CN103108501B - A kind of microwell plate chemical copper activation back scrubbing technique and system thereof - Google Patents
A kind of microwell plate chemical copper activation back scrubbing technique and system thereof Download PDFInfo
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- CN103108501B CN103108501B CN201310018549.9A CN201310018549A CN103108501B CN 103108501 B CN103108501 B CN 103108501B CN 201310018549 A CN201310018549 A CN 201310018549A CN 103108501 B CN103108501 B CN 103108501B
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Abstract
The present invention provides a kind of microwell plate chemical copper activation back scrubbing technique and system thereof, and described technique includes: microetch: increase the roughness on copper surface, it is ensured that the adhesion of layers of copper；Once washing: the micro-etching agent of clean plate face residual；Once preimpregnation: activating plate face and hole wall；Activation: make hole wall adsorb one layer of metal with catalytic capability, makes to adsorb through the matrix surface of overactivation to activate target；Secondary is washed: the activator of clean plate face residual；Heavy copper: copper ion reduces under the effect of activation target and is deposited on hole wall, makes non-conductive insulated vias be converted into the conductive through hole of activity；The secondary preimpregnation step that protection activation target is not dissolved it is provided with between described activation and secondary water-washing step.Implement the present invention so that the activation target in pcb board will not be dissolved in water, and decreases the risk that backlight is bad, improves product quality, reduces production cost simultaneously.
Description
Technical field
The present invention relates to a kind of pcb board technical field, particularly relate to a kind of microwell plate chemical copper activation back scrubbing technique and
System.
Background technology
PCB(Printed Circuit Board), Chinese is printed wiring board, is called for short printed board, is electronics industry
One of vitals.Almost every kind of electronic equipment, little to accutron, computer, arrive greatly computer, communication electronic device,
Military issue weapons system, as long as there being the electronic devices and components such as integrated circuit, for the electric interconnection between them, will use printing
Plate.
In the pcb board production and processing having through hole, having a key link is exactly hole metallization flow process, and this process makes
Non-conductive insulated vias is converted into the conductive through hole of activity, and the method that existing pcb board makes hole conducting is PTH(chemistry
Heavy copper vias) technique, its technological process is: feeding → bulk → bis-grade or three stage countercurrent rinsing → de-smears → recovery hot water wash
→ bis-stage countercurrents rinsing → neutralize/reduction → bis-stage countercurrent rinsing → whole hole/alkaline degreasing → bis-grade or three stage countercurrents rinse →
Microetch roughening → bis-stage countercurrent rinsing → preimpregnation → washing → rushization → bis-stage countercurrent rinsing city of activation → bis-stage countercurrent rinsing city
Washing → heavy copper → bis-stage countercurrent rinsing city's washing → blanking.This complex process, the production cycle is long, and cost is high, and is passing through
After activation, the activation target in pcb board hole is easily dissolved in two follow-up stage countercurrent rinsing city's washings, causes pcb board to go out
The problem that existing backlight is bad, reduces the product yield of pcb board, and for making activation target be not dissolved, activator concentration can increase, and lives
The increase of agent concentration makes entreprise cost increase.
Chinese patent discloses a kind of application number: 201210332993.3, a kind of sets in the conductive layer of printed circuit board (PCB)
Put method and the layer structure thereof of metal target layer, the steps include: first insulated substrate to be covered copper, then carry out baking sheet, it
After carry out Drilling operation, heavy copper operation, make circuit, the operating process of insulating barrier welding resistance obtains semi-finished product, finally to semi-finished product
The circuit pack of plate body carries out heavy nickel, heavy target successively, and turmeric operates, when pcb board carries out heavy copper operation, mainly in boring
Use chemistry non-electrolytic copper facing mode to form the first coating on Copper Foil after processing, make both sides Copper Foil mutual conduction, to complete to sink
Copper operates, and this kind of heavy copper operating procedure uses original heavy copper method, and technique is simple, and cost is high, and is unfavorable for follow-up sinking
Nickel, heavy target, turmeric operates, and product defect rate is low.
Summary of the invention
The present invention is directed to problems of the prior art, be optimized on the basis of existing heavy process for copper so that PCB
Activation target in plate will not be dissolved in water, and decreases the risk that backlight is bad, improves product quality, reduces simultaneously and produces into
This.
A kind of microwell plate chemical copper activation back scrubbing technique that the present invention provides, order comprises the following steps:
Microetch: increase the roughness on copper surface, it is ensured that the adhesion of layers of copper；
Once washing: the micro-etching agent of clean plate face residual；
Once preimpregnation: activating plate face and hole wall；
Activation: make hole wall adsorb one layer of metal with catalytic capability, makes to adsorb upper activation through the matrix surface of overactivation
Target, described activator effective ingredient is containing Sn2+、Pd2+The solution of colloid ion；
Secondary is washed: the activator of clean plate face residual；
Heavy copper: copper ion reduces under the effect of activation target and is deposited on hole wall, makes non-conductive insulated vias be converted into
The conductive through hole of activity；
It is provided with to protect between described activation and secondary water-washing step and activates the secondary preimpregnation step that target is not dissolved, described two
Secondary preimpregnation step uses secondary prepreg solution pre-impregnated sheet face, and described secondary prepreg solution is similar to activator component.
Optimizing technique as one, described secondary prepreg solution acidity is 0.58 ~ 0.8N.
Optimizing technique as one, the proportion of described secondary prepreg solution is ＞ 1.142.
Optimizing the technological parameter of secondary preimpregnation further, described secondary prepreg solution acidity is 0.65N.
Optimizing the technological parameter of secondary preimpregnation further, the proportion of described secondary prepreg solution is 2.
Optimizing technique as one, described micro-etching speed is 20 ~ 40 Unich, and temperature is 25 DEG C ~ 30 DEG C.
Optimizing technique as one, described once preimpregnation acid content is 0.5 ~ 0.7N, described activator proportion is 1.25 ~
1.35g/cm3。
Optimizing technique as one, the step before described microetching step is:
Expand: effectively remove boring dirty copper coin substrate resin by expanding to decompose；
Whole hole/alkaline degreasing: remove hole wall and the greasy dirt on copper coin surface, make effectively to deposit copper.
Accordingly, the present invention also proposes a kind of microwell plate chemical copper activation back scrubbing system, it is characterised in that including:
Microetch cylinder: after the expanded and whole hole/alkaline degreasing of pcb board, enters in microetch cylinder, pcb board surface etches recessed
The matsurface of convex injustice；
Water washing cylinder: the pcb board after microetch is entered in a water washing cylinder, pcb board is carried out countercurrent rinsing；
Once presoak cylinder: enter through the pcb board of a water washing cylinder rinsing and once presoak cylinder, activating plate face and hole wall；
Active cylinder: the pcb board after once preimpregnation enters active cylinder, makes hole wall adsorb one layer in active cylinder and has catalysis
The metal of ability, makes to adsorb through the matrix surface of overactivation to activate target；
Secondary preimpregnation cylinder: the pcb board after activated enters in secondary preimpregnation cylinder, in secondary preimpregnation cylinder, protection activation target is not
It is dissolved in water；
Secondary water washing cylinder: pcb board is the activator of clear board face residual in secondary water washing cylinder；
Heavy copper groove: for pcb board carries out heavy copper, make non-conductive insulated vias be converted into the conductive through hole of activity.
Described microetch cylinder, water washing cylinder, water washing cylinder, active cylinder, secondary preimpregnation cylinder, secondary water washing cylinder, a heavy copper groove
It is sequentially connected with.
Further, described microetch cylinder, water washing cylinder, water washing cylinder, active cylinder, secondary preimpregnation cylinder, a secondary washing
Cylinder, heavy copper groove are arranged over lifting appliance, and described lifting appliance stroke is back scrubbing system length；
Described once preimpregnation cylinder and secondary preimpregnation cylinder are provided with the PH meter measuring acidity；
Described microetch cylinder is provided with the temperature control meter for controlling temperature.
A kind of microwell plate chemical copper that the present invention provides activates back scrubbing technique and system thereof, on original heavy process for copper,
Pcb board after activated is entered secondary preimpregnation so that the activation target in pcb board hole will not be molten in follow-up secondary washing
Solve, thus decrease the risk that backlight is bad, improve production panel products quality, greatly improve work efficiency, reduce
Labor intensity, not readily dissolves because activating target in hole, it is possible to decrease the activator concentration in active cylinder simultaneously, reduces production cost.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to
Other accompanying drawing is obtained according to these accompanying drawings.
Fig. 1 is a kind of microwell plate chemical copper activation back scrubbing process flow diagram that the present invention provides；
Fig. 2 is a kind of microwell plate chemical copper activation back scrubbing system structure schematic diagram that the present invention provides.
Detailed description of the invention
The embodiment of the present invention is optimized on original heavy process for copper, makes the pcb board after overactivation again presoak,
Decrease the risk that backlight is bad, improve production panel products quality, greatly improve work efficiency, reduce work strong
Degree, not readily dissolves because activating target in hole, it is possible to decrease the activator concentration in active cylinder simultaneously, reduces production cost.
See Fig. 1, a kind of microwell plate chemical copper activation back scrubbing process flow diagram provided for the present invention.
A kind of microwell plate chemical copper activation back scrubbing technique that the present embodiment provides, including:
Step 100, expands: effectively remove boring dirty copper coin substrate resin by expanding to decompose；
Step 101, whole hole/alkaline degreasing: remove hole wall and the greasy dirt on copper coin surface, make effectively to deposit copper；
Step 102, microetch: increase the roughness on copper surface, it is ensured that the adhesion of layers of copper；
Step 103, once washing: the micro-etching agent of clean plate face residual；
Step 104, once preimpregnation: activating plate face and hole wall；
Step 105, activation: make hole wall adsorb one layer of metal with catalytic capability, make the matrix surface through overactivation inhale
Enclosing activation target, described activator effective ingredient is containing Sn2+、Pd2+The solution of colloid ion；
Step 106, secondary presoaks: protection activation target is not dissolved；
Step 107, secondary washing: the activator of clean plate face residual；
Step 108, heavy copper: copper ion reduces under the effect of activation target and is deposited on hole wall, make non-conductive insulation lead to
Hole is converted into the conductive through hole of activity.
Wherein, in a step 102, controlling micro-etching speed is 20 ~ 40 Unich, and using temperature control meter temperature is 25 DEG C ~ 30 DEG C；
Wherein, at step 104, described once preimpregnation acid content is 0.5 ~ 0.7N, described activator proportion is 1.25 ~
1.35g/cm3；
Wherein, in step 106, described secondary prepreg solution acidity is 0.58 ~ 0.8N, and the proportion of described secondary prepreg solution is
＞ 1.142, for reaching more preferably to presoak effect, described in state secondary prepreg solution acidity be 0.65N, described secondary prepreg solution
Proportion is 2.
Further, in described step 104 and step 106, use immersion type operation, with lifting appliance, pcb board is complete
Portion is immersed in once in preimpregnation cylinder and secondary preimpregnation cylinder, and the described once preimpregnation time is 2 ~ 3min, and the described secondary preimpregnation time is 4
~5min。
See Fig. 2, a kind of microwell plate chemical copper activation back scrubbing system structure schematic diagram provided for the present invention, including:
After the expanded and whole hole/alkaline degreasing of microetch cylinder 10:PCB plate, entering in microetch cylinder, pcb board etches on surface
Rough matsurface；
Water washing cylinder 11: the pcb board after microetch is entered in a water washing cylinder, pcb board is carried out countercurrent rinsing；
Once preimpregnation cylinder 12: enter through the pcb board of water washing cylinder rinsing and once presoak cylinder, activating plate face and hole wall；
Active cylinder 13: the pcb board after once preimpregnation enters active cylinder, makes hole wall absorption one layer have in active cylinder and urges
The metal of change ability, makes to adsorb through the matrix surface of overactivation to activate target；
Secondary preimpregnation cylinder 14: the pcb board after activated enters in secondary preimpregnation cylinder, protection activation target in secondary preimpregnation cylinder
It is not dissolved in water；
Secondary water washing cylinder 15:PCB plate is the activator of clear board face residual in secondary water washing cylinder；
Heavy copper groove 16: for pcb board carries out heavy copper, the conduction making non-conductive insulated vias be converted into activity is led to
Hole.
Described microetch cylinder 11, water washing cylinder 12 of 10, water washing cylinder, active cylinder 13, secondary preimpregnation cylinder 14, secondary washing
Cylinder 15, heavy copper groove 16 are sequentially connected with.
This back scrubbing system is simultaneously provided with lifting appliance 17, is used for alleviating artificial intensity, uses automated machine to complete operation,
Described lifting appliance 17 is arranged on described microetch cylinder 11, water washing cylinder 12 of 10, water washing cylinder, active cylinder 13, secondary preimpregnation
Above cylinder 14, secondary water washing cylinder 15, heavy copper groove 16, described lifting appliance 17 stroke is consistent with described back scrubbing system length.
In order to preferably control technological parameter, described once preimpregnation cylinder and secondary preimpregnation cylinder are provided with the PH meter measuring acidity,
Operator can adjust once preimpregnation cylinder and the acidity of secondary preimpregnation cylinder in time according to the numerical value on PH meter, and described microetch cylinder is provided with
For controlling the temperature control meter of temperature so that microetch temperature controls in rational parameter area.
Microwell plate chemical copper activation back scrubbing technique its each side experiment number compared with existing heavy process for copper that the present invention provides
According to as follows:
One, production cost contrast
1, existing heavy process for copper production cost
2, microwell plate chemical copper activation back scrubbing technique production cost calculates
3, Cost comparisons
Two, quality estimating is produced:
1, existing heavy process for copper is used to produce: test plate (panel) PR03588 model, 100 blocks of plates, good through having produced middle survey detection
Rate, fraction defective is 76%, and major defect is Kong Wutong；
2, microwell plate chemical copper activation back scrubbing technique is used to produce: test plate (panel) PR03588 model, 100 blocks of plates, through having produced
Middle survey detects yield, and fraction defective is 98%.
In summary, a kind of microwell plate chemical copper activation back scrubbing technique is complete by its working condition on probation and quality results
Meeting the requirements, atresia is without quality abnormals such as copper.Use a kind of microwell plate chemical copper activation back scrubbing technology generations for existing heavy process for copper
Production cost has saved 0.229 yuan/FT2；Cost reduces 21%, as with Production rate in April, the most monthly can save 52670
Unit.Through using different schemes to verify, use a kind of microwell plate chemical copper activation back scrubbing technique production quality all can reach and want
Ask.Therefore, a kind of microwell plate chemical copper activation back scrubbing technology generations is used to save 0.229 for existing heavy process for copper production cost
Unit/FT2, and produce quality be improved.
One of ordinary skill in the art will appreciate that all or part of flow process realizing in above-described embodiment method, be permissible
Instructing relevant hardware by computer program to complete, described program can be stored in a computer read/write memory medium
In, this program is upon execution, it may include such as the flow process of the embodiment of above-mentioned each method.Wherein, described storage medium can be magnetic
Dish, CD, read-only store-memory body (Read-Only Memory, ROM) or random store-memory body (Random Access
Memory, RAM) etc..
Above content is to combine concrete preferred implementation further description made for the present invention, it is impossible to assert
Being embodied as of the present invention is confined to these explanations.For general technical staff of the technical field of the invention,
On the premise of present inventive concept, it is also possible to make some simple deduction or replace, all should be considered as belonging to the present invention's
Protection domain.
Claims (10)
1. a microwell plate chemical copper activation back scrubbing technique, order comprises the following steps:
Microetch: be etched in microetch cylinder, increases the roughness on copper surface, it is ensured that the adhesion of layers of copper；
Once washing: be carried out in a water washing cylinder, the micro-etching agent of clean plate face residual；
Once preimpregnation: presoak in once presoaking cylinder, activating plate face and hole wall；
Activation: activate in active cylinder, makes hole wall adsorb one layer of metal with catalytic capability, makes the matrix through overactivation
Activating target in surface adsorption, described activator effective ingredient is containing Sn2+、Pd2+The solution of colloid ion；
Secondary is washed: be carried out in secondary water washing cylinder, the activator of clean plate face residual；
Heavy copper: carry out heavy copper in heavy copper groove, copper ion reduces under the effect of activation target and is deposited on hole wall, makes non-conductive
Insulated vias is converted into the conductive through hole of activity；
It is characterized in that, between described activation and secondary water-washing step, be provided with the secondary preimpregnation step that protection activation target is not dissolved
Suddenly, described secondary preimpregnation step is to use secondary prepreg solution pre-impregnated sheet face, described secondary prepreg solution and work in secondary preimpregnation cylinder
Agent composition is similar.
A kind of microwell plate chemical copper activation back scrubbing technique the most according to claim 1, it is characterised in that described secondary presoaks
Liquid acidity is 0.58～0.8N.
A kind of microwell plate chemical copper activation back scrubbing technique the most according to claim 2, it is characterised in that described secondary presoaks
The proportion of liquid is ＞ 1.142.
A kind of microwell plate chemical copper activation back scrubbing technique the most according to claim 3, it is characterised in that described secondary presoaks
Liquid acidity is 0.65N.
A kind of microwell plate chemical copper activation back scrubbing technique the most according to claim 4, it is characterised in that described secondary presoaks
The proportion of liquid is 2.
A kind of microwell plate chemical copper activation back scrubbing technique the most according to claim 1, it is characterised in that described micro-etching speed
Being 20～40Unich, temperature is 25 DEG C～30 DEG C.
A kind of microwell plate chemical copper activation back scrubbing technique the most according to claim 1, it is characterised in that described once presoak
Acid content is 0.5～0.7N, and described activator proportion is 1.25～1.35g/cm3。
8. activate back scrubbing technique according to a kind of microwell plate chemical copper described in any one of claim 1-7, it is characterised in that described
Step before microetching step is:
Expand: effectively remove boring dirty copper coin substrate resin by expanding to decompose；
Whole hole/alkaline degreasing: remove hole wall and the greasy dirt on copper coin surface, make effectively to deposit copper.
9. a microwell plate chemical copper activation back scrubbing system, it is characterised in that including:
Microetch cylinder: after the expanded and whole hole/alkaline degreasing of pcb board, enters in microetch cylinder, pcb board surface etches concavo-convex not
Flat matsurface；
Water washing cylinder: the pcb board after microetch is entered in a water washing cylinder, pcb board is carried out countercurrent rinsing；
Once presoak cylinder: enter through the pcb board of a water washing cylinder rinsing and once presoak cylinder, activating plate face and hole wall；
Active cylinder: the pcb board after once preimpregnation enters active cylinder, makes hole wall adsorb one layer in active cylinder and has catalytic capability
Metal, make through overactivation matrix surface adsorb on activate target；
Secondary preimpregnation cylinder: the pcb board after activated enters in secondary preimpregnation cylinder, and protection activation target is not by water in secondary preimpregnation cylinder
Dissolve；
Secondary water washing cylinder: pcb board is the activator of clear board face residual in secondary water washing cylinder；
Heavy copper groove: for pcb board carries out heavy copper, make non-conductive insulated vias be converted into the conductive through hole of activity；
Described microetch cylinder, water washing cylinder, once presoak cylinder, active cylinder, secondary preimpregnation cylinder, secondary water washing cylinder, heavy copper groove successively
Connect.
A kind of microwell plate chemical copper activation back scrubbing system the most according to claim 9, it is characterised in that described microetch cylinder,
One time water washing cylinder, water washing cylinder, active cylinder, secondary preimpregnation cylinder, secondary water washing cylinder, a heavy copper groove are arranged over lifting appliance, institute
Stating lifting appliance stroke is back scrubbing system length；
Described once preimpregnation cylinder and secondary preimpregnation cylinder are provided with the PH meter measuring acidity；
Described microetch cylinder is provided with the temperature control meter for controlling temperature.
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| CN201310018549.9A CN103108501B (en) | 2013-01-18 | 2013-01-18 | A kind of microwell plate chemical copper activation back scrubbing technique and system thereof |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104378930B (en) * | 2013-08-14 | 2017-11-24 | 四川海英电子科技有限公司 | The two-sided sink copper plate electric manufacture methods of PCB |
| CN104703411A (en) * | 2015-04-01 | 2015-06-10 | 竞陆电子(昆山)有限公司 | Horizontal plated-through hole production line pH monitoring device |
| CN105208798B (en) * | 2015-08-18 | 2018-07-06 | 四川海英电子科技有限公司 | Double-sided PCB conductive film plating technology |
| CN106211613A (en) * | 2016-08-05 | 2016-12-07 | 广州美维电子有限公司 | A kind of horizontal removing glue technique producing pcb board |
| CN106591907A (en) * | 2016-10-14 | 2017-04-26 | 江门崇达电路技术有限公司 | Copper plating method for PCB production process |
| CN108601243A (en) * | 2018-02-09 | 2018-09-28 | 深圳市赛孚科技有限公司 | A kind of heavy copper method of pcb board |
| CN114449759A (en) * | 2020-11-04 | 2022-05-06 | 竞华电子(深圳)有限公司 | PTH process |
| CN115369390A (en) * | 2021-12-16 | 2022-11-22 | 广东硕成科技股份有限公司 | Activation process for electroless copper plating and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101979709A (en) * | 2010-11-15 | 2011-02-23 | 深圳市成功科技有限公司 | Novel chemical copper plating method |
| CN101990363A (en) * | 2010-08-06 | 2011-03-23 | 雷玉菡 | Gold plating method for electronic circuit board |
| CN103205735A (en) * | 2012-01-17 | 2013-07-17 | 江苏华神电子有限公司 | Chemical copper deposition return type process flow for printed wiring board |
| CN203104980U (en) * | 2013-01-18 | 2013-07-31 | 金悦通电子（翁源）有限公司 | Microplate chemical copper activation back washing system |
-
2013
- 2013-01-18 CN CN201310018549.9A patent/CN103108501B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101990363A (en) * | 2010-08-06 | 2011-03-23 | 雷玉菡 | Gold plating method for electronic circuit board |
| CN101979709A (en) * | 2010-11-15 | 2011-02-23 | 深圳市成功科技有限公司 | Novel chemical copper plating method |
| CN103205735A (en) * | 2012-01-17 | 2013-07-17 | 江苏华神电子有限公司 | Chemical copper deposition return type process flow for printed wiring board |
| CN203104980U (en) * | 2013-01-18 | 2013-07-31 | 金悦通电子（翁源）有限公司 | Microplate chemical copper activation back washing system |
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