DE69510023T2 - Gerät und Verfahren zum Reinigen von Fotomasken - Google Patents

Gerät und Verfahren zum Reinigen von Fotomasken

Info

Publication number
DE69510023T2
DE69510023T2 DE69510023T DE69510023T DE69510023T2 DE 69510023 T2 DE69510023 T2 DE 69510023T2 DE 69510023 T DE69510023 T DE 69510023T DE 69510023 T DE69510023 T DE 69510023T DE 69510023 T2 DE69510023 T2 DE 69510023T2
Authority
DE
Germany
Prior art keywords
particle
contaminants
probe
target object
contaminant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69510023T
Other languages
English (en)
Other versions
DE69510023D1 (de
Inventor
Wilhelm Maurer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qimonda AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Application granted granted Critical
Publication of DE69510023D1 publication Critical patent/DE69510023D1/de
Publication of DE69510023T2 publication Critical patent/DE69510023T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Cleaning In General (AREA)
DE69510023T 1994-12-27 1995-12-19 Gerät und Verfahren zum Reinigen von Fotomasken Expired - Lifetime DE69510023T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US36416594A 1994-12-27 1994-12-27

Publications (2)

Publication Number Publication Date
DE69510023D1 DE69510023D1 (de) 1999-07-08
DE69510023T2 true DE69510023T2 (de) 1999-10-21

Family

ID=23433334

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69510023T Expired - Lifetime DE69510023T2 (de) 1994-12-27 1995-12-19 Gerät und Verfahren zum Reinigen von Fotomasken

Country Status (8)

Country Link
US (1) US5634230A (de)
EP (1) EP0720050B1 (de)
JP (1) JP2831607B2 (de)
KR (1) KR100485024B1 (de)
AT (1) ATE180901T1 (de)
DE (1) DE69510023T2 (de)
HK (1) HK1004992A1 (de)
TW (1) TW285721B (de)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6353219B1 (en) 1994-07-28 2002-03-05 Victor B. Kley Object inspection and/or modification system and method
US6337479B1 (en) * 1994-07-28 2002-01-08 Victor B. Kley Object inspection and/or modification system and method
US6339217B1 (en) 1995-07-28 2002-01-15 General Nanotechnology Llc Scanning probe microscope assembly and method for making spectrophotometric, near-field, and scanning probe measurements
US5751683A (en) * 1995-07-24 1998-05-12 General Nanotechnology, L.L.C. Nanometer scale data storage device and associated positioning system
EP1012584A4 (de) * 1997-01-21 2006-10-04 Rave L L C Vorrichtung zur kontrollie und/oder veränderung von gegenständen.
US6076216A (en) * 1997-08-04 2000-06-20 Ben-Gurion University Of Negev Apparatus for dust removal from surfaces
US5938860A (en) 1997-08-28 1999-08-17 Micron Technology, Inc. Reticle cleaning without damaging pellicle
JP3920429B2 (ja) * 1997-12-02 2007-05-30 株式会社ルネサステクノロジ 位相シフトフォトマスクの洗浄方法および洗浄装置
US7196328B1 (en) 2001-03-08 2007-03-27 General Nanotechnology Llc Nanomachining method and apparatus
US6802646B1 (en) 2001-04-30 2004-10-12 General Nanotechnology Llc Low-friction moving interfaces in micromachines and nanomachines
US6752008B1 (en) 2001-03-08 2004-06-22 General Nanotechnology Llc Method and apparatus for scanning in scanning probe microscopy and presenting results
US6787768B1 (en) 2001-03-08 2004-09-07 General Nanotechnology Llc Method and apparatus for tool and tip design for nanomachining and measurement
DE19815872C1 (de) * 1998-04-08 1999-07-15 Siemens Ag Musterzeichner für Maskenblank
US6356653B2 (en) * 1998-07-16 2002-03-12 International Business Machines Corporation Method and apparatus for combined particle location and removal
GB9821826D0 (en) * 1998-10-08 1998-12-02 Magna Specialist Confectioners Moulding hollow articles
IL127720A0 (en) 1998-12-24 1999-10-28 Oramir Semiconductor Ltd Local particle cleaning
AU6061100A (en) * 1999-07-01 2001-01-22 General Nanotechnology, Llc Object inspection and/or modification system and method
US6827816B1 (en) * 1999-12-16 2004-12-07 Applied Materials, Inc. In situ module for particle removal from solid-state surfaces
DE10039337A1 (de) * 2000-08-04 2002-02-28 Infineon Technologies Ag Kombination von abtastenden und abbildenden Methoden bei der Überprüfung von Photomasken
JP3479838B2 (ja) * 2000-10-19 2003-12-15 日本電気株式会社 パターン修正方法及びパターン修正装置
US6931710B2 (en) 2001-01-30 2005-08-23 General Nanotechnology Llc Manufacturing of micro-objects such as miniature diamond tool tips
US20020170897A1 (en) * 2001-05-21 2002-11-21 Hall Frank L. Methods for preparing ball grid array substrates via use of a laser
US7053369B1 (en) * 2001-10-19 2006-05-30 Rave Llc Scan data collection for better overall data accuracy
US6813937B2 (en) 2001-11-28 2004-11-09 General Nanotechnology Llc Method and apparatus for micromachines, microstructures, nanomachines and nanostructures
EP1329770A1 (de) * 2002-01-18 2003-07-23 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
US7008487B1 (en) 2002-03-04 2006-03-07 Micron Technology, Inc. Method and system for removal of contaminates from phaseshift photomasks
JP2003302745A (ja) * 2002-04-12 2003-10-24 Dainippon Printing Co Ltd 異物の無害化方法
US6948537B2 (en) 2002-05-31 2005-09-27 John Jones Systems and methods for collecting a particulate substance
JP2005538855A (ja) * 2002-09-09 2005-12-22 ジェネラル ナノテクノロジー エルエルシー 走査型プローブ顕微鏡の流体送達
US6829035B2 (en) * 2002-11-12 2004-12-07 Applied Materials Israel, Ltd. Advanced mask cleaning and handling
JP2005084582A (ja) * 2003-09-11 2005-03-31 Sii Nanotechnology Inc フォトマスクのパーティクル除去方法
WO2005116758A2 (en) * 2004-05-28 2005-12-08 Koninklijke Philips Electronics N.V. Cleaning a mask substrate
JP4739244B2 (ja) * 2007-01-23 2011-08-03 エスアイアイ・ナノテクノロジー株式会社 パーティクル除去方法
US7993464B2 (en) * 2007-08-09 2011-08-09 Rave, Llc Apparatus and method for indirect surface cleaning
US11311917B2 (en) 2007-08-09 2022-04-26 Bruker Nano, Inc. Apparatus and method for contamination identification
US8287653B2 (en) * 2007-09-17 2012-10-16 Rave, Llc Debris removal in high aspect structures
US10330581B2 (en) 2007-09-17 2019-06-25 Rave Llc Debris removal from high aspect structures
US10618080B2 (en) 2007-09-17 2020-04-14 Bruker Nano, Inc. Debris removal from high aspect structures
US10384238B2 (en) 2007-09-17 2019-08-20 Rave Llc Debris removal in high aspect structures
US20090183322A1 (en) * 2008-01-17 2009-07-23 Banqiu Wu Electrostatic surface cleaning
KR101053450B1 (ko) * 2008-09-26 2011-08-03 참엔지니어링(주) 마스크 리페어 장치 및 방법
TWI369546B (en) 2008-12-03 2012-08-01 Au Optronics Corp Light guide plate microstructure
JP2010210527A (ja) * 2009-03-11 2010-09-24 Horiba Ltd 異物検査除去装置及び異物検査除去プログラム
JP5481401B2 (ja) 2011-01-14 2014-04-23 株式会社日立ハイテクノロジーズ 走査電子顕微鏡
JP6045787B2 (ja) * 2011-12-05 2016-12-14 Ntn株式会社 異物除去装置および異物除去方法
US10459353B2 (en) 2013-03-15 2019-10-29 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography system with an embedded cleaning module
DE102014020027B3 (de) 2013-03-15 2023-03-09 Taiwan Semiconductor Manufacturing Company, Ltd. Lithographiesystem mit eingebettetem reinigungsmodul sowie verfahren
CN105467777A (zh) * 2015-12-14 2016-04-06 深圳市华星光电技术有限公司 曝光机及光罩洁净设备
TWI770024B (zh) * 2016-05-20 2022-07-11 美商瑞弗股份有限公司 決定粒子及從基板移除之粒子的組成物的方法
TWI787181B (zh) * 2016-05-20 2022-12-21 美商瑞弗股份有限公司 從高深寬比結構移除碎片
DE102017208103A1 (de) * 2017-05-15 2018-11-15 Bayerische Motoren Werke Aktiengesellschaft Verfahren zur automatischen Entfernung von Fremdkörpern aus einer flüssigen Beschichtung eines Substrats
EP3655819A1 (de) * 2017-07-21 2020-05-27 Carl Zeiss SMT GmbH Verfahren und vorrichtungen zur entsorgung von überschüssigem material einer fotolithografischen maske
DE102018206278A1 (de) 2018-04-24 2019-10-24 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Entfernen eines Partikels von einer photolithographischen Maske
DE102018210098B4 (de) 2018-06-21 2022-02-03 Carl Zeiss Smt Gmbh Vorrichtung und Verfahren zum Untersuchen und/oder zum Bearbeiten einer Probe
US11062898B2 (en) 2018-07-30 2021-07-13 Taiwan Semiconductor Manufacturing Co., Ltd. Particle removal apparatus, particle removal system and particle removal method
US11017996B2 (en) * 2019-04-05 2021-05-25 Asm Technology Singapore Pte Ltd Automated particle removal system
US11600484B2 (en) * 2019-08-22 2023-03-07 Taiwan Semiconductor Manufacturing Company Ltd. Cleaning method, semiconductor manufacturing method and a system thereof
JP6827509B1 (ja) * 2019-10-11 2021-02-10 浜松ホトニクス株式会社 ミラーデバイスの製造方法、及び、ミラーユニットの製造方法
CN112230511A (zh) * 2020-10-21 2021-01-15 上海华力集成电路制造有限公司 光罩防护薄膜表面上的污染颗粒去除方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3877371A (en) * 1972-09-28 1975-04-15 Precision Screen Machines Screen printing lint removing apparatus and method
JPS5938090B2 (ja) * 1981-02-12 1984-09-13 一雄 坂東 プラスチック成形金型面のクリ−ニング装置
DE3145278C2 (de) * 1981-11-14 1985-02-14 Schott-Zwiesel-Glaswerke Ag, 8372 Zwiesel Verfahren zum berührungslosen Abtragen von Material von der Oberfläche eines Glasgegenstandes und Vorrichtung zur Durchführung des Verfahrens
JPH0750664B2 (ja) * 1983-06-23 1995-05-31 富士通株式会社 レチクルの検査方法
US4470508A (en) * 1983-08-19 1984-09-11 Micro Lithography, Inc. Dustfree packaging container and method
US4715392A (en) * 1983-11-10 1987-12-29 Nippon Kogaku K. K. Automatic photomask or reticle washing and cleaning system
JPS61159730A (ja) * 1985-01-08 1986-07-19 Oki Electric Ind Co Ltd エマルジヨンマスクのパ−テイクル除去方法
US4776462A (en) * 1985-09-27 1988-10-11 Canon Kabushiki Kaisha Container for a sheet-like article
JP2531581B2 (ja) * 1985-10-30 1996-09-04 ダイセル化学工業株式会社 光デイスクの表面浄化方法および浄化具
US4677704A (en) * 1986-04-22 1987-07-07 Huggins Richard A Cleaning system for static charged semiconductor wafer surface
JPS62272258A (ja) * 1986-05-21 1987-11-26 Hitachi Ltd 異物除去装置
US4737387A (en) * 1986-07-07 1988-04-12 Yen Yung Tsai Removable pellicle and method
JPH0695508B2 (ja) * 1986-11-28 1994-11-24 大日本スクリ−ン製造株式会社 基板の両面洗浄装置
US4744833A (en) * 1987-06-11 1988-05-17 International Business Machines Corporation Electrostatic removal of contaminants
DE3721940A1 (de) * 1987-07-02 1989-01-12 Ibm Deutschland Entfernen von partikeln von oberflaechen fester koerper durch laserbeschuss
JP2642637B2 (ja) * 1987-08-18 1997-08-20 三井石油化学工業 株式会社 防塵膜
JPH02244046A (ja) * 1988-11-22 1990-09-28 Seiko Epson Corp フォトマスク及び半導体装置の製造方法
US5000203A (en) * 1989-04-07 1991-03-19 Nitto Denko Corp. Foreign matter removing method
CA2031776A1 (en) * 1989-12-08 1991-06-09 Masanori Nishiguchi Pickup method and the pickup apparatus for chip-type part
JPH03204648A (ja) * 1990-01-08 1991-09-06 Seiko Epson Corp 異物除去方法
US5023424A (en) * 1990-01-22 1991-06-11 Tencor Instruments Shock wave particle removal method and apparatus
JPH03231248A (ja) * 1990-02-06 1991-10-15 Seiko Epson Corp 異物検査装置及び露光装置
US5168001A (en) * 1991-05-20 1992-12-01 E. I. Du Pont De Nemours And Company Perfluoropolymer coated pellicle
JP3089590B2 (ja) * 1991-07-12 2000-09-18 キヤノン株式会社 板状物収納容器およびその蓋開口装置
JPH0629175A (ja) * 1992-07-08 1994-02-04 Seiko Epson Corp マスク異物検査装置と半導体装置の製造方法
JPH0627643A (ja) * 1992-07-08 1994-02-04 Seiko Epson Corp フォトマスクおよび半導体装置の製造方法
JP3200776B2 (ja) * 1992-08-06 2001-08-20 大日本印刷株式会社 基板保持用ケース
US5361453A (en) * 1992-09-11 1994-11-08 Gerber Garment Technology, Inc. Bristle bed cleaner for sheet material cutting machine
JP3251665B2 (ja) * 1992-11-12 2002-01-28 大日本印刷株式会社 位相シフト層を有するフォトマスクの修正方法
JPH06273922A (ja) * 1993-03-22 1994-09-30 Nippon Precision Circuits Kk マスク保護用ペリクル
US5350428A (en) * 1993-06-17 1994-09-27 Vlsi Technology, Inc. Electrostatic apparatus and method for removing particles from semiconductor wafers

Also Published As

Publication number Publication date
EP0720050A2 (de) 1996-07-03
KR960026110A (ko) 1996-07-22
JPH08254817A (ja) 1996-10-01
JP2831607B2 (ja) 1998-12-02
EP0720050B1 (de) 1999-06-02
KR100485024B1 (ko) 2005-08-03
ATE180901T1 (de) 1999-06-15
TW285721B (de) 1996-09-11
HK1004992A1 (en) 1998-12-18
EP0720050A3 (de) 1996-11-20
US5634230A (en) 1997-06-03
DE69510023D1 (de) 1999-07-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: QIMONDA AG, 81739 MUENCHEN, DE