CN104411107A - PCB electrogilding technology - Google Patents
PCB electrogilding technology Download PDFInfo
- Publication number
- CN104411107A CN104411107A CN201410612595.6A CN201410612595A CN104411107A CN 104411107 A CN104411107 A CN 104411107A CN 201410612595 A CN201410612595 A CN 201410612595A CN 104411107 A CN104411107 A CN 104411107A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- carried out
- film
- pcb
- silk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
Abstract
The invention discloses the PCB manufacturing technology. The PCB electrogilding technology comprises steps of, line manufacturing, a line is manufactured on a line board after copper plating; nickel plating, nickel plating is carried out in a nickel plating region of the line board; drying, the line board after nickel plating is dried; silkscreen, silkscreen for the line board is carried out by utilizing photosensitive printing ink; pre-baking, the line board after silkscreen is pre-baked; film contraposition, film contraposition for the line board is carried out; exposure development, exposure development for the film after contraposition is carried out; post-baking, post-baking for the line board after exposure development is carried out; acid pickling, acid pickling for the line board after post-baking is carried out; qualified-city-water washing, qualified-city-water washing for the line board after acid pickling is carried out; deionized water washing, deionized water washing for the line board after qualified-city-water washing is carried out; electrogilding, electrogilding for the nickel plating region of the line board is carried out; film removing, film removing for the line board after electrogilding is carried out; and etching, etching for the line board after film removing is carried out. The PCB electrogilding technology saves gold and greatly reduces production cost of enterprises.
Description
Technical field
The present invention relates to printed-board technology field, particularly relate to a kind of pcb board electricity gold process.
Background technology
Printed substrate (PCB) is almost applied in all electronic equipments that we can see, little of electronic watch, calculator, general-purpose computer, large to computer, electronics, military issue weapons system etc., as long as there are the electronic devices and components such as integrated circuit, the electric interconnection between them all will use PCB.Printed substrate is that its manufacturing process is comparatively complicated by arranging the conductive pattern that is electrically connected between electronic devices and components and formed on insulating substrate.In order to improve the conductivity of printed substrate, weldability and non-oxidizability, require all will at the copper foil surface nickel plating of its conductive pattern and gold on higher printed substrate.
In the electric gold process of traditional printed substrate, all conductive patterns all need plated with gold, therefore need to consume a large amount of gold, the waste not needing the position electricity gold of electricity gold to result in noble metal, and considerably increase the production cost of enterprise.
Summary of the invention
The object of the present invention is to provide the PCB electricity gold process of a kind of province gold.
In order to solve above-mentioned technical problem, the invention provides a kind of pcb board manufacture craft, comprising the following steps: circuit makes: the wiring board after copper facing makes circuit; Electricity nickel: in the electric nickel region electronickelling of described wiring board; Dry: the wiring board after electric nickel is dried; Silk-screen: utilize photosensitive-ink to carry out silk-screen to described wiring board; Pre-baked: to carry out pre-baked to the wiring board after silk-screen; Film aligning: the film and described wiring board are carried out contraposition; Exposure imaging: the film after contraposition is carried out exposure imaging; Rear roasting: the wiring board after exposure imaging to be carried out rear roasting; Pickling: pickling is carried out to the wiring board after rear baking; City is washed: carry out city's washing to the wiring board after pickling; Deionization is washed: carry out deionization washing to the wiring board after city's washing;
Electricity gold: at the electric nickel region electrogilding of described wiring board; Move back film: film is moved back to the wiring board after described electric gold; Etching: move back the wiring board after film etch described.
Wherein, in the rear before roasting step, also comprise step: check described wiring board whether oil impregnate, if described wiring board oil impregnate, then film is moved back to described wiring board, and described wiring board is dried again, silk-screen, preexamination, film aligning and exposure imaging.
Wherein, in described silk-screen step, the mesh of described silk-screen is 100T-150T.
Wherein, in described pre-baked step, described pre-baked temperature is 80 °-90 °, and the pre-baked time of every one side of described wiring board is 8-12 minute.
Wherein, in described rear roasting step, described rear roasting temperature is 110 °-130 °, and the rear roasting time of described wiring board is 6-10 minute.
Wherein, in described acid pickling step, the hydrochloric acid that the acid that described pickling uses is 3%-5%.
Wherein, the soak time of described pickling is not less than 10 seconds, is no more than 1 minute.
Wherein, in described city water-washing step, the replacing frequency of described city water is 2 hours/time, and the frequency of dripping is 10 seconds/.
Wherein, in described deionization water-washing step, the replacing frequency of described deionized water is 4 hours/time, and the frequency of dripping is 10 seconds/, and the time of described deionization washing is no more than 10 minutes.
Wherein, in described silk-screen step, adopt manual platform silk-screen, rope paper frequency is 5-10PNL.
Implement the pcb board electricity gold process of the embodiment of the present invention, its beneficial effect is, pickling was carried out before pcb board electricity gold, and before moving back film, carry out electricity gold, amassing by surfacing of pcb board can be greatly reduced, make to save gold in the electric gold process of pcb board, greatly reduce the production cost of enterprise.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the first execution mode of embodiment of the present invention pcb board electricity gold process.
Fig. 2 is the schematic flow sheet of the second execution mode of embodiment of the present invention pcb board electricity gold process.
Embodiment
Below in conjunction with Figure of description, the technical scheme in embodiment of the present invention is clearly and completely described.
With reference to Fig. 1, embodiments provide a kind of pcb board electricity gold process, comprise the following steps: circuit makes: the wiring board after copper facing makes circuit; Electricity nickel: in the electric nickel region electronickelling of described wiring board; Dry: the wiring board after electric nickel is dried; Silk-screen: utilize photosensitive-ink to carry out silk-screen to described wiring board; Pre-baked: to carry out pre-baked to the wiring board after silk-screen; Film aligning: the film and described wiring board are carried out contraposition; Exposure imaging: the film after contraposition is carried out exposure imaging; Rear roasting: the wiring board after exposure imaging to be carried out rear roasting; Pickling: pickling is carried out to the wiring board after rear baking; City is washed: carry out city's washing to the wiring board after pickling; Deionization is washed: carry out deionization washing to the wiring board after city's washing; Electricity gold: at the electric nickel region electrogilding of described wiring board; Move back film: film is moved back to the wiring board after described electric gold; Etching: move back the wiring board after film etch described.
Implement the pcb board electricity gold process of the embodiment of the present invention, before pcb board electricity gold, carry out pickling, and before moving back film, carry out electricity gold, amassing by surfacing of pcb board can be greatly reduced, make to save gold in the electric gold process of pcb board, greatly reduce the production cost of enterprise.
Wherein, in described silk-screen step, the mesh of described silk-screen is 100T-150T.
Wherein, in described pre-baked step, described pre-baked temperature is 80 °-90 °, and the pre-baked time of every one side of described wiring board is 8-12 minute.
Wherein, in described rear roasting step, described rear roasting temperature is 110 °-130 °, and the rear roasting time of described wiring board is 6-10 minute.
Wherein, in described acid pickling step, the hydrochloric acid that the acid that described pickling uses is 3%-5%.
Wherein, the soak time of described pickling is not less than 10 seconds, is no more than 1 minute.
Wherein, in described city water-washing step, the replacing frequency of described city water is 2 hours/time, and the frequency of dripping is 10 seconds/.
Wherein, in described deionization water-washing step, the replacing frequency of described deionized water is 4 hours/time, and the frequency of dripping is 10 seconds/, and the time of described deionization washing is no more than 10 minutes.
Wherein, in described silk-screen step, adopt manual platform silk-screen, rope paper frequency is 5-10PNL.
With reference to Fig. 2, the embodiment of the present invention proposes the second execution mode of pcb board electricity gold process, namely before baking step in the rear, also comprise step: check described wiring board whether oil impregnate, if described wiring board oil impregnate, then film is moved back to described wiring board, and described wiring board is dried again, silk-screen, preexamination, film aligning and exposure imaging, if described wiring board.
Implement the pcb board electricity gold process of example of the present invention, before pcb board electricity gold, carry out pickling, and before moving back film, carry out electricity gold, amassing by surfacing of pcb board can be greatly reduced, make to save gold in the electric gold process of pcb board, greatly reduce the production cost of enterprise.
Furthermore, the embodiment of the present invention provides the cost calculation example calculating this pcb board electricity gold process further:
1, the D3804 in units of 100 ㎡ is 900pnl altogether
2, labour cost: 8.85 Yuan/㎡ * 100 ㎡=885 yuan
3, ink calculating 1kg ink prints 10 ㎡, and 100 ㎡ share ink 20kg
Account form: (100 ㎡ * 2 face) ÷ 10 ㎡=20kg*45 unit/KG(ink unit price)=900 yuan
4,900pnl plate when totally 3 people's contrapositions share with 1 exposure machine 5 hours
Account form 900pnl ÷ 3 people ÷ 60pnl people/H=5H
With 5KW exposure machine altogether power consumption: 5H*5KW/ hour=25KWH*1.2 unit/degree (unit price of electricity)=30 yuan
5, developing machine needs 3 hours with the speed of 2.0M/min development 900pnl
Power consumption calculates: 40KW/ hour (developing machine power) * 3 hours=120KWH*1.2 unit/degree=144 yuan
Water consumption calculates: the unit price of 700L/ hour (flow) * 3 hours=2100L*6 unit/T(water)=13 yuan
This pcb board electricity gold process second time circuit total cost: 885+900+30+144+13+13 yuan (electric cost of screen printer)=1985 yuan
Furthermore, on the basis of above-mentioned calculated examples, this pcb board electricity gold process and traditional electric gold process contrast by the embodiment of the present invention further.
1, get D3804 item number 100 ㎡ (quantity: 900pnl) for unit and carry out assessment of cost;
A, PNL size: 520.5*249MM;
B, former electricity gold amass by surfacing: about 53%(one side);
C, new technology electricity gold amasss by surfacing: about 15%(one side);
D, electric golden thickness: 0.4-0.6U "
2, the golden cost of former electricity:
A, 520.5*249MM*53%*2*0.5 U " * 900pnl*19.3=29.83g(electricity gold amount)
B, required golden salt: 29.83/0.683=43.67g(gold salt amount)
3, the golden cost of new technology electricity
A, 520.5*249MM*15%*2*0.5 U " * 900pnl*19.3=8.44g(electricity gold amount)
B, required golden salt: 8.44/0.683=12.36g(gold salt amount)
4, Cost comparisons:
A, save golden salt ratio:
Represent with percentage: 100%-12.36/43.67*100=72%, new technology saves 72% gold medal salt than former technique;
B, save golden salt amount:
Gold salt amount (g): 43.67-12.36=31.31g, new technology saves 31.31 g gold salt than reason technique;
C, with the 240 yuan of calculating of every gram of golden salt, (31.31*240=) 7514 yuan can be saved:
D, finally can to save: the golden salt of new technology saving 7514 yuan of amount of money cuts the cost 1985 yuan because second time circuit increases;
7514-1985=5529 unit, finally can save 5529 yuan.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a pcb board manufacture craft, is characterized in that, comprises the following steps:
Circuit makes: the wiring board after copper facing makes circuit;
Electricity nickel: in the electric nickel region electronickelling of described wiring board;
Dry: the wiring board after electric nickel is dried;
Silk-screen: utilize photosensitive-ink to carry out silk-screen to described wiring board;
Pre-baked: to carry out pre-baked to the wiring board after silk-screen;
Film aligning: the film and described wiring board are carried out contraposition;
Exposure imaging: the film after contraposition is carried out exposure imaging;
Rear roasting: the wiring board after exposure imaging to be carried out rear roasting;
Pickling: pickling is carried out to the wiring board after rear baking;
City is washed: carry out city's washing to the wiring board after pickling;
Deionization is washed: carry out deionization washing to the wiring board after city's washing;
Electricity gold: at the electric nickel region electrogilding of described wiring board;
Move back film: film is moved back to the wiring board after described electric gold;
Etching: move back the wiring board after film etch described.
2. pcb board electricity gold process according to claim 1, is characterized in that, in the rear before roasting step, also comprises step:
Check described wiring board whether oil impregnate, if described wiring board oil impregnate, then film moved back to described wiring board, and described wiring board is dried again, silk-screen, preexamination, film aligning and exposure imaging.
3. pcb board electricity gold process according to claim 1, it is characterized in that, in described silk-screen step, the mesh of described silk-screen is 100T-150T.
4. pcb board electricity gold process according to claim 1, it is characterized in that, in described pre-baked step, described pre-baked temperature is 80 °-90 °, and the pre-baked time of every one side of described wiring board is 8-12 minute.
5. pcb board electricity gold process according to claim 1, it is characterized in that, in described rear roasting step, described rear roasting temperature is 110 °-130 °, and the rear roasting time of described wiring board is 6-10 minute.
6. pcb board electricity gold process according to claim 1, is characterized in that, in described acid pickling step, and the hydrochloric acid that the acid that described pickling uses is 3%-5%.
7. pcb board electricity gold process according to claim 6, it is characterized in that, the soak time of described pickling is not less than 10 seconds, is no more than 1 minute.
8. PCB electricity gold process according to claim 1, it is characterized in that, in described city water-washing step, the replacing frequency of described city water is 2 hours/time, and the frequency of dripping is 10 seconds/.
9. PCB electricity gold process according to claim 1, it is characterized in that, in described deionization water-washing step, the replacing frequency of described deionized water is 4 hours/time, and the frequency of dripping is 10 seconds/, and the time of described deionization washing is no more than 10 minutes.
10. the PCB electricity gold process according to claim 1-9, it is characterized in that, in described silk-screen step, adopt manual platform silk-screen, rope paper frequency is 5-10PNL.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410612595.6A CN104411107A (en) | 2014-11-05 | 2014-11-05 | PCB electrogilding technology |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410612595.6A CN104411107A (en) | 2014-11-05 | 2014-11-05 | PCB electrogilding technology |
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| Publication Number | Publication Date |
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| CN104411107A true CN104411107A (en) | 2015-03-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410612595.6A Pending CN104411107A (en) | 2014-11-05 | 2014-11-05 | PCB electrogilding technology |
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| CN (1) | CN104411107A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555037A (en) * | 2016-02-02 | 2016-05-04 | 东莞翔国光电科技有限公司 | Manufacturing process for PCB (printed circuit board) with micropore structure |
| CN107580411A (en) * | 2017-08-31 | 2018-01-12 | 广州兴森快捷电路科技有限公司 | Gold finger lead structure and preparation method |
| CN107815669A (en) * | 2017-11-02 | 2018-03-20 | 广州市天承化工有限公司 | A kind of method of PCB chemical nickel and golds |
| CN112804821A (en) * | 2020-12-14 | 2021-05-14 | 中山市宝悦嘉电子有限公司 | Selective electrogilding process for PCB (printed circuit board) |
| CN113365432A (en) * | 2020-03-05 | 2021-09-07 | 竞华电子(深圳)有限公司 | Method for improving character jet printing adhesion and printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105555037A (en) * | 2016-02-02 | 2016-05-04 | 东莞翔国光电科技有限公司 | Manufacturing process for PCB (printed circuit board) with micropore structure |
| CN107580411A (en) * | 2017-08-31 | 2018-01-12 | 广州兴森快捷电路科技有限公司 | Gold finger lead structure and preparation method |
| CN107815669A (en) * | 2017-11-02 | 2018-03-20 | 广州市天承化工有限公司 | A kind of method of PCB chemical nickel and golds |
| CN113365432A (en) * | 2020-03-05 | 2021-09-07 | 竞华电子(深圳)有限公司 | Method for improving character jet printing adhesion and printed circuit board |
| CN112804821A (en) * | 2020-12-14 | 2021-05-14 | 中山市宝悦嘉电子有限公司 | Selective electrogilding process for PCB (printed circuit board) |
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Application publication date: 20150311 |