DE69030283D1 - Halbleitervorrichtung und Verfahren zu deren Einbrennen - Google Patents
Halbleitervorrichtung und Verfahren zu deren EinbrennenInfo
- Publication number
- DE69030283D1 DE69030283D1 DE69030283T DE69030283T DE69030283D1 DE 69030283 D1 DE69030283 D1 DE 69030283D1 DE 69030283 T DE69030283 T DE 69030283T DE 69030283 T DE69030283 T DE 69030283T DE 69030283 D1 DE69030283 D1 DE 69030283D1
- Authority
- DE
- Germany
- Prior art keywords
- baking
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Geometry (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Semiconductor Memories (AREA)
- For Increasing The Reliability Of Semiconductor Memories (AREA)
- Dram (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1169659A JP2585799B2 (ja) | 1989-06-30 | 1989-06-30 | 半導体メモリ装置及びそのバーンイン方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69030283D1 true DE69030283D1 (de) | 1997-04-30 |
DE69030283T2 DE69030283T2 (de) | 1997-08-07 |
Family
ID=15890557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69030283T Expired - Fee Related DE69030283T2 (de) | 1989-06-30 | 1990-06-29 | Halbleitervorrichtung und Verfahren zu deren Einbrennen |
Country Status (5)
Country | Link |
---|---|
US (2) | US5138427A (de) |
EP (1) | EP0405586B1 (de) |
JP (1) | JP2585799B2 (de) |
KR (1) | KR940006577B1 (de) |
DE (1) | DE69030283T2 (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5905382A (en) * | 1990-08-29 | 1999-05-18 | Micron Technology, Inc. | Universal wafer carrier for wafer level die burn-in |
US7511520B2 (en) * | 1990-08-29 | 2009-03-31 | Micron Technology, Inc. | Universal wafer carrier for wafer level die burn-in |
KR960007478B1 (ko) * | 1990-12-27 | 1996-06-03 | 가부시키가이샤 도시바 | 반도체장치 및 반도체장치의 제조방법 |
JP2925337B2 (ja) * | 1990-12-27 | 1999-07-28 | 株式会社東芝 | 半導体装置 |
DE69219165T2 (de) * | 1991-01-11 | 1997-08-07 | Texas Instruments Inc | Prüf- und Einbrennsystem für einen Wafer und Methode für deren Herstellung |
JPH04330755A (ja) * | 1991-02-27 | 1992-11-18 | Mitsubishi Electric Corp | 半導体集積回路およびそのエージング装置 |
US5391984A (en) * | 1991-11-01 | 1995-02-21 | Sgs-Thomson Microelectronics, Inc. | Method and apparatus for testing integrated circuit devices |
US5279975A (en) * | 1992-02-07 | 1994-01-18 | Micron Technology, Inc. | Method of testing individual dies on semiconductor wafers prior to singulation |
US5424651A (en) * | 1992-03-27 | 1995-06-13 | Green; Robert S. | Fixture for burn-in testing of semiconductor wafers, and a semiconductor wafer |
US5519193A (en) * | 1992-10-27 | 1996-05-21 | International Business Machines Corporation | Method and apparatus for stressing, burning in and reducing leakage current of electronic devices using microwave radiation |
US5399505A (en) * | 1993-07-23 | 1995-03-21 | Motorola, Inc. | Method and apparatus for performing wafer level testing of integrated circuit dice |
US5654588A (en) * | 1993-07-23 | 1997-08-05 | Motorola Inc. | Apparatus for performing wafer-level testing of integrated circuits where the wafer uses a segmented conductive top-layer bus structure |
US5594273A (en) * | 1993-07-23 | 1997-01-14 | Motorola Inc. | Apparatus for performing wafer-level testing of integrated circuits where test pads lie within integrated circuit die but overly no active circuitry for improved yield |
JPH07169807A (ja) * | 1993-12-16 | 1995-07-04 | Nippondenso Co Ltd | 半導体ウェハ |
DE4400118A1 (de) * | 1994-01-04 | 1995-07-06 | Siemens Ag | Verfahren zum Durchführen von Burn-in-Prozeduren an Halbleiterchips |
US6577148B1 (en) | 1994-08-31 | 2003-06-10 | Motorola, Inc. | Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer |
US5777486A (en) * | 1994-10-03 | 1998-07-07 | United Microelectronics Corporation | Electromigration test pattern simulating semiconductor components |
JP3734853B2 (ja) | 1995-06-27 | 2006-01-11 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
US5852581A (en) * | 1996-06-13 | 1998-12-22 | Micron Technology, Inc. | Method of stress testing memory integrated circuits |
JP3592885B2 (ja) * | 1997-03-31 | 2004-11-24 | シャープ株式会社 | 半導体集積回路装置 |
US5898706A (en) * | 1997-04-30 | 1999-04-27 | International Business Machines Corporation | Structure and method for reliability stressing of dielectrics |
US6233185B1 (en) | 1997-08-21 | 2001-05-15 | Micron Technology, Inc. | Wafer level burn-in of memory integrated circuits |
US7161175B2 (en) * | 1997-09-30 | 2007-01-09 | Jeng-Jye Shau | Inter-dice signal transfer methods for integrated circuits |
JPH11354721A (ja) | 1998-06-04 | 1999-12-24 | Mitsubishi Electric Corp | 半導体装置 |
KR100313185B1 (ko) * | 1998-09-29 | 2001-11-07 | 포만 제프리 엘 | 집적 회로 소자의 전기적 액세스 및 상호 접속 방법과 그 장치 |
DE59900130D1 (de) * | 1998-11-02 | 2001-07-26 | Atg Test Systems Gmbh | Vorrichtung zum prüfen von leiterplatten |
US6233184B1 (en) | 1998-11-13 | 2001-05-15 | International Business Machines Corporation | Structures for wafer level test and burn-in |
JP4234244B2 (ja) * | 1998-12-28 | 2009-03-04 | 富士通マイクロエレクトロニクス株式会社 | ウエハーレベルパッケージ及びウエハーレベルパッケージを用いた半導体装置の製造方法 |
KR100355225B1 (ko) * | 1999-07-12 | 2002-10-11 | 삼성전자 주식회사 | 교류 스트레스의 번-인 테스트가 가능한 집적회로 및 이를 이용한 테스트 방법 |
US6337576B1 (en) | 1999-07-19 | 2002-01-08 | Alpine Microsystems, Inc. | Wafer-level burn-in |
DE19936321C2 (de) * | 1999-08-02 | 2003-12-24 | Infineon Technologies Ag | Anordnung und Verfahren zum Testen einer Vielzahl von Halbleiterchips auf Waferebene |
US6603323B1 (en) * | 2000-07-10 | 2003-08-05 | Formfactor, Inc. | Closed-grid bus architecture for wafer interconnect structure |
JP2002033363A (ja) * | 2000-07-19 | 2002-01-31 | Hitachi Ltd | 半導体ウエハ、半導体チップ、および半導体装置の製造方法 |
US7042073B2 (en) | 2001-06-07 | 2006-05-09 | Renesas Technology Corp. | Semiconductor device and manufacturing method thereof |
KR100575882B1 (ko) * | 2003-11-26 | 2006-05-03 | 주식회사 하이닉스반도체 | 번인 테스트용 내부 전압 발생 장치 |
US9521375B2 (en) | 2010-01-26 | 2016-12-13 | Touchtunes Music Corporation | Digital jukebox device with improved user interfaces, and associated methods |
JP5375834B2 (ja) | 2008-12-26 | 2013-12-25 | 日本電気株式会社 | 半導体装置およびそのテスト方法 |
CA2754990C (en) | 2009-03-18 | 2015-07-14 | Touchtunes Music Corporation | Entertainment server and associated social networking services |
US8274301B2 (en) * | 2009-11-02 | 2012-09-25 | International Business Machines Corporation | On-chip accelerated failure indicator |
DE112014003371T5 (de) | 2013-07-22 | 2016-04-07 | Murata Manufacturing Co., Ltd. | Oberflächenemitter-array |
CN112907655B (zh) * | 2021-02-08 | 2021-12-17 | 深圳信息职业技术学院 | Ic烧录的定位方法、***、终端设备及计算机存储介质 |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3781683A (en) * | 1971-03-30 | 1973-12-25 | Ibm | Test circuit configuration for integrated semiconductor circuits and a test system containing said configuration |
US3890611A (en) * | 1972-01-24 | 1975-06-17 | Analog Devices Inc | Constant-current digital-to-analog converter |
US3849872A (en) * | 1972-10-24 | 1974-11-26 | Ibm | Contacting integrated circuit chip terminal through the wafer kerf |
US4038648A (en) * | 1974-06-03 | 1977-07-26 | Chesley Gilman D | Self-configurable circuit structure for achieving wafer scale integration |
GB1487945A (en) * | 1974-11-20 | 1977-10-05 | Ibm | Semiconductor integrated circuit devices |
US4281449A (en) * | 1979-12-21 | 1981-08-04 | Harris Corporation | Method for qualifying biased burn-in integrated circuits on a wafer level |
US4467400A (en) * | 1981-01-16 | 1984-08-21 | Burroughs Corporation | Wafer scale integrated circuit |
US4479088A (en) * | 1981-01-16 | 1984-10-23 | Burroughs Corporation | Wafer including test lead connected to ground for testing networks thereon |
US4413271A (en) * | 1981-03-30 | 1983-11-01 | Sprague Electric Company | Integrated circuit including test portion and method for making |
EP0072690A3 (de) * | 1981-08-17 | 1983-11-09 | Fujitsu Limited | MIS Halbleiteranordnung und Verfahren zu deren Herstellung |
JPS5911661A (ja) * | 1982-07-13 | 1984-01-21 | Nec Corp | 集積回路 |
JPS59172243A (ja) * | 1983-03-18 | 1984-09-28 | Nippon Denso Co Ltd | Icウエハ |
DE3481958D1 (de) * | 1983-05-24 | 1990-05-17 | Toshiba Kawasaki Kk | Integrierte halbleiterschaltungsanordnung. |
DE3483137D1 (de) * | 1983-11-30 | 1990-10-11 | Fujitsu Ltd | Ec-torfeld. |
JPS60140842A (ja) * | 1983-12-28 | 1985-07-25 | Nec Corp | 半導体装置 |
JPH0714002B2 (ja) * | 1984-05-15 | 1995-02-15 | セイコーエプソン株式会社 | チップへの信号供給方法 |
EP0170052B1 (de) * | 1984-07-02 | 1992-04-01 | Fujitsu Limited | Halbleiterschaltungsanordnung in Hauptscheibentechnik |
SU1250997A1 (ru) * | 1984-10-01 | 1986-08-15 | Предприятие П/Я Р-6668 | Способ контрол интегральных микросхем |
US4721495A (en) * | 1985-09-01 | 1988-01-26 | Nippon Seiko Kabushiki Kaisha | Autotensioner |
JPS6295853A (ja) * | 1985-10-22 | 1987-05-02 | Nec Corp | 半導体集積回路 |
US4813017A (en) * | 1985-10-28 | 1989-03-14 | International Business Machines Corportion | Semiconductor memory device and array |
JPH0740583B2 (ja) * | 1986-03-24 | 1995-05-01 | 日立コンピユ−タエンジニアリング株式会社 | 半導体装置の試験方法及びその実施用ウエハ |
JPS6343344A (ja) * | 1986-08-08 | 1988-02-24 | Nec Corp | マスタスライス方式lsiのブロツク |
JPS63213965A (ja) * | 1987-03-03 | 1988-09-06 | Mitsubishi Electric Corp | 半導体装置 |
US4910574A (en) * | 1987-04-30 | 1990-03-20 | Ibm Corporation | Porous circuit macro for semiconductor integrated circuits |
JPS63300530A (ja) * | 1987-05-29 | 1988-12-07 | Nec Corp | 集積回路 |
JP2606845B2 (ja) * | 1987-06-19 | 1997-05-07 | 富士通株式会社 | 半導体集積回路 |
JPS6435934A (en) * | 1987-07-30 | 1989-02-07 | Hitachi Ltd | Semiconductor integrated circuit device |
US4812742A (en) * | 1987-12-03 | 1989-03-14 | Unisys Corporation | Integrated circuit package having a removable test region for testing for shorts and opens |
JPH01239950A (ja) * | 1988-03-22 | 1989-09-25 | Mitsubishi Electric Corp | 半導体ウエハ |
JPH01298733A (ja) * | 1988-05-27 | 1989-12-01 | Fujitsu Ltd | 自走機能内蔵集積回路 |
US5014110A (en) * | 1988-06-03 | 1991-05-07 | Mitsubishi Denki Kabushiki Kaisha | Wiring structures for semiconductor memory device |
JPH0227467A (ja) * | 1988-07-16 | 1990-01-30 | Fuji Electric Co Ltd | 演算装置間の同期方法 |
JP2746925B2 (ja) * | 1988-08-04 | 1998-05-06 | 株式会社リコー | 画像形成装置 |
JPH039364A (ja) * | 1989-06-06 | 1991-01-17 | Toshiba Corp | 電子写真感光体 |
JP2508288B2 (ja) * | 1989-08-30 | 1996-06-19 | 三菱電機株式会社 | 半導体記憶装置 |
JPH03106029A (ja) * | 1989-09-20 | 1991-05-02 | Fujitsu Ltd | ウエハ・スケール・ic |
US5070296A (en) * | 1990-06-22 | 1991-12-03 | Honeywell Inc. | Integrated circuit interconnections testing |
US5059899A (en) * | 1990-08-16 | 1991-10-22 | Micron Technology, Inc. | Semiconductor dies and wafers and methods for making |
-
1989
- 1989-06-30 JP JP1169659A patent/JP2585799B2/ja not_active Expired - Fee Related
-
1990
- 1990-06-29 DE DE69030283T patent/DE69030283T2/de not_active Expired - Fee Related
- 1990-06-29 EP EP90112467A patent/EP0405586B1/de not_active Expired - Lifetime
- 1990-06-29 KR KR1019900009729A patent/KR940006577B1/ko not_active IP Right Cessation
- 1990-07-02 US US07/547,036 patent/US5138427A/en not_active Expired - Lifetime
-
1992
- 1992-08-10 US US07/926,432 patent/US5294776A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2585799B2 (ja) | 1997-02-26 |
EP0405586A1 (de) | 1991-01-02 |
EP0405586B1 (de) | 1997-03-26 |
KR910001975A (ko) | 1991-01-31 |
KR940006577B1 (ko) | 1994-07-22 |
US5294776A (en) | 1994-03-15 |
JPH0334555A (ja) | 1991-02-14 |
DE69030283T2 (de) | 1997-08-07 |
US5138427A (en) | 1992-08-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |