CN102647858A - Processing method of printed circuit board (PCB) - Google Patents
Processing method of printed circuit board (PCB) Download PDFInfo
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- CN102647858A CN102647858A CN2012101512968A CN201210151296A CN102647858A CN 102647858 A CN102647858 A CN 102647858A CN 2012101512968 A CN2012101512968 A CN 2012101512968A CN 201210151296 A CN201210151296 A CN 201210151296A CN 102647858 A CN102647858 A CN 102647858A
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- pcb board
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Abstract
The invention belongs to the technical field of printed circuit board (PCB) processing, and particularly discloses a processing method of a PCB. The technology breaks through the conventional chemistry copper vertical deposition method, and adopts a carbon film deposition horizontal continuous production method. The processing method provided by the invention comprises the following steps: acid cleaning, oil removal, bulking, gel removal, hole finishing, preimpregnation, carbon deposition, board electroplating, outer-layer line manufacture and the like. The goal of breakover of an inner layer and an outer layer through a layer of carbon film deposited on a hole wall is achieved. For the breakover of the hole of the PCB manufactured by adopting the method provided by the invention, the process is simplified, the production period is shortened and the manufacturing cost is saved.
Description
Technical field
The invention belongs to the PCB processing technique field, be specifically related to the pcb board processing method that a kind of conductivity of utilizing carbon dust makes the hole conducting.
Background technology
PCB (Printed Circuit Board), Chinese is a printed wiring board, is called for short printed board, is one of vitals of electronics industry.Every kind of electronic equipment almost arrives computer greatly to electronic watch, calculator for a short time, the communication electronic equipment, and military armament systems as long as electronic devices and components such as integrated circuit are arranged, for the electric interconnection between them, all will use printed board.
In the pcb board production and processing that through hole is arranged; It is exactly the hole metallization flow process that a key link is arranged; This process makes non-conductive insulated vias be converted into active conductive through hole; And the method for existing P CB plate making hole conducting is PTH (electroless copper plating through hole) technology, and its technological process is: material loading → bulk → secondary or three stage countercurrent rinsing → de-smears → recovery hot water wash → secondary countercurrent rinsing → neutralization/reduction → secondary countercurrent rinsing → whole hole/alkaline degreasing → secondary or three stage countercurrent rinsings → little erosion alligatoring → secondary countercurrent rinsing → preimpregnation → activation → secondary countercurrent rinsing city washing → shortization → secondary countercurrent rinsing city washing → heavy copper → secondary countercurrent rinsing city's washing → blanking.This complex process, the production cycle is long, and cost is high.
Summary of the invention
In order to simplify working process, shorten the production cycle, practice thrift manufacturing cost, the object of the present invention is to provide a kind of pcb board processing method that adopts the carbon film through hole.
For realizing the foregoing invention purpose, technical scheme that the present invention adopts is following:
A kind of pcb board processing method comprises plate plating and outer-layer circuit making step, and is further comprising the steps of before said plate plating step:
Pickling cleaning: the oxide layer of removing copper face with the aqueous sulfuric acid of 3-5%;
Oil removing: the alkaline aqueous solution clear board face greasy dirt that uses 3-5%;
Bulk, remove glue, whole hole: in two adjacent grooves, working concentration is 7 ~ 9% liquor potassic permanganate, adopts the immersion type level to work continuously, and the cinder in the hole is removed;
Preimpregnation: adopt the immersion type level to work continuously, use pure water and activator to soak into the pcb board hole wall;
Carbon laydown: will pass through carbon film solution with certain speed through overpickling cleaning, oil removing, pcb board bulk, that remove glue, whole hole, preimpregnation, and on hole wall, bear one deck carbon film, and accomplish the conducting of ectonexine.
In the said pcb board processing method, said pickling cleaning temperature is a normal temperature, and pressure is the 3-4 kilograms per square centimetres.
In the said pcb board processing method, said deoiling step temperature is 45-55 ℃, pressure 3-4 kilograms per square centimetres.
In the said pcb board processing method, said bulk, remove glue, whole hole step temperature is controlled at 75-85 ℃.
In the said pcb board processing method, said preimpregnation step temperature is controlled at 55-65 ℃.
In the said pcb board processing method; The carbon film solution main component that said carbon laydown step is adopted is: carbon dust, deionized water, anticoagulant and resin additive; Pcb board is 3.5 meters/minute through the speed of carbon film solution, and the carbon film solution temperature is 60 ℃, and carbon film thickness is 10-15u.
In the said pcb board processing method, said plate plating step specifically: on pcb board, add thick copper layer through the means of electroplating.
In the said pcb board processing method, said outer-layer circuit is made, and adopts negative film technology to make outer-layer circuit at the pcb board face, and is specific as follows:
Attach one deck dry film etching resistance agent at whole pcb board face;
Film base plate is being alignd with pcb board, and the dry film on the pcb board is made public and develops;
Utilize acidic etching liquid that the unnecessary copper of pcb board face is etched away;
Outer-layer circuit is exposed in the dry film removal that is attached to the pcb board face.
In the said pcb board processing method, the speed of said acid etching is 3 meters per minutes.
In the said pcb board processing method, said acidic etching liquid is hydrochloric acid, copper ion.
The present invention utilizes the conductivity of carbon dust to make non-conductive insulated vias be converted into active conductive through hole through the carbon film deposition process, has simplified production process, has shortened the production cycle, has reduced production cost.
Embodiment
To combine the practical implementation method to specify the present invention below, be used for explaining the present invention in schematic enforcement of the present invention and explanation, but not as to qualification of the present invention.
The invention discloses a kind of hole conducting processing method, comprise the step below the order execution:
Step1: the pickling cleaning, at normal temperature, pressure is under the 3-4 kilograms per square centimetres; Through using the aqueous sulfuric acid of concentration as 3-5%; Depress in adding of motor, aqueous sulfuric acid sprays the plate face up and down uniformly, through redox reaction the oxide layer of copper face is removed; 3 grades of washings subsequently are clean with the residual pickling of plate face, avoid taking out of the degreasing tank that pollutes the back.
Step2: oil removing is the alkaline aqueous solution of 3-5% through working concentration, depresses in adding of motor; Alkaline aqueous solution sprays the plate face up and down uniformly; Through the oil removal of redox reaction with copper face, the residual liquid medicine of plate face is cleaned in 3 grades of washings subsequently, avoids taking out of the bulk groove that pollutes the back.
Step3: bulk, remove glue, whole hole; In two adjacent solution tanks, working concentration is 7 ~ 9% liquor potassic permanganate, and the control temperature is at 75-85 ℃; Pcb board adopts the immersion type level mode of working continuously the cinder in the hole to be removed during through this solution; Play the effect of cleaning hole wall, Purge holes, for the deposition of carbon film provides the carrier of cleaning, the quality problem that prevention hole copper separates with hole wall.
Step4: preimpregnation, adopt the immersion type level to work continuously, use pure water and activator to soak into the pcb board hole wall, for making follow-up carbon laydown easier, wherein, temperature is controlled at 55-65 ℃.
Step5: carbon laydown; Will through overpickling cleaning, oil removing, bulk, through carbon film solution, described carbon film solution main component is with certain speed for the pcb board that removes glue, whole hole, preimpregnation: carbon dust, DI water, anticoagulant and resin additive, pcb board with 3.5 meters/minute speed through placing the carbon film solution in the carbon film through-hole groove; Said carbon film solution is warming up to 60 ℃; On hole wall, will bear one deck carbon film, thickness is 10-15u, like this; Be deposited on one deck carbon film on the hole wall, make conducting between each layer of pcb board;
Step6: plate is electroplated: before plate is electroplated, must the pcb board oven dry and the resistance of carbon film deposition be measured its quality, the colory pcb board of carbon laydown is added thick copper layer through the means of electroplating.
Step7: outer-layer circuit is made: adopt negative film technology to make outer-layer circuit at the pcb board face, specific as follows:
Attach one deck dry film etching resistance agent at whole pcb board face;
Film base plate is being alignd with pcb board, and the dry film on the pcb board is made public and develops;
Utilize acidic etching liquid that the unnecessary copper of pcb board face is etched away, the speed of said acid etching is 3 meters per minutes, and said acidic etching liquid is hydrochloric acid, copper ion;
Outer-layer circuit is exposed in the dry film removal that is attached to the pcb board face.
Its detailed process flow is:
Horizontal line advances plate → pickling → three grade city's washing → oil removing → three grade high-pressure washing → bulk → three grade deionization to be washed → except that glue → three grade deionized water → whole hole → three grades of deionized water washing → preimpregnation → three grade washing → carbon laydown → three grades of deionizations washing → (oven dry, resistance measurement) → plate plating → outer-layer circuit negative film technologies making
Make hole conducting contrast as follows through said method and existing process:
One, PTH and carbon film technology production cost contrast
| Method and flow process contrast | The hole conducting | Plate is electroplated | Outer-layer circuit | Graphic plating | Add up to |
| The PTH production cost (unit/SF) | 1.5 | 2.2 | 3.5 | 3.8 | 11 |
| The carbon technology production cost (unit/SF) | 0.7 | 0 | 3.5 | 4.9 | 9.1 |
Two, production cycle contrast
Three, produce quality estimating:
Can know by last table contrast:
Two kinds of schemes of the present invention and PTH technology show that through contrast it adopts the carbon film technology to make the hole conducting, in the production cycle, obviously is superior to PTH technology on the production cost, and has simplified operation, has improved production efficiency.
More than the technical scheme that the embodiment of the invention provided has been carried out detailed introduction; Used concrete example among this paper the principle and the execution mode of the embodiment of the invention are set forth, the explanation of above embodiment only is applicable to the principle that helps to understand the embodiment of the invention; Simultaneously, for one of ordinary skill in the art, according to the embodiment of the invention, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (9)
1. a pcb board processing method comprises that plate is electroplated and outer-layer circuit is made, and it is characterized in that, and is further comprising the steps of before said plate plating step:
Pickling cleaning: the oxide layer of removing copper face with the aqueous sulfuric acid of 3-5%;
Oil removing: the alkaline aqueous solution clear board face greasy dirt that uses 3-5%;
Bulk, remove glue, whole hole: in two adjacent grooves, working concentration is 7 ~ 9% liquor potassic permanganate, adopts the immersion type level to work continuously, and the cinder in the hole is removed;
Preimpregnation: adopt the immersion type level to work continuously, use pure water and activator to soak into the pcb board hole wall;
Carbon laydown: will pass through carbon film solution with certain speed through overpickling cleaning, oil removing, pcb board bulk, that remove glue, whole hole, preimpregnation, and on hole wall, bear one deck carbon film, and accomplish the conducting of ectonexine.
2. pcb board processing method according to claim 1 is characterized in that, in the said pickling cleaning, temperature is a normal temperature, and pressure is the 3-4 kilograms per square centimetres.
3. pcb board processing method according to claim 1 is characterized in that, in the said deoiling step, temperature is 45-55 ℃, and pressure is the 3-4 kilograms per square centimetres.
4. pcb board processing method according to claim 1 is characterized in that, said bulk, remove in glue, the whole hole step, adopt the horizontal operation of immersion type, temperature is controlled at 75-85 ℃.
5. pcb board processing method according to claim 1 is characterized in that, temperature is controlled at 55-65 ℃ in the said preimpregnation step.
6. pcb board processing method according to claim 1; It is characterized in that; The carbon film solution main component that is adopted in the said carbon laydown step is: carbon dust, deionized water, anticoagulant and resin additive; Pcb board is 3.5 meters/minute through the speed of carbon film solution in the said carbon laydown step, and the carbon film solution temperature is 60 ℃ in the said carbon laydown step, and said carbon film thickness is 10-15u.
7. according to the described pcb board processing method of claim 1-6, it is characterized in that, the plate plating step specifically: on pcb board, add thick copper layer through the means of electroplating.
8. according to the described pcb board processing method of claim 1-6, it is characterized in that said outer-layer circuit is made, adopt negative film technology to make outer-layer circuit at the pcb board face, specific as follows:
Attach one deck dry film etching resistance agent at whole pcb board face;
Film base plate is being alignd with pcb board, and the dry film on the pcb board is made public and develops;
Utilize acidic etching liquid that the unnecessary copper of pcb board face is etched away;
Outer-layer circuit is exposed in the dry film removal that is attached to the pcb board face.
9. in the said according to Claim 8 pcb board processing method, the speed of said acid etching is 3 meters per minutes, and said acidic etching liquid is hydrochloric acid, copper ion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101512968A CN102647858A (en) | 2012-05-15 | 2012-05-15 | Processing method of printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101512968A CN102647858A (en) | 2012-05-15 | 2012-05-15 | Processing method of printed circuit board (PCB) |
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| CN102647858A true CN102647858A (en) | 2012-08-22 |
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| CN2012101512968A Pending CN102647858A (en) | 2012-05-15 | 2012-05-15 | Processing method of printed circuit board (PCB) |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103533776A (en) * | 2013-09-18 | 2014-01-22 | 金悦通电子（翁源）有限公司 | Method for manufacturing embedded PCB (printed circuit board) |
| CN104378930A (en) * | 2013-08-14 | 2015-02-25 | 四川海英电子科技有限公司 | Electric manufacturing method for two-sided copper deposition plate of PCB |
| CN104411107A (en) * | 2014-11-05 | 2015-03-11 | 深圳恒宝士线路板有限公司 | PCB electrogilding technology |
| CN104735927A (en) * | 2013-12-20 | 2015-06-24 | 深圳崇达多层线路板有限公司 | PCB glue removing method in mode of vertically depositing copper wires |
| CN106535476A (en) * | 2016-10-31 | 2017-03-22 | 芜湖赋兴光电有限公司 | Glue refuse removal technology after drilling of flexible circuit board of camera module |
| CN106559958A (en) * | 2016-11-22 | 2017-04-05 | 奥士康精密电路（惠州）有限公司 | A kind of method for lifting heavy copper cash production capacity |
| CN106591907A (en) * | 2016-10-14 | 2017-04-26 | 江门崇达电路技术有限公司 | Copper plating method for PCB production process |
| CN107172830A (en) * | 2017-07-24 | 2017-09-15 | 泰州市博泰电子有限公司 | A kind of hole method of low intermodulation high-frequency model circuit board |
| CN109862709A (en) * | 2019-02-21 | 2019-06-07 | 深圳崇达多层线路板有限公司 | A kind of production method for improving electric platinum plating leakage and getting rid of platinum problem |
| CN112804821A (en) * | 2020-12-14 | 2021-05-14 | 中山市宝悦嘉电子有限公司 | Selective electrogilding process for PCB (printed circuit board) |
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| CN1063395A (en) * | 1991-01-10 | 1992-08-05 | 机械电子工业部第十五研究所 | The non-chemical plating hole metallizing process-hole blackening method |
| CN1733980A (en) * | 2004-08-02 | 2006-02-15 | 吕桂生 | Electricity conductive liquid capable of directly galvanizing the printed board |
| CN101394712A (en) * | 2007-09-21 | 2009-03-25 | 清华大学 | Hole blackening solution and preparation thereof |
| CN101841979A (en) * | 2009-03-13 | 2010-09-22 | 味之素株式会社 | Be coated with the laminated plate of metal |
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| CN1733980A (en) * | 2004-08-02 | 2006-02-15 | 吕桂生 | Electricity conductive liquid capable of directly galvanizing the printed board |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104378930A (en) * | 2013-08-14 | 2015-02-25 | 四川海英电子科技有限公司 | Electric manufacturing method for two-sided copper deposition plate of PCB |
| CN104378930B (en) * | 2013-08-14 | 2017-11-24 | 四川海英电子科技有限公司 | The two-sided sink copper plate electric manufacture methods of PCB |
| CN103533776A (en) * | 2013-09-18 | 2014-01-22 | 金悦通电子（翁源）有限公司 | Method for manufacturing embedded PCB (printed circuit board) |
| CN104735927A (en) * | 2013-12-20 | 2015-06-24 | 深圳崇达多层线路板有限公司 | PCB glue removing method in mode of vertically depositing copper wires |
| CN104411107A (en) * | 2014-11-05 | 2015-03-11 | 深圳恒宝士线路板有限公司 | PCB electrogilding technology |
| CN106591907A (en) * | 2016-10-14 | 2017-04-26 | 江门崇达电路技术有限公司 | Copper plating method for PCB production process |
| CN106535476A (en) * | 2016-10-31 | 2017-03-22 | 芜湖赋兴光电有限公司 | Glue refuse removal technology after drilling of flexible circuit board of camera module |
| CN106559958A (en) * | 2016-11-22 | 2017-04-05 | 奥士康精密电路（惠州）有限公司 | A kind of method for lifting heavy copper cash production capacity |
| CN106559958B (en) * | 2016-11-22 | 2018-11-09 | 奥士康精密电路（惠州）有限公司 | A method of promoting heavy copper cash production capacity |
| CN107172830A (en) * | 2017-07-24 | 2017-09-15 | 泰州市博泰电子有限公司 | A kind of hole method of low intermodulation high-frequency model circuit board |
| CN107172830B (en) * | 2017-07-24 | 2019-11-05 | 泰州市博泰电子有限公司 | A kind of hole method of low intermodulation high-frequency model circuit board |
| CN109862709A (en) * | 2019-02-21 | 2019-06-07 | 深圳崇达多层线路板有限公司 | A kind of production method for improving electric platinum plating leakage and getting rid of platinum problem |
| CN112804821A (en) * | 2020-12-14 | 2021-05-14 | 中山市宝悦嘉电子有限公司 | Selective electrogilding process for PCB (printed circuit board) |
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Application publication date: 20120822 |