CN112804821A - Selective electrogilding process for PCB (printed circuit board) - Google Patents
Selective electrogilding process for PCB (printed circuit board) Download PDFInfo
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- CN112804821A CN112804821A CN202011463535.4A CN202011463535A CN112804821A CN 112804821 A CN112804821 A CN 112804821A CN 202011463535 A CN202011463535 A CN 202011463535A CN 112804821 A CN112804821 A CN 112804821A
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- pcb
- film
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- etching
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- 238000000034 method Methods 0.000 title claims abstract description 87
- 238000009713 electroplating Methods 0.000 claims abstract description 64
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 62
- 239000010949 copper Substances 0.000 claims abstract description 54
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 53
- 229910052737 gold Inorganic materials 0.000 claims abstract description 53
- 239000010931 gold Substances 0.000 claims abstract description 53
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052802 copper Inorganic materials 0.000 claims abstract description 47
- 238000005530 etching Methods 0.000 claims abstract description 44
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 44
- 238000005406 washing Methods 0.000 claims abstract description 41
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910001868 water Inorganic materials 0.000 claims abstract description 36
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 31
- 238000007650 screen-printing Methods 0.000 claims abstract description 28
- 238000001035 drying Methods 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 23
- 238000005553 drilling Methods 0.000 claims abstract description 17
- 238000005520 cutting process Methods 0.000 claims abstract description 16
- 230000008021 deposition Effects 0.000 claims abstract description 16
- 239000003814 drug Substances 0.000 claims abstract description 16
- 238000005554 pickling Methods 0.000 claims abstract description 9
- 238000011068 loading method Methods 0.000 claims abstract description 7
- 229910021592 Copper(II) chloride Inorganic materials 0.000 claims abstract description 6
- 238000007639 printing Methods 0.000 claims description 14
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 238000007747 plating Methods 0.000 abstract description 8
- 239000002699 waste material Substances 0.000 abstract description 5
- 230000003647 oxidation Effects 0.000 abstract description 4
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical group [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 abstract description 3
- 229910000510 noble metal Inorganic materials 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Abstract
The invention belongs to the technical field of printed circuit board preparation, and particularly discloses a selective electrogilding process for a PCB, which comprises the following steps: cutting, drilling, copper deposition and full-board electroplating are carried out on the PCB; attaching a layer of dry film on the PCB, exposing and developing the PCB with the attached film, removing the uncured dry film, and removing oil and then carrying out micro-etching; pickling the PCB after the microetching, then electroplating copper/nickel, then carrying out plate loading and drying; performing wet film silk-screen printing on the PCB in a character process, and then baking the PCB; and (3) carrying out citric acid pickling and water washing on the PCB, then electroplating gold, and finally stripping and etching. The process adopts a non-gold plating mode for the parts of the PCB which do not need to be welded, thus reducing the waste of noble metals and lowering the production cost of enterprises; at the same time, the user can select the desired position,the etching process is controlled by adopting special liquid medicine, and the main component of the liquid medicine is NH4Cl、NH3·H2O、CuCl2Cu in liquid medicine2+、Cl‑The contents are respectively 130-150g/L and 165-175g/L, and the pH is 8.0-8.5, so that the oxidation risk can be reduced.
Description
Technical Field
The invention relates to the technical field of printed circuit board preparation, in particular to a selective electrogilding process for a PCB (printed circuit board).
Background
The PCB is also called a printed circuit board or PCB, and is a provider of electrical connection of electronic components. The development of the circuit board has been over 100 years, the design is mainly a layout design, and the circuit board has the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate. Due to the high concentration of interconnect lines resulting from the increased packaging density of integrated circuits, the use of double-sided boards and even multi-layer boards has become necessary, and drilling has to be performed in order to achieve electrical connections between the multi-layer boards. Copper has the characteristics of good electrical conductivity, thermal conductivity, low resistivity, high reliability, good ductility and the like, and is widely used as an interconnection material in the manufacture of ultra-large integrated circuits and PCB boards at present.
Printed wiring boards are formed by providing conductive patterns for electrical connection between electronic components on an insulating base material, and the manufacturing process thereof is complicated. In order to improve the conductivity, solderability and oxidation resistance of the printed circuit board, nickel and gold are plated on the surface of the copper foil of the conductive pattern of the printed circuit board with high requirements. Because the electroplated nickel is easily attacked by liquid medicine to generate passivation and is easily oxidized and blackened, the traditional flow design is protected by a gold plating mode, passivation can be prevented, and the PCB (printed circuit board) can be welded in the SMT process.
The traditional gold plating process flow of the printed circuit board comprises the following steps: cutting → drilling → copper deposition + plate electric → wiring (dry film) → electroplating (copper + nickel) → gold electroplating (citric acid washing → electric gold → water washing) → etching → green oil → characters → molding → testing → FQC → packaging.
In the traditional gold electroplating process of the printed circuit board, gold is plated on all conductive patterns, so that a large amount of gold is consumed, and gold plating on the parts which do not need to be welded can not only cause waste of precious metals, but also greatly increase the production cost of enterprises.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a selective electrogilding process for a PCB, which uses special etching control points to control, and uses a non-gold plating manner for the portion of the PCB that does not need to be soldered, so as to reduce the waste of precious metals and reduce the production cost.
In order to achieve the above objects and other related objects, the present invention provides a selective electrogilding process for a PCB, including the steps of:
(1) cutting, drilling, copper deposition, plate electric and primary circuit dry film: cutting and drilling a PCB, and then carrying out copper deposition and full-board electroplating; attaching a layer of dry film on the PCB, exposing and developing the PCB with the attached film, removing the uncured dry film, and removing oil and then carrying out micro-etching;
(2) primary copper/nickel electroplating and drying: pickling the PCB after the microetching is finished, then sequentially electroplating copper and nickel, then carrying out plate loading, and drying the plate;
(3) wet film printing and baking: performing wet film silk-screen printing on the PCB in a character process, and then baking the PCB;
(4) secondary gold electroplating: the PCB is washed by citric acid, then washed by water and then electroplated with gold;
(5) film stripping and etching: and stripping the film of the PCB after the gold electroplating, and etching the PCB after the film stripping.
Further, in the step (2), the copper electroplating condition is 20 to 24ASF × 25 minutes.
Further, in the step (2), the nickel electroplating condition is 16 to 18ASF × 20 minutes.
Further, in the step (3), when the wet film is used for screen printing, the mesh of the screen printing plate is 100-.
Further, in the step (3), the baking step comprises: first side 75 ℃ X15 minutes, second side 75 ℃ X20 minutes.
Further, in the step (4), the citric acid pickling time is 50-60 seconds.
Further, in the step (4), the number of times of washing is at least two, and the water used for washing is deionized water.
Further, in the step (4), the gold electroplating conditions are as follows: 3ASF 30-50 seconds. The specific gold electroplating time is adjusted and set according to the requirement of gold thickness.
Further, in the step (5), a chemical liquid is used for etching the copper layer of the non-circuit part in the etching process, and the chemical liquid comprises the following components: NH (NH)4Cl、NH3·H2O、CuCl2。
Further, in the liquid medicine, Cu2+The content is 130-150g/L, Cl-The content is 130-150 g/L.
Further, the pH value of the liquid medicine is controlled to be 8.0-8.5.
Further, in the step (5), an automatic film removing line is used in the film removing process, and the process steps are as follows in sequence: placing the plate, bulking, removing the film, washing by 4-level water, and drying by suction; and etching the PCB, washing with 3-level water, pickling, washing with 3-level water, and drying.
Further, the selective electrogilding process for the PCB further comprises the following step (6): green oil, characters, forming, testing, FQC and packaging. The process is a conventional process for manufacturing the PCB and can be carried out by referring to the conventional process.
As mentioned above, the selective electrogilding process for the PCB has the following beneficial effects:
the invention provides a novel selective electrogilding process for a PCB (printed circuit board), wherein a non-gilding mode is adopted for parts of the PCB which do not need to be welded, so that the waste of precious metals can be reduced, and the production cost of an enterprise is reduced; meanwhile, the etching process is controlled by adopting special liquid medicine, and the main component of the liquid medicine is NH4Cl、NH3·H2O、CuCl2Cu in liquid medicine2+The content is controlled to be 130-150g/L, Cl-The content is controlled at 165-175g/L, and the pH is controlled between 8.0-8.5, so that the oxidation risk can be reduced in the production process.
Drawings
Fig. 1 is a diagram illustrating an embodiment of a PCB board according to the present invention.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
The traditional PCB gold plating process flow is as follows:
cutting → drilling → copper deposition + plate electric → wiring (dry film) → electroplating (copper + nickel + gold) → etching → green oil → character → molding → test → FQC → packaging.
The PCB selective electrogilding process provided by the invention comprises the following steps:
cutting → drilling → copper deposition + board electric → primary circuit (dry film) → primary electroplating (copper + nickel) → drying → wet film printing → baking board → secondary electroplating gold (citric acid washing → water washing → electric gold) → film removal → etching → green oil → character → molding → testing → FQC → packaging.
The selective electrogilding process for the PCB comprises the following specific process steps of:
(1) cutting, drilling, copper deposition, plate electric and primary circuit dry film: cutting and drilling a PCB, and then carrying out copper deposition and full-board electroplating; and (3) attaching a layer of dry film on the PCB, exposing and developing the PCB with the attached film, removing the uncured dry film, and removing oil and then carrying out micro-etching.
(2) Primary copper/nickel electroplating and drying: and (3) carrying out acid cleaning on the PCB after the micro-etching is finished, then sequentially electroplating copper and nickel, then carrying out plate loading, and drying the plate.
(3) Wet film printing and baking: and in the character process, the PCB is subjected to wet film silk-screen printing and then is baked.
(4) Secondary gold electroplating: the PCB is washed by citric acid and then by water, and then is electroplated with gold.
(5) Film stripping and etching: the PCB board after will electroplate gold is moved back the membrane, moves back the membrane flow and uses automatic membrane line that moves back, and the process is in proper order: placing the plate, bulking, removing the film, washing by 4-level water, and drying by suction; and etching the PCB after film stripping, washing by 3-level water and acid after etching, drying after washing by 3-level water, and performing subsequent processes.
And etching the PCB after the film is removed.
(6) And finally, carrying out green oil, character, forming, testing, FQC and packaging on the etched PCB. The process is a conventional process for manufacturing the PCB and can be carried out by referring to the conventional process.
Specifically, in the step (2), the copper electroplating condition is 20 to 24ASF × 25 minutes, and the nickel electroplating condition is 16 to 18ASF × 20 minutes.
Specifically, in the step (3), when the wet film is used for screen printing, the mesh of the screen printing plate is 100-.
Specifically, in the step (3), the baking step is as follows: first side 75 ℃ X15 minutes, second side 75 ℃ X20 minutes.
Specifically, in the step (4), the citric acid pickling time is 50 to 60 seconds.
Specifically, in the step (4), the number of times of washing is at least two, and the water used for washing is deionized water.
Specifically, in the step (4), the gold electroplating conditions are as follows: 3ASF 30-50 seconds. The specific gold electroplating time is adjusted and set according to the requirement of gold thickness. Note that: the area of the plated film is changed when gold is electroplated, and the plated area when copper/nickel cannot be electroplated at one time is calculated by a computer according to the residual area of the previous wet film printing.
Specifically, in the step (5), a chemical liquid is used for etching the copper layer of the non-circuit part in the etching process, and the chemical liquid comprises the following components: NH (NH)4Cl、NH3·H2O、CuCl2. In liquid medicine, Cu2+The content is 130-150g/L, Cl-The content is 130-150g/L, and the pH value of the liquid medicine is controlled between 8.0 and 8.5.
The working principle of the invention is as follows:
1、Cu+Cu(NH3)4 2++2Cl-→2Cu(NH3)2 ++2Cl-
2、2Cu(NH3)2 ++2Cl-+O2+4NH3→2Cu(NH3)4 2++2Cl-
┍Cu+Cu(NH3)4Cl2→2Cu(NH3)2Cl
┕2Cu(NH3)4Cl+2NH4OH+2NH4Cl-O2→2Cu(NH3)4Cl2+2H2O
the copper is mostly Cu (NH) in the reaction3)4 2+Presence of cation, Cl-Is an anion for maintaining balance, and part is cuprous complex ion Cu (NH)3)2 +。
Nickel did not participate in the reaction during the reaction, but Cl-And O2In an amount that will attack the nickel, control of the chemical reaction rate during the process can effectively drive the process into stability.
In the traditional process, generally, because the electroplated nickel PCB is easily attacked by liquid medicine to generate passivation and is easily oxidized and blackened, the traditional flow design is protected by a gold plating mode, passivation can be prevented, and the PCB is favorably welded in an SMT (surface mounting technology) process. The novel process provided by the invention breaks through the conventional thinking, and adopts a non-gold plating mode for the part which does not need to be welded, so that the waste of noble metal can be reduced, and the production cost of enterprises can be reduced; meanwhile, the etching process is controlled by adopting special liquid medicine, and the main component of the liquid medicine is NH4Cl、NH3·H2O、CuCl2Cu in liquid medicine2+The content is controlled to be 130-150g/L, Cl-The content is controlled at 165-175g/L, and the pH is controlled between 8.0-8.5, so that the oxidation risk can be reduced in the production process.
The invention is further illustrated by the following specific examples.
Fig. 1 is a diagram illustrating an embodiment of a PCB board according to the present invention.
Example 1
A selective electrogilding process for a PCB comprises the following specific steps:
(1) cutting, drilling, copper deposition, plate electric and primary circuit dry film: cutting and drilling a PCB, and then carrying out copper deposition and full-board electroplating; and (3) attaching a layer of dry film on the PCB, exposing and developing the PCB with the attached film, removing the uncured dry film, and removing oil and then carrying out micro-etching. The operation is carried out according to the conventional flow of the PCB.
(2) Primary copper/nickel electroplating and drying: and (3) carrying out acid cleaning on the PCB after the micro-etching is finished, then sequentially electroplating copper and nickel, then carrying out plate loading, and drying the plate.
The copper electroplating conditions were 20ASF × 25 minutes, and the nickel electroplating conditions were 16ASF × 20 minutes.
(3) Wet film printing and baking: and in the character process, the PCB is subjected to wet film silk-screen printing and then is baked.
And when wet film silk-screen printing is performed, the mesh of the silk-screen printing plate is 100T, and two cutters are used for printing.
The baking process comprises the following steps: first side 75 ℃ X15 minutes, second side 75 ℃ X20 minutes.
After silk-screen printing, the key management and control time is as follows:
firstly, plate collection → silk screen printing is completed within 2 hours;
secondly, after the plate is baked by silk screen printing, the plate is sent to a gold electroplating process within 1 hour;
problem boards received no rewashing in the earlier stage.
(4) Secondary gold electroplating: the method comprises the following steps of washing the PCB for 50 seconds by citric acid, washing the PCB twice by a water washing cylinder, then washing the PCB by deionized water (DI water), and then carrying out gold electroplating, wherein the conditions of the gold electroplating are as follows: 3ASF 30 seconds.
Note that: the area of the plated film is changed when gold is electroplated, and the plated area when copper/nickel cannot be electroplated at one time is calculated by a computer according to the residual area of the previous wet film printing.
(5) Film stripping and etching: removing the film of the PCB after the gold electroplating, pre-soaking for 3 minutes in a manual film removing cylinder before removing the film, and then taking out the film to remove the film; the film removing process uses an automatic film removing line, and the processes are as follows in sequence: placing the plate, bulking, removing the film, washing by 4-level water, and drying by suction; and etching the PCB after film stripping, washing by 3-level water and acid after etching, drying after washing by 3-level water, and performing subsequent processes.
(6) And finally, carrying out green oil, character, forming, testing, FQC and packaging on the etched PCB. The process is a conventional process for manufacturing the PCB and can be carried out by referring to the conventional process.
Example 2
A selective electrogilding process for a PCB comprises the following specific steps:
(1) cutting, drilling, copper deposition, plate electric and primary circuit dry film: cutting and drilling a PCB, and then carrying out copper deposition and full-board electroplating; and (3) attaching a layer of dry film on the PCB, exposing and developing the PCB with the attached film, removing the uncured dry film, and removing oil and then carrying out micro-etching. The operation is carried out according to the conventional flow of the PCB.
(2) Primary copper/nickel electroplating and drying: and (3) carrying out acid cleaning on the PCB after the micro-etching is finished, then sequentially electroplating copper and nickel, then carrying out plate loading, and drying the plate.
The copper electroplating conditions were 24ASF × 25 minutes, and the nickel electroplating conditions were 18ASF × 20 minutes.
(3) Wet film printing and baking: and in the character process, the PCB is subjected to wet film silk-screen printing and then is baked.
And when wet film silk-screen printing is performed, the mesh of the silk-screen printing plate is 120T, and two cutters are used for printing.
The baking process comprises the following steps: first side 75 ℃ X15 minutes, second side 75 ℃ X20 minutes.
After silk-screen printing, the key management and control time is as follows:
firstly, plate collection → silk screen printing is completed within 2 hours;
secondly, after the plate is baked by silk screen printing, the plate is sent to a gold electroplating process within 1 hour;
problem boards received no rewashing in the earlier stage.
(4) Secondary gold electroplating: the method comprises the following steps of washing a PCB for 60 seconds by citric acid, washing the PCB twice by a water washing cylinder, then washing the PCB by deionized water (DI water), and then carrying out gold electroplating, wherein the conditions of the gold electroplating are as follows: 3ASF × 50 seconds.
Note that: the area of the plated film is changed when gold is electroplated, and the plated area when copper/nickel cannot be electroplated at one time is calculated by a computer according to the residual area of the previous wet film printing.
(5) Film stripping and etching: removing the film of the PCB after the gold electroplating, pre-soaking for 5 minutes in a manual film removing cylinder before removing the film, and then taking out the film to remove the film; the film removing process uses an automatic film removing line, and the processes are as follows in sequence: placing the plate, bulking, removing the film, washing by 4-level water, and drying by suction; and etching the PCB after film stripping, washing by 3-level water and acid after etching, drying after washing by 3-level water, and performing subsequent processes.
(6) And finally, carrying out green oil, character, forming, testing, FQC and packaging on the etched PCB. The process is a conventional process for manufacturing the PCB and can be carried out by referring to the conventional process.
Example 3
A selective electrogilding process for a PCB comprises the following specific steps:
(1) cutting, drilling, copper deposition, plate electric and primary circuit dry film: cutting and drilling a PCB, and then carrying out copper deposition and full-board electroplating; and (3) attaching a layer of dry film on the PCB, exposing and developing the PCB with the attached film, removing the uncured dry film, and removing oil and then carrying out micro-etching. The operation is carried out according to the conventional flow of the PCB.
(2) Primary copper/nickel electroplating and drying: and (3) carrying out acid cleaning on the PCB after the micro-etching is finished, then sequentially electroplating copper and nickel, then carrying out plate loading, and drying the plate.
The copper electroplating conditions were 22ASF × 25 minutes, and the nickel electroplating conditions were 17ASF × 20 minutes.
(3) Wet film printing and baking: and in the character process, the PCB is subjected to wet film silk-screen printing and then is baked.
And when wet film silk-screen printing is performed, the mesh of the silk-screen printing plate is 120T, and two cutters are used for printing.
The baking process comprises the following steps: first side 75 ℃ X15 minutes, second side 75 ℃ X20 minutes.
After silk-screen printing, the key management and control time is as follows:
firstly, plate collection → silk screen printing is completed within 2 hours;
secondly, after the plate is baked by silk screen printing, the plate is sent to a gold electroplating process within 1 hour;
problem boards received no rewashing in the earlier stage.
(4) Secondary gold electroplating: washing the PCB for 55 seconds by citric acid, washing twice by a water washing cylinder, then washing by deionized water (DI water), and then carrying out gold electroplating, wherein the conditions of the gold electroplating are as follows: 3ASF × 40 seconds.
Note that: the area of the plated film is changed when gold is electroplated, and the plated area when copper/nickel cannot be electroplated at one time is calculated by a computer according to the residual area of the previous wet film printing.
(5) Film stripping and etching: removing the film of the PCB after the gold electroplating, pre-soaking for 4 minutes in a manual film removing cylinder before removing the film, and then taking out the film to remove the film; the film removing process uses an automatic film removing line, and the processes are as follows in sequence: placing the plate, bulking, removing the film, washing by 4-level water, and drying by suction; and etching the PCB after film stripping, washing by 3-level water and acid after etching, drying after washing by 3-level water, and performing subsequent processes.
(6) And finally, carrying out green oil, character, forming, testing, FQC and packaging on the etched PCB. The process is a conventional process for manufacturing the PCB and can be carried out by referring to the conventional process.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A selective electrogilding process for a PCB is characterized by comprising the following steps:
(1) cutting, drilling, copper deposition, plate electric and primary circuit dry film: cutting and drilling a PCB, and then carrying out copper deposition and full-board electroplating; attaching a layer of dry film on the PCB, exposing and developing the PCB with the attached film, removing the uncured dry film, and removing oil and then carrying out micro-etching;
(2) primary copper/nickel electroplating and drying: pickling the PCB after the microetching is finished, then sequentially electroplating copper and nickel, then carrying out plate loading, and drying the plate;
(3) wet film printing and baking: performing wet film silk-screen printing on the PCB in a character process, and then baking the PCB;
(4) secondary gold electroplating: the PCB is washed by citric acid, then washed by water and then electroplated with gold;
(5) film stripping and etching: and stripping the film of the PCB after the gold electroplating, and etching the PCB after the film stripping.
2. The PCB selective electrogilding process of claim 1, wherein: in the step (2), the condition of copper electroplating is 20-24ASF multiplied by 25 minutes; and/or, in the step (2), the nickel electroplating condition is 16-18ASF multiplied by 20 minutes.
3. The PCB selective electrogilding process of claim 1, wherein: in the step (3), when the wet film is used for silk-screen printing, the mesh of the silk-screen printing plate is 100-120T, and two cutters are printed.
4. The PCB selective electrogilding process of claim 1, wherein: in the step (3), the baking process comprises the following steps: first side 75 ℃ X15 minutes, second side 75 ℃ X20 minutes.
5. The PCB selective electrogilding process of claim 1, wherein: in the step (4), the citric acid pickling time is 50-60 seconds.
6. The PCB selective electrogilding process of claim 1, wherein: in the step (4), the washing times are at least two times, and the water adopted for washing is deionized water.
7. The PCB selective electrogilding process of claim 1, wherein: in the step (4), the gold electroplating conditions are as follows: 3ASF 30-50 seconds.
8. The PCB selective electrogilding process of claim 1, wherein: in the step (5), a chemical liquid is used for etching the copper layer of the non-circuit part in the etching process, and the chemical liquid comprises the following components: NH (NH)4Cl、NH3·H2O、CuCl2。
9. The PCB selective electrogilding process of claim 8, wherein: in the liquid medicine, Cu2+The content is 130-150g/L, Cl-The content is 130-150 g/L; and/or, the liquid medicineThe pH of (A) is controlled to be between 8.0 and 8.5.
10. The PCB selective electrogilding process of claim 1, wherein: in the step (5), the film removing process uses an automatic film removing line, and the processes are as follows in sequence: placing the plate, bulking, removing the film, washing by 4-level water, and drying by suction; and etching the PCB, washing with 3-level water, pickling, washing with 3-level water, and drying.
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| CN101820730A (en) * | 2010-03-30 | 2010-09-01 | 梅州博敏电子有限公司 | Method for preparing printed wiring board by selectively plating gold |
| CN102647858A (en) * | 2012-05-15 | 2012-08-22 | 金悦通电子（翁源）有限公司 | Processing method of printed circuit board (PCB) |
| CN104411107A (en) * | 2014-11-05 | 2015-03-11 | 深圳恒宝士线路板有限公司 | PCB electrogilding technology |
| CN108235591A (en) * | 2018-01-08 | 2018-06-29 | 昆山首源电子科技有限公司 | The gold-plated etch process of 5G communication high frequency signal plates |
| CN109183033A (en) * | 2018-08-21 | 2019-01-11 | 嘉应学院 | A kind of preparation method of the netted copper foil of lithium ion battery |
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2020
- 2020-12-14 CN CN202011463535.4A patent/CN112804821A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101820730A (en) * | 2010-03-30 | 2010-09-01 | 梅州博敏电子有限公司 | Method for preparing printed wiring board by selectively plating gold |
| CN102647858A (en) * | 2012-05-15 | 2012-08-22 | 金悦通电子（翁源）有限公司 | Processing method of printed circuit board (PCB) |
| CN104411107A (en) * | 2014-11-05 | 2015-03-11 | 深圳恒宝士线路板有限公司 | PCB electrogilding technology |
| CN108235591A (en) * | 2018-01-08 | 2018-06-29 | 昆山首源电子科技有限公司 | The gold-plated etch process of 5G communication high frequency signal plates |
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