CN104294340A - PCB black hole process - Google Patents
PCB black hole process Download PDFInfo
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- CN104294340A CN104294340A CN201410499158.8A CN201410499158A CN104294340A CN 104294340 A CN104294340 A CN 104294340A CN 201410499158 A CN201410499158 A CN 201410499158A CN 104294340 A CN104294340 A CN 104294340A
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- pcb
- hole
- black holes
- metallization processes
- processes according
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Abstract
The invention discloses a PCB black hole process comprising the following steps: (1) performing entire hole cleaning treatment by using a weakly-alkaline cleaning agent to remove oil dirt on the surface of a PCB; (2) cleaning an excessive residual liquid in a hole and on the surface of the hole by using water; (3) coating the hole wall with conductive silver paste to form a conducting layer; (4) cleaning the excessive residual liquid in the hole and on the surface of the hole by using the water, and drying; (5) performing polymerization reaction under the action of an acidic solution; and (6) entering a groove under the condition of electrifying, wherein impulse current is adopted to ensure that the conducting layer is completely covered. The PCB black hole process disclosed by the invention is simple in technological process and relatively low in cost.
Description
Technical field
The present invention relates to a kind of PCB black holes metallization processes.
Background technology
In prior art, PCB Hole Metallization technology is one of key of Manufacturing Technology for PCB, the quality controlling heavy copper plating is crucial, but the technical process of heavy copper is complicated, controlling factor is more, and Quantity of drugs is many, and the production cycle is long, production efficiency is low, and a large amount of sewage can be produced in the process, also need a large amount of sewage disposal expense of cost to go process, the printing total cost of circuit card is uprised.
Summary of the invention
Goal of the invention: the invention solves the problems referred to above, provide a kind of technical process simply, environmental protection and the lower PCB black holes metallization processes of total cost more.
Technical scheme: a kind of PCB black holes metallization processes, comprises the following steps:
(1) clean whole hole process: clean the process of whole hole with weakly alkaline sanitising agent, remove the greasy dirt on pcb board surface;
(2) use in water wash-out hole and the debris of excess surface;
(3) black holes process: be coated on hole wall with conductive silver paste and form conductive layer;
(4) use in water wash-out hole and the debris of excess surface, dry;
(5) pickling: carry out polyreaction under the effect of acidic solution;
(6) electro-coppering, charged enter groove, and adopt rush current, guarantee that conductive layer is all capped.
Described in step (1), weakly alkaline sanitising agent is ammoniacal liquor or sodium hydroxide solution; Ammoniacal liquor or sodium hydroxide solution temperature when clean controls at 60-65 DEG C.
The high temperature of the oven dry available short period of time described in step (4) or long subzero treatment.
Acidic solution described in step (5) can adopt acid potassium permanganate or high violent sour sodium.
Beneficial effect: compared with prior art, its advantage is that conductive silver paste is coated on hole wall and forms conductive layer, can Direct Electroplating, and technical process is simple, and cost is lower in the present invention.
Embodiment
Below in conjunction with embodiment, illustrate the present invention further.
The process of whole hole is cleaned with ammoniacal liquor or sodium hydroxide solution, remove the greasy dirt on pcb board surface, by ammoniacal liquor or the positively charged adjustment of sodium hydroxide solution, can in and resin surface with negative charge even can also give hole wall resin positive charge, so that the polymkeric substance of adsorbed polymer; With the debris of excess surface in wash-out hole.
High molecular polymer carries out polyreaction under the effect of Manganse Dioxide, certain electroconductibility can be made it have, use the basic solution process printed board of potassium permanganate again, potassium permanganate can produce chemical reaction generation Manganse Dioxide and be adsorbed on the surface of insulating material and the surface of printed board on the insulating material of base material, and can enter in the hole at non-conductive position of base material.
With the debris of excess surface in wash-out hole.
For removing adsorption layer contained humidity, short time high temperature and long subzero treatment can be adopted, to promote the sticking power between graphite carbon black and hole wall substrate surface.
Through above-mentioned process, printed board is immersed in acid potassium permanganate or high violent sour sodium, when the pcb substrate being adsorbed with Manganse Dioxide contacts the compound monomer in this acidic solution, meeting react with on the hole wall of insulation, generate insoluble conductive polymers, be follow-up can the conductive layer of Direct Electroplating copper
Electro-coppering: charged enter groove, and adopt rush current, guarantee that electroconductive coating is all capped.
Black holes metallization processes, not containing traditional electroless copper composition, is cancelled the use of the chemical substance of formaldehyde and harm ecotope, is belonged to environmentally friendly machine.Technical process simplifies, black holes processing procedure only needs 10 minutes, instead of very thin and unmanageable middle layer, thus improve the sticking power of electro-coppering, improve the metallized reliability of PCB aperture, compared with electroplating with traditional heavy copper, simple operation, with short production cycle, waste disposal fee reduces, thus reduces the total cost of production.
Claims (5)
1. a PCB black holes metallization processes, comprises the following steps:
(1) clean whole hole process: clean the process of whole hole with weakly alkaline sanitising agent, remove the greasy dirt on pcb board surface;
(2) use in water wash-out hole and the debris of excess surface;
(3) black holes process: be coated on hole wall with conductive silver paste and form conductive layer;
(4) use in water wash-out hole and the debris of excess surface, dry;
(5) pickling: carry out polyreaction under the effect of acidic solution;
(6) electro-coppering, charged enter groove, and adopt rush current, guarantee that conductive layer is all capped.
2. a kind of PCB black holes metallization processes according to claim 1, is characterized in that: the weakly alkaline sanitising agent described in step (1) is ammoniacal liquor or sodium hydroxide solution.
3. a kind of PCB black holes metallization processes according to claim 2, is characterized in that: ammoniacal liquor or sodium hydroxide solution temperature when clean controls at 60-65 DEG C.
4. a kind of PCB black holes metallization processes according to claim 1, is characterized in that: the high temperature of the oven dry available short period of time described in step (4) or long subzero treatment.
5. a kind of PCB black holes metallization processes according to claim 1, is characterized in that: the acidic solution described in step (5) can adopt acid potassium permanganate or high violent sour sodium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410499158.8A CN104294340A (en) | 2014-09-26 | 2014-09-26 | PCB black hole process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410499158.8A CN104294340A (en) | 2014-09-26 | 2014-09-26 | PCB black hole process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104294340A true CN104294340A (en) | 2015-01-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410499158.8A Pending CN104294340A (en) | 2014-09-26 | 2014-09-26 | PCB black hole process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104294340A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106191952A (en) * | 2016-07-20 | 2016-12-07 | 苏州顾氏新材料有限公司 | A kind of black holes liquid and methods for making and using same thereof |
| CN106319603A (en) * | 2016-08-29 | 2017-01-11 | 苏州铱诺化学材料有限公司 | Formula of blackhole hole-leveling agent |
| CN107723764A (en) * | 2017-10-31 | 2018-02-23 | 电子科技大学 | A kind of method of the Direct Electroplating on insulating substrate |
| CN108055793A (en) * | 2017-11-09 | 2018-05-18 | 建业科技电子（惠州）有限公司 | A kind of blind hole processing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1063395A (en) * | 1991-01-10 | 1992-08-05 | 机械电子工业部第十五研究所 | The non-chemical plating hole metallizing process-hole blackening method |
| CN104018196A (en) * | 2013-02-28 | 2014-09-03 | 武汉孟鼎电化学技术有限公司 | Direct plating method for printed circuit board free of chemical plating |
-
2014
- 2014-09-26 CN CN201410499158.8A patent/CN104294340A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1063395A (en) * | 1991-01-10 | 1992-08-05 | 机械电子工业部第十五研究所 | The non-chemical plating hole metallizing process-hole blackening method |
| CN104018196A (en) * | 2013-02-28 | 2014-09-03 | 武汉孟鼎电化学技术有限公司 | Direct plating method for printed circuit board free of chemical plating |
Non-Patent Citations (1)
| Title |
|---|
| 喻如英: "印制板金属化孔的直接电镀技术", 《印制电路信息》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106191952A (en) * | 2016-07-20 | 2016-12-07 | 苏州顾氏新材料有限公司 | A kind of black holes liquid and methods for making and using same thereof |
| CN106319603A (en) * | 2016-08-29 | 2017-01-11 | 苏州铱诺化学材料有限公司 | Formula of blackhole hole-leveling agent |
| CN107723764A (en) * | 2017-10-31 | 2018-02-23 | 电子科技大学 | A kind of method of the Direct Electroplating on insulating substrate |
| CN108055793A (en) * | 2017-11-09 | 2018-05-18 | 建业科技电子（惠州）有限公司 | A kind of blind hole processing method |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150121 |
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| WD01 | Invention patent application deemed withdrawn after publication |