CN103572264A - Circuit board surface treatment method - Google Patents
Circuit board surface treatment method Download PDFInfo
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- CN103572264A CN103572264A CN201210260222.8A CN201210260222A CN103572264A CN 103572264 A CN103572264 A CN 103572264A CN 201210260222 A CN201210260222 A CN 201210260222A CN 103572264 A CN103572264 A CN 103572264A
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Abstract
The invention discloses a circuit board surface treatment method. The circuit board surface treatment method comprises the following steps of treating a circuit board by an acidic oil-removal liquid at a temperature of 35-45 DEG C, treating the circuit board by a micro-etching liquid at a temperature of 25-35 DEG C, treating the circuit board by an acid liquid at a temperature of 45-55 DEG C, treating the circuit board by a presoak at a room temperature, treating the presoaked circuit board by an activation liquid at a temperature of 25-31 DEG C, treating the circuit board by an after-soak at the room temperature, carrying out chemical nickel-plating on the circuit board at a temperature of 80-84 DEG C, treating the circuit board by a silver precipitation presoak at a temperature of 32-43 DEG C, and carrying out chemical silver-precipitation on the circuit board presoaked with silver at a temperature of 43-54 DEG C to obtain the circuit board subjected to surface treatment. The circuit board surface treatment method utilizes cheap silver to replace gold and thus compared with the traditional surface treatment technology adopting nickel and gold chemical plating, the circuit board surface treatment method has a low cost.
Description
Technical field
The present invention relates to art of printed circuit boards, relate in particular to a kind of circuit board surface treatment process.
Background technology
In the manufacturing process flow of a printed circuit board, the final surperficial weldability of product is processed, and the assembling of the finished product and use are played to vital effect.
The surface treatment of traditional printed-wiring board (PWB) adopts chemical nickel plating gold process more.Yet, progressively high along with the price of gold, it is very high that the cost of the process of surface treatment of traditional printed-wiring board (PWB) becomes.
Summary of the invention
Based on this, provide a kind of lower-cost circuit board surface treatment process.
A treatment process, comprises the steps:
Step 1, at 35 ℃ ~ 45 ℃ with acid deoiling liquid treatment circuit plate;
Step 2, the circuit card obtaining with micro-etching solution treatment step one at 25 ℃ ~ 35 ℃;
Step 3, the circuit card obtaining with acid solution treatment step two at 45 ℃ ~ 55 ℃;
Step 4, the circuit card at room temperature obtaining with presoak treatment step three are then processed the circuit card of preimpregnation at 25 ℃ ~ 31 ℃ with activation solution;
Step 5, the circuit card at room temperature obtaining with rear immersion liquid treatment step four;
Step 6, the circuit card at 80 ℃ ~ 84 ℃, step 5 being obtained carry out chemical nickel plating; And
Step 7, the circuit card obtaining with heavy silver-colored presoak treatment step six at 32 ℃ ~ 43 ℃, then carry out Immersion Ag at 43 ℃ ~ 54 ℃ circuit cards that preimpregnation silver is crossed, and obtains the circuit card after surface treatment.
In one embodiment, in step 1, described acid deoiling liquid is that volume fraction is 8% ~ 12% sulfuric acid, and the time that adopts described acid deoiling liquid to process described circuit card is 4min ~ 6min.
In one embodiment, also comprise the step of washing after step 1, described washing is first at 48 ℃ ~ 52 ℃, circuit card to be washed to 1min ~ 2min, then at room temperature circuit card is washed to 1min ~ 2min twice.
In one embodiment, in step 2, described micro-etching solution comprises Sodium Persulfate, sulfuric acid and soluble copper salt, and the concentration of Sodium Persulfate is 60g/L ~ 100g/L, and the massfraction of sulfuric acid is 1% ~ 3%, and the concentration of soluble copper salt is 5g/L ~ 20g/L;
The time that adopts described micro-etching solution to process described circuit card is 1min ~ 2min.
In one embodiment, also comprise the step of washing after step 2, described washing is at room temperature washing 1min ~ 2min twice to circuit card.
In one embodiment, in step 3, the sulphuric acid soln that described acid solution is 20mL/L ~ 40mL/L, adopting the time of acid solution treatment circuit plate is 1min ~ 2min.
In one embodiment, also comprise the step of washing after step 3, described washing is at room temperature using twice of deionized water cleaning circuit plate 1min ~ 2min.
In one embodiment, in step 4, the sulphuric acid soln that described presoak is 4mL/L ~ 6mL/L, the time of presoak treatment circuit plate is 1min ~ 2min.
In one embodiment, in step 4, described activation solution is that palladium content is the palladium activation solution of 8ppm ~ 15ppm, and the acidity of described activation solution is 0.25N ~ 0.35N, and the time that adopts described activation solution to process the circuit card of preimpregnation is 1min ~ 2min.
In one embodiment, also comprise the step of washing after step 4, described washing is at room temperature using twice of deionized water cleaning circuit plate 1min ~ 2min.
In one embodiment, in step 5, the sulphuric acid soln that described rear immersion liquid is 4mL/L ~ 6mL/L, the time that adopts described rear immersion liquid treatment circuit plate is 1min ~ 2min.
In one embodiment, also comprise the step of washing after step 5, described washing is at room temperature using twice of deionized water cleaning circuit plate 1min ~ 2min.
In one embodiment, in step 6, described chemical nickel plating is for using nickel-phosphor bath treatment circuit plate 17min ~ 22min.
In one embodiment, in step 6, in described nickel-phosphor bath, nickel content is 4.4g/L ~ 5g/L, and described nickel-phosphor bath comprises that mass concentration is the sodium hypophosphite that 75% single nickel salt and mass concentration are 15%, and the pH of described nickel-phosphor bath is 4.3 ~ 4.7.
In one embodiment, also comprise the step of washing after step 6, described washing, for first at room temperature using deionized water cleaning circuit plate 1min ~ 2min twice, is then used deionized water cleaning circuit plate 1min ~ 2min at 48 ℃ ~ 52 ℃.
In one embodiment, in step 7, described heavy silver-colored presoak comprises nitric acid and ethylenediamine tetraacetic acid (EDTA), and the mass concentration of nitric acid is 1.6%, and the mass concentration of ethylenediamine tetraacetic acid (EDTA) is 5%;
The time that adopts described heavy silver-colored presoak to process described circuit card is 1min ~ 3min.
In one embodiment, in step 7, described Immersion Ag is for using heavy silver plating solution treatment circuit plate 1min ~ 10min.
In one embodiment, described heavy silver plating solution comprises nitric acid, Silver Nitrate and ethylenediamine tetraacetic acid (EDTA), and the mass concentration of nitric acid is 3.2%, and the mass concentration of Silver Nitrate is 5%, and the mass concentration of ethylenediamine tetraacetic acid (EDTA) is 10%.
In one embodiment, also comprise the step of washing after step 7, described washing, for first at room temperature using deionized water cleaning circuit plate 1min ~ 2min twice, is then used deionized water cleaning circuit plate 1min ~ 2min at 48 ℃ ~ 52 ℃.
In one embodiment, after step 7, also comprise and reclaim silver-colored operation.
Sort circuit plate surface treatment method is by adopting comparatively cheap silver to replace gold, and with respect to the process of surface treatment of traditional employing chemical nickel plating gold process, cost is lower.
Accompanying drawing explanation
Fig. 1 is the schema of the circuit board surface treatment process of an embodiment.
Embodiment
Below in conjunction with drawings and the specific embodiments, circuit board surface treatment process is described further.
Refer to Fig. 1, an embodiment circuit board surface treatment process, comprises the steps:
Step S10, at 35 ℃ ~ 45 ℃ with acid deoiling liquid treatment circuit plate.
Acid deoiling liquid is for removing organic dirt (light oil), finger mark, the oxide film in printed board, bright and clean copper layer surface, washing property is good, does not damage anti-solder ink and the dry film of circuit card, make plate face and copper plate have good bonding force, and can regulate hole wall activity to be beneficial to adsorptive catalyst.
Acid deoiling liquid can obtain concentrated sulfuric acid dissolution according to volume fraction for the volume fraction sulfuric acid that is 8% ~ 12% in water, and adopting the time of acid deoiling liquid treatment circuit plate is 4min ~ 6min.
After S10 completes, also need to wash operation, be specially: first at 48 ℃ ~ 52 ℃, circuit card is washed to 1min ~ 2min, then at room temperature circuit card is washed to 1min ~ 2min twice.
Oil removing operation can be selected acid deoiling groove, and actual conditions is as follows:
Acid deoiling agent 10% (8 ~ 12%) (V/V);
40 ℃ of temperature (35 ~ 45 ℃);
Treatment time 5min (4 ~ 6min);
Agitation and filtration circulation (5 ~ 10 μ m polypropylene filter core), 3 ~ 4 circulations per hour;
Well heater is quartzy;
The larger vibrating motor of power for vibrating device;
Cell body material PVC or PP.
Step S20, the circuit card obtaining by micro-etching solution treatment S 10 at 25 ℃ ~ 35 ℃.
Micro-etching solution forms after being mixed by Sodium Persulfate, sulfuric acid and soluble copper salt.Wherein, the concentration of Sodium Persulfate is 60g/L ~ 100g/L, and the massfraction of sulfuric acid is 1% ~ 3%, and the concentration of soluble copper salt is 5g/L ~ 20g/L.
Sodium Persulfate for microetch (SPS) is a kind of more stable micro-etching agent of erosion speed of stinging, and slight etching is carried out in the surface of copper, strengthens surface adhesion force, and can guarantee to remove completely the oxide compound of copper foil surface.
After S20 completes, also need to wash operation, be specially: at room temperature circuit card is washed to 1min ~ 2min twice.
Microetch operation can choice for use microetch groove, and actual conditions is as follows:
Sodium Persulfate (SPS) 80g/L (60 ~ 100g/L);
H
2SO
4(C.P) 2.0%(1~3%)；
Cu
2+be less than 20g/L;
25 ℃ ~ 35 ℃ of temperature;
Treatment time 1 ~ 2min;
The microetch degree of depth 0.8 ~ 1.5um;
Mixing Machine swings and filtration cycle pneumatic blending;
Cell body material PP or PVC;
Exhausting needs.
Join groove (100L builds bath)
1. 50L pure water is put into groove.
2. under stirring state, slowly add H
2sO
42.0L.
3. add Sodium Persulfate (SPS) 8kg, add water to 100L, stir.
Bath maintenance
1. every processing 100m
2add Sodium Persulfate (SPS) 2kg, H
2sO
4(C.P) 200ml.
2. every 4h ~ 6h analysis and regulation once.
3. copper content reaches 20g/L or 1turn-over, and working fluid needs removable parts or whole tank liquor.
Step S30, the circuit card obtaining by acid solution treatment S 20 at 45 ℃ ~ 55 ℃.
Acid solution is the sulphuric acid soln of 20mL/L ~ 40mL/L, and adopting the time of acid solution treatment circuit plate is 1min ~ 2min.
After S30 completes, also need to wash operation, be specially: at room temperature use twice of deionized water cleaning circuit plate 1min ~ 2min.
Step S40, the circuit card at room temperature obtaining by presoak treatment S 30 are then processed the circuit card of preimpregnation at 25 ℃ ~ 31 ℃ with activation solution.
Presoak is the sulphuric acid soln of 4mL/L ~ 6mL/L.The time of presoak treatment circuit plate is 1min ~ 2min.
Activation solution is that palladium content is the palladium activation solution of 8ppm ~ 15ppm, and acidity is 0.25N ~ 0.35N.The time of activation solution treatment circuit plate is 1min ~ 2min.
In present embodiment, palladium activation solution is palladous sulfate.
Palladium activation solution is at present uniquely can, under low consistency conditions, but have the novel palladous sulfate type activator of very excellent function.For product of the same type on the market, the shortcoming of copper face, anti-welding green paint and base plate resin attack is improved, solved in the lump copper ion concentration in activation tank liquor and rise too soon, bridge formation plating, single-point reveal the problems such as copper or negative and positive aberration.
After S40 completes, also need to wash operation, be specially: at room temperature use twice of deionized water cleaning circuit plate 1min ~ 2min.
Preimpregnation operation can adopt pre-immersion trough, and actual conditions is as follows:
Pre-immersion trough (AR.H
2sO
4) the 5ml/L treatment time is 1 minute.
Activation act can choice for use palladium activated bath, and actual conditions is as follows:
Palladium activated bath 100ml/L (only for opening cylinder), stoste is containing palladium amount 125ppm;
Palladium activated bath is for daily interpolation, and stoste is containing palladium amount 125ppm;
Palladium content 11ppm (8 ~ 15ppm);
Acidity 0.3N (0.25 ~ 0.35N);
28 ℃ of temperature (25 ~ 30 ℃);
Treatment time 1 ~ 3min (needing to determine according to producing plate classification and situation);
Stirring is shaken, filtration cycle (5 μ m polypropylene filter core), 3 ~ 4 circulations per hour;
Well heater is quartzy;
The larger vibrating motor of power for vibrating device;
Cell body material PVC or PP.
Step S50, the circuit card at room temperature obtaining by rear immersion liquid treatment S 40, washing.
Rear immersion liquid is the sulphuric acid soln of 4mL/L ~ 6mL/L.The time of rear immersion liquid treatment circuit plate is 1min ~ 2min.
After S50 completes, also need to wash operation, be specially: at room temperature use twice of deionized water cleaning circuit plate 1min ~ 2min.
Step S60, the circuit card at 80 ℃ ~ 84 ℃, S50 being obtained carry out chemical nickel plating.
Chemical nickel plating is for using nickel-phosphor bath treatment circuit plate 17min ~ 22min.
In nickel-phosphor bath, nickel content is 4.4g/L ~ 5g/L, and pH is 4.3 ~ 4.7, and nickel-phosphor bath comprises 75% single nickel salt and 15% sodium hypophosphite according to mass percent.
In the coating that chemical nickel plating obtains, the content of phosphorus is 6% ~ 10% according to mass percent.
The plating solution of chemical nickel plating, has the good plating ability that opens and excellent bath stability, and coating epithelium phosphorus content is stable, compact crystallization and excellent corrosion resistance.Inner tensions is low, and outward appearance is good, coordinates automatic adding device and separates out the use of anti-locking apparatus, can obtain certain speed of separating out and the coating of homogeneous, is conducive to automatic production.Meet client in multiple function requirements such as solderability, routing performance, low surface resistivitys.
After S60 completes, also need to wash operation, be specially: first at room temperature use deionized water cleaning circuit plate 1min ~ 2min twice, then at 48 ℃ ~ 52 ℃, use deionized water cleaning circuit plate 1min ~ 2min.
Chemical nickel plating operation can adopt nickel bath, and actual conditions is as follows:
Ni content 4.6g/L (4.4 ~ 5.0g/L);
PH value 4.5 (4.3 ~ 4.7);
82 ℃ of temperature (80 ~ 84 ℃);
Tank liquor load 0.2 ~ 0.8dm
2/ L;
Treatment time 17 ~ 26min (thick requirement is fixed time according to nickel);
Coating phosphorus content 6% ~ 10%;
Stirring Cylinder Vibration or upper and lower machinery shake;
Filter 5 ~ 10 μ m polypropylene filter cores, 6 ~ 10 circulations per hour, overflow filtration method;
Well heater quartz or Teflon, immersion method indirect heating;
The larger vibrating motor of power for vibrating device;
Cell body material is used 316 stainless steels, inwall polishing, and PP is circulation device;
Other automatic adding devices and prevent from separating out current protective device.
Step S70, the circuit card obtaining by heavy silver-colored presoak treatment S 60 at 32 ℃ ~ 43 ℃, then carry out Immersion Ag at 43 ℃ ~ 54 ℃ circuit cards that preimpregnation silver is crossed, and obtains the circuit card after surface treatment.
Heavy silver-colored presoak is mixed to form by nitric acid and ethylenediamine tetraacetic acid (EDTA).The mass concentration of nitric acid is 1.6%, and the mass concentration of ethylenediamine tetraacetic acid (EDTA) is 5%.
The time of heavy silver-colored presoak treatment circuit plate is 1min ~ 3min.
The concrete operations of heavy silver-colored preimpregnation are as follows:
Build bath amount: 93.4% pure water
5% ethylenediamine tetraacetic acid (EDTA)
1.6% HNO
3concentrated nitric acid (chemical pure)
Its major function of heavy silver-colored preimpregnation is in advance copper surface wettability to be increased to activation, and the concentration of the supplementary heavy silver-colored groove of appropriateness, avoids diluting heavy silver-colored groove.
Service temperature: 32 ℃ ~ 43 ℃ optimum values: 38 ℃
Controlled concentration: Ni compound 0.01 ~ 0.02M optimum value: 0.015M
Acid content 0.2 ~ 0.4N optimum value: 0.25N
Copper content <1000mg/L
Supplement and add: the every increase of Ni compound 0.001M adds 75098 3.3mL/L
The every increase of acid content 0.01N adds HNO
30.63mL/L
Stir: stirring rod and liquid recycle pump (5-7 groove/hour), unavailable pneumatic blending.
Strainer: use the PP filter core of 20 μ m, more change during groove with tank liquor.
The tank liquor life-span: when copper content arrives 1000mg/L or silver-plating bath more during groove, arbitrary condition gives more groove while arriving.
Immersion Ag is for using heavy silver plating solution treatment circuit plate 1min ~ 10min.
Heavy silver plating solution is mixed to form by nitric acid, Silver Nitrate and ethylenediamine tetraacetic acid (EDTA).The mass concentration of nitric acid is 3.2%, and the mass concentration of Silver Nitrate is 5%, and the mass concentration of ethylenediamine tetraacetic acid (EDTA) is 10%.
The concrete operations of Immersion Ag are as follows:
Build bath amount: 81.8% pure water
10% ethylenediamine tetraacetic acid (EDTA)
3.2% HNO
3concentrated nitric acid (chemical pure)
5% Silver Nitrate
Immersion Ag is that the final surface metalation of printed circuit board (PCB) is processed, and is mainly that copper surface is soaked and put the thin silver of one deck.
Service temperature: 43 ℃ ~ 54 ℃ optimum values: 50 ℃
Controlled concentration: silver content 1 ~ 2g/L optimum value: 1.5g/L
Ni compound 0.02 ~ 0.04M optimum value: 0.03M
Acid content 0.4 ~ 0.6N optimum value: 0.5N
Copper content <3000mg/L
Supplement and add: silver content increases 0.1g/L and adds silver nitrate solution 3.3mL/L
The every increase of Ni compound 0.001M adds ethylenediamine tetraacetic acid (EDTA) 3.3mL/L
The every increase of acid content 0.01N adds HNO3 0.63mL/L
Stir: stirring rod and liquid recycle pump (5-7 groove/hour), unavailable pneumatic blending.
Strainer: use the PP filter core of 20 μ m, more change during groove with tank liquor.
The tank liquor life-span: reach five times and join groove chemical feeding quantity when copper content arrives silver nitrate solution that 3000mg/L or silver-plating bath add, or used while reaching six months, give more groove when arbitrary condition arrives.
Sort circuit plate surface treatment method is by adopting comparatively cheap silver to replace gold, and with respect to the process of surface treatment of traditional employing chemical nickel plating gold process, cost is lower.
After S70 completes, also comprise the step of washing, wash and be: first at room temperature use deionized water cleaning circuit plate 1min ~ 2min twice, then at 48 ℃ ~ 52 ℃ with deionized water cleaning circuit plate 1min ~ 2min.
Sort circuit plate chemical nickel plating gold process adopts multistep washing operation, and the effect of washing is to avoid liquid medicine above to enter into liquid medicine tank below, pollutes liquid medicine, and the washing effect of the design's each several part is fine.The present invention has increased activation procedure, and in activation procedure, has used palladium activator, and the copper ion concentration rising solving in the lump in activation tank liquor is too fast, and bridge formation plating, single-point reveal the problems such as copper or negative and positive aberration.And the operation of washing also differs widely, minute washing, hot water (50 ℃) is washed and deionization washing, thereby has guaranteed the weldability of wiring board.
It is below specific embodiment part.
Embodiment 1
With the thick FR-4 substrate of 1.0mm, finish boring, heavy copper, circuit, electroplates, and green oil, after chemical nickel plating, is handled as follows, and obtains the circuit card sample of chemical sinking nickel silver.
Heavy silver-colored preimpregnation: at the temperature of 35 ℃, the circuit card that completes chemical nickel plating is put in the solution of heavy silver-colored preimpregnation, floods 2 minutes, contain 1.6% nitric acid, 5% ethylenediamine tetraacetic acid (EDTA) in heavy silver-colored preimpregnation solution.
Chemical silvering: at the temperature of 50 ℃, the circuit card that completes heavy silver-colored preimpregnation is put in Immersion Ag solution, floods 2 minutes, contain 3.2% nitric acid in Immersion Ag solution, 5% Silver Nitrate, 10% ethylenediamine tetraacetic acid (EDTA).
Washing: through the circuit card sample of chemical silvering, at room temperature, with deionized water washing 1.5 minutes, wash 2 times.With the deionized water washing of 50 ℃, water Xian 1.5 minutes, washes 1 time again.
Dry: the circuit card sample of the chemical sinking nickel silver after washing, at the temperature of 60 ℃ with hot blast blow 3 minutes air-dry.
Detect the reliability of sample under varying environment
Testing method: with reference to IPC-TM-650 2.6.6 and KY-QMS-SIP-QA-06.
Testing tool: constant temperature and humidity instrument MHU-150L.
Test condition: temperature: 80 ℃, humidity: 90%, 96 hour.
Result after sample test:
1, variable color: no
2, wrinkling: no
3, plate bursting: no
4, bubble: no
5, white point: no
6, de-S/M: no
7, fracture: no
8, layering: no
Judge: accept.
Embodiment 2
With the thick FR-4 substrate of 1.0mm, finish boring, heavy copper, circuit, electroplates, and green oil, after chemical nickel plating, is handled as follows, and obtains the circuit card sample of chemical sinking nickel silver.
Heavy silver-colored preimpregnation: at the temperature of 38 ℃, the circuit card that completes chemical nickel plating is put in the solution of heavy silver-colored preimpregnation, floods 2 minutes, contain 1.6% nitric acid, 5% ethylenediamine tetraacetic acid (EDTA) in heavy silver-colored preimpregnation solution.
Chemical silvering: at the temperature of 51 ℃, the circuit card that completes heavy silver-colored preimpregnation is put in Immersion Ag solution, floods 2 minutes, contain 3.2% nitric acid in Immersion Ag solution, 5% Silver Nitrate, 10% ethylenediamine tetraacetic acid (EDTA).
Washing: through the circuit card sample of chemical silvering, at room temperature, with deionized water washing 1.5 minutes, wash 2 times.With the deionized water washing of 48 ℃, water Xian 1.5 minutes, washes 1 time again.
Dry: the circuit card sample of the chemical sinking nickel silver after washing, at the temperature of 62 ℃ with hot blast blow 3 minutes air-dry.
Detect the upper tin ability of sample.
Testing method: with reference to IPC-TM-650 2.4.12/14 and KY-QMS-SIP-QA-06.
Testing tool: tin stove, thermometer.
Test condition: tin furnace temperature: 255 ℃ ~ 265 ℃, the soldering time: 5Sec.
Test result:
1, variable color: no
2, wrinkling: no
3, plate bursting: no
4, bubble: no
5, white point: no
6, de-S/M: no
7, fracture: no
8, layering: no
Judge: accept.
Embodiment 3
With the thick FR-4 substrate of 1.0mm, finish boring, heavy copper, circuit, electroplates, and green oil, after chemical nickel plating, is handled as follows, and obtains the circuit card sample of chemical sinking nickel silver.
Heavy silver-colored preimpregnation: at the temperature of 36 ℃, the circuit card that completes chemical nickel plating is put in the solution of heavy silver-colored preimpregnation, floods 2 minutes, contain 1.6% nitric acid, 5% ethylenediamine tetraacetic acid (EDTA) in heavy silver-colored preimpregnation solution.
Chemical silvering: at the temperature of 51 ℃, the circuit card that completes heavy silver-colored preimpregnation is put in Immersion Ag solution, floods 2 minutes, contain 3.2% nitric acid in Immersion Ag solution, 5% Silver Nitrate, 10% ethylenediamine tetraacetic acid (EDTA).
Washing: through the circuit card sample of chemical silvering, at room temperature, with deionized water washing 1.5 minutes, wash 2 times.With the deionized water washing of 50 ℃, water Xian 1.5 minutes, washes 1 time again.
Dry: the circuit card sample of the chemical sinking nickel silver after washing, at the temperature of 60 ℃ with hot blast blow 3 minutes air-dry.
Sample is carried out to nation's location survey examination.
Testing method: IPC-TM-650 2.4.18.The location survey test-run a machine TS-P64 of nation
Test result: two end points are without disengaging, and intermediate point pulling force 7.0-8.0CN, meets nation and determine test request.
Above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (20)
1. a circuit board surface treatment process, is characterized in that, comprises the steps:
Step 1, at 35 ℃ ~ 45 ℃ with acid deoiling liquid treatment circuit plate;
Step 2, the circuit card obtaining with micro-etching solution treatment step one at 25 ℃ ~ 35 ℃;
Step 3, the circuit card obtaining with acid solution treatment step two at 45 ℃ ~ 55 ℃;
Step 4, the circuit card at room temperature obtaining with presoak treatment step three are then processed the circuit card of preimpregnation at 25 ℃ ~ 31 ℃ with activation solution;
Step 5, the circuit card at room temperature obtaining with rear immersion liquid treatment step four;
Step 6, the circuit card at 80 ℃ ~ 84 ℃, step 5 being obtained carry out chemical nickel plating; And
Step 7, the circuit card obtaining with heavy silver-colored presoak treatment step six at 32 ℃ ~ 43 ℃, then carry out Immersion Ag at 43 ℃ ~ 54 ℃ circuit cards that preimpregnation silver is crossed, and obtains the circuit card after surface treatment.
2. circuit board surface treatment process as claimed in claim 1, is characterized in that, in step 1, described acid deoiling liquid is that volume fraction is 8% ~ 12% sulfuric acid, and the time that adopts described acid deoiling liquid to process described circuit card is 4min ~ 6min.
3. circuit board surface treatment process as claimed in claim 1, it is characterized in that, after step 1, also comprise the step of washing, described washing is first at 48 ℃ ~ 52 ℃, circuit card to be washed to 1min ~ 2min, then at room temperature circuit card is washed to 1min ~ 2min twice.
4. circuit board surface treatment process as claimed in claim 1, it is characterized in that, in step 2, described micro-etching solution comprises Sodium Persulfate, sulfuric acid and soluble copper salt, the concentration of Sodium Persulfate is 60g/L ~ 100g/L, the massfraction of sulfuric acid is 1% ~ 3%, and the concentration of soluble copper salt is 5g/L ~ 20g/L;
The time that adopts described micro-etching solution to process described circuit card is 1min ~ 2min.
5. circuit board surface treatment process as claimed in claim 1, is characterized in that, also comprises the step of washing after step 2, and described washing is at room temperature washing 1min ~ 2min twice to circuit card.
6. circuit board surface treatment process as claimed in claim 1, is characterized in that, in step 3, and the sulphuric acid soln that described acid solution is 20mL/L ~ 40mL/L, adopting the time of acid solution treatment circuit plate is 1min ~ 2min.
7. circuit board surface treatment process as claimed in claim 1, is characterized in that, also comprises the step of washing after step 3, and described washing is at room temperature using twice of deionized water cleaning circuit plate 1min ~ 2min.
8. circuit board surface treatment process as claimed in claim 1, is characterized in that, in step 4, and the sulphuric acid soln that described presoak is 4mL/L ~ 6mL/L, the time of presoak treatment circuit plate is 1min ~ 2min.
9. circuit board surface treatment process as claimed in claim 1, it is characterized in that, in step 4, described activation solution is that palladium content is the palladium activation solution of 8ppm ~ 15ppm, the acidity of described activation solution is 0.25N ~ 0.35N, and the time that adopts described activation solution to process the circuit card of preimpregnation is 1min ~ 2min.
10. circuit board surface treatment process as claimed in claim 1, is characterized in that, also comprises the step of washing after step 4, and described washing is at room temperature using twice of deionized water cleaning circuit plate 1min ~ 2min.
11. circuit board surface treatment processs as claimed in claim 1, is characterized in that, in step 5, and the sulphuric acid soln that described rear immersion liquid is 4mL/L ~ 6mL/L, the time that adopts described rear immersion liquid treatment circuit plate is 1min ~ 2min.
12. circuit board surface treatment processs as claimed in claim 1, is characterized in that, also comprise the step of washing after step 5, and described washing is at room temperature using twice of deionized water cleaning circuit plate 1min ~ 2min.
13. circuit board surface treatment processs as claimed in claim 1, is characterized in that, in step 6, described chemical nickel plating is for using nickel-phosphor bath treatment circuit plate 17min ~ 22min.
14. circuit board surface treatment processs as claimed in claim 13, it is characterized in that, in step 6, in described nickel-phosphor bath, nickel content is 4.4g/L ~ 5g/L, described nickel-phosphor bath comprises that mass concentration is the sodium hypophosphite that 75% single nickel salt and mass concentration are 15%, and the pH of described nickel-phosphor bath is 4.3 ~ 4.7.
15. circuit board surface treatment processs as claimed in claim 1, it is characterized in that, after step 6, also comprise the step of washing, described washing, for first at room temperature using deionized water cleaning circuit plate 1min ~ 2min twice, is then used deionized water cleaning circuit plate 1min ~ 2min at 48 ℃ ~ 52 ℃.
16. circuit board surface treatment processs as claimed in claim 1, is characterized in that, in step 7, described heavy silver-colored presoak comprises nitric acid and ethylenediamine tetraacetic acid (EDTA), and the mass concentration of nitric acid is 1.6%, and the mass concentration of ethylenediamine tetraacetic acid (EDTA) is 5%;
The time that adopts described heavy silver-colored presoak to process described circuit card is 1min ~ 3min.
17. circuit board surface treatment processs as claimed in claim 1, is characterized in that, in step 7, described Immersion Ag is for using heavy silver plating solution treatment circuit plate 1min ~ 10min.
18. circuit board surface treatment processs as claimed in claim 17, it is characterized in that, described heavy silver plating solution comprises nitric acid, Silver Nitrate and ethylenediamine tetraacetic acid (EDTA), and the mass concentration of nitric acid is 3.2%, the mass concentration of Silver Nitrate is 5%, and the mass concentration of ethylenediamine tetraacetic acid (EDTA) is 10%.
19. circuit board surface treatment processs as claimed in claim 1, it is characterized in that, after step 7, also comprise the step of washing, described washing, for first at room temperature using deionized water cleaning circuit plate 1min ~ 2min twice, is then used deionized water cleaning circuit plate 1min ~ 2min at 48 ℃ ~ 52 ℃.
20. circuit board surface treatment processs as claimed in claim 1, is characterized in that, after step 7, also comprise and reclaim silver-colored operation.
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Effective date of registration: 20181122 Address after: 516008 Xiangshui River Industrial Zone, Daya Bay Economic and Technological Development Zone, Huizhou City, Guangdong Province Patentee after: Jianye Technology Electronics (Huizhou) Co., Ltd. Address before: Hong Kong New Territories, Shatin, Baishijiao, Hong Kong Science Park, 8 West Science and Technology Avenue, Shanghu Tower, 6/F, Room 607 Patentee before: Build industry (Huizhou) circuit version Co., Ltd |
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