CN106535476A - Glue refuse removal technology after drilling of flexible circuit board of camera module - Google Patents
Glue refuse removal technology after drilling of flexible circuit board of camera module Download PDFInfo
- Publication number
- CN106535476A CN106535476A CN201610927820.4A CN201610927820A CN106535476A CN 106535476 A CN106535476 A CN 106535476A CN 201610927820 A CN201610927820 A CN 201610927820A CN 106535476 A CN106535476 A CN 106535476A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electric circuit
- flexible electric
- camera module
- tank liquor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
Abstract
The invention aims at providing a glue refuse removal technology after drilling of a flexible circuit board of a camera module. A glue refuse is softened by adopting a swelling agent and then dissolved by adopting a resin etchant, a previous residue is treated by adopting a neutralizer, and counter-current washing is carried out after treatment in each step, so that the glue refuse can be well removed, no dirt on the drilled hole wall is ensured and the quality of a product is ensured.
Description
Technical field
The present invention relates to the flexible electric circuit board manufacture field of camera module, more particularly to a kind of camera module flexible electrical
De-smear technique behind the twist drill hole of road.
Background technology
With the continuous aspect of science and technology, the function of becoming commonly used in people's daily life of taking pictures, therefore photographic head
Development is just particularly significant.Flexible electric circuit board, flexible electric circuit board is needed to need drilling in process of production in camera module, it
Afterwards in heavy plated with copper in the borehole, at present for there is glue residue to fill hole wall after the drilling of flexible electric circuit board, glue residue affects hole wall to connect
Connect performance and insecure, thus solve the above problems just seem it is particularly significant.
The content of the invention
To solve the above problems, the present invention provides the de-smear technique after a kind of camera module flexible electric circuit board drilling,
Softening glue residue is carried out using bulking agent successively, dissolves glue residue using resin etchant, before being processed using nertralizer afterwards
Residue, carries out adverse current washing after often step process, can be very good to remove glue residue, occur in solving background technology
Problem.
It is an object of the invention to provide the de-smear technique after a kind of drilling of camera module flexible electric circuit board, include with
Lower step：
Step one：Flexible electric circuit board after drilling is placed with the tank liquor of bulking agent carries out sofening treatment to glue residue, it is laggard
Two stage countercurrent of row is washed；
Step 2：The flexible electric circuit board that step one was processed is placed with the tank liquor of resin etchant and is processed, carry out three afterwards
Stage countercurrent is washed；
Step 3：By the flexible electric circuit board that step 2 was processed be placed with the tank liquor of nertralizer process, carry out afterwards two grades it is inverse
Flowing water is washed, and so as to remove de-smear, carries out electroless copper plating afterwards.
Further improvement is that：In the tank liquor of the resin etchant of the step 2, treatment temperature is 78-82 DEG C, during process
Between be 8-14min.
Further improvement is that：In the tank liquor of the step 3 nertralizer, treatment temperature is 22-28 DEG C, and process time is 2-
3min。
Further improvement is that：In the tank liquor of the resin etchant of the step 2 process is with mechanical agitation or beats
Gas.
Beneficial effects of the present invention：The present invention is by carrying out softening glue residue using bulking agent successively, using resin etchant
Dissolve glue residue, afterwards using the residue before nertralizer process, often step carries out adverse current washing after processing, can be fine
Glue residue is removed, it is ensured that the hole wall after drilling without dirt, it is ensured that product quality.
Specific embodiment
In order to deepen the understanding of the present invention, below in conjunction with embodiment, the invention will be further described, the embodiment
It is only used for explaining the present invention, does not constitute limiting the scope of the present invention.
The present embodiment provides the de-smear technique after a kind of camera module flexible electric circuit board drilling, includes following step
Suddenly：
Step one：Flexible electric circuit board after drilling is placed with the tank liquor of bulking agent carries out sofening treatment to glue residue, it is laggard
Two stage countercurrent of row is washed；
Step 2：The flexible electric circuit board that step one was processed is placed with the tank liquor of resin etchant and is processed, carry out three afterwards
Stage countercurrent is washed；
Step 3：By the flexible electric circuit board that step 2 was processed be placed with the tank liquor of nertralizer process, carry out afterwards two grades it is inverse
Flowing water is washed, and so as to remove de-smear, carries out electroless copper plating afterwards.
In the tank liquor of the resin etchant of the step 2, treatment temperature is 78-82 DEG C, and process time is 8-14min.Institute
In stating the tank liquor of step 3 nertralizer, treatment temperature is 22-28 DEG C, and process time is 2-3min.The resin etching of the step 2
Process in the tank liquor of agent is with mechanical agitation or inflates.
By carrying out softening glue residue using bulking agent successively, dissolving glue residue using resin etchant, afterwards using neutralization
Residue before agent process, carries out adverse current washing after often step process, can be very good to remove glue residue, it is ensured that after drilling
Hole wall without dirt, it is ensured that product quality.
Claims (4)
1. the de-smear technique after a kind of camera module flexible electric circuit board drills, it is characterised in that：Include following steps：
Step one：Flexible electric circuit board after drilling is placed with the tank liquor of bulking agent carries out sofening treatment to glue residue, it is laggard
Two stage countercurrent of row is washed；
Step 2：The flexible electric circuit board that step one was processed is placed with the tank liquor of resin etchant and is processed, carry out three afterwards
Stage countercurrent is washed；
Step 3：By the flexible electric circuit board that step 2 was processed be placed with the tank liquor of nertralizer process, carry out afterwards two grades it is inverse
Flowing water is washed, and so as to remove de-smear, carries out electroless copper plating afterwards.
2. the de-smear technique after camera module flexible electric circuit board drills as claimed in claim 1, it is characterised in that：The step
In the tank liquor of rapid two resin etchant, treatment temperature is 78-82 DEG C, and process time is 8-14min.
3. the de-smear technique after camera module flexible electric circuit board as claimed in claim 1 drills, it is characterised in that：The step
In the tank liquor of rapid three nertralizer, treatment temperature is 22-28 DEG C, and process time is 2-3min.
4. the de-smear technique after camera module flexible electric circuit board as claimed in claim 1 drills, it is characterised in that：The step
In the tank liquor of rapid two resin etchant process is with mechanical agitation or inflates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610927820.4A CN106535476A (en) | 2016-10-31 | 2016-10-31 | Glue refuse removal technology after drilling of flexible circuit board of camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610927820.4A CN106535476A (en) | 2016-10-31 | 2016-10-31 | Glue refuse removal technology after drilling of flexible circuit board of camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106535476A true CN106535476A (en) | 2017-03-22 |
Family
ID=58291663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610927820.4A Pending CN106535476A (en) | 2016-10-31 | 2016-10-31 | Glue refuse removal technology after drilling of flexible circuit board of camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106535476A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000332418A (en) * | 1999-05-19 | 2000-11-30 | Meiko:Kk | Method of removing laser residue |
| CN102647858A (en) * | 2012-05-15 | 2012-08-22 | 金悦通电子（翁源）有限公司 | Processing method of printed circuit board (PCB) |
| CN202752272U (en) * | 2012-07-31 | 2013-02-27 | 深圳市化讯应用材料有限公司 | Device capable of cleaning glue refuse in drill hole of printed circuit board (PCB) |
| CN105813396A (en) * | 2016-03-30 | 2016-07-27 | 广东工业大学 | Medical liquid for electroless copper plating desmearing of printed circuit board (PCB) and preparation method and application thereof |
-
2016
- 2016-10-31 CN CN201610927820.4A patent/CN106535476A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000332418A (en) * | 1999-05-19 | 2000-11-30 | Meiko:Kk | Method of removing laser residue |
| CN102647858A (en) * | 2012-05-15 | 2012-08-22 | 金悦通电子（翁源）有限公司 | Processing method of printed circuit board (PCB) |
| CN202752272U (en) * | 2012-07-31 | 2013-02-27 | 深圳市化讯应用材料有限公司 | Device capable of cleaning glue refuse in drill hole of printed circuit board (PCB) |
| CN105813396A (en) * | 2016-03-30 | 2016-07-27 | 广东工业大学 | Medical liquid for electroless copper plating desmearing of printed circuit board (PCB) and preparation method and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170322 |