CN106559958A - A kind of method for lifting heavy copper cash production capacity - Google Patents
A kind of method for lifting heavy copper cash production capacity Download PDFInfo
- Publication number
- CN106559958A CN106559958A CN201611028260.5A CN201611028260A CN106559958A CN 106559958 A CN106559958 A CN 106559958A CN 201611028260 A CN201611028260 A CN 201611028260A CN 106559958 A CN106559958 A CN 106559958A
- Authority
- CN
- China
- Prior art keywords
- heavy copper
- groove
- dual platen
- layer sheet
- production line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 67
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 67
- 239000010949 copper Substances 0.000 title claims abstract description 67
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 34
- 230000009977 dual effect Effects 0.000 claims abstract description 50
- 239000003292 glue Substances 0.000 claims abstract description 29
- 238000004140 cleaning Methods 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
Abstract
For the problems referred to above, according to doubling plate and multiple-plate heavy process for copper feature, design one kind can quickly realize that multi-layer sheet and the heavy Copper fabrication of doubling plate mutually turn to the present invention, the method for lifting heavy copper cash production capacity, including:On adjustment production line dual platen it is heavy+operation of copper, the plate first object groove that enters of dual platen is set to into the rinsing bowl after bulk groove, is entered back into and is processed except glue groove, be now processed except glue groove only opens a target position；And dual platen heavy copper is stopped, then carry out the heavy copper of multi-layer sheet and multi-layer sheet heavy copper is stopped, then carry out the specific implementation method of the heavy copper of dual platen.It is not required to whole production line is carried out reeling stopping line, merely with the adjustment that the of short duration time out of processing apparatus completes into plate first object groove and target position, realize dual platen and the heavy Copper fabrication of multi-layer sheet quick mutual turn.
Description
Technical field
The present invention relates to the heavy process for copper of wiring board, and in particular to a kind of method of lifting heavy copper cash production capacity.
Background technology
In the heavy process for copper of assist side, dual platen is typically not required to carry out bulk and removing glue, and is directly entered cleaning groove and enters
Row is processed, and multi-layer sheet needs first to carry out bulk and removing glue, then is cleaned groove process, and follow-up process is essentially identical,
And in the heavy process for copper of multi-layer sheet, except need to generally open three target position in glue groove.As multi-layer sheet and dual platen are typically with together
A set of production equipment carries out heavy copper, therefore in concrete production, often carries out mutual the turning of multi-layer sheet and the heavy Copper fabrication of doubling plate
Technique, will the heavy Copper fabrication of doubling plate be converted to multiple-plate heavy Copper fabrication, or reverse conversion.Traditional skill needs of mutually changing a job
Reel and stop line, to the processing apparatus on production line and except glue groove target position etc. is adjusted, expend a large amount of man-hours, material and the energy,
Affect the production capacity of production line.
The content of the invention
For the problems referred to above, according to doubling plate and multiple-plate heavy process for copper feature, design one kind can be quick for the present invention
Realize that multi-layer sheet and the heavy Copper fabrication of doubling plate mutually turn, the method for lifting heavy copper cash production capacity, including:
1）On adjustment production line, the operation of the heavy copper of dual platen, the plate first object groove that enters of dual platen is set to after bulk groove
Rinsing bowl, then make dual platen into except glue groove is processed so that the heavy copper of multi-layer sheet and the heavy copper of dual platen are after bulk groove
Process it is consistent；And except glue groove opens a target position；
2）When needing to stop dual platen heavy copper, then when carrying out the heavy copper of multi-layer sheet；
By in rinsing bowl of the multi-layer sheet input after the bulk groove, and each operation equipment on production line is changed to into list by continuously running
One operating, that is, stop the continuous transport of wiring board between processing apparatus, each operation equipment continue to complete wiring board in equipment plus
After work, into halted state；
After on production line, each operation equipment suspends, the multi-layer sheet in rinsing bowl that will be now placed in after bulk groove is adjusted to swollen
Loose groove；And open except the unopened two air target positions of glue groove；
Control again each operation equipment on production line by single operating be changed to according to the process of the heavy copper of multi-layer sheet carry out it is continuous
Operating.
3）When needing to stop multi-layer sheet heavy copper, then when carrying out the heavy copper of dual platen；
First from upper two air targets in production line upper plate position, when two air targets are all reached except glue groove, dual platen is put in bulk groove,
And equipment is changed to into single operating by continuously running；
After on production line, each operation equipment suspends, the dual platen being now placed in bulk groove is transferred to after bulk groove
Rinsing bowl in, and close except glue groove two air targets target position；
Each operation equipment on production line is controlled again, and continuously running for the process according to the heavy copper of dual platen is changed to by single operating.
Preferably, when needing to stop dual platen heavy copper, then when carrying out the heavy copper of multi-layer sheet, each operation equipment on production line
After being changed to continuously run by single operating, when cleaning groove is moved in the air target position opened except glue groove, upper plate position simultaneously on
Two frame dual platens, air target position is filled up.
The present invention is not required to whole production line is carried out reeling to stop line, only by the adjustment to the heavy process for copper of dual platen, and profit
Enter plate first object groove and the adjustment except glue groove target position with what the of short duration time out of processing apparatus completed heavy copper process, it is real
Quick mutual turn of existing dual platen and the heavy Copper fabrication of multi-layer sheet.
Specific embodiment
The present invention is better understood from for ease of those skilled in the art, is carried out further with reference to specific embodiment
It is bright.
The operation of the heavy copper of dual platen on production line when being embodied as, is adjusted, the plate first object groove that enters of dual platen is arranged
It is the rinsing bowl after bulk groove, then makes dual platen into except glue groove is processed, except glue groove opens a target position, removing glue is complete
Follow-up heavy Copper fabrication is carried out into the operations such as cleaning are followed by entered.
When needing to stop dual platen heavy copper, then when carrying out the heavy copper of multi-layer sheet；Stopping puts into production dual platen in line,
Start multi-layer sheet puts into production in line, due to now still carrying out by the heavy copper process of dual platen, therefore the multilamellar for now putting into
The plate first object groove that enters of plate is the rinsing bowl after bulk groove；Stop the continuous transport of wiring board between processing apparatus simultaneously,
Each operation equipment is made to continue to complete in equipment after the processing of wiring board, into halted state；On production line, each operation equipment is equal
After time-out, the multi-layer sheet in rinsing bowl that will be now placed in after bulk groove is adjusted in bulk groove, and is opened except glue groove is not opened
Two air target positions, now open target position quantity is the target position quantity needed for multi-layer sheet removing glue is processed so that subsequently enter life
The multi-layer sheet of producing line can have enough target position to carry out removing glue process；As the multi-layer sheet of the line that now puts into production has been located in multilamellar
The first object groove of the heavy copper process of plate, i.e., bulk groove, and had enough target position to carry out heavy Copper fabrication, can control on production line
Each operation equipment is changed to continuously running for the process by the heavy copper of multi-layer sheet by single operating, that is, start circuit between processing apparatus
The continuous transport of plate.After the operation of the heavy copper of dual platen on the adjustment production line, multi-layer sheet and dual platen bulk groove it
Rear process is consistent, therefore heavy copper production line is when being processed by the process of the heavy copper of multi-layer sheet, is still located at life
Dual platen in producing line is respectively positioned in the processing apparatus after bulk groove, therefore can be normally carried out processing, realizes the continuous of production,
So as to improve the production capacity of production line.
To make full use of processing apparatus, can on a production line each operation equipment by it is single operating be changed to continuously run after, when
When the air target position opened except glue groove moves to cleaning groove, in upper plate position while upper two framves dual platen, air target position is filled up.
When needing to stop multi-layer sheet heavy copper, then when carrying out the heavy copper of dual platen；First from production line upper plate position it is upper two it is empty
Target is then followed by dual platen, and after two air targets are all reached except glue groove, dual platen is by the multi-layer sheet performed on now production line
The operation of heavy copper, have been enter into it is multiple-plate enter plate first object groove, i.e., bulk groove, and the rinsing bowl after bulk groove also vacate；
Equipment is changed to into single operating by continuously running now；After on production line, each operation equipment suspends, will be now placed in swollen
Dual platen in loose groove is transferred to the first object groove of the heavy copper process of dual platen, the i.e. rinsing bowl after bulk groove, and closes this
When positioned at two air targets except glue groove target position, now except in glue groove only one target position open, and dual platen also be located at it is two-sided
The first object groove of the heavy copper process of plate, now production line can be continuously run according to the process of the heavy copper of dual platen immediately；
And due to the operation of the heavy copper of dual platen on the adjustment production line after, the process of multi-layer sheet and dual platen after bulk groove
Unanimously, and now the multi-layer sheet in production line is all located in the processing apparatus after bulk groove, can be normally carried out processing, realizes life
That what is produced is continuous, so as to improve the production capacity of production line.
Above-described embodiment is only the specific embodiment of the present invention, and its description is more concrete and in detail, but can not therefore and
It is interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, do not taking off
On the premise of present inventive concept, some deformations and improvement can also be made, these obvious alternative forms belong to this
The protection domain of invention.
Claims (2)
1. it is a kind of lifted heavy copper cash production capacity method, including：
1）On adjustment production line, the operation of the heavy copper of dual platen, the plate first object groove that enters of dual platen is set to after bulk groove
Rinsing bowl, then make dual platen into except glue groove is processed so that the heavy copper of multi-layer sheet and the heavy copper of dual platen are after bulk groove
Process it is consistent；And except glue groove opens a target position；
2）When needing to stop dual platen heavy copper, then when carrying out the heavy copper of multi-layer sheet；
By in rinsing bowl of the multi-layer sheet input after the bulk groove, and each operation equipment on production line is changed to into list by continuously running
One operating, that is, stop the continuous transport of wiring board between processing apparatus, each operation equipment continue to complete wiring board in equipment plus
After work, into halted state；
After on production line, each operation equipment suspends, the multi-layer sheet in rinsing bowl that will be now placed in after bulk groove is adjusted to swollen
Loose groove；And open except the unopened two air target positions of glue groove；
Control again each operation equipment on production line by single operating be changed to according to the process of the heavy copper of multi-layer sheet carry out it is continuous
Operating；
3）When needing to stop multi-layer sheet heavy copper, then when carrying out the heavy copper of dual platen；
First from upper two air targets in production line upper plate position, when two air targets are all reached except glue groove, dual platen is put in bulk groove,
And equipment is changed to into single operating by continuously running；
After on production line, each operation equipment suspends, the dual platen being now placed in bulk groove is transferred to after bulk groove
Rinsing bowl in, and close except glue groove two air targets target position；
Each operation equipment on production line is controlled again, and continuously running for the process according to the heavy copper of dual platen is changed to by single operating.
2. according to the method that heavy copper cash production capacity is lifted described in claim 1, it is characterised in that：When needing to stop dual platen heavy copper
Only, then when carrying out the heavy copper of multi-layer sheet, after on production line, each operation equipment is changed to continuously run by single operating, when except glue groove
When open air target position moves to cleaning groove, in upper plate position while upper two framves dual platen, air target position is filled up.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611028260.5A CN106559958B (en) | 2016-11-22 | 2016-11-22 | A method of promoting heavy copper cash production capacity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611028260.5A CN106559958B (en) | 2016-11-22 | 2016-11-22 | A method of promoting heavy copper cash production capacity |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106559958A true CN106559958A (en) | 2017-04-05 |
| CN106559958B CN106559958B (en) | 2018-11-09 |
Family
ID=58444313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611028260.5A Expired - Fee Related CN106559958B (en) | 2016-11-22 | 2016-11-22 | A method of promoting heavy copper cash production capacity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106559958B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060088705A1 (en) * | 2004-10-21 | 2006-04-27 | Alps Electric Co., Ltd. | Plating substrate, electroless plating method, and circuit forming method using the same |
| CN101896039A (en) * | 2010-07-28 | 2010-11-24 | 广东东硕科技有限公司 | Post treatment neutralizer for removing smears from alkaline permanganate in printed circuit board manufacture |
| CN102647858A (en) * | 2012-05-15 | 2012-08-22 | 金悦通电子（翁源）有限公司 | Processing method of printed circuit board (PCB) |
| CN104378930A (en) * | 2013-08-14 | 2015-02-25 | 四川海英电子科技有限公司 | Electric manufacturing method for two-sided copper deposition plate of PCB |
| CN105657976A (en) * | 2016-01-19 | 2016-06-08 | 深圳崇达多层线路板有限公司 | Manufacturing method of entire-board nickel gold plating stepped board |
| CN105813390A (en) * | 2016-05-27 | 2016-07-27 | 东莞联桥电子有限公司 | Adhesive removing process for high-TG printed circuit board |
-
2016
- 2016-11-22 CN CN201611028260.5A patent/CN106559958B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060088705A1 (en) * | 2004-10-21 | 2006-04-27 | Alps Electric Co., Ltd. | Plating substrate, electroless plating method, and circuit forming method using the same |
| CN101896039A (en) * | 2010-07-28 | 2010-11-24 | 广东东硕科技有限公司 | Post treatment neutralizer for removing smears from alkaline permanganate in printed circuit board manufacture |
| CN102647858A (en) * | 2012-05-15 | 2012-08-22 | 金悦通电子（翁源）有限公司 | Processing method of printed circuit board (PCB) |
| CN104378930A (en) * | 2013-08-14 | 2015-02-25 | 四川海英电子科技有限公司 | Electric manufacturing method for two-sided copper deposition plate of PCB |
| CN105657976A (en) * | 2016-01-19 | 2016-06-08 | 深圳崇达多层线路板有限公司 | Manufacturing method of entire-board nickel gold plating stepped board |
| CN105813390A (en) * | 2016-05-27 | 2016-07-27 | 东莞联桥电子有限公司 | Adhesive removing process for high-TG printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106559958B (en) | 2018-11-09 |
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| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181109 |
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| CF01 | Termination of patent right due to non-payment of annual fee |