CN109862709A - A kind of production method for improving electric platinum plating leakage and getting rid of platinum problem - Google Patents
A kind of production method for improving electric platinum plating leakage and getting rid of platinum problem Download PDFInfo
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- CN109862709A CN109862709A CN201910129948.XA CN201910129948A CN109862709A CN 109862709 A CN109862709 A CN 109862709A CN 201910129948 A CN201910129948 A CN 201910129948A CN 109862709 A CN109862709 A CN 109862709A
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Abstract
The invention discloses a kind of production method for improving electric platinum plating leakage and getting rid of platinum problem, the pad pasting on production plate, and correspond on film and open a window at platinum position to be electroplated；On production plate before electrodeposition platinum, production plate first carries out pre-electroplating treatment, the pre-electroplating treatment successively includes plate edge rubber-coating, acidity deoils, washes, pickling and DI are washed, and first produces plate using sulfuric acid cleaned in the pickling, then cleans a production plate with hydrochloric acid again；Electrodeposition platinum on production plate at windowing；Then production plate is toasted.The method of the present invention solves the problems, such as the plating leakage after electrodeposition platinum and gets rid of platinum, improves the yields of electrodeposition platinum, and reduce production cost.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of electric platinum plating leakage of improvement and gets rid of platinum problem
Production method.
Background technique
Other than gold, silver, tin, it is line that metal platinum, which also has excellent electric conductivity, inoxidizability, preferable hardness,
A selection well in the processing of road plate surface.In addition, there is platinum good catalytic performance can meet some specific function requirements,
Electrodeposition platinum is gradually applied in PCB surface treatment process.
The process flow of electrodeposition platinum in the circuit board is generally " sawing sheet → inner figure → pressing → outer layer drilling → outer
Heavy copper → electric plating of whole board → outer graphics → the graphic plating of layer → electronickelling gold → electric platinum figure → part electricity platinum → moves back film
Test → molding → FQC → FQA → packaging before → outer layer etching → outer layer AOI → silk-screen welding resistance → silk-screen character → molding ".
Wherein, treatment before plating way when part electricity platinum is: wiring board to be plated (protect by the covering of electroless coating region dry film
Shield) it successively deoils, wash by plate edge rubber-coating, acidity, pickling, DI washing；In the above method, production plate is passing through treatment before plating
Afterwards, can usually there be the impurity such as oxide and greasy dirt residual in figure to be plated, generate following lack after leading to subsequent electrodeposition platinum
Fall into: same plate has plated platinum on the pad of some after electrodeposition platinum, some pad are not plated, that is, plating leakage problem occurs；Plating
Good platinum layer is easy to fall off, that is, occurs getting rid of platinum problem.
Summary of the invention
It is an object of the invention to overcome existing technological deficiency, provide a kind of electric platinum plating leakage of improvement and get rid of platinum problem
Production method, this method solve the plating leakage after electrodeposition platinum and get rid of platinum problem, improve the yields of electrodeposition platinum, and
Reduce production cost.
In order to solve the above-mentioned technical problems, the present invention provides a kind of production sides for improving electric platinum plating leakage and getting rid of platinum problem
Method, comprising the following steps:
S1, the pad pasting on production plate, and correspond on film and open a window at platinum position to be electroplated；
S2, it before electrodeposition platinum, produces plate on production plate and first carries out pre-electroplating treatment, the pre-electroplating treatment successively includes
Plate edge rubber-coating, acidity deoil, wash, pickling and DI are washed, and first produce plate using sulfuric acid cleaned in the pickling, then use salt again
An acid time production plate of cleaning；
Electrodeposition platinum on S3, the production plate at windowing；
S4, then production plate is toasted.
Further, in step S2, the acidity deoils to produce plate, and temperature when cleaning using acid deoiling agent cleaning
Degree is maintained at 30-40 DEG C.
Further, in the pickling of step S2, mass percent concentration is used to produce plate for 5% sulfuric acid cleaned.
Further, in step S2, when producing plate using sulfuric acid cleaned, temperature is maintained at room temperature.
Further, in the pickling of step S2, mass percent concentration is used to produce plate for 5% hydrochloric acid cleaning.
Further, in step S2, when cleaning production plate using hydrochloric acid, temperature is maintained at room temperature.
Further, in the pickling of step S2, sulfuric acid is AR grades of sulfuric acid, and hydrochloric acid is AR grade hydrochloric acid.
Further, in step S4, production plate toasts 1h in 150 DEG C.
Further, the production plate is the multilayer for being press-fitted together as one core material and outer copper foil by prepreg
Plate, and multi-layer board has been subjected to drilling, heavy copper, electric plating of whole board and graphic plating processing.
Compared with prior art, the invention has the following beneficial effects:
By optimization technique production procedure, the acid pickling step handled before plating is changed to twice clearly the present invention by once cleaning
It washes, i.e., increases hydrochloric acid cleaning after sulfuric acid cleaned step, can effectively and thoroughly dispose oxide layer present in figure to be plated
With the sundries such as greasy dirt, the problem of to avoid having sundries on figure to be plated and influencing its electric conductivity, prevent plating leakage, to solve
During electrodeposition platinum the problem of plating leakage；Increase baking sheet process after electrodeposition platinum, it will be between plating platinum layer and underlying metal layer
Aqueous vapor completely removes, and prevents platinum layer from falling off, to get rid of platinum after solving the problems, such as electrodeposition platinum；The method of the present invention can be mentioned effectively
The yields of high electrodeposition platinum, and reduce production cost.
Specific embodiment
In order to more fully understand technology contents of the invention, below in conjunction with specific embodiment to technical side of the invention
Case is described further and illustrates.
Embodiment
The present embodiment provides the production method of PCB a kind of, including improving electric platinum plating leakage and get rid of the production of platinum problem
Method, the specific process is as follows:
(1), sawing sheet: outputing core plate by jigsaw size 520mm × 620mm, core thickness 0.8mm, outer copper foil with a thickness of
1OZ。
(2) internal layer circuit production (negative film technique): inner figure transfer is coated on core plate photosensitive with vertical application machine
Film, 8 μm of the film thickness monitoring of light-sensitive surface are completed on core plate using Full-automatic exposure machine with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)
Internal layer circuit exposure, it is developed, inner line figure is formed on core plate；Internal layer etching, the core plate after exposure development is etched
Internal layer circuit out, it is 3mil that internal layer line width, which measures,；Internal layer AOI, then check internal layer circuit opens short circuit, route notch, route
The defects of pin hole, defective to scrap processing, flawless product goes out to downstream.
(3), press: core plate crosses vertical blackening process, and core plate and outer copper foil are then superimposed on one with prepreg in advance
(specific plate-laying sequence is copper foil, prepreg, core plate, prepreg, copper foil from top to bottom) is played, is then selected according to plate Tg
Lamination appropriate presses superimposed sheet, forms production plate.
(4), it drills: being drilled on production plate according to borehole data using the mode of machine drilling.
(5), heavy copper: one layer of thin copper is deposited by way of chemical reaction on hole wall, is provided for subsequent electric plating of whole board
Basis, backlight test 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(6), according to the principle of electrochemical reaction, upper one layer of copper electric plating of whole board: is electroplated on the basis of heavy copper.
(7), outer graphics shift: using Full-automatic exposure machine and positive line film, (21 lattice expose with 5-7 lattice exposure guide rule
Light ruler) outer-layer circuit exposure is completed on production plate, it is developed, outer-layer circuit figure is formed on production plate.
(8), graphic plating: and then the copper facing on production plate, copper facing is the current density electric plating of whole board with 1.0-2.2ASD
Face copper thickness at outer-layer circuit visuals is plated to 1OZ by 150min.
(9), one layer of nickel layer and layer gold successively electronickelling gold: are plated on the face copper at outer-layer circuit visuals.
(10), electric platinum figure: dry film is pasted on production plate, and corresponds to platinum to be electroplated (such as pad) on dry film
It opens a window at position, other non-electrical gold,platinizeds region is lived by dry film covering protection.
(11), pre-electroplating treatment: specifically includes the following steps:
S1, plate edge rubber-coating specially wrap protective glue band in the edges of boards of production plate, reduce gold salt loss, save old；
S2, acidity are deoiled, and specially using acid deoiling agent cleaning production plate, and temperature when cleaning is maintained at 30-40
DEG C, for removing plate face oxide layer and greasy dirt, guarantee plate face cleaning；
S3, then production plate is successively washed, pickling and DI are washed, for cleaning and activating golden face；Specifically, in acid
Wash it is middle first use mass percent concentration for 5% AR grade sulfuric acid cleaned produce plate, then again with mass percent concentration be 5%
AR grade hydrochloric acid clean a production plate, and in the cleaning process twice of pickling, temperature is held in room temperature.
(12), one layer of platinum layer the electric platinum in part: is plated on the production plate at windowing.
(13), baking sheet: then production plate is placed in 150 DEG C and toasts 1h.
(14), outer-layer circuit: and then outer-layer circuit is successively made in production plate after moving back film and etching, outer layer AOI is used
Automatic optical detecting system detects whether outer-layer circuit has open circuit, notch, etching not clean, short by the comparison with CAM data
The defects of road.
(15), welding resistance, silk-screen character: using the white face wire mark brush TOP solder mask, and the face TOP character adds " UL label "；Tool
Body is, on the route and substrate for being not required to welding, one layer of coating prevents from generating bridge joint when welding between route, provides permanent electricity
The protective layer in compression ring border and resist chemical, while playing aesthetic appeal.
(16), electrical testing: testing the electrically conducting performance of production board, this plate uses test method are as follows: flying probe.
(17), it forms: according to the prior art and pressing design requirement gong shape, PCB is made in the +/- 0.05mm of external form tolerance.
(18), FQC: according to customs inspection standard and our company test stone, checking PCB appearance, such as it is defective and
Shi Xiuli guarantees to provide excellent quality control for client.
(19), FQA: taking a sample test appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of PCB etc. again is
The no requirement for meeting client.
(20), it packs: according to the manner of packing and packaging quantity of customer requirement, packaging being sealed to PCB, and be allowed to dry
Drying prescription and humidity card, then shipment.
It is verified by actual production, the technique production procedure after optimizing by the method for the invention can effectively improve electroplatinizing
The yields of gold, has been increased to 98% from original 20% for the yields of electric platinum, and reduce production cost.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above embodiments is only applicable to help to understand this
The principle of inventive embodiments；At the same time, for those skilled in the art, according to an embodiment of the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (9)
1. a kind of production method for improving electric platinum plating leakage and getting rid of platinum problem, which comprises the following steps:
S1, the pad pasting on production plate, and correspond on film and open a window at platinum position to be electroplated；
S2, it before electrodeposition platinum, produces plate on production plate and first carries out pre-electroplating treatment, the pre-electroplating treatment successively includes edges of boards
It is encapsulated, acid deoil, wash, pickling and DI washing, plate is first produced using sulfuric acid cleaned in the pickling, it is then clear with hydrochloric acid again
Wash a production plate；
Electrodeposition platinum on S3, the production plate at windowing；
S4, then production plate is toasted.
2. the production method according to claim 1 for improving electric platinum plating leakage and getting rid of platinum problem, which is characterized in that step S2
In, the acidity is deoiled to produce plate using acid deoiling agent cleaning, and temperature when cleaning is maintained at 30-40 DEG C.
3. the production method according to claim 1 for improving electric platinum plating leakage and getting rid of platinum problem, which is characterized in that step S2
The pickling in, use mass percent concentration for 5% sulfuric acid cleaned produce plate.
4. the production method according to claim 3 for improving electric platinum plating leakage and getting rid of platinum problem, which is characterized in that step S2
In, when producing plate using sulfuric acid cleaned, temperature is maintained at room temperature.
5. the production method according to claim 1 for improving electric platinum plating leakage and getting rid of platinum problem, which is characterized in that step S2
The pickling in, use mass percent concentration for 5% hydrochloric acid cleaning production plate.
6. the production method according to claim 5 for improving electric platinum plating leakage and getting rid of platinum problem, which is characterized in that step S2
In, when cleaning production plate using hydrochloric acid, temperature is maintained at room temperature.
7. the production method according to claim 1-6 for improving electric platinum plating leakage and getting rid of platinum problem, feature exist
In in the pickling of step S2, sulfuric acid is AR grades of sulfuric acid, and hydrochloric acid is AR grade hydrochloric acid.
8. the production method according to claim 1 for improving electric platinum plating leakage and getting rid of platinum problem, which is characterized in that step S4
In, production plate toasts 1h in 150 DEG C.
9. the production method according to claim 1 for improving electric platinum plating leakage and getting rid of platinum problem, which is characterized in that the life
Producing plate is the multi-layer board for being press-fitted together as one core material and outer copper foil by prepreg, and multi-layer board has been subjected to drilling, sinks
Copper, electric plating of whole board and graphic plating processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910129948.XA CN109862709A (en) | 2019-02-21 | 2019-02-21 | A kind of production method for improving electric platinum plating leakage and getting rid of platinum problem |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910129948.XA CN109862709A (en) | 2019-02-21 | 2019-02-21 | A kind of production method for improving electric platinum plating leakage and getting rid of platinum problem |
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| CN109862709A true CN109862709A (en) | 2019-06-07 |
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| CN201910129948.XA Pending CN109862709A (en) | 2019-02-21 | 2019-02-21 | A kind of production method for improving electric platinum plating leakage and getting rid of platinum problem |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102647858A (en) * | 2012-05-15 | 2012-08-22 | 金悦通电子（翁源）有限公司 | Processing method of printed circuit board (PCB) |
| CN105441952A (en) * | 2015-11-29 | 2016-03-30 | 郑臣钏 | Metal part surface polishing technology |
| CN108668459A (en) * | 2018-05-22 | 2018-10-16 | 深圳崇达多层线路板有限公司 | A kind of printed board Novel electric platinum surface treatment method |
-
2019
- 2019-02-21 CN CN201910129948.XA patent/CN109862709A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102647858A (en) * | 2012-05-15 | 2012-08-22 | 金悦通电子（翁源）有限公司 | Processing method of printed circuit board (PCB) |
| CN105441952A (en) * | 2015-11-29 | 2016-03-30 | 郑臣钏 | Metal part surface polishing technology |
| CN108668459A (en) * | 2018-05-22 | 2018-10-16 | 深圳崇达多层线路板有限公司 | A kind of printed board Novel electric platinum surface treatment method |
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Application publication date: 20190607 |
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