CN104073845A - Gold plating method for PCB - Google Patents
Gold plating method for PCB Download PDFInfo
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- CN104073845A CN104073845A CN201410255783.8A CN201410255783A CN104073845A CN 104073845 A CN104073845 A CN 104073845A CN 201410255783 A CN201410255783 A CN 201410255783A CN 104073845 A CN104073845 A CN 104073845A
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- pcb board
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Abstract
The invention provides a gold plating method for a PCB. A protective film is arranged on a gold-unplated region so that the gold-unplated region is prevented from being polluted; meanwhile, a nickel-based layer is plated firstly so that the obtained coating is level in surface; the metal nickel layer with the coating which is uniform and strong in binding force can be used for favorably improving the quality of a gold plated layer, and meanwhile, the gold plating efficiency and the utilization ratio of a gold plating solution can also be increased, so that the resource is saved; in addition, the gold plating method is low in cost and simple in operation step.
Description
Technical field
The present invention relates to a kind of electric plating method, particularly a kind of gold-plated method of pcb board.
Background technology
In modern industry is produced, Metal plating is applied widely by people, and in the surface treatment of pcb board, electrogilding is a very important step process.Existing craft of gilding is generally present plated surface one deck nickel, and then in nickel dam surface gold-plating.There is the poor defect of dispersive ability in prior art nickel-phosphorus alloy coating, it is the problem of low current density district plating leakage, and in existing electronickelling, adopt constant current density to electroplate, what current density directly affected is exactly coating deposition rate, and current density is large, sedimentation velocity is fast, otherwise slow, but current density large after, coating can be more coarse, even can burn, affect outward appearance and antiseptic property.Therefore how to improve electroplating efficiency and improve electroplating quality and become a very large problem.
Summary of the invention
For addressing the above problem, the invention discloses a kind of gold-plated method of pcb board.
In order to achieve the above object, the invention provides following technical scheme: a kind of method that pcb board is gold-plated, comprises the steps:
(1), overlay film processing is carried out in the non-gold-plated region on pcb board, on its non-gold-plated region, be covered with layer protecting film;
(2), the pcb board that has covered protective membrane is immersed in the alkaline cleaning fluid that removes PH 10-12 and soaks 5-8min, and carry out electrolysis treatment, cathode current density is 3-5 A/dm2, carries out surface cleaning, remove surperficial greasy dirt, after electrolysis, rinse with deionized water;
(3), pcb board is immersed in acid solvent and cleaned, remove its surperficial oxide film, after pickling, pcb board is put into clear water and clean up;
(4), will carry out activation treatment through step 3 pcb board after treatment, after being disposed, rinse well with clear water again;
(5), pcb board being put into electroplating solution electroplates, described electroplating solution comprises following composition: concentration is that 80 g/L-140 g/L single nickel salts, concentration are that 180 g/L-220 g/L single nickel salt nickel sulfamic acids, concentration are that nickelous chloride, the concentration of 10 g/L-20 g/L is the boric acid of 20 g/L, described solution temperature is 45-75 DEG C, the density of electric current is to replace between 6-12 A/dm2 and 20-30A/dm2, wherein the time between low current and high electric current compares for 1:2-2:3, and electroplating time is 15min-20min;
(6), the pcb board having plated in step 5 is passed through in the basic solution through PH 10-12;
(7), by the pcb board deionized water rinsing in step 6;
(8), the pcb board in step 7 being put into gold plating solution electroplates, described gold plating solution comprises following composition: inorganic salt 1～50 g/L of gold, main complexing agent barbiturate 5～250 g/L, organic polyphosphonic acid 1～60 g/L of auxiliary complex-former, pyridine carboxylic acid 30-60 g/L, 2-thiobarbituricacidα-50-150 g/L;
(9), the pcb board in step 8 is rinsed with deionized water;
(10), the pcb board in step 9 is sent in the baking oven of vacuum and is dried, the temperature of baking oven is controlled at 280-300 DEG C.
As a modification of the present invention, the concentration ratio between described single nickel salt and described single nickel salt nickel sulfamic acid is 1:2-2:3.
As a modification of the present invention, the acid solvent in described step 3 be the mixture of rare nitric acid and dilute sulphuric acid, wherein the concentration ratio between rare nitric acid and dilute sulphuric acid is 1:1-1:2.
As a modification of the present invention, the step of in step 4, pcb board being carried out to activation treatment, for pcb board is put into stearic acid, is soaked in the mixing solutions of Sodium dodecylbenzene sulfonate, and wherein soak time is 2-5min.
The method gold plating method that a kind of pcb board provided by the invention is gold-plated; with low cost; operation steps is simple, by non-gold-plated region division protective membrane, prevents the pollution in non-gold-plated region; simultaneously by first plating the Ni-based layer of one deck; the coating surface obtaining is smooth, and the metal nickel dam that coating is even, binding force of cladding material is strong can improve the quality of Gold plated Layer well; also can improve the utilization ratio of gold-plated efficiency and gold plating liquid, saved resource simultaneously.
Embodiment
Below with reference to specific embodiment, technical scheme provided by the invention is elaborated, should understands following embodiment and only be not used in and limit the scope of the invention for the present invention is described.
Embodiment 1:
The method that pcb board is gold-plated, comprises the steps:
(1), overlay film processing is carried out in the non-gold-plated region on pcb board, on its non-gold-plated region, be covered with layer protecting film;
(2), the pcb board that has covered protective membrane is immersed and goes to soak 5min in the alkaline cleaning fluid of PH 10, and carry out electrolysis treatment, cathode current density is 3 A/dm2, carries out surface cleaning, removes surperficial greasy dirt, after electrolysis, rinses with deionized water;
(3), pcb board is immersed in acid solvent and cleaned, described acid solvent be the mixture of rare nitric acid and dilute sulphuric acid, wherein the concentration ratio between rare nitric acid and dilute sulphuric acid is 1:1, removes its surperficial oxide film, after pickling, pcb board is put into clear water and cleans up;
(4), will carry out activation treatment through step 3 pcb board after treatment, pcb board is put into stearic acid, in the mixing solutions of Sodium dodecylbenzene sulfonate, soak, wherein soak time is 2min, after being disposed, rinses well with clear water again;
(5), pcb board being put into electroplating solution electroplates, described electroplating solution comprises following composition: concentration is that 90 g/L single nickel salts, concentration are that 180 g/L single nickel salt nickel sulfamic acids, concentration are that nickelous chloride, the concentration of 10 g/L is the boric acid of 20 g/L, described solution temperature is 45 DEG C, the density of electric current is to replace between 6A/dm2 and 20A/dm2, alternate frequency is 15 times, wherein the time between low current and high electric current compares for 1:2, and electroplating time is 15min;
(6), the pcb board having plated in step 5 is passed through through in the basic solution of PH 10;
(7), by the pcb board deionized water rinsing in step 6;
(8), the pcb board in step 7 being put into gold plating solution electroplates, described gold plating solution comprises following composition: inorganic salt 10 g/L of gold, main complexing agent barbiturate 50 g/L, the organic polyphosphonic acid 20g/L of auxiliary complex-former, pyridine carboxylic acid 30 g/L, 2-thiobarbituricacidα-50 g/L;
(9), the pcb board in step 8 is rinsed with deionized water;
(10), the pcb board in step 9 is sent in the baking oven of vacuum and is dried, the temperature of baking oven is controlled at 280 DEG C.
Embodiment 2:
The method that pcb board is gold-plated, comprises the steps:
(1), overlay film processing is carried out in the non-gold-plated region on pcb board, on its non-gold-plated region, be covered with layer protecting film;
(2), the pcb board that has covered protective membrane is immersed and goes to soak 6min in the alkaline cleaning fluid of PH 11, and carry out electrolysis treatment, cathode current density is 4 A/dm2, carries out surface cleaning, removes surperficial greasy dirt, after electrolysis, rinses with deionized water;
(3), pcb board is immersed in acid solvent and cleaned, acid solvent be the mixture of rare nitric acid and dilute sulphuric acid, wherein the concentration ratio between rare nitric acid and dilute sulphuric acid is 1:1.5, removes its surperficial oxide film, after pickling, pcb board is put into clear water and cleans up;
(4), will carry out activation treatment through step 3 pcb board after treatment, pcb board is put into stearic acid, in the mixing solutions of Sodium dodecylbenzene sulfonate, soak, wherein soak time is 4min, after being disposed, rinses well with clear water again;
(5), pcb board being put into electroplating solution electroplates, described electroplating solution comprises following composition: concentration is that 120 g/L single nickel salts, concentration are that nickelous chloride, the concentration that 200 g/L single nickel salt nickel sulfamic acids, concentration are 15g/L is the boric acid of 20 g/L, described solution temperature is 60 DEG C, the density of electric current is to replace between 8 A/dm2 and 25A/dm2, wherein the time between low current and high electric current compares for 3:5, and electroplating time is 18min;
(6), the pcb board having plated in step 5 is passed through through in the basic solution of PH 11;
(7), by the pcb board deionized water rinsing in step 6;
(8), the pcb board in step 7 being put into gold plating solution electroplates, described gold plating solution comprises following composition: inorganic salt 20 g/L of gold, main complexing agent barbiturate 100 g/L, organic polyphosphonic acid 40 g/L of auxiliary complex-former, pyridine carboxylic acid 40 g/L, 2-thiobarbituricacidα-80 g/L;
(9), the pcb board in step 8 is rinsed with deionized water;
(10), the pcb board in step 9 is sent in the baking oven of vacuum and is dried, the temperature of baking oven is controlled at 290 DEG C.
Embodiment 3:
The method that pcb board is gold-plated, comprises the steps:
(1), overlay film processing is carried out in the non-gold-plated region on pcb board, on its non-gold-plated region, be covered with layer protecting film;
(2), the pcb board that has covered protective membrane is immersed and goes to soak 8min in the alkaline cleaning fluid of PH 12, and carry out electrolysis treatment, cathode current density is 5 A/dm2, carries out surface cleaning, removes surperficial greasy dirt, after electrolysis, rinses with deionized water;
(3), pcb board is immersed in acid solvent and cleaned, acid solvent be the mixture of rare nitric acid and dilute sulphuric acid, wherein the concentration ratio between rare nitric acid and dilute sulphuric acid is 1:2, removes its surperficial oxide film, after pickling, pcb board is put into clear water and cleans up;
(4), will carry out activation treatment through step 3 pcb board after treatment, pcb board is put into stearic acid, in the mixing solutions of Sodium dodecylbenzene sulfonate, soak, wherein soak time is 5min, after being disposed, rinses well with clear water again;
(5), pcb board being put into electroplating solution electroplates, described electroplating solution comprises following composition: concentration be 140 g/L single nickel salts, concentration be that 210 g/L single nickel salt nickel sulfamic acids, concentration are that nickelous chloride, the concentration of 20 g/L is the boric acid of 20 g/L, described solution temperature is 75 DEG C, the density of electric current is to replace between 12 A/dm2 and 30A/dm2, wherein the time between low current and high electric current compares for 2:3, and electroplating time is 20min;
(6), the pcb board having plated in step 5 is passed through through in the basic solution of PH12;
(7), by the pcb board deionized water rinsing in step 6;
(8), the pcb board in step 7 being put into gold plating solution electroplates, described gold plating solution comprises following composition: inorganic salt 50 g/L of gold, main complexing agent barbiturate 250 g/L, organic polyphosphonic acid 60 g/L of auxiliary complex-former, pyridine carboxylic acid 60 g/L, 2-thiobarbituricacidα-150 g/L;
(9), the pcb board in step 8 is rinsed with deionized water;
(10), the pcb board in step 9 is sent in the baking oven of vacuum and is dried, the temperature of baking oven is controlled at 300 DEG C.
The method gold plating method that a kind of pcb board provided by the invention is gold-plated; with low cost; operation steps is simple, by non-gold-plated region division protective membrane, prevents the pollution in non-gold-plated region; simultaneously by first plating the Ni-based layer of one deck; the coating surface obtaining is smooth, and the metal nickel dam that coating is even, binding force of cladding material is strong can improve the quality of Gold plated Layer well; also can improve the utilization ratio of gold-plated efficiency and gold plating liquid, saved resource simultaneously.
The disclosed technique means of the present invention program is not limited only to the disclosed technique means of above-mentioned embodiment, also comprises the technical scheme being made up of above technical characterictic arbitrary combination.
Claims (4)
1. the gold-plated method of pcb board, is characterized in that: comprise the steps:
(1), overlay film processing is carried out in the non-gold-plated region on pcb board, on its non-gold-plated region, be covered with layer protecting film;
(2), the pcb board that has covered protective membrane is immersed in the alkaline cleaning fluid that removes PH 10-12 and soaks 5-8min, and carry out electrolysis treatment, cathode current density is 3-5 A/dm2, carries out surface cleaning, remove surperficial greasy dirt, after electrolysis, rinse with deionized water;
(3), pcb board is immersed in acid solvent and cleaned, remove its surperficial oxide film, after pickling, pcb board is put into clear water and clean up;
(4), will carry out activation treatment through step 3 pcb board after treatment, after being disposed, rinse well with clear water again;
(5), pcb board being put into electroplating solution electroplates, described electroplating solution comprises following composition: concentration is that 80 g/L-140 g/L single nickel salts, concentration are that 180 g/L-220 g/L single nickel salt nickel sulfamic acids, concentration are that nickelous chloride, the concentration of 10 g/L-20 g/L is the boric acid of 20 g/L, described solution temperature is 45-75 DEG C, the density of electric current is to replace between 6-12 A/dm2 and 20-30A/dm2, wherein the time between low current and high electric current compares for 1:2-2:3, and electroplating time is 15min-20min;
(6), the pcb board having plated in step 5 is passed through in the basic solution through PH 10-12;
(7), by the pcb board deionized water rinsing in step 6;
(8), the pcb board in step 7 being put into gold plating solution electroplates, described gold plating solution comprises following composition: inorganic salt 1～50 g/L of gold, main complexing agent barbiturate 5～250 g/L, organic polyphosphonic acid 1～60 g/L of auxiliary complex-former, pyridine carboxylic acid 30-60 g/L, 2-thiobarbituricacidα-50-150 g/L;
(9), the pcb board in step 8 is rinsed with deionized water;
(10), the pcb board in step 9 is sent in the baking oven of vacuum and is dried, the temperature of baking oven is controlled at 280-300 DEG C.
2. the gold-plated method of a kind of pcb board according to claim 1, is characterized in that: the concentration ratio between described single nickel salt and described single nickel salt nickel sulfamic acid is 1:2-2:3.
3. the gold-plated method of a kind of pcb board according to claim 1, is characterized in that: the mixture for rare nitric acid and dilute sulphuric acid of the acid solvent in described step 3, wherein the concentration ratio between rare nitric acid and dilute sulphuric acid is 1:1-1:2.
4. the gold-plated method of a kind of pcb board according to claim 1, it is characterized in that: the step of in step 4, pcb board being carried out to activation treatment is for to put into stearic acid by pcb board, in the mixing solutions of Sodium dodecylbenzene sulfonate, soak, wherein soak time is 2-5min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410255783.8A CN104073845A (en) | 2014-06-11 | 2014-06-11 | Gold plating method for PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410255783.8A CN104073845A (en) | 2014-06-11 | 2014-06-11 | Gold plating method for PCB |
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| CN104073845A true CN104073845A (en) | 2014-10-01 |
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| CN201410255783.8A Pending CN104073845A (en) | 2014-06-11 | 2014-06-11 | Gold plating method for PCB |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104480519A (en) * | 2014-11-21 | 2015-04-01 | 广州明铨机械设备有限公司 | Vertical continuous PCB nickel or gold plating equipment |
| CN107796858A (en) * | 2017-08-29 | 2018-03-13 | 苏州荣磐医疗科技有限公司 | A kind of preparation method of metal electrode |
| CN110923797A (en) * | 2019-11-08 | 2020-03-27 | 东莞市国瓷新材料科技有限公司 | Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning |
| WO2023070319A1 (en) * | 2021-10-26 | 2023-05-04 | 宁德时代新能源科技股份有限公司 | Copper plating solution and negative electrode composite current collector prepared therefrom |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104480519A (en) * | 2014-11-21 | 2015-04-01 | 广州明铨机械设备有限公司 | Vertical continuous PCB nickel or gold plating equipment |
| CN107796858A (en) * | 2017-08-29 | 2018-03-13 | 苏州荣磐医疗科技有限公司 | A kind of preparation method of metal electrode |
| CN110923797A (en) * | 2019-11-08 | 2020-03-27 | 东莞市国瓷新材料科技有限公司 | Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning |
| WO2023070319A1 (en) * | 2021-10-26 | 2023-05-04 | 宁德时代新能源科技股份有限公司 | Copper plating solution and negative electrode composite current collector prepared therefrom |
| US11932959B2 (en) | 2021-10-26 | 2024-03-19 | Contemporary Amperex Technology Co., Limited | Copper plating solution and negative electrode composite current collector prepared using same |
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Application publication date: 20141001 |