CN1063395A - The non-chemical plating hole metallizing process-hole blackening method - Google Patents
The non-chemical plating hole metallizing process-hole blackening method Download PDFInfo
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- CN1063395A CN1063395A CN 91100028 CN91100028A CN1063395A CN 1063395 A CN1063395 A CN 1063395A CN 91100028 CN91100028 CN 91100028 CN 91100028 A CN91100028 A CN 91100028A CN 1063395 A CN1063395 A CN 1063395A
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Abstract
The present invention relates to PCB Hole Metallization technology, a kind of non-chemical plating hole metallizing process-hole blackening method.The invention belongs to field of printed-circuit board manufacturing technology.Its technological process is to deceive the hole processing before pcb plating, makes to apply the black hole of last layer film on its hole wall, and drying, striping are handled then, carry out the electro-coppering operation again.This method is compared with chemical plating hole metallization technology has the reliability height, and technological process is simple, and black hole nontoxic, tasteless, the no burn into of liquid reduces pollution, and water consumption is few, saves copper and noble metal, the effect that cost is low; This method is safe and reliable, uses in a large number in being convenient to produce; This method is specially adapted to aperture, highdensity printed-circuit board manufacturing technology.
Description
The present invention relates to PCB Hole Metallization technology, a kind of non-chemical plating hole metallization technology-Hei hole method.
The invention belongs to printed circuit board manufacturing technology field.
In the prior art, PCB Hole Metallization technology, generally be to use the method for chemical plating, promptly before the electric plating of whole board operation is carried out in printed board, through giving processing-sensitization, activation processing, then, with chemical plating hole metallization method, behind deposition last layer metal on the non metallic substrate, carry out the electro-coppering operation again, for example conventional the electroplates in hole (PTH) technology, its technological process is as follows:
Copper clad laminate → cleaning → sensitization → activation → electroless copper → electro-coppering
This method has the following disadvantages:
1. in the chemical plating process, can produce hydrogen, the effusion owing to hydrogen in the plating hole can hinder the surface that plating bath immerses the hole, so that cause the incomplete phenomenon of metallization in the hole;
2. in the chemical plating process, generally adopt formaldehyde to make reducing agent, this tends to cause disproportionated reaction, influences the copper facing quality, even causes tank liquor to decompose, and expends tank liquor, also has the severe contamination problem;
3. chemical plating process complexity, will give processing before the plating, for example multiple working procedure such as sensitization, activation activates and need use precious metal, as Pd, processing procedure requires automatic control equipment, and is extremely unstable because of the plating bath of electroless copper again, easily decomposes, want wasteful water gaging in the chemical plating process, therefore, this technology waste is big, the cost height.
The objective of the invention is to overcome above deficiency, a kind of non-chemical plating hole metallization technology-Hei hole method is provided.
Technical essential of the present invention is, utilizes a kind of black hole liquid with certain conductivity, and it is coated in the through hole of copper-clad plate, make it to replace to be deposited on suprabasil layer of metal in the chemical plating process, make in this way and can simplify preprocessor, economical with materials reduces and pollutes, and reduces cost.
The technological process of black hole method:
Copper clad laminate → cleaning → black holeization → drying → striping → electro-coppering
The concrete practice is:
1. clean: purpose is greasy dirt and other impurity of removing in the printed board through hole, in helping and the electric He of resin surface, is beneficial to black hole liquid and adsorbs fully on hole wall; This operation is carried out in two steps;
A. alkali cleaning: the copper clad laminate that machine work is good, immerse to contain in the alkaline bath that concentration is 5～20% NaOH aqueous slkali and soaked 5～20 minutes, temperature remains on 20～60 ℃ of scopes, and after the taking-up, the water flushing is rinsed well with deionized water again;
B. pickling: with the copper clad laminate (printed board) of alkali cleaning, put into concentration and be 10% dilution heat of sulfuric acid, under room temperature state, flooded 1～3 minute, after the taking-up, the water flushing is rinsed well with deionized water again;
2. black holeization: printed board is immersed in the liquid of black hole, and temperature remains on 15～40 ℃, flood 1～10 minute, make black hole liquid equably coated on hole wall, and contact well in the dielectric base layer, make and deceive the hole plate;
3. dry: will deceive orifice plate and place vacuumize or heat drying under the room temperature, heating-up temperature is incubated 20～30 minutes 75～120 ℃ of scopes, can use far infrared drying machine or other drying plant to carry out, and makes through this operation to form uniform black thin film in the hole;
4. striping: through the printed board of above-mentioned operation, all expose portions all scribble one deck black thin film, and this operation is the black thin film of copper laminar surface will be removed; Carry out in order to following method:
A. Mechanical Method is utilized wiping board machine or other instrument, wipes the black thin film that remains in the copper laminar surface;
B. weak etch: with 200g/l sodium peroxydisulfate and concentration is 0.4～1% sulfuric acid liquid, is mixed with weak corrosive liquid, will deceive orifice plate and put into weak corrosion liquid bath, at room temperature soaks water flushing immediately after the taking-up about 1 minute; This process should be carried out in dedicated slot, utilizes circulating pump to filter, and weak corrosive liquid can be recycled.
5. electro-coppering: will deceiving the hole plate, to immerse concentration be to flood in 5% the sulfuric acid solution, after the taking-up, carries out electric plating of whole board in the acid electroplating bath of routine, and Current Control is at 1～1.5A/dm during plating
2, the time kept 0.5 hour, and thickness of coating reaches 6 μ m and gets final product.
Through after the above operation, can graphic plating technology routinely finish the making of printed circuit board.
Black hole formula of liquid is as follows, prescription 1:
Compound title specification proportioning (WT%)
Graphite and carbon black are less than 3 μ m 0.1～5
Alkali metal hydroxide CP 0.1～1.5
Surface active agent ion type 0.01～2
Silica gel PH8～10 are less than 0.5
Water-soluble polymer molecular weight 1000～3,000 0.01～0.2
Deionized water PH7 balance
Prescription 2:
Compound title specification proportioning (WT%)
Aquadag solids content 10～25% 20～50
Surface active agent ion type 0.01～0.1
Hydroxide CP 0.01～0.05
Silica gel PH8～10 are less than 0.3
Deionized water PH7 balance
To deceive after hole liquid prepares in above ratio, and put into container, and stir with high speed agitator (greater than 2000 rev/mins), until making uniform suspension, pH value is controlled between 8～10.
Embodiments of the invention are as follows:
To carry out the copper clad laminate after the hole processing, remove behind the burr in the hole in, put in the alkaline bath immersion into 5 minutes, the temperature of groove is 40 ℃, takes out back water flushing, puts into the deionization tank again and soaks, and take out immediately and put into descaling bath, flooding 2 minutes, temperature is a room temperature in the groove; Take out the back with the big flood flushing, put into the deionization tank again and soak, and take out immediately, put in the liquid bath of black hole, the temperature in this groove is 22 ℃, floods after 4 minutes and takes out, put in the baking oven that circulating blast device is housed and dry, temperature is controlled at 105 ℃, places after 25 minutes and to take out, be cooled to room temperature after, after soaking for 30～60 seconds in the corrosion liquid bath a little less than putting it into again, the black book film fall in flakes of printing board surface takes out and washes with big flood, can carry out electric plating of whole board.It is 5%(VOL that printed board behind the striping is immersed in concentration) the sulfuric acid solution groove in, then, take out and put into the copper facing of electro-coppering groove, Current Control is at 1A/dm
2, the time is 30 minutes.
Among this embodiment, the prescription of black hole liquid is:
Compound title specification proportioning (WT%)
The aquadag solids content is 12% 40
Surface active agent ion type 0.01
Hydroxide CP 0.02
Silica gel PH8～10 0.1
Deionized water PH7 balance
The prescription of electrolytic copper plating solution is:
Copper sulphate 100 g/l
Sulfuric acid 184 g/l
Cl
-1(chloride ion) 60m g/l
153 additives, 8～10mg/l
After the electric plating of whole board operation was finished, graphic plating technology was finished the making of printed circuit board routinely.
The present invention compares with chemical plating hole metallization technology has following effect:
1. the plated through-hole reliability height of the printed board of processing with non-chemical plating hole metallization technology of the present invention-Hei hole method, indices all meets national standard (GB4588.2-84) requirement of printed circuit board;
2. the technological process of this method is simple, easy operating;
3. this method is not used poisonous formalin, and hole blackening solution is stable, and is nontoxic, tasteless, does not have corrosion, reduces and pollutes; Again because of copper content in the cleaning fluid less than 1PPM, so rinse water can Reusability, greatly reduce water consumption;
4. save copper and noble metal, so the printed circuit board cost that uses this method to produce is low, every square metre about 10～15 yuan, then need 20～30 yuan with general chemical plating hole metallization explained hereafter.
Method safety of the present invention is reliable, uses in a large number in being convenient to produce; Method of the present invention is specially adapted to aperture, highdensity printed-circuit board manufacturing technology.
Claims (7)
1, a kind of non-chemical plating hole metallization technology-Hei hole method that is used to make printed circuit board, its technological process: with copper clad laminate copper facing again behind cleaning, hole metallization, it is characterized in that: the copper clad laminate (printed board) before will electroplating is deceived the hole processing, make and apply the black hole of last layer film on its hole wall, drying, striping are handled then, carry out the electro-coppering operation again.
2, non-chemical plating hole metallization technology according to claim 1-Hei hole method, it is characterized in that: black hole processing: printed board is immersed in the liquid of black hole, temperature remains on 15～40 ℃, flooded 1～10 minute, make black hole liquid equably coated on hole wall, and good in the contact of dielectric base layer, make black hole plate.
3, non-chemical plating hole metallization technology according to claim 1-Hei hole method, it is characterized in that: matting is undertaken by following step preface:
A. alkali cleaning: the copper clad laminate that machine work is good, immerse to contain in the alkaline bath that concentration is 5～20% NaOH aqueous slkali and soaked 5～20 minutes, temperature remains on 20～60 ℃ of scopes, and after the taking-up, the water flushing is rinsed well with deionized water again;
B. pickling: with the copper clad laminate (printed board) of alkali cleaning, put into concentration and be 10% dilution heat of sulfuric acid, under room temperature state, flooded 1～3 minute, after the taking-up, the water flushing is rinsed well with deionized water again.
4, non-chemical plating hole metallization technology according to claim 2-Hei hole method is characterized in that: the prescription of black hole liquid is:
Compound title specification proportioning (WT%)
Graphite and carbon black are less than 3 μ m 0.1～5
Alkali metal hydroxide CP 0.1～1.5
Surface active agent ion type 0.01～2
Silica gel PH8～10 are less than 0.5
Water-soluble polymer molecular weight 1000～3,000 0.01～0.2
Deionized water PH7 balance
5, non-chemical plating hole metallization technology according to claim 2-Hei hole method is characterized in that: the prescription of black hole liquid is:
Compound title specification proportioning (WT%)
Aquadag solids content 10～25% 20～50
Surface active agent ion type 0.01～0.1
Hydroxide CP 0.01～0.05
Silica gel PH8～10 are less than 0.3
Deionized water PH7 balance
6, non-chemical plating hole metallization technology according to claim 1-Hei hole method,
It is characterized in that:
Dry: will deceive the hole plate and place vacuumize or heat drying under the room temperature, heating-up temperature is incubated 20～30 minutes 75～120 ℃ of scopes,
Make and form uniform black thin film in the hole;
Striping: through the printed board of above-mentioned operation, all expose portions all scribble one deck black thin film, and this operation is the black thin film of copper laminar surface will be removed; Carry out in order to following method:
A. Mechanical Method is utilized wiping board machine or other instrument, wipes the black thin film that remains in the copper laminar surface;
B. weak etch: with 200g/l sodium peroxydisulfate and concentration is 0.4～1% sulfuric acid solution, is mixed with weak corrosive liquid, will deceive orifice plate and put into weak corrosion liquid bath, at room temperature soaks water flushing immediately after the taking-up about 1 minute.
7, non-chemical plating hole metallization technology according to claim 1-Hei hole method,
It is characterized in that:
Electro-coppering: will deceiving the hole plate, to immerse concentration be to flood in 5% the sulfuric acid solution, after the taking-up, carries out electric plating of whole board again in the acid electroplating bath of routine, and Current Control is at 1～1.5A/dm during plating
2, the time kept 0.5 hour, and thickness of coating reaches 6 μ m and gets final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 91100028 CN1063395A (en) | 1991-01-10 | 1991-01-10 | The non-chemical plating hole metallizing process-hole blackening method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 91100028 CN1063395A (en) | 1991-01-10 | 1991-01-10 | The non-chemical plating hole metallizing process-hole blackening method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1063395A true CN1063395A (en) | 1992-08-05 |
Family
ID=4904405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 91100028 Pending CN1063395A (en) | 1991-01-10 | 1991-01-10 | The non-chemical plating hole metallizing process-hole blackening method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1063395A (en) |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101394712B (en) * | 2007-09-21 | 2010-08-25 | 清华大学 | Hole blackening solution and preparation thereof |
| CN101150930B (en) * | 2006-09-18 | 2010-12-15 | 比亚迪股份有限公司 | A graphic plating method for dual-side and multi-layer flexible printed circuit board |
| CN101631427B (en) * | 2008-07-14 | 2011-07-27 | 深圳市九和咏精密电路有限公司 | Method for plating thick gold layer in circuit board manufacturing process |
| CN102647858A (en) * | 2012-05-15 | 2012-08-22 | 金悦通电子（翁源）有限公司 | Processing method of printed circuit board (PCB) |
| WO2013059985A1 (en) * | 2011-10-25 | 2013-05-02 | 建业（惠州）电路版有限公司 | Process for metallisation of holes in printed circuit board |
| CN103160896A (en) * | 2013-03-01 | 2013-06-19 | 溧阳市新力机械铸造有限公司 | Preparing method of black hole solution for printed circuit board |
| CN103429009A (en) * | 2012-05-25 | 2013-12-04 | 镇江华扬信息科技有限公司 | Manufacture method of printed circuit board comprising metal aluminium layer |
| CN103675584A (en) * | 2013-09-10 | 2014-03-26 | 镇江华印电路板有限公司 | A circuit board black pore conductivity test method |
| CN104302124A (en) * | 2014-08-27 | 2015-01-21 | 无锡长辉机电科技有限公司 | Manufacturing technology of double-faced flexibility printed board |
| CN104294340A (en) * | 2014-09-26 | 2015-01-21 | 无锡长辉机电科技有限公司 | PCB black hole process |
| CN104388996A (en) * | 2014-10-30 | 2015-03-04 | 苏州禾川化学技术服务有限公司 | Black hole liquid and preparation method thereof |
| CN104411107A (en) * | 2014-11-05 | 2015-03-11 | 深圳恒宝士线路板有限公司 | PCB electrogilding technology |
| CN105063681A (en) * | 2015-08-28 | 2015-11-18 | 韶关硕成化工有限公司 | High-concentration carbon hole solution for PCB and preparation method thereof |
| CN105132962A (en) * | 2015-08-28 | 2015-12-09 | 韶关硕成化工有限公司 | High-concentration carbon pore solution applied to PCB boards and preparation method thereof |
| CN105177661A (en) * | 2015-08-28 | 2015-12-23 | 韶关硕成化工有限公司 | High-concentration carbon pore solution for PCB and preparation method of high-concentration carbon pore solution |
| CN105282989A (en) * | 2015-10-14 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Manufacturing method of windowed rigid-flex PCB |
| CN107740145A (en) * | 2017-10-16 | 2018-02-27 | 广州市天承化工有限公司 | A kind of highly conductive carbon pores liquid of pcb board and its preparation method and application |
| CN108323036A (en) * | 2018-02-10 | 2018-07-24 | 深圳市祥盛兴科技有限公司 | A kind of blank hole liquid and black holes chemical industry skill |
| CN109219251A (en) * | 2018-08-30 | 2019-01-15 | 广合科技（广州）有限公司 | A kind of production method of flexible electric circuit board fine-line |
| CN109327975A (en) * | 2017-07-31 | 2019-02-12 | 奥特斯奥地利科技与***技术有限公司 | The method and plater that zero defect copper for the hole in component load-bearing part is filled |
| CN112333933A (en) * | 2020-11-03 | 2021-02-05 | 生益电子股份有限公司 | Manufacturing method of mixed pressing plate and mixed pressing plate |
-
1991
- 1991-01-10 CN CN 91100028 patent/CN1063395A/en active Pending
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101150930B (en) * | 2006-09-18 | 2010-12-15 | 比亚迪股份有限公司 | A graphic plating method for dual-side and multi-layer flexible printed circuit board |
| CN101394712B (en) * | 2007-09-21 | 2010-08-25 | 清华大学 | Hole blackening solution and preparation thereof |
| CN101631427B (en) * | 2008-07-14 | 2011-07-27 | 深圳市九和咏精密电路有限公司 | Method for plating thick gold layer in circuit board manufacturing process |
| CN103222351A (en) * | 2011-10-25 | 2013-07-24 | 建业（惠州）电路版有限公司 | Method for metallisation of holes in printed circuit board |
| CN103222351B (en) * | 2011-10-25 | 2015-12-16 | 建业（惠州）电路版有限公司 | The metallized method of printed circuit board aperture |
| WO2013059985A1 (en) * | 2011-10-25 | 2013-05-02 | 建业（惠州）电路版有限公司 | Process for metallisation of holes in printed circuit board |
| CN102647858A (en) * | 2012-05-15 | 2012-08-22 | 金悦通电子（翁源）有限公司 | Processing method of printed circuit board (PCB) |
| CN103429009A (en) * | 2012-05-25 | 2013-12-04 | 镇江华扬信息科技有限公司 | Manufacture method of printed circuit board comprising metal aluminium layer |
| CN103160896A (en) * | 2013-03-01 | 2013-06-19 | 溧阳市新力机械铸造有限公司 | Preparing method of black hole solution for printed circuit board |
| CN103160896B (en) * | 2013-03-01 | 2015-06-10 | 溧阳市新力机械铸造有限公司 | Preparing method of black hole solution for printed circuit board |
| CN103675584A (en) * | 2013-09-10 | 2014-03-26 | 镇江华印电路板有限公司 | A circuit board black pore conductivity test method |
| CN104302124A (en) * | 2014-08-27 | 2015-01-21 | 无锡长辉机电科技有限公司 | Manufacturing technology of double-faced flexibility printed board |
| CN104294340A (en) * | 2014-09-26 | 2015-01-21 | 无锡长辉机电科技有限公司 | PCB black hole process |
| CN104388996A (en) * | 2014-10-30 | 2015-03-04 | 苏州禾川化学技术服务有限公司 | Black hole liquid and preparation method thereof |
| CN104411107A (en) * | 2014-11-05 | 2015-03-11 | 深圳恒宝士线路板有限公司 | PCB electrogilding technology |
| CN105132962A (en) * | 2015-08-28 | 2015-12-09 | 韶关硕成化工有限公司 | High-concentration carbon pore solution applied to PCB boards and preparation method thereof |
| CN105063681A (en) * | 2015-08-28 | 2015-11-18 | 韶关硕成化工有限公司 | High-concentration carbon hole solution for PCB and preparation method thereof |
| CN105177661A (en) * | 2015-08-28 | 2015-12-23 | 韶关硕成化工有限公司 | High-concentration carbon pore solution for PCB and preparation method of high-concentration carbon pore solution |
| CN105282989A (en) * | 2015-10-14 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Manufacturing method of windowed rigid-flex PCB |
| CN105282989B (en) * | 2015-10-14 | 2018-06-15 | 深圳崇达多层线路板有限公司 | A kind of production method of fenestration Rigid Flex |
| CN109327975A (en) * | 2017-07-31 | 2019-02-12 | 奥特斯奥地利科技与***技术有限公司 | The method and plater that zero defect copper for the hole in component load-bearing part is filled |
| CN107740145A (en) * | 2017-10-16 | 2018-02-27 | 广州市天承化工有限公司 | A kind of highly conductive carbon pores liquid of pcb board and its preparation method and application |
| CN108323036A (en) * | 2018-02-10 | 2018-07-24 | 深圳市祥盛兴科技有限公司 | A kind of blank hole liquid and black holes chemical industry skill |
| CN109219251A (en) * | 2018-08-30 | 2019-01-15 | 广合科技（广州）有限公司 | A kind of production method of flexible electric circuit board fine-line |
| CN109219251B (en) * | 2018-08-30 | 2020-11-13 | 广州广合科技股份有限公司 | Manufacturing method of fine circuit of flexible circuit board |
| CN112333933A (en) * | 2020-11-03 | 2021-02-05 | 生益电子股份有限公司 | Manufacturing method of mixed pressing plate and mixed pressing plate |
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