CN1733980A - Electricity conductive liquid capable of directly galvanizing the printed board - Google Patents
Electricity conductive liquid capable of directly galvanizing the printed board Download PDFInfo
- Publication number
- CN1733980A CN1733980A CN 200410020222 CN200410020222A CN1733980A CN 1733980 A CN1733980 A CN 1733980A CN 200410020222 CN200410020222 CN 200410020222 CN 200410020222 A CN200410020222 A CN 200410020222A CN 1733980 A CN1733980 A CN 1733980A
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- Prior art keywords
- printed board
- conductive liquid
- liquid
- directly
- galvanizing
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Abstract
The conductive liquid to plate directly the printed board comprises graphite 2-5%, Na2SiO3 0.5-1%, anionic surface active agent 0.5-2%, NH4OH 2-4% and water 88-96%. The product has advantages: 1. well stability. There is no hydrogen separated out during absorption to copper covered plate to ensure layer interlinkage quality; there is no chemical reaction to consume other constituents; thereby, it needs not to analyze and adjust solution to add fresh liquid for real production; 2. it is convenient to operate and maintenance and reliable; 3. it saves labor and time, controls effectively the waste water discharge, and decreases consumption and cost.
Description
Affiliated field:
The invention belongs to a kind of conductive liquid of metal, particularly a kind of conductive liquid that makes the printed board Direct Electroplating.
Background technology:
Hole metallization is the process procedure of most critical in the printed circuit board (pcb) manufacturing processed.For a long time, the electroless copper plating technology is to realize the mainstream technology of hole metallization, and it is a kind of autocatalysis redox reaction.Though this technology has been prolonged with for many years and carried out continuous improvement, but still the shortcoming that is difficult to overcome below existing: 1, adopt formaldehyde (Formal dehyde) to make reductive agent, not only endanger ecotope, and carcinogenic danger is arranged.2, the network of electroless copper and agent EDTA are difficult for biodegrade, and wastewater treatment is difficulty very.3, the less stable of chemical copper plating solution is operated the careless slightly solution that will occur and decomposed, and is very strict to the requirement of monitoring and maintenance.4, the mechanical property of the coating of electroless copper (for example: unit elongation, tensile strength etc.) is all less than copper electroplating layer.5, chemical-copper-plating process long flow path, operation and maintenance are extremely inconvenient, and quality control is difficulty and working cost height relatively.
Summary of the invention:
Purpose of the present invention just is being to overcome above-mentioned the deficiencies in the prior art, and provide a kind of conductive liquid that makes the printed board Direct Electroplating, utilize this electroplate liquid to carry out the technology of plated through-hole, save man-hour, reduce materials consumption, and controlled discharged waste water effectively, reduced the production cost of printed board.
Technical scheme of the present invention is: a kind of conductive liquid that makes the printed board Direct Electroplating is characterized in that: made according to following ratio by following raw materials according: graphite 2-5% Na
2SiO
30.5-1% anion surfactant 0.5-2% NH
4OH 2-4% water 88-96%..
The median size of described graphite is 0.2um.
Advantage of the present invention is: 1, the dark solution be made up of extremely strong meticulous carbon black of conductive capability or graphite of this conductive liquid, general designation blank hole liquid (Blackhole).Because it has satisfactory stability, therefore no hydrogen is separated out in finishing the adsorption process of the copper-clad plate after the boring, can ensure the inter-level interconnects quality of printed board.And it is physical property in adsorption process, and chemical reaction does not take place, and does not also just have the phenomenon that consumes other composition because of chemical reaction.Therefore need not to analyze and adjust solution, can add new liquid (blank hole liquid) according to the impairment of actual production fully, can guarantee its serviceability.2, the using and safeguarding of this solution, not only simply but also reliable, practical value was very high.3, use the present invention to carry out the technology of plated through-hole, can save man-hour, reduce materials consumption, and controlled discharged waste water effectively, reduced the production cost of printed board.
Embodiment:
Graphite with 3.5%, 0.5% Na
2SiO
3, 1% anion surfactant, 2% NH
4The stirring that neutralizes of OH and 93% water, synthetic at last this electroplate liquid, i.e. blank hole liquid.
Blank hole liquid can adopt impregnated and these two kinds of methods of horizontal in application.
1. impregnated: relatively be fit to small business,, use producer under existing condition, finish with dipping → oven dry two-step approach because need not to acquire equipment in this way.2. horizontal: must adopt special equipment to implement, in relatively being fit to, large-lot producer, it can realize the whole processing procedure of black holeization in the short period of time with single stage method, and can improve throughput greatly.
PCB manufacturer can decide according to enterprise condition and select impregnated or horizontal for use.
Below be the technical process and the processing condition of impregnated:
One, technical process:
Cleaning → washing → whole hole → washing → deionization is washed → is blotted → blank hole liquid → drying → microetch → washing → air-dry → electro-coppering
Two, tank liquor configuration and processing condition:
| 1. clean (B-108) | |
| B-108 | 15％ |
| Deionized water | 85％ |
| Temperature | 58～64℃ |
| Time | 5min |
| 2. whole hole (B-206) | |
| B-206 | 50ml/L |
| Sodium hydroxide | 20g/L |
| Deionized water | 950ml/L |
| Time | 3-5min |
| 3. blank hole liquid (BB-1) | |
| Temperature | 25～32℃ |
| Time | 2～3min |
| Proportion | 1.01～1.03 |
| PH value | 10～10.5 |
| 4. microetch (B-304) | |
| Sodium Persulfate | 150g/L |
| Sulfuric acid | 80ml/L |
| Temperature | Room temperature |
| Time | 1.5～2min |
Three, precaution
1. blank hole liquid should have recirculation unit, with ultrasonic wave mode the best, forbids the pollution of acids, oils and other impurity on sea line.
2. soak the drying of damp formula and can utilize baking oven or drying tunnel, 105～110 ℃ of temperature, 5 minutes time.Horizontal is provided with cold and hot air-dry section.
3. under normal operation, blank hole liquid need not to carry out the adjustment of pH value, but impregnated brings into unavoidably in operation and take phenomenon out of, after for some time is used in suggestion, detects pH value with the pH value tester, replenishes liquid (BB--2) modulation specification with black hole.
4. the storage temperature of blank hole liquid is 2～40 ℃.
5. on special base material, as polyimide, polyester, tetrafluoroethylene etc., can adopt twice black hole to handle, its technical process is as follows:
Cleaning → washing → whole hole → washing → deionization washing → drying → blank hole liquid → drying → blank hole liquid → drying → microetch → washing → air-dry → electro-coppering
Claims (2)
1, a kind of conductive liquid that makes the printed board Direct Electroplating is characterized in that: made according to following ratio by following raw materials according: graphite 2-5%Na
2SiO
30.5-1% anion surfactant 0.5-2%NH
4OH 2-4% water 88-96%..
2, the described conductive liquid that makes the printed board Direct Electroplating according to claim 1, it is characterized in that: the median size of graphite is 0.2um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100202226A CN100451178C (en) | 2004-08-02 | 2004-08-02 | Electricity conductive liquid capable of directly galvanizing the printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100202226A CN100451178C (en) | 2004-08-02 | 2004-08-02 | Electricity conductive liquid capable of directly galvanizing the printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1733980A true CN1733980A (en) | 2006-02-15 |
| CN100451178C CN100451178C (en) | 2009-01-14 |
Family
ID=36076584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100202226A Expired - Fee Related CN100451178C (en) | 2004-08-02 | 2004-08-02 | Electricity conductive liquid capable of directly galvanizing the printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100451178C (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101453837B (en) * | 2007-11-28 | 2011-03-30 | 比亚迪股份有限公司 | Hole electricity conduction method for printed circuit board |
| CN102251233A (en) * | 2010-05-18 | 2011-11-23 | 三星电子株式会社 | Resin plating method using graphene thin layer |
| CN102647858A (en) * | 2012-05-15 | 2012-08-22 | 金悦通电子（翁源）有限公司 | Processing method of printed circuit board (PCB) |
| US8440158B2 (en) | 2007-09-21 | 2013-05-14 | Tsinghua University | Pre-plating solutions for making printed circuit boards and methods for preparing the same |
| CN103167747A (en) * | 2013-03-01 | 2013-06-19 | 溧阳市新力机械铸造有限公司 | Manufacturing method of printed circuit board |
| CN103173824A (en) * | 2013-03-01 | 2013-06-26 | 溧阳市新力机械铸造有限公司 | Black hole solution for printed circuit board |
| TWI408003B (en) * | 2007-09-28 | 2013-09-11 | Hon Hai Prec Ind Co Ltd | Solution for preparing the through hole walls for electroplating and method of making the same |
| CN104388996A (en) * | 2014-10-30 | 2015-03-04 | 苏州禾川化学技术服务有限公司 | Black hole liquid and preparation method thereof |
| CN104562115A (en) * | 2014-07-04 | 2015-04-29 | 广东丹邦科技有限公司 | Black hole liquid for printed circuit board and preparation method of black hole liquid |
| CN104703411A (en) * | 2015-04-01 | 2015-06-10 | 竞陆电子(昆山)有限公司 | Horizontal plated-through hole production line pH monitoring device |
| CN104818506A (en) * | 2015-05-28 | 2015-08-05 | 哈尔滨工业大学 | Solution for metalizing printed circuit board hole |
| CN106319603A (en) * | 2016-08-29 | 2017-01-11 | 苏州铱诺化学材料有限公司 | Formula of blackhole hole-leveling agent |
| CN106559961A (en) * | 2016-08-31 | 2017-04-05 | 广州市天承化工有限公司 | A kind of conduction liquid and preparation method thereof and conductive processing method |
| CN106852026A (en) * | 2016-11-29 | 2017-06-13 | 深圳崇达多层线路板有限公司 | Suitable for the black holes production technology of HDI products |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4622108A (en) * | 1986-05-05 | 1986-11-11 | Olin Hunt Specialty Products, Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
| JPH07268682A (en) * | 1994-03-28 | 1995-10-17 | Mec Kk | Method for electroplating surface of electric nonconductor |
| CN1182107A (en) * | 1996-11-13 | 1998-05-20 | 马忠好 | Outer conductive paint for glass bulb of display tube and its preparation |
| CN1152098C (en) * | 2002-02-24 | 2004-06-02 | 青岛石墨股份有限公司 | Graphite conducting coating material |
-
2004
- 2004-08-02 CN CNB2004100202226A patent/CN100451178C/en not_active Expired - Fee Related
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8440158B2 (en) | 2007-09-21 | 2013-05-14 | Tsinghua University | Pre-plating solutions for making printed circuit boards and methods for preparing the same |
| TWI408003B (en) * | 2007-09-28 | 2013-09-11 | Hon Hai Prec Ind Co Ltd | Solution for preparing the through hole walls for electroplating and method of making the same |
| CN101453837B (en) * | 2007-11-28 | 2011-03-30 | 比亚迪股份有限公司 | Hole electricity conduction method for printed circuit board |
| CN102251233A (en) * | 2010-05-18 | 2011-11-23 | 三星电子株式会社 | Resin plating method using graphene thin layer |
| CN102647858A (en) * | 2012-05-15 | 2012-08-22 | 金悦通电子（翁源）有限公司 | Processing method of printed circuit board (PCB) |
| CN103167747A (en) * | 2013-03-01 | 2013-06-19 | 溧阳市新力机械铸造有限公司 | Manufacturing method of printed circuit board |
| CN103173824A (en) * | 2013-03-01 | 2013-06-26 | 溧阳市新力机械铸造有限公司 | Black hole solution for printed circuit board |
| CN104562115A (en) * | 2014-07-04 | 2015-04-29 | 广东丹邦科技有限公司 | Black hole liquid for printed circuit board and preparation method of black hole liquid |
| CN104562115B (en) * | 2014-07-04 | 2017-07-11 | 广东丹邦科技有限公司 | Blank hole liquid for printed circuit board and preparation method thereof |
| CN104388996A (en) * | 2014-10-30 | 2015-03-04 | 苏州禾川化学技术服务有限公司 | Black hole liquid and preparation method thereof |
| CN104703411A (en) * | 2015-04-01 | 2015-06-10 | 竞陆电子(昆山)有限公司 | Horizontal plated-through hole production line pH monitoring device |
| CN104818506A (en) * | 2015-05-28 | 2015-08-05 | 哈尔滨工业大学 | Solution for metalizing printed circuit board hole |
| CN106319603A (en) * | 2016-08-29 | 2017-01-11 | 苏州铱诺化学材料有限公司 | Formula of blackhole hole-leveling agent |
| CN106559961A (en) * | 2016-08-31 | 2017-04-05 | 广州市天承化工有限公司 | A kind of conduction liquid and preparation method thereof and conductive processing method |
| CN106559961B (en) * | 2016-08-31 | 2021-10-08 | 广东天承科技股份有限公司 | Conductive liquid, preparation method thereof and conductive treatment method |
| CN106852026A (en) * | 2016-11-29 | 2017-06-13 | 深圳崇达多层线路板有限公司 | Suitable for the black holes production technology of HDI products |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100451178C (en) | 2009-01-14 |
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Granted publication date: 20090114 Termination date: 20120802 |