 2013-06-14 US US13/918,064 patent/US8952471B2/en active Active
- 2013-09-12 JP JP2013189638A patent/JP5902657B2/ja active Active
-
2014
- 2014-02-18 JP JP2014028213A patent/JP5848382B2/ja active Active
-
2015
- 2015-03-09 JP JP2015045607A patent/JP6376995B2/ja active Active
- 2015-05-08 US US14/707,319 patent/US9859489B2/en active Active
- 2015-08-10 JP JP2015157901A patent/JP6150855B2/ja active Active
-
2016
- 2016-12-30 US US15/395,083 patent/US10069063B2/en active Active
-
2017
- 2017-09-11 JP JP2017173831A patent/JP2018036267A/ja active Pending
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE551609T1 (de) | Anordnungen für einen integrierten sensor | |
ATE443266T1 (de) | Stromsensor | |
WO2008008581A3 (en) | An electronics package with an integrated circuit device having post wafer fabrication integrated passive components | |
TWI264133B (en) | Optical semiconductor device, optical connector and electronic equipment | |
TW200802782A (en) | Chip module for complete power train | |
ATE473489T1 (de) | Duales chipkartensystem | |
TW200715708A (en) | Electronic substrate, manufacturing method for electronic substrate, and electronic device | |
TW200708175A (en) | Mask holding structure, film forming method, electro-optic device manufacturing method, and electronic apparatus | |
TW200801565A (en) | Magnetic sensor, production method thereof, rotation detection device, and position detection device | |
TW200631064A (en) | Semiconductor device | |
EP1786249A4 (de) | Keramisches substrat mit einer darauf angebrachten elektronischen komponente des chip-typs und herstellungsprozess dafür | |
EP1619725A3 (de) | Dünnschicht-Halbleiterbauelement und diesbezügliches Herstellungsverfahren, elektro-optische Vorrichtung und elektronisches Gerät | |
TW200733026A (en) | Circuit structure of a display | |
TW200628878A (en) | Display apparatus | |
WO2010048102A3 (en) | Integrated sensor including sensing and processing die mounted on opposite sides of package substrate | |
TW200802537A (en) | Semiconductor device having symbol pattern utilized as identification sign and its manufacture method | |
ATE502399T1 (de) | Schaltungsvorrichtung mit gebondetem smd-bauteil | |
WO2008105228A1 (ja) | 磁気センサモジュール及び、ピストン位置検出装置 | |
EP2026082A3 (de) | Doppelseitiger integrierter Verarbeitungs- und Erfassungschip | |
TW200703472A (en) | Semiconductor test device | |
TW200702851A (en) | Module for manufacturing a display device, method of manufacturing the same, and method of manufacturing a display device using the same | |
TW200723462A (en) | Package module with alignment structure and electronic device with the same | |
TW200722460A (en) | Semiconductor device and display module using same | |
TW200733030A (en) | Light source driving device with light sensor module and electronic device using the same | |
TW200707864A (en) | Connecting element and circuit connecting device using the connecting element |