CN106559958B - A method of promoting heavy copper cash production capacity - Google Patents
A method of promoting heavy copper cash production capacity Download PDFInfo
- Publication number
- CN106559958B CN106559958B CN201611028260.5A CN201611028260A CN106559958B CN 106559958 B CN106559958 B CN 106559958B CN 201611028260 A CN201611028260 A CN 201611028260A CN 106559958 B CN106559958 B CN 106559958B
- Authority
- CN
- China
- Prior art keywords
- copper
- dual platen
- slot
- layer board
- production line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 67
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 67
- 239000010949 copper Substances 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 62
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 60
- 230000001737 promoting effect Effects 0.000 title claims abstract description 7
- 230000009977 dual effect Effects 0.000 claims abstract description 50
- 239000003292 glue Substances 0.000 claims abstract description 29
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
Abstract
In view of the above-mentioned problems, the present invention, according to doubling plate and multiple-plate heavy process for copper feature, design one kind can fast implement multi-layer board and the heavy Copper fabrication of doubling plate mutually turns, the method for promoting heavy copper cash production capacity, including:Adjust dual platen on production line it is heavy+process of copper, dual platen is entered into the rinsing bowl after plate first object slot is set as being located at bulk slot, is entered back into except glue groove is handled, glue groove is removed at this time and only opens a target position and be processed；And by dual platen sink copper stop, then carry out multi-layer board sink copper and by multi-layer board sink copper stop, then carry out dual platen sink copper specific implementation method.It is not required to that whole production line reel to stop line, the of short duration time out merely with processing apparatus is the adjustment completed into plate first object slot and target position, realizes quick mutually the turning of dual platen and the heavy Copper fabrication of multi-layer board.
Description
Technical field
Process for copper is sunk the present invention relates to wiring board, and in particular to a method of promoting heavy copper cash production capacity.
Background technology
In the heavy process for copper of assist side, dual platen is generally not required to carry out bulk and removing glue, and be directly entered clean tank into
Row processing, and multi-layer board needs first to carry out bulk and removing glue, then clean tank processing is carried out, subsequent process is essentially identical,
And multi-layer board sinks in process for copper, except need to usually open three target position in glue groove.Since multi-layer board and dual platen are typically using same
A set of production equipment carries out heavy copper, therefore in specific production, often carries out multi-layer board and doubling plate sinks mutually the turning of Copper fabrication
The heavy Copper fabrication of doubling plate is converted to multiple-plate heavy Copper fabrication or reverse conversion by technique.Traditional skill needs of mutually changing a job
Reel and stop line, on production line processing apparatus and except glue groove target position etc. is adjusted, expend a large amount of working hours, material and the energy,
Influence the production capacity of production line.
Invention content
In view of the above-mentioned problems, the present invention is according to doubling plate and multiple-plate heavy process for copper feature, design one kind can be quick
Realize that multi-layer board and the heavy Copper fabrication of doubling plate mutually turn, the method for promoting heavy copper cash production capacity, including:
1）The process for adjusting the heavy copper of dual platen on production line sets positioned at bulk the plate first object slot that enters of dual platen to
Rinsing bowl after slot, then dual platen is made to enter except glue groove is handled so that the heavy copper of multi-layer board and dual platen sink copper in bulk slot
About subsequent process step is consistent；And except glue groove opens a target position；
2）When need by dual platen sink copper stop, then carry out multi-layer board sink copper when；
Multi-layer board input is located in the rinsing bowl after bulk slot, and each process equipment on production line is changed by continuously running
For single operating, that is, stop the continuous transport of wiring board between processing apparatus, each process equipment is continuing to complete wiring board in equipment
Processing after, into halted state；
After each process equipment is suspended on production line, the multi-layer board tune that will be now placed in the rinsing bowl after bulk slot
To bulk slot；And it opens and removes the unopened two air target positions of glue groove；
Each process equipment on production line is controlled again to be changed to sink the process of copper according to multi-layer board by single operating to carry out
It continuously runs.
3）When need by multi-layer board sink copper stop, then carry out dual platen sink copper when；
First dual platen is put into bulk from upper two air targets in production line upper plate position when two air targets are all reached except glue groove
In slot, and equipment is changed to single operating by continuously running；
After each process equipment is suspended on production line, the dual platen being now placed in bulk slot is transferred to positioned at bulk
In rinsing bowl after slot, and close the target position of two air targets except glue groove；
Control again each process equipment on production line by single operating be changed to according to dual platen sink copper process it is continuous
Operating.
Preferably, stop when needing dual platen sinking copper, then carry out multi-layer board sink copper when, each process equipment on production line
By it is single operating be changed to after continuously running, when moving to clean tank in the air target position opened except glue groove, upper plate position simultaneously on
Two frame dual platens, air target position is filled up.
The present invention is not required to whole production line reel to stop line, only by sinking the adjustment of process for copper, and profit to dual platen
It is the adjustment for entering plate first object slot and remove glue groove target position for completing heavy copper process with the of short duration time out of processing apparatus, it is real
Quick mutually the turning of existing dual platen and the heavy Copper fabrication of multi-layer board.
Specific implementation mode
It is better understood from the present invention for ease of those skilled in the art, is carried out further with reference to specific embodiment
It is bright.
When it is implemented, the process for adjusting the heavy copper of dual platen on production line, enters the setting of plate first object slot by dual platen
For the rinsing bowl after bulk slot, then dual platen is made to enter except glue groove is handled, except glue groove one target position of opening, removing glue is complete
Subsequent heavy Copper fabrication is carried out at the processes such as cleaning are followed by entered.
When need by dual platen sink copper stop, then carry out multi-layer board sink copper when；Stopping puts into production dual platen in line,
Start to put into production multi-layer board in line, the heavy copper process due to still pressing dual platen at this time carries out, the multilayer put at this time
The plate first object slot that enters of plate is the rinsing bowl after bulk slot；It is simultaneously stopped the continuous transport of wiring board between processing apparatus,
Each process equipment is set to continue to complete in equipment after the processing of wiring board, into halted state；Each process equipment is equal on production line
After pause, the multi-layer board being now placed in the rinsing bowl after bulk slot is adjusted in bulk slot, and is opened except glue groove does not open
Two air target positions, target position quantity open at this time is the target position quantity needed for the processing of multi-layer board removing glue so that subsequently enters life
The multi-layer board of producing line can have enough target position to carry out removing glue processing；Since the multi-layer board for the line that puts into production at this time has been located in multilayer
The first object slot of the heavy copper process of plate, i.e., bulk slot, and there are enough target position to carry out heavy Copper fabrication, it can control on production line
Each process equipment is changed to sink the process of copper by multi-layer board to continuously run by single operating, that is, starts circuit between processing apparatus
The continuous transport of plate.Due on adjustment production line dual platen sink copper process after, multi-layer board and dual platen bulk slot it
Process afterwards is consistent, thus heavy copper production line by multi-layer board sink the process of copper be processed when, be still located at life
Dual platen in producing line is respectively positioned in bulk slot about subsequent process equipment, therefore can be normally carried out processing, realizes the continuous of production,
To improve the production capacity of production line.
To make full use of processing apparatus, each process equipment can be changed to after continuously running by single operating in the production line, when
When the air target position opened except glue groove moves to clean tank, in upper plate position while upper two framves dual platen, air target position is filled up.
When need by multi-layer board sink copper stop, then carry out dual platen sink copper when；First from upper two skies in production line upper plate position
Target is then followed by dual platen, and after two air targets are all reached except glue groove, dual platen is by the multi-layer board executed on production line at this time
The process of heavy copper, have been enter into it is multiple-plate enter plate first object slot, i.e., bulk slot, and the rinsing bowl after bulk slot has also been vacated；
Equipment is changed to single operating by continuously running at this time；After each process equipment is suspended on production line, it will be now placed in swollen
Dual platen in loose slot is transferred to the first object slot of the heavy copper process of dual platen, that is, is located at the rinsing bowl after bulk slot, and close this
When positioned at two air targets except glue groove target position, at this time remove glue groove in only there are one target position open, and dual platen also be located at it is two-sided
Plate sinks the first object slot of copper process, and production line can sink the process of copper according to dual platen immediately and be continuously run at this time；
And due to adjustment production line on dual platen sink copper process after, multi-layer board and dual platen are in bulk slot about subsequent process step
Unanimously, and the multi-layer board in production line is all located in bulk slot about subsequent process equipment at this time, can be normally carried out processing, realize life
That produces is continuous, to improve the production capacity of production line.
Above-described embodiment is only specific embodiments of the present invention, the description thereof is more specific and detailed, but can not therefore and
It is interpreted as the limitation to the scope of the claims of the present invention.It should be pointed out that for those of ordinary skill in the art, not taking off
Under the premise of present inventive concept, various modifications and improvements can be made, these obvious alternative forms belong to this
The protection domain of invention.
Claims (2)
1. a kind of method promoting heavy copper cash production capacity, including：
1）The process for adjusting the heavy copper of dual platen on production line sets after being located at bulk slot the plate first object slot that enters of dual platen to
Rinsing bowl, then dual platen is made to enter except glue groove is handled so that multi-layer board sinks the heavy copper of copper and dual platen after bulk slot
Process it is consistent；And except glue groove opens a target position；
2）When need by dual platen sink copper stop, then carry out multi-layer board sink copper when；
Multi-layer board input is located in the rinsing bowl after bulk slot, and each process equipment on production line is changed to list by continuously running
One operating, that is, stop the continuous transport of wiring board between processing apparatus, each process equipment continue to complete wiring board in equipment plus
After work, into halted state；
After each process equipment is suspended on production line, the multi-layer board being now placed in the rinsing bowl after bulk slot is adjusted to swollen
Loose slot；And it opens and removes the unopened two air target positions of glue groove；
Control again each process equipment on production line by single operating be changed to according to multi-layer board sink copper process carry out it is continuous
Operating；
3）When need by multi-layer board sink copper stop, then carry out dual platen sink copper when；
First dual platen is put into bulk slot when two air targets are all reached except glue groove from upper two air targets in production line upper plate position,
And equipment is changed to single operating by continuously running；The continuous transport of wiring board, each process equipment exist i.e. between stopping processing apparatus
It continues to complete in equipment after the processing of wiring board, into halted state；
After each process equipment is suspended on production line, the dual platen being now placed in bulk slot is transferred to after bulk slot
Rinsing bowl in, and close except glue groove two air targets target position；
Each process equipment on production line is controlled again to be changed to sink the process of copper according to dual platen by single operating to continuously run.
2. according to the method for promoting heavy copper cash production capacity described in claim 1, it is characterised in that：Stop when needing dual platen sinking copper
Only, then carry out multi-layer board sink copper when, each process equipment is changed to by single operating after continuously running on production line, when except glue groove
When open air target position moves to clean tank, in upper plate position while upper two framves dual platen, air target position is filled up.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611028260.5A CN106559958B (en) | 2016-11-22 | 2016-11-22 | A method of promoting heavy copper cash production capacity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611028260.5A CN106559958B (en) | 2016-11-22 | 2016-11-22 | A method of promoting heavy copper cash production capacity |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106559958A CN106559958A (en) | 2017-04-05 |
| CN106559958B true CN106559958B (en) | 2018-11-09 |
Family
ID=58444313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611028260.5A Expired - Fee Related CN106559958B (en) | 2016-11-22 | 2016-11-22 | A method of promoting heavy copper cash production capacity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106559958B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101896039A (en) * | 2010-07-28 | 2010-11-24 | 广东东硕科技有限公司 | Post treatment neutralizer for removing smears from alkaline permanganate in printed circuit board manufacture |
| CN102647858A (en) * | 2012-05-15 | 2012-08-22 | 金悦通电子（翁源）有限公司 | Processing method of printed circuit board (PCB) |
| CN104378930A (en) * | 2013-08-14 | 2015-02-25 | 四川海英电子科技有限公司 | Electric manufacturing method for two-sided copper deposition plate of PCB |
| CN105657976A (en) * | 2016-01-19 | 2016-06-08 | 深圳崇达多层线路板有限公司 | Manufacturing method of entire-board nickel gold plating stepped board |
| CN105813390A (en) * | 2016-05-27 | 2016-07-27 | 东莞联桥电子有限公司 | Adhesive removing process for high-TG printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4559936B2 (en) * | 2004-10-21 | 2010-10-13 | アルプス電気株式会社 | Electroless plating method and circuit forming method using this method |
-
2016
- 2016-11-22 CN CN201611028260.5A patent/CN106559958B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101896039A (en) * | 2010-07-28 | 2010-11-24 | 广东东硕科技有限公司 | Post treatment neutralizer for removing smears from alkaline permanganate in printed circuit board manufacture |
| CN102647858A (en) * | 2012-05-15 | 2012-08-22 | 金悦通电子（翁源）有限公司 | Processing method of printed circuit board (PCB) |
| CN104378930A (en) * | 2013-08-14 | 2015-02-25 | 四川海英电子科技有限公司 | Electric manufacturing method for two-sided copper deposition plate of PCB |
| CN105657976A (en) * | 2016-01-19 | 2016-06-08 | 深圳崇达多层线路板有限公司 | Manufacturing method of entire-board nickel gold plating stepped board |
| CN105813390A (en) * | 2016-05-27 | 2016-07-27 | 东莞联桥电子有限公司 | Adhesive removing process for high-TG printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106559958A (en) | 2017-04-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105338746B (en) | A kind of circuit panel forming method of no positioning hole | |
| DE69133535T2 (en) | Working method for vacuum treatment device | |
| CN102271469B (en) | Method for processing rigid-flexible printed circuit board (PCB) | |
| CN206474331U (en) | Automatic glue-spraying equipment with robot | |
| CN103753865A (en) | Flip box automatic production line and production method thereof | |
| CN106559958B (en) | A method of promoting heavy copper cash production capacity | |
| CN106183391B (en) | A kind of energy-efficient vamp printing equipment | |
| CN102407656A (en) | Full-automatic pad printing device | |
| CN205221982U (en) | Automatic plate turnover of PCB board | |
| CN202425212U (en) | Board blockage prevention and alarm system for PCB (Printed Circuit Board) horizontal production line | |
| CN205738252U (en) | A kind of paper towel box overlay film packing device | |
| CN206100615U (en) | Makeup structure of multilayer pressfitting circuit board | |
| CN109366257A (en) | A kind of quartzite slate polishing production line | |
| CN105472890B (en) | The production method and process units of bonding sheet | |
| CN108323022A (en) | One kind being applied to PCB manufactures concatenation single flow exposure device and technological process | |
| CN205199838U (en) | High accuracy is from moving point system that glues based on robotechnology | |
| CN202985931U (en) | Full-automation production line of injection molded products | |
| CN204054290U (en) | The efficient plaster tablet forming machine of automatic detection material block thickness | |
| CN202968667U (en) | Crest tin plating device capable of automatic tin plating on components | |
| CN206835469U (en) | A kind of pcb sprays tin streamline | |
| CN204811720U (en) | With filling cake apparatus for producing | |
| CN106032034B (en) | A kind of full-automatic stone brick production line and its production technology | |
| CN204751438U (en) | Automatic panel turnover machine of continuous type | |
| CN204602551U (en) | A kind of Copper Foil glue spreading apparatus | |
| CN103200770A (en) | Asymmetric pressing control slab warping structure of multilayer printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181109 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |