JP5794777B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5794777B2 JP5794777B2 JP2010286342A JP2010286342A JP5794777B2 JP 5794777 B2 JP5794777 B2 JP 5794777B2 JP 2010286342 A JP2010286342 A JP 2010286342A JP 2010286342 A JP2010286342 A JP 2010286342A JP 5794777 B2 JP5794777 B2 JP 5794777B2
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- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
- G01R15/205—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices using magneto-resistance devices, e.g. field plates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/091—Constructional adaptation of the sensor to specific applications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/096—Magnetoresistive devices anisotropic magnetoresistance sensors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/098—Magnetoresistive devices comprising tunnel junctions, e.g. tunnel magnetoresistance sensors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/325—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being noble metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4846—Connecting portions with multiple bonds on the same bonding area
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- Condensed Matter Physics & Semiconductors (AREA)
- Nanotechnology (AREA)
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- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
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- Measuring Magnetic Variables (AREA)
- Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
Description
図1は、本発明の実施の形態1に係る半導体装置を示す平面図である。図2は、図1のA−A´に沿った断面図である。半導体素子1は、インバータ装置等の電力変換装置に適用される絶縁ゲート型バイポーラトランジスタ(IGBT: Insulated Gate Bipolar Transistor)である。半導体基板2の表面近傍にpウェルベース領域3が設けられている。pウェルベース領域3を貫通するようにトレンチゲート4が設けられている。pウェルベース領域3の周囲にガードリングPウエル領域5とN+チャネルストッパー6が設けられている。チップ表面側にエミッタ電極7とゲート電極8が設けられている。エミッタ電極7は絶縁分離膜9に覆われている。
図6は、本発明の実施の形態2に係る半導体装置を示す平面図である。電流センサー11は、第1及び第2の強磁性体14a,14bを更に有する。第1及び第2の強磁性体14a,14bは、電流の向きに対し直角方向に伸延し、磁気抵抗素子12を挟み込むように配置されている。これにより、通電時に発生する磁界を集束させることできるため、磁気抵抗素子12の感度を向上させることができる。
図7は、本発明の実施の形態3に係る半導体装置を示す平面図である。図8は、図7のA−A´に沿った断面図である。強磁性体材料からなるブリッジ形状体15が第1及び第2の強磁性体14a,14bに接続されている。ブリッジ形状体15は磁気抵抗素子12や引き出し線10に対して絶縁されている。このブリッジ形状体15により磁界を更に集束させることできるため、磁気抵抗素子12の感度を更に向上させることができる。
図9は、本発明の実施の形態4に係る半導体装置を示す平面図である。磁気抵抗素子12は、磁界に対して直角方向に複数回折り返したつづら折り形状(クランク形状)を持つ。これにより、磁気抵抗素子12は、集束された磁界を受ける線路長が長くなるため、磁界の変化を検知しやすくなる。
図10は、本発明の実施の形態5に係る半導体装置の一部を示す平面図である。磁気に対して抵抗値が変化しない固定抵抗16a〜16cが、エミッタ電極7上に配置されている。固定抵抗16a〜16cは、磁気抵抗素子12に接続されてブリッジ回路を構成する。ブリッジ回路内の各接続点に電極パッド17a〜17dが設けられ、任意の外部回路と接続することができる。これにより、磁気抵抗素子12の抵抗値の変化を精度よく検知することができる。
図12は、本発明の実施の形態6に係る半導体装置を示す平面図である。図13は、図12のA−A´に沿った断面図である。磁気抵抗素子12の抵抗値を読み取る磁気抵抗読み取り回路18が、半導体素子1と同一チップ内に、CMOSICプロセスにより形成されている。磁気抵抗素子12は、IGBT主電極領域からガードリング部を跨いで磁気抵抗読み取り回路18まで伸延して、磁気抵抗読み取り回路18に接続されている。このように半導体素子1と同一チップ内に磁気抵抗読み取り回路18を設けることで、迅速かつ高精度なフィードバック制御を行うことができる。
7 エミッタ電極(表面電極)
10 引き出し線
11 電流センサー
12 磁気抵抗素子
14a 第1の強磁性体
14b 第2の強磁性体
15 ブリッジ形状体
16a〜16f 固定抵抗
18 磁気抵抗読み取り回路
Claims (6)
- 表面電極を有する半導体素子と、
前記表面電極に電気的に接続され、前記表面電極の上方を通ってサイドに引き出された引き出し線と、
前記引き出し線に流れる電流を検出する電流センサーとを備え、
前記引き出し線は、前記表面電極の少なくとも一部上を通過し、前記表面電極に対向するように配置され、
前記電流センサーは、前記表面電極と前記引き出し線の間の空間に配置された磁気抵抗素子を有し、
前記磁気抵抗素子は細長い形状を持ち、
前記磁気抵抗素子は前記引き出し線を横切って配置され、
前記磁気抵抗素子の抵抗値は、前記電流により発生した磁界に対してリニアに変化し、
前記電流センサーは、前記半導体素子と同一チップ内に設けられ、前記磁気抵抗素子の抵抗値を読み取る回路を更に有することを特徴とする半導体装置。 - 前記磁気抵抗素子は、スピンバルブ型TMR(tunnel Magneto Resistance)素子、スピンバルブ型GMR(Giant Magneto Resistance)素子、及びバーバーポール電極を付加したAMR(Anitorpic Magneto Resistance)素子の何れかであることを特徴とする請求項1に記載の半導体装置。
- 前記電流センサーは、前記電流の向きに対し直角方向に伸延し前記磁気抵抗素子を挟み込む第1及び第2の強磁性体を更に有することを特徴とする請求項1又は2に記載の半導体装置。
- 前記電流センサーは、前記第1及び第2の強磁性体に接続された強磁性体材料からなるブリッジ形状体を更に有することを特徴とする請求項3に記載の半導体装置。
- 前記磁気抵抗素子は、前記磁界に対して直角方向に複数回折り返した形状を持つことを特徴とする請求項1〜4の何れか1項に記載の半導体装置。
- 前記電流センサーは、前記表面電極上に配置され、前記磁気抵抗素子に接続されてブリッジ回路を構成する固定抵抗を更に有することを特徴とする請求項1〜5の何れか1項に記載の半導体装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010286342A JP5794777B2 (ja) | 2010-12-22 | 2010-12-22 | 半導体装置 |
US13/213,778 US8823360B2 (en) | 2010-12-22 | 2011-08-19 | Semiconductor device |
TW100129907A TWI460434B (zh) | 2010-12-22 | 2011-08-22 | 半導體裝置 |
DE102011086034.7A DE102011086034B4 (de) | 2010-12-22 | 2011-11-09 | Halbleitervorrichtung |
CN201110432580.8A CN102565508B (zh) | 2010-12-22 | 2011-12-21 | 半导体装置 |
US14/305,693 US9121899B2 (en) | 2010-12-22 | 2014-06-16 | Semiconductor device |
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JP2010286342A JP5794777B2 (ja) | 2010-12-22 | 2010-12-22 | 半導体装置 |
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JP2012132832A JP2012132832A (ja) | 2012-07-12 |
JP5794777B2 true JP5794777B2 (ja) | 2015-10-14 |
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JP2010286342A Active JP5794777B2 (ja) | 2010-12-22 | 2010-12-22 | 半導体装置 |
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US (2) | US8823360B2 (ja) |
JP (1) | JP5794777B2 (ja) |
CN (1) | CN102565508B (ja) |
DE (1) | DE102011086034B4 (ja) |
TW (1) | TWI460434B (ja) |
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US8482029B2 (en) * | 2011-05-27 | 2013-07-09 | Infineon Technologies Austria Ag | Semiconductor device and integrated circuit including the semiconductor device |
US20130334531A1 (en) * | 2012-06-15 | 2013-12-19 | Franz Jost | Systems and methods for measuring temperature and current in integrated circuit devices |
JP6052732B2 (ja) * | 2012-11-22 | 2016-12-27 | 公立大学法人大阪市立大学 | 磁気抵抗効果素子 |
DE102019103030B4 (de) * | 2018-04-04 | 2022-03-31 | Infineon Technologies Ag | Transistorvorrichtungen sowie Verfahren zur Herstellung und zum Betreiben von Transistorvorrichtungen |
JP7276070B2 (ja) * | 2019-10-21 | 2023-05-18 | 株式会社デンソー | 半導体モジュール |
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- 2011-08-19 US US13/213,778 patent/US8823360B2/en active Active
- 2011-08-22 TW TW100129907A patent/TWI460434B/zh active
- 2011-11-09 DE DE102011086034.7A patent/DE102011086034B4/de active Active
- 2011-12-21 CN CN201110432580.8A patent/CN102565508B/zh active Active
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US20140346514A1 (en) | 2014-11-27 |
TWI460434B (zh) | 2014-11-11 |
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JP2012132832A (ja) | 2012-07-12 |
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TW201243344A (en) | 2012-11-01 |
DE102011086034B4 (de) | 2016-06-09 |
CN102565508B (zh) | 2015-07-01 |
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