CN103228112B - A kind of electroless copper plating method of high aspect ratio pcb board - Google Patents
A kind of electroless copper plating method of high aspect ratio pcb board Download PDFInfo
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- CN103228112B CN103228112B CN201310115297.1A CN201310115297A CN103228112B CN 103228112 B CN103228112 B CN 103228112B CN 201310115297 A CN201310115297 A CN 201310115297A CN 103228112 B CN103228112 B CN 103228112B
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Abstract
The invention discloses a kind of electroless copper plating method of high aspect ratio pcb board, by adjusting the spacing between adjacent high aspect ratio pcb board, and flashboard rack is waved along direction, vertical panel face in heavy copper liquid medicine, bubble in the hole of high aspect ratio PCB is discharged, then twice electroless copper plating process is carried out to high aspect ratio pcb board, and after first time electroless copper plating, electric plating of whole board flash is carried out to pcb board, make the thick increase of hole wall copper, carry out second time electric plating of whole board afterwards again and thicken copper.Compared with prior art, present invention effectively prevents because bubble in hole cannot be driven out of or in hole, liquid medicine exchanges bad in heavy copper process, and cause having no copper in the holes, cause the problem that wiring board is scrapped; And the present invention is after first time electroless copper plating process, adopt electric plating of whole board flash, effectively prevent the pre-treatment of second time electroless copper plating by the problem of copper eating away original in hole, thus effectively less manufacturing scrap, reduce making rework cost.
Description
Technical field:
The invention belongs to printed wiring board manufacture technology field, what be specifically related to is a kind of electroless copper plating method of high aspect ratio pcb board.
Background technology:
After circuit board pressing, boring, for making mutual conducting between each sandwich circuit, must electroless copper plating flow process be passed through, hole wall is formed the thin copper of one deck, and then by the mode of plating, hole wall copper be thickeied, reach the good conducting of each sandwich circuit.
Along with the number of plies of PCB is more and more higher, thickness of slab is more and more thicker, aperture design on wiring board is then more and more less, for the high aspect ratio pcb board that aspect ratio is more than or equal to 8:1, because aperture is less, often because bubble in hole cannot be driven out of or in hole, liquid medicine exchanges bad in heavy copper process, very easily cause the phenomenon of having no copper in the holes, cause wiring board to scrap.
Summary of the invention:
For this reason, the object of the present invention is to provide a kind of electroless copper plating method of high aspect ratio pcb board, to solve current high aspect ratio pcb board because bubble in hole cannot be driven out of or in hole, liquid medicine exchanges bad in heavy copper process, and cause having no copper in the holes, cause the problem that wiring board is scrapped.
For achieving the above object, the present invention mainly adopts following technical scheme:
An electroless copper plating method for high aspect ratio pcb board, comprises step:
A, wiring board is holed, nog plate, after de-smear process, carry out first time electroless copper plating pre-treatment;
B, first time electroless copper plating is carried out to wiring board, wiring board is fixed in flashboard rack, and keep the spacing between adjacent lines plate to be not less than 2cm, then control flashboard rack swings back and forth in heavy copper liquid medicine along the direction in horizontal path plate plate face, bubble in circuit plate hole is discharged, and makes copper layer thickness in hole reach 3um;
C, electric plating of whole board flash is carried out to wiring board, make copper layer thickness in circuit plate hole reach 4 ~ 6um;
D, the pre-treatment of second time electroless copper plating is carried out to wiring board, copper layer thickness microetch in circuit plate hole is fallen 0.5 ~ 1um;
E, second time electroless copper plating is carried out to wiring board, make copper layer thickness in circuit plate hole increase 0.3um;
F, wiring board carried out to electric plating of whole board and thicken Copper treatment.
Preferably, in step C, electric plating of whole board flash is carried out to wiring board, make copper layer thickness in circuit plate hole reach 4um.
Preferably, the aspect ratio of described wiring board is not less than 8:1.
The present invention is by the spacing between the adjacent high aspect ratio pcb board of adjustment, and flashboard rack is waved along direction, vertical panel face in heavy copper liquid medicine, bubble in the hole of high aspect ratio PCB is discharged, then twice electroless copper plating process is carried out to high aspect ratio pcb board, and after first time electroless copper plating, electric plating of whole board flash is carried out to pcb board, make the thick increase of hole wall copper, carry out second time electric plating of whole board afterwards again and thicken copper.Compared with prior art, present invention effectively prevents because bubble in hole cannot be driven out of or in hole, liquid medicine exchanges bad in heavy copper process, and cause having no copper in the holes, cause the problem that wiring board is scrapped; And the present invention is after first time electroless copper plating process, adopt electric plating of whole board flash, effectively prevent the pre-treatment of second time electroless copper plating by the problem of copper eating away original in hole, thus effectively less manufacturing scrap, reduce making rework cost.
Embodiment:
For setting forth thought of the present invention and object, below in conjunction with specific embodiment, the present invention is described further.
The present invention is to provide a kind of electroless copper plating method of high aspect ratio pcb board, it is mainly used in solving current high aspect ratio pcb board in heavy copper process because bubble in hole cannot be driven out of or in hole, liquid medicine exchanges bad, and cause having no copper in the holes, cause the problem that wiring board is scrapped.
The wherein electroless copper plating method of high aspect ratio pcb board of the present invention, specifically comprises:
A, wiring board is holed, nog plate, after de-smear process, carry out first time electroless copper plating pre-treatment;
First high aspect ratio pcb board is holed, on outer copper foil, burr or the existence of aperture burr is had after boring, afterflow Cheng Qian after entering, these burrs are needed to remove totally, cleaned by nog plate, the burr produced when can remove boring, carries out de-smear process afterwards, the dirt produced during to remove boring.
After said process, need to carry out first time electroless copper plating pre-treatment to high aspect ratio pcb board, it is specially oil removing, washing, microetch and speedization process; When oil removing mainly will be holed, remain in greasy dirt in hole or on Copper Foil and grease removes; The degreaser remained in when oil removing in plate face or hole is mainly washed off, to prevent from polluting follow-up micro-corrosion liquid and activated solution by washing; Microetch is then main to the roughening treatment of wiring board copper face, for follow-up electroplating copper deposition provides a scabrid movable copper face structure, to improve chemical copper and the direct adhesion of base material copper; Speedization then mainly improves the electroless copper plating speed of high aspect ratio pcb board, reduces the reaction time.
B, first time electroless copper plating is carried out to wiring board, wiring board is fixed in flashboard rack, and keep the spacing between adjacent lines plate to be not less than 2cm, then control flashboard rack swings back and forth in heavy copper liquid medicine along the direction in horizontal path plate plate face, bubble in circuit plate hole is discharged, and makes copper layer thickness in hole reach 3um;
During first time electroless copper plating, wiring board is fixed in flashboard rack, and keep the spacing between adjacent lines plate enough large (being not less than 2cm), control flashboard rack swings back and forth in heavy copper liquid medicine along the direction in horizontal path plate plate face simultaneously, the bubble formed in hole smoothly by whole hole, can be driven away by liquid medicine, by through the swelling and loose epoxy resin that becomes from the removing of internal layer copper ring surface, present desirable metallic luster, increase the adhesion with heavy layers of copper and electrodeposited coating.
Need in this operation to ensure that heavy copper solution successfully flows in hole, constantly change, heavy copper is made to form fine and close conductive layer at hole wall surface, it can according to the feature of the thickness of slab of multi-layer PCB board with aperture ratio, select the formula of the heavy copper series that expression activitiy is high, to guarantee that the mobility of little hole solution increases, outside bubble escape orifice in holes all on multi-layer PCB board the most at last, ensure heavy copper liquid flowing freely in hole, contact to reach with hole wall fully and react completely, make sedimentary deposit perfect sunken.
C, electric plating of whole board flash is carried out to wiring board, make copper layer thickness in circuit plate hole reach 4 ~ 6um;
Flash (being also strike plating) is exactly short time big current plating, and main purpose allows plating piece surface plate one deck coating as early as possible, so that normal plating later, makes copper layer thickness in circuit plate hole reach 4um.
D, the pre-treatment of second time electroless copper plating is carried out to wiring board, copper layer thickness microetch in circuit plate hole is fallen 0.5 ~ 1um;
Due to after flash, hole wall layers of copper correspondence increases, and therefore in follow-up second time electroless copper plating pre-treatment, when carrying out microetch, even if layers of copper is etched away 0.5 ~ 1um, the copper that also can not have influence on hole wall is thick.
E, second time electroless copper plating is carried out to wiring board, make copper layer thickness in circuit plate hole increase 0.3um;
Second time electroless copper plating can increase 0.3um by having in hole wall copper segment thickness, and for after the pre-treatment of second time electroless copper plating, at the sunk part that hole wall may be formed, then after the process of second time electroless copper plating, this sunk part correspondence can be filled and led up.
F, wiring board carried out to electric plating of whole board and thicken Copper treatment.
Afterwards according to client's needs, electric plating of whole board is carried out to wiring board, by the required thickness that the copper layer thickness of wiring board increases.
More than that the electroless copper plating method of a kind of high aspect ratio pcb board provided by the present invention is described in detail, apply specific case herein to set forth structural principle of the present invention and execution mode, above embodiment just understands method of the present invention and core concept thereof for helping; Meanwhile, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (1)
1. an electroless copper plating method for high aspect ratio pcb board, is characterized in that comprising step:
First the pcb board that aspect ratio is not less than 8:1 is holed, and remove clean by nog plate cleaning by remaining in the burr on outer copper foil or the burr on aperture after boring, carry out de-smear process afterwards, then oil removing is carried out to remove the greasy dirt and grease that remain in hole or on Copper Foil to pcb board, then carry out the degreaser washed remaining in when oil removing in plate face or hole to wash off, carry out microetch afterwards to the roughening treatment of wiring board copper face, finally carry out speedization process with the electroless copper plating speed improving pcb board, reduce the reaction time;
Secondly first time electroless copper plating process is carried out to wiring board, wiring board is fixed in flashboard rack, and keep the spacing between adjacent lines plate to be not less than 2cm, make liquid medicine can smoothly by whole hole, the bubble formed in hole is driven away, by through the swelling and loose epoxy resin that becomes from the removing of internal layer copper ring surface, increase the adhesion with heavy layers of copper and electrodeposited coating, then control flashboard rack swings back and forth in heavy copper liquid medicine along the direction in horizontal path plate plate face, bubble in circuit plate hole is discharged, and makes copper layer thickness in hole reach 3um;
Then electric plating of whole board flash is carried out to wiring board, allow plating piece surface plate one deck coating as early as possible, so that normal plating later, make copper layer thickness in circuit plate hole reach 4um; Then copper layer thickness microetch in circuit plate hole is fallen 0.5 ~ 1um;
Afterwards the process of second time electroless copper plating is carried out to wiring board, will in hole wall, have copper segment thickness to increase 0.3um, and for after electroless copper plating pre-treatment, at the sunk part that hole wall can be formed, then after electroless copper plating process, this sunk part correspondence can be filled and led up;
Finally electric plating of whole board is carried out to wiring board and thicken Copper treatment, the copper layer thickness of wiring board is increased to the thickness of requirement.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310115297.1A CN103228112B (en) | 2013-04-03 | 2013-04-03 | A kind of electroless copper plating method of high aspect ratio pcb board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310115297.1A CN103228112B (en) | 2013-04-03 | 2013-04-03 | A kind of electroless copper plating method of high aspect ratio pcb board |
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| CN103228112A CN103228112A (en) | 2013-07-31 |
| CN103228112B true CN103228112B (en) | 2016-03-23 |
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| CN201310115297.1A Expired - Fee Related CN103228112B (en) | 2013-04-03 | 2013-04-03 | A kind of electroless copper plating method of high aspect ratio pcb board |
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| CN104162913B (en) * | 2014-06-06 | 2016-01-20 | 胜宏科技（惠州）股份有限公司 | A kind of non complete symmetry pcb board stamping that prevents rushes anti-foolproof method |
| CN106350787A (en) * | 2015-07-13 | 2017-01-25 | 东莞市斯坦得电子材料有限公司 | Palladium inactivation process for electroless nickel-gold plating |
| CN105163521B (en) * | 2015-08-26 | 2017-11-17 | 昆山苏杭电路板有限公司 | Aperture hole metallization processing method |
| CN105592637A (en) * | 2016-03-08 | 2016-05-18 | 浪潮电子信息产业股份有限公司 | Chemical plating production process applied on PCB with through-hole aspect ratio higher than 4:1 |
| CN106028653B (en) * | 2016-06-17 | 2018-10-30 | 景旺电子科技(龙川)有限公司 | A kind of copper base surface crater fills and leads up method |
| CN106149018A (en) * | 2016-08-09 | 2016-11-23 | 安徽广德威正光电科技有限公司 | A kind of process for pcb board electro-coppering |
| CN106535502A (en) * | 2016-10-17 | 2017-03-22 | 奥士康精密电路（惠州）有限公司 | Electroplating method of high-aspect ratio circuit board |
| CN107592755A (en) * | 2017-09-07 | 2018-01-16 | 信丰文峰电子科技有限公司 | A kind of heavy copper method of the pcb board of high aspect ratio |
| CN109714907A (en) * | 2018-12-18 | 2019-05-03 | 安徽四创电子股份有限公司 | A kind of production method of the multi-layer PCB for 5G communication |
| CN109640546A (en) * | 2018-12-29 | 2019-04-16 | 深圳万基隆电子科技有限公司 | A kind of thick copper sheet manufacture craft that can prevent having no copper in the holes |
| CN110035618A (en) * | 2019-04-17 | 2019-07-19 | 宏俐（汕头）电子科技有限公司 | A kind of circuit board surface treatment process |
| CN110785014A (en) * | 2019-10-31 | 2020-02-11 | 珠海精毅电路有限公司 | Circuit board manufacturing process |
| CN111575752B (en) * | 2020-05-14 | 2021-10-12 | 深圳崇达多层线路板有限公司 | Electroplating manufacturing method for deep micro-hole in PCB |
| CN112004339A (en) * | 2020-07-07 | 2020-11-27 | 广德三生科技有限公司 | High-frequency and high-speed printed circuit board and manufacturing method thereof |
| CN113969417B (en) * | 2020-07-22 | 2024-01-05 | 深南电路股份有限公司 | Electroplating method of circuit board and circuit board |
| CN114071890A (en) * | 2020-08-05 | 2022-02-18 | 深南电路股份有限公司 | Circuit board and copper deposition method thereof |
| CN113923883A (en) * | 2021-09-29 | 2022-01-11 | 胜宏科技（惠州）股份有限公司 | Method for improving sunken part of copper plate |
| CN113993303B (en) * | 2021-10-27 | 2023-12-22 | 上海天承化学有限公司 | Method for metallizing holes of mixed-voltage circuit board |
| CN114182314A (en) * | 2021-12-10 | 2022-03-15 | 广东合通建业科技股份有限公司 | Electroplating copper deposition process for printed circuit board |
| CN115058749A (en) * | 2021-12-22 | 2022-09-16 | 江苏本川智能电路科技股份有限公司 | Electroplating processing method with high thickness-diameter ratio |
| CN115066099A (en) * | 2022-07-15 | 2022-09-16 | 科惠白井(佛冈)电路有限公司 | Forming method of PTH hole with high thickness-diameter ratio of PCB |
| CN117241478B (en) * | 2023-11-15 | 2024-02-23 | 深圳市宇通瑞特科技有限公司 | Horizontal electroplating process for double-sided and multi-layer PCB (printed circuit board) |
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| JP2001230507A (en) * | 2000-02-14 | 2001-08-24 | Sumitomo Metal Electronics Devices Inc | Plastic package and its manufacturing method |
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