CN103052270A - Method for plating copper and tin on metal circuit board through pattern plating - Google Patents
Method for plating copper and tin on metal circuit board through pattern plating Download PDFInfo
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- CN103052270A CN103052270A CN2012105267999A CN201210526799A CN103052270A CN 103052270 A CN103052270 A CN 103052270A CN 2012105267999 A CN2012105267999 A CN 2012105267999A CN 201210526799 A CN201210526799 A CN 201210526799A CN 103052270 A CN103052270 A CN 103052270A
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Abstract
The invention discloses a method for plating copper and tin on a metal circuit board through pattern plating. The method comprises steps of workpiece pre-treating, micro-etching, primary cleaning, copper plating, secondary cleaning, tin plating and third cleaning. According to the method, after copper is plated, workpieces are cleaned, and tin plating operation is performed immediately; a tin welding plane is smoother through tin plating operation, so that the uniformity of a product is improved, and batch treatment can be performed; a tin plating process is adopted, so that the conventional process concept is changed, the technical bias that a PCB (Printed Circuit Board) cannot be plated with tin is eliminated, the performance of the product is improved, and the production efficiency of the product is increased; a degreasing agent of CS-4-A or CS-4-B series is taken as a mailing component in a degreasing process, so that the decomposing speed of grease can be increased, and the efficiency is further increased; and a bronzing agent is added into a copper plating solution, so that the copper surface of the product is smooth and complete and has high flatness, and the quality of the product is improved.
Description
Technical field
The present invention relates to a kind of printing method of PCB circuit board, specifically refer to the method for metallic circuit pattern plating copper tin.
Background technology
Printed circuit board claims again printed circuit board (PCB), is the supplier of electronic devices and components electrical connection.The history in existing more than 100 year of its development; Its design mainly is layout design; The major advantage that adopts circuit board is the mistake that greatly reduces wiring and assembling, has improved the gentle productive labor rate of Automated water.Pcb board has following three kinds of main classified types: single sided board (Single-SidedBoards), and on the most basic PCB, part concentrates on wherein one side, and wire then concentrates on the another side.Because wire only appears at wherein one side, so this PCB is called single sided board (Single-sided).Because single sided board has many strict restrictions (because only have one side, can not intersect between wiring and must be around path alone) in designed lines, so only have early stage circuit just to use the plank of this class; Double sided board (Double-SidedBoards), there is wiring on the two sides of sort circuit plate, but will use the wire on two sides, must have suitable circuit to connect between the two sides." bridge " between sort circuit is called guide hole (via), guide hole is on PCB, be full of or the duck eye of coated with metal, it can be connected with the wire on two sides, because the Area Ratio single sided board of double sided board is large one times, double sided board has solved in the single sided board because the staggered difficult point of wiring, and it is more suitable for being used in than on the more complicated circuit of single sided board; Multi-layer sheet (Multi-LayerBoards) is in order to increase the area that can connect up, multi-layer sheet has been used more single or two-sided wiring plates, with a two-sided internal layer of doing, two single faces are made outer or two two-sided internal layers of doing, two single faces are made outer field printed substrate, by navigation system and adhesive material alternately together and the printed substrate that interconnects by designing requirement of conductive pattern just become four layers, six-layer printed circuit board, be also referred to as multilayer printed circuit board, which floor independently wiring layer is the number of plies of plank do not represented, can add under special circumstances dead level and control thickness of slab, usually the number of plies all is even number, and comprise outermost two-layer, most motherboard all is 4 to 8 layers structure, but technical theory can be accomplished nearly 100 layers pcb board, large-scale supercomputer uses the motherboard of suitable multilayer mostly, but because this class computer can replace with the cluster of many common computer, super multi-layer sheet has not been used gradually, because layer all closely combination of each among the PCB, generally find out not too easily actual number, if but examine motherboard, still can find out.Present circuit board all only has the copper facing operation basically, and the tin material welding on it is got on, and the characteristics of the method are whole inefficiencies, and the consistency of product is poor, and qualification rate is low.
Summary of the invention
The object of the present invention is to provide the method for metallic circuit pattern plating copper tin, solve in the present printing circuit board process, low, the poor problem of product homogeneity of the production efficiency that the welding of tin material brings reaches the purpose of improving the quality of products with speed of production.
Purpose of the present invention is achieved through the following technical solutions:
The method of metallic circuit pattern plating copper tin may further comprise the steps:
(A) workpiece preliminary treatment: workpiece is placed on the platen, then oil removing, and carry out twice washing;
(B) microetch: utilize micro-corrosion liquid that surface of the work is slightly corroded;
(C) clean for the first time: micro-corrosion liquid is cleaned up;
(D) copper facing: in copper-plated cylinder, workpiece is carried out the copper facing operation;
(E) clean for the second time: copper plating bath is cleaned up;
(F) zinc-plated: as in zinc-plated cylinder, workpiece to be carried out zinc-plated operation;
(G) clean for the third time: tin plating electrolyte is cleaned up.
In the method for the present invention, utilize electroplating technology, after copper facing is finished, workpiece is cleaned, then carry out immediately zinc-plated operation, because zinc-plated operation is so that the plane of scolding tin is Paint Gloss, improved the homogeneity of product, and can batch process, the manual welding technique with respect to traditional has improved its production efficiency greatly; Owing to adopted tin plating technique, changed traditional operation idea, overcome the technology prejudice that pcb board can not be zinc-plated, improved performance and the production efficiency of product.
Specifically, in the described step (A), the oil removing process is workpiece to be placed on soak 3～8min in the degreasing fluid, and wherein every liter of degreasing fluid contains 90～110ml concentrated sulfuric acid, 45～55ml degreaser.Adopt the degreaser of CS-4-A or CS-4-B series, can accelerate the speed that grease decomposes.
Specifically, in the described step (B), the microetch process is workpiece to be placed on soak 1～2min in the micro-corrosion liquid, and wherein every liter of micro-corrosion liquid contains 40～60 sodium peroxydisulfates, 30～50ml concentrated sulfuric acid, CU
2+Content less than 15g/L.
Specifically, in the described step (C), at first workpiece is carried out twice washing, then be placed on and carry out pickling 3～8min in the acid solution one time, wherein acid solution is that to contain percentage by volume be 6～8% sulfuric acid.
Specifically, in the described step (D), the copper facing process is workpiece to be placed on utilize copper plating bath to carry out in the copper-plated cylinder, keeps 22～28 ℃ of temperature, 35～55min, wherein CuSO in every liter of copper plating bath
45H
2The content of O is 60～100g, and the content of the concentrated sulfuric acid is 90～110ml, and the content of bronzing agent is 5～7ml.By in copper plating bath, adding the bronzing agent, can be so that the copper smooth surface of product, complete, evenness is high, is conducive to improve the quality of product.
Specifically, in the described step (F), zinc-plated process is workpiece to be placed on utilize tin plating electrolyte to carry out in the zinc-plated cylinder, keeps 18～26 ℃ of temperature, 15～18min, wherein SnSO in every liter of tin plating electrolyte
4Content be 25～40g, the content of the concentrated sulfuric acid is 110～140ml.
The present invention compared with prior art has following advantage and beneficial effect:
The method of 1 metallic circuit pattern plating copper tin of the present invention, utilize electroplating technology, after copper facing is finished, workpiece is cleaned, then carry out immediately zinc-plated operation, because zinc-plated operation is so that the plane of scolding tin is Paint Gloss, improved the homogeneity of product, and can batch process, the manual welding technique with respect to traditional has improved its production efficiency greatly; Owing to adopted tin plating technique, changed traditional operation idea, overcome the technology prejudice that pcb board can not be zinc-plated, improved performance and the production efficiency of product;
The method of 2 metallic circuit pattern plating copper tin of the present invention adopts the degreaser of CS-4-A or CS-4-B series as the mailing composition in the oil removing process, can accelerate the speed that grease decomposes, and further raises the efficiency;
The method of 3 metallic circuit pattern plating copper tin of the present invention, by in copper plating bath, adding the bronzing agent, can be so that the copper smooth surface of product, complete, evenness is high, is conducive to improve the quality of product.
Embodiment
The present invention is described in further detail below in conjunction with embodiment, but embodiments of the present invention are not limited to this.
Embodiment
The preliminary treatment of this (A) workpiece: workpiece is placed on the platen, and then oil removing is placed on workpiece and soaks 3～8min in the degreasing fluid, and wherein every liter of degreasing fluid contains 90～110ml concentrated sulfuric acid, 45～55ml degreaser.Adopt the degreaser of CS-4-A or CS-4-B series, can accelerate the speed that grease decomposes, and carry out twice washing, the degreaser of surface of the work is removed fully;
(B) microetch: workpiece is placed on soaks 1～2min in the micro-corrosion liquid, wherein every liter of micro-corrosion liquid contains 40～60 sodium peroxydisulfates, 30～50ml concentrated sulfuric acid, CU
2+Content less than 15g/L, work as CU
2+Content change micro-corrosion liquid greater than 25g/L the time;
(C) clean for the first time: at first workpiece is carried out twice washing, the micro-corrosion liquid that it is surperficial is removed fully, then is placed on to carry out pickling 3～8min in the acid solution one time, and wherein acid solution is that to contain percentage by volume be 6～8% sulfuric acid;
(D) copper facing: the copper facing process is workpiece to be placed on utilize copper plating bath to carry out in the copper-plated cylinder, keeps 22～28 ℃ of temperature, 35～55min, wherein CuSO in every liter of copper plating bath
45H
2The content of O is 60～100g, and the content of the concentrated sulfuric acid is 90～110ml, and the content of bronzing agent is 5～7ml, and wherein to select 25 ℃ be the control point for temperature control, CuSO in every liter of copper plating bath
45H
2The content of O take the content of 75g, the concentrated sulfuric acid as 100ml, the bronzing agent is best preparation control point as 5ml, current density is 1.6-2.0A/d ㎡, the electric tin time is 15-18 minute, current density is 0.7-1.2A/d ㎡, hole copper standard 18-25um; The care and maintenance of electrolytic copper cylinder liquid medicine: do during production and carry out 100 ㎡ and consume and reinforcedly to add with analyzing, accomplish repeatedly to add on a small quantity, see " the plating line material consumes table "; Uninterrupted air stirring and cotton core circulating filtration when the copper cylinder is produced; A carbon core filters per month, and filtration time is 8～12h; Clean per month anode, titanium basket, copper ball, must be with low current electrolytic treatments 8～12h after clean; Add new copper ball at every turn, must use rare H
2SO
4The water soaking certain hour adds after cleaning with clear water again, adds and will drag cylinder to process processing time 8～12h; Clean anode rod every day during production, guarantees that conductive effect is good;
(E) clean for the second time: matting is cleaned identical with the first time, at first workpiece is carried out twice washing, the surface of the work copper plating bath is cleaned up, then be placed on and carry out pickling 3～8min in the acid solution one time, wherein acid solution is that to contain percentage by volume be 6～8% sulfuric acid;
(F) zinc-plated: zinc-plated process is workpiece to be placed on utilize tin plating electrolyte to carry out in the zinc-plated cylinder, keeps 18～26 ℃ of temperature, 15～18min, wherein SnSO in every liter of tin plating electrolyte
4Content be 25～40g, the content of the concentrated sulfuric acid is 110～140ml, wherein temperature take 22 ℃ as the control point, the content of SnSO4 is 30g in every liter of tin plating electrolyte, the content of the concentrated sulfuric acid is that 125ml is best preparation control point; Done the reinforced and analysis interpolation of 100 ㎡ consumption during production, accomplished repeatedly to add on a small quantity, sheet tin of cleaning in two months and anode, must clean anode rod every day, guarantees that conductive effect is good; Change weekly and once filter cotton core, do weekly one time low current electrolytic treatments, processing time 8～12h simultaneously; Fell a tin cylinder in 4～6 months, the inverted engine method is: the filter pump cotton core is renewed, with filter pump the liquid medicine of tin cylinder is extracted in the cylinder for subsequent use and clarifies, again sheet tin, anode are put forward to clean up, thoroughly clean the original production cylinder, then change the filter pump cotton core, again the liquid medicine of cylinder for subsequent use is drawn back the original production cylinder, add the good liquid medicine content of liquid level adjustment to processing range, use again low current electrolytic treatments 8～12h, according to one's analysis adjustment good after just the batch production;
(G) clean for the third time: workpiece is carried out twice washing, tin plating electrolyte is cleaned up.
Should be noted that in the production process: reinforced and maintenance must have been worn protective articles in the production, avoids causing unexpected injury; Necessarily instead during operation wear clean Rubber gloves, upper and lower plates must be handled with care, avoids wiping the card face; The try one's best during clamping plate wide copper bound of clamping plate is to avoid folder on the line; Check at any time whether cable the end of a thread and anode rod be loosening, and whether electric current is normal; Do not use the folder rod of encapsulate serious damage; If any the plate of quality abnormal, to group leader, supervisor's feedback, determine again processing method immediately, can not act on one's own; When having a power failure suddenly in the production process, powered-down immediately plays out being placed on wash clean in the water vat to the plate in the liquid medicine tank, plate is taken off inserted frame and put well, and pin asked group leader, supervisor's suggestion to determine processing method by technique in case of necessity after electricity came; Each liquid medicine tank is circulated throughout filter pump more during cotton core, must first powered-down switch and import and export switch after, can change; Clamping plate must clip during production, can not fall cylinder, in order to avoid there is quality problem to occur; During upper plate, check carefully that copper face has oxidation, finger-marks, dirt etc. to process bad thing, returns in the time of can't processing and does the district.
The above only is preferred embodiment of the present invention, is not the present invention is done any pro forma restriction, and any simple modification, the equivalent variations on every foundation technical spirit of the present invention above embodiment done all fall within protection scope of the present invention.
Claims (6)
1. the method for metallic circuit pattern plating copper tin is characterized in that, may further comprise the steps:
(A) workpiece preliminary treatment: workpiece is placed on the platen, then oil removing, and carry out twice washing;
(B) microetch: utilize micro-corrosion liquid that surface of the work is slightly corroded;
(C) clean for the first time: micro-corrosion liquid is cleaned up;
(D) copper facing: in copper-plated cylinder, workpiece is carried out the copper facing operation;
(E) clean for the second time: copper plating bath is cleaned up;
(F) zinc-plated: as in zinc-plated cylinder, workpiece to be carried out zinc-plated operation;
(G) clean for the third time: tin plating electrolyte is cleaned up.
2. the method for metallic circuit pattern plating copper tin according to claim 1, it is characterized in that, in the described step (A), the oil removing process is workpiece to be placed on soak 3～8min in the degreasing fluid, and wherein every liter of degreasing fluid contains 90～110ml concentrated sulfuric acid, 45～55ml degreaser.
3. the method for metallic circuit pattern plating copper tin according to claim 1, it is characterized in that: in the described step (B), the microetch process is workpiece to be placed on soak 1～2min in the micro-corrosion liquid, and wherein every liter of micro-corrosion liquid contains 40～60 sodium peroxydisulfates, 30～50ml concentrated sulfuric acid, CU
2+Content less than 15g/L.
4. the method for metallic circuit pattern plating copper tin according to claim 1, it is characterized in that: in the described step (C), at first workpiece is carried out twice washing, then be placed on and carry out pickling 3～8min in the acid solution one time, wherein acid solution is that to contain percentage by volume be 6～8% sulfuric acid.
5. the method for the described metallic circuit pattern plating copper of any one tin in 4 according to claim 1, it is characterized in that: in the described step (D), the copper facing process is workpiece to be placed on utilize copper plating bath to carry out in the copper-plated cylinder, keep 22～28 ℃ of temperature, 35～55min, wherein CuSO in every liter of copper plating bath
45H
2The content of O is 60～100g, and the content of the concentrated sulfuric acid is 90～110ml, and the content of bronzing agent is 5～7ml.
6. the method for metallic circuit pattern plating copper tin according to claim 5, it is characterized in that: in the described step (F), zinc-plated process is workpiece to be placed on utilize tin plating electrolyte to carry out in the zinc-plated cylinder, keeps 18～26 ℃ of temperature, 15～18min, wherein SnSO in every liter of tin plating electrolyte
4Content be 25～40g, the content of the concentrated sulfuric acid is 110～140ml.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105267999A CN103052270A (en) | 2012-12-10 | 2012-12-10 | Method for plating copper and tin on metal circuit board through pattern plating |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105267999A CN103052270A (en) | 2012-12-10 | 2012-12-10 | Method for plating copper and tin on metal circuit board through pattern plating |
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| CN103052270A true CN103052270A (en) | 2013-04-17 |
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| CN2012105267999A Pending CN103052270A (en) | 2012-12-10 | 2012-12-10 | Method for plating copper and tin on metal circuit board through pattern plating |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104195610A (en) * | 2014-09-16 | 2014-12-10 | 四川海英电子科技有限公司 | Tin-plating method for high-order and high density circuit board |
| CN104213170A (en) * | 2014-09-16 | 2014-12-17 | 四川海英电子科技有限公司 | Copper plating method for high-order high-density circuit board |
| CN104780710A (en) * | 2014-01-15 | 2015-07-15 | 深圳崇达多层线路板有限公司 | PCB (Printed circuit board) and manufacturing method thereof |
| CN107059105A (en) * | 2017-01-13 | 2017-08-18 | 昆山福烨电子有限公司 | A kind of PCB electroplating printed circuit boards carbon handling process |
| CN107435158A (en) * | 2016-05-30 | 2017-12-05 | 建业（惠州）电路版有限公司 | Can simultaneous copper facing, the circuit board electroplating production line and electro-plating method of tin |
| CN107435163A (en) * | 2017-07-31 | 2017-12-05 | 木林森股份有限公司 | Horizontal electroplating production line of circuit board |
| CN107567207A (en) * | 2017-08-28 | 2018-01-09 | 东莞市卡小二智能卡有限公司 | The manufacture craft of Contact Type Ic Card PCB support plates |
| CN108286063A (en) * | 2018-02-09 | 2018-07-17 | 深圳市赛孚科技有限公司 | A kind of PCB pattern electro-plating method |
| CN114096070A (en) * | 2021-11-17 | 2022-02-25 | 博罗县宏瑞兴电子有限公司 | PCB electroplating etching solution and etching process thereof |
| CN114980562A (en) * | 2022-06-28 | 2022-08-30 | 珠海中京电子电路有限公司 | Manufacturing method of pure tin plated plate, PCB and terminal equipment |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104780710A (en) * | 2014-01-15 | 2015-07-15 | 深圳崇达多层线路板有限公司 | PCB (Printed circuit board) and manufacturing method thereof |
| CN104780710B (en) * | 2014-01-15 | 2018-06-15 | 深圳崇达多层线路板有限公司 | Printed wiring board and preparation method thereof |
| CN104195610A (en) * | 2014-09-16 | 2014-12-10 | 四川海英电子科技有限公司 | Tin-plating method for high-order and high density circuit board |
| CN104213170A (en) * | 2014-09-16 | 2014-12-17 | 四川海英电子科技有限公司 | Copper plating method for high-order high-density circuit board |
| CN107435158A (en) * | 2016-05-30 | 2017-12-05 | 建业（惠州）电路版有限公司 | Can simultaneous copper facing, the circuit board electroplating production line and electro-plating method of tin |
| CN107059105A (en) * | 2017-01-13 | 2017-08-18 | 昆山福烨电子有限公司 | A kind of PCB electroplating printed circuit boards carbon handling process |
| CN107435163A (en) * | 2017-07-31 | 2017-12-05 | 木林森股份有限公司 | Horizontal electroplating production line of circuit board |
| CN107567207A (en) * | 2017-08-28 | 2018-01-09 | 东莞市卡小二智能卡有限公司 | The manufacture craft of Contact Type Ic Card PCB support plates |
| CN108286063A (en) * | 2018-02-09 | 2018-07-17 | 深圳市赛孚科技有限公司 | A kind of PCB pattern electro-plating method |
| CN114096070A (en) * | 2021-11-17 | 2022-02-25 | 博罗县宏瑞兴电子有限公司 | PCB electroplating etching solution and etching process thereof |
| CN114980562A (en) * | 2022-06-28 | 2022-08-30 | 珠海中京电子电路有限公司 | Manufacturing method of pure tin plated plate, PCB and terminal equipment |
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Application publication date: 20130417 |