CN103533776A - Method for manufacturing embedded PCB (printed circuit board) - Google Patents
Method for manufacturing embedded PCB (printed circuit board) Download PDFInfo
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- CN103533776A CN103533776A CN201310428178.1A CN201310428178A CN103533776A CN 103533776 A CN103533776 A CN 103533776A CN 201310428178 A CN201310428178 A CN 201310428178A CN 103533776 A CN103533776 A CN 103533776A
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Abstract
The invention discloses a method for manufacturing an embedded PCB (printed circuit board). The method is implemented by the steps of cutting, drilling, electroless copper plating, primary film coating, primary exposure, primary etching, secondary etching, primary film removal, secondary film coating, tertiary etching, secondary film removal and lamination. According to the method, the technical problem that a large area of a conventional PCB is occupied by passive components is solved, the size of the PCB is effectively reduced, and the passive components are embedded into the PCB; a (buried) resistor is successfully obtained by performing etching, film coating and film removal for many times, and meanwhile, a more precise PCB can be produced by performing an optimization process for many times.
Description
Technical field
The invention belongs to PCB and make field, be specifically related to a kind of manufacture method of embedded PCB.
Background technology
Develop rapidly along with electronic technology, common PCB(printed circuit board (PCB)) by the HDI of high density interconnect (High Density Interconnect) product, replaced gradually, and being embedded into formula wiring board gradually, HDI plate replaces, common PCB enters low margin age, Enterprise Development, model change is trend of the times, along with radio communication, the progress at full speed of technology in automotive electronics and consumer electronics field, supporting PCB product also needs constantly to promote its performance with it, reliability and the power consumption that reduces PCB product, and meet electronic product greater functionality, the development object of epistasis energy and compact in size more.Evolution from electronic product compact in size, PCB sends out from initial single sided board, double sided board products such as putting on display gradually baroque multi-layer sheet, high density interconnecting board, for the lifting of electronic product performance, function abundant, condition has been created in the reduction of cost.This constantly increases the pressure encapsulating on the pcb board face of limited area increasing passive component must to be set in circuit when meeting the continuous improving product design of electric property of electronic product, therefore, miniaturization of electronic products is greatly limited.
Conventionally in PCB, the ratio of passive component and active element quantity be for can reach 15:1 to 20:1, and along with the raising of electronic product integrated level, this ratio also will constantly rise.Under the driving of passive component and the increase of active element quantity ratio, passive component potting is called to the passive device technology of imbedding to inner this technology of PCB, be EPT (embedded passives technology), novel IC printed technology is the inexorable trend result of production technology and electronic interconnection development in science and technology.Under this background, PCB potting passive component technology has obtained paying close attention to more and more widely.And in passive component, capacitor, resistor account for the more than 80% of its sum, so the research people that PCB potting capacitance technology and PCB embedded resistors technology have become in current industry is popular.
Progress at full speed along with technology in radio communication, automotive electronics and consumer electronics field, the power consumption that supporting PCB product also needs constantly to promote its performance, reliability and reduces PCB product with it, and meet electronic product greater functionality, the development object of epistasis energy and compact in size more.At present domestic mass-produced traditional PCB product is because technology content is not high, dog-eat-dog, and profit margin is quite little; Embedded capacitance formula multi-layer sheet belongs to the extraordinary PCB of high-end wiring board; Belong to one of new and high technology foremost in industry, along with the miniaturization of electronic product and the development of high frequency, the market demand of the type product is also at increase year after year.
There is advantage in the buried resistor after integrated, buy resistance loss very low after cold cycling aspect stability, be approximately 50ppm, and other discrete resistor components and parts losses is about 100ppm-300ppm; Under 110 ℃ of conditions, deposit after 10000 hours, resistance is increased in 2% left and right: in wide frequency range, carry out stability debugging, be less than 20GH.
In Chinese utility model patent specification CN102857147U, disclose a kind of PCB board structure of circuit, the utility model discloses a kind of PCB board structure of circuit, comprised PCB substrate and passive device, described passive device is embedded in described PCB substrate.This PCB circuit board is integrated into PCB internal layer passive device from the welding of pcb board face, and the passive device of potting is protected by PCB, avoids extraneous factor impact, improves element job stability.
A kind of method of processing embedded PCB plate structure is disclosed in Chinese invention patent specification CN102833947A, on the PCB plate with multi-layer PCB plank layer, be provided with one for embedding the groove of device, will be arranged on groove internal layer for welding the pad flush type of described device.Because described method is used pad, can greatly increase the shared space of components and parts.
Summary of the invention
In order to solve existing PCB passive component, occupy excessive space, the invention provides a kind of manufacture method of embedded PCB.
The manufacture method of described a kind of embedded PCB, first selects the base material of 3 laminate materials to carry out sawing sheet, obtains substrate, it is characterized in that, carries out following steps after sawing sheet:
Boring: hole on substrate, drilling hole is slightly less than 0.8 mil;
Heavy copper: utilize chemical principle to deposit the copper of one deck 0.3um-0.5um on borehole wall;
Overlay film for the first time: cover ground floor resistance film on ground floor sheet material;
Exposure for the first time: use Full-automatic exposure machine to expose to ground floor resistance film, the moulding of tentatively developing of ground floor resistance film:
Etching for the first time: ground floor sheet material is carried out to etch processes, lose copper and process;
Etching for the second time: second layer sheet material is carried out to etch processes, lose resistive layer and process;
Take off for the first time film: ground floor resistance film is taken off;
Overlay film for the second time: cover second layer resistance film on ground floor sheet material;
Etching for the third time: second layer resistance film is carried out to etch processes, lose for the second time copper and process;
Take off for the second time film: second layer resistance film is taken off;
Lamination: use electric heating press lamination.
Wherein, obtain resistance after taking off for the second time film.
Wherein, drilling hole is slightly less than 0.8 mil, is because drilling hole slightly directly affects conducting and resistance, so hole slightly must be controlled at below 0.8 mil.
Wherein, while exposing for the first time, use Full-automatic exposure machine, guarantee contraposition accuracy and live width tolerance; After exposure, use for the first time optical checking machine to check, in exposure process, every 30PNL is used optical checking machine to do autonomous inspection, has prevented to open in batches short circuit and has produced.
Preferably, ground floor cleans Darkening process after taking off film, so that can keep stronger pull-out capacity between multiple-plate copper face and resin P sheet after pressing, described cleaning method adopts water cleaning technique, to remove aqueous solvent and nonpolar pollutant.
More preferably, carry out for the second time for the second time exposure-processed after overlay film and use optical checking machine inspection.
More preferably, after checking, use optical checking machine carries out pickling processes, to wash surperficial oxide layer off.
Further, according to the resistance value of wanting to obtain, resistance film is for the second time carried out to selective etch during etching for the third time.
Preferably, use diamond guillotine to carry out sawing sheet, after sawing sheet, transfer instrument uses hydraulic car and L frame, to reduce to greatest extent fold and plate, damages.
Wherein, when internal layer is made live width line-spacing must management and control to ± 10%, therefore, when etching for the first time, etching for the second time and etching for the third time, etching factor is greater than 2.0.
Preferably, use diamond guillotine to carry out sawing sheet, after sawing sheet, transfer instrument uses hydraulic car and L frame, to reduce to greatest extent fold and plate, damages.
The PCB that uses the inventive method to produce has following aspect benefit:
One, product is reached technical indicator:
Wiring density: >=180/inch2;
Density :≤20, hole hole/inch2;
Solder joint density :≤18 point/inch2;
Buried resistor loss :≤50ppm after cold cycling;
Wideband measuring stability :≤20G HZ;
Resistance change under maximum conditions: 1-3%;
Signal transmission attenuation :≤5%;
Thickness of dielectric layers (min): 0.2mm;
End copper thickness: 18um-70um;
Minimum feature/line-spacing: 3mil/ 2mil;
Minimum-value aperture: 0.15mm;
Motherboard type: 4 layers and more than.
Two, economic benefit:
After the invention process, can realize following economic index:
(1), year volume increase value: 100,000 ten thousand yuan;
(2), year increasing profit: 30,000 ten thousand yuan;
(3), year tax increase gold: 60,000 ten thousand.
Simultaneously after the invention process, China has possessed and the ability of Japan, the U.S. first-class PCB manufacturer direct competitive, realizes enterprise technology, market, brand, capital and international comprehensive docking, participation global competition, the core competitive of General Promotion PCB in China.
Three, social benefit
After the invention process, can change the low value-added situation of PCB in China industry, better energy savings, reduces carbon emission, realizes energy sustainable development strategic objective.And in my department, just can increase by 1200 jobs after the invention process, promoted greatly social harmonious development.
The invention solves the technical problem that existing passive components and parts occupy PCB significant volume, effectively reduced the volume of PCB, realized passive component has been embedded in PCB, the etching of the present invention by repeatedly and overlay film repeatedly with take off film, successfully obtained (burying) resistance, by Optimization Technology repeatedly, made the PCB producing through the present invention more accurate simultaneously.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is schematic flow sheet of the present invention;
Fig. 2 is most preferred embodiment schematic flow sheet of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described.Embodiment based in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment mono-
With reference to figure 2, a kind of manufacture method of embedded PCB, carry out according to the following steps:
Sawing sheet, selects the base material of 3 laminate materials to use diamond guillotine to carry out sawing sheet, obtains substrate, and after sawing sheet, transfer instrument uses hydraulic car and L frame, to reduce to greatest extent fold and plate, damages;
Boring is holed on substrate, and drilling hole is slightly less than 0.8 mil;
Heavy copper, utilizes chemical principle on borehole wall, to deposit the copper of one deck 0.3um-0.5um;
Overlay film covers ground floor resistance film on ground floor sheet material for the first time;
Exposure, is used Full-automatic exposure machine during exposure for the first time, guarantees contraposition accuracy and live width tolerance;
Use optical checking machine to check, in exposure process, every 30PNL is used optical checking machine to do autonomous inspection;
Clean and Darkening process, so that can keep stronger pull-out capacity between multiple-plate copper face and resin P sheet after pressing, described cleaning method adopts water cleaning technique, to remove aqueous solvent and nonpolar pollutant;
Etching for the first time: ground floor sheet material is carried out to etch processes, lose copper and process;
Etching for the second time: second layer sheet material is carried out to etch processes, lose resistive layer and process;
Take off for the first time film: ground floor resistance film is taken off;
Overlay film for the second time: cover second layer resistance film on ground floor sheet material;
Exposure for the second time;
Use optical checking machine to check;
Pickling, washes surperficial oxide layer off;
Etching for the third time: second layer resistance film is carried out to etch processes, lose for the second time copper and process;
Take off for the second time film: second layer resistance film is taken off;
Lamination: use electric heating press lamination.
The present embodiment has been realized passive component has been embedded in PCB, solved the technical problem that existing passive components and parts occupy PCB significant volume, effectively reduced the volume of PCB, simultaneously the etching by repeatedly and overlay film repeatedly with take off film, successfully obtained (burying) resistance, further by Optimization Technology repeatedly, made the PCB producing through the present invention more accurate.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (8)
1. a manufacture method for embedded PCB, first selects the base material of 3 laminate materials to carry out sawing sheet, obtains substrate, it is characterized in that, carries out following steps after sawing sheet:
Boring: hole on substrate, drilling hole is slightly less than 0.8 mil;
Heavy copper: utilize chemical principle to deposit the copper of one deck 0.3um-0.5um on borehole wall;
Overlay film for the first time: cover ground floor resistance film on ground floor sheet material;
Exposure for the first time: use Full-automatic exposure machine to expose to ground floor resistance film, the moulding of tentatively developing of ground floor resistance film:
Etching for the first time: ground floor sheet material is carried out to etch processes, lose copper and process;
Etching for the second time: second layer sheet material is carried out to etch processes, lose resistive layer and process;
Take off for the first time film: ground floor resistance film is taken off;
Overlay film for the second time: cover second layer resistance film on ground floor sheet material;
Etching for the third time: second layer resistance film is carried out to etch processes, lose for the second time copper and process;
Take off for the second time film: second layer resistance film is taken off;
Lamination: use electric heating press lamination.
2. a kind of manufacture method of embedded PCB according to claim 1, is characterized in that, uses for the first time optical checking machine to check after exposure.
3. a kind of manufacture method of embedded PCB according to claim 1, is characterized in that, ground floor cleans and Darkening process after taking off film.
4. a kind of manufacture method of embedded PCB according to claim 1, is characterized in that, carries out for the second time for the second time exposure-processed and use optical checking machine inspection after overlay film.
5. a kind of manufacture method of embedded PCB according to claim 4, is characterized in that, carries out pickling processes after using optical checking machine to check.
6. a kind of manufacture method of embedded PCB according to claim 1, is characterized in that, during etching for the third time, according to the resistance value of wanting to obtain, resistance film is for the second time carried out to selective etch.
7. a kind of manufacture method of embedded PCB according to claim 1, is characterized in that, uses diamond guillotine to carry out sawing sheet, and after sawing sheet, transfer instrument uses hydraulic car and L frame.
8. a kind of manufacture method of embedded PCB according to claim 1, is characterized in that, when etching for the first time, etching for the second time and etching for the third time, etching factor is greater than 2.0.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310428178.1A CN103533776A (en) | 2013-09-18 | 2013-09-18 | Method for manufacturing embedded PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310428178.1A CN103533776A (en) | 2013-09-18 | 2013-09-18 | Method for manufacturing embedded PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103533776A true CN103533776A (en) | 2014-01-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310428178.1A Pending CN103533776A (en) | 2013-09-18 | 2013-09-18 | Method for manufacturing embedded PCB (printed circuit board) |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009021581A (en) * | 2007-06-15 | 2009-01-29 | Meltex Inc | Buried copper plating method for manufacturing printed circuit board and printed circuit board obtained employing the buried copper plating method |
| CN101605433A (en) * | 2009-06-26 | 2009-12-16 | 上海美维电子有限公司 | The processing method of buried resistor in a kind of printed circuit board |
| CN102612270A (en) * | 2012-03-23 | 2012-07-25 | 深圳崇达多层线路板有限公司 | Plane resistance etching method |
| CN102647858A (en) * | 2012-05-15 | 2012-08-22 | 金悦通电子（翁源）有限公司 | Processing method of printed circuit board (PCB) |
| CN102766870A (en) * | 2011-05-06 | 2012-11-07 | 比亚迪股份有限公司 | Etching liquid and method for etching flexible circuit board |
| CN103079354A (en) * | 2012-11-08 | 2013-05-01 | 东莞生益电子有限公司 | Method for improving accuracy of resistance value of buried resistance printed circuit board |
-
2013
- 2013-09-18 CN CN201310428178.1A patent/CN103533776A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009021581A (en) * | 2007-06-15 | 2009-01-29 | Meltex Inc | Buried copper plating method for manufacturing printed circuit board and printed circuit board obtained employing the buried copper plating method |
| CN101605433A (en) * | 2009-06-26 | 2009-12-16 | 上海美维电子有限公司 | The processing method of buried resistor in a kind of printed circuit board |
| CN102766870A (en) * | 2011-05-06 | 2012-11-07 | 比亚迪股份有限公司 | Etching liquid and method for etching flexible circuit board |
| CN102612270A (en) * | 2012-03-23 | 2012-07-25 | 深圳崇达多层线路板有限公司 | Plane resistance etching method |
| CN102647858A (en) * | 2012-05-15 | 2012-08-22 | 金悦通电子（翁源）有限公司 | Processing method of printed circuit board (PCB) |
| CN103079354A (en) * | 2012-11-08 | 2013-05-01 | 东莞生益电子有限公司 | Method for improving accuracy of resistance value of buried resistance printed circuit board |
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Application publication date: 20140122 |
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