CN102469689B - Manufacturing process for PCB (Printed Circuit Board) step board - Google Patents

Abstract

The invention, suitable for the field of PCB (Printed Circuit Board) manufacture, provides a manufacturing process for a PCB step board. When a bottom layer is manufactured, a nickel gold layer is electroplated on a circuit pattern in advance as an anticorrosion protection layer; in subsequent processes such as copper plating, electroplating and the like, when a corrosive solution leaks into a groove from a plug-in hole, as the electroplated nickel gold layer on the circuit pattern is used as the anticorrosion protection layer, the corrosive solution cannot damage the circuit pattern in the groove; as a copper plate does not need to be laminated at the bottom of the bottom layer of the PCB step board, the bottom of the bottom layer is flat, and the phenomenon of poor microwave signal transmission caused by the height difference due to the lamination of the copper plate at the bottom of the bottom layer is avoided; and the phenomenon of blocking off the plug-in hole by using an anticorrosion material is avoided as well.

Description

PCB stepped plate manufacturing process

Technical field

The invention belongs to PCB and make the field, relate in particular to a kind of PCB stepped plate manufacturing process.

Background technology

As shown in Figure 1, along with the diversified requirement to PCB circuit board function, a kind of novel PCB circuit board-PCB stepped plate 9 has appearred in this area, this PCB stepped plate 9 is formed by top layer 91 and bottom 92 pressings, top layer 91 is formed by a plurality of copper-clad plate 911 laminations, offer the groove 912 of perforation on top layer 91, groove 912 sidewalls are non-metallic; Bottom 92 is one to offer the copper-clad plate 924 of the insert hole 921 of perforation, is equipped with line pattern 922 in bottom 92 upper and lower surfaces and insert hole 922, is coated with nickel-gold layer 923 on line pattern 922, and nickel-gold layer 923 is for the protection of line pattern 922.

When satisfying the circuit requirement, also at groove 912 bottom cablings and by insert hole 921 placing components, therefore, can significantly reduce the usage space of circuit board due to this PCB stepped plate 9, satisfy the multi-functional requirement to circuit board.Simultaneously, this PCB stepped plate 9 bottoms are smooth, and facilitating welding component and to connect up, and available technology adopting copper sheet or other anticorrosive laminated structures invest the scheme of circuit board bottom and can't satisfy this requirement.Therefore, the advantage of PCB stepped plate 9 is more and more obvious, and the scope of application is more and more extensive.

At present, in the manufacture process of PCB stepped plate 9, because nickel-gold layer 923 is that in the end a procedure is electroplated onto on line pattern 922, therefore, in technique before electroplating nickel-gold layer 923 (as techniques such as heavy copper, plating), have corrosive solution and leak groove 912 from insert hole 921, cause the line pattern 922 in groove 912 damaged, and then cause PCB stepped plate 9 to cancel.

Also there is the anticorrosive of employing to block insert hole 921 in prior art, can prevent that like this liquid medicine from entering in groove 912, but after blocking, this particular matter can't take out, forever stay in insert hole 921, cause insert hole 921 can't be used for placing components, also just can't realize the multi-functional purpose of PCB stepped plate.

Prior art also has by at copper coin of bottom 92 bottom lamination, but this copper coin can't remove after lamination, cause bottom 92 bottoms not due difference in height to occur, it is bad that this difference in height causes installing rear microwave signal transmission.

Summary of the invention

The object of the invention is to overcome above-mentioned the deficiencies in the prior art, provide a kind of line pattern that need not block in insert hole, groove can be by solution corrosion, the smooth PCB stepped plate in bottom.

The present invention is achieved in that a kind of PCB stepped plate manufacturing process, comprises the steps:

(1) make top layer: a plurality of the first copper-clad plates are set, printed wire figure in described each first copper-clad plate, with described a plurality of the first superimposed laminations of copper-clad plate, offer the groove of perforation in described a plurality of the first copper-clad plates after lamination, described recess sidewall is non-metallic;

(2) make bottom: one second copper-clad plate is set, offer the insert hole of perforation in described the second copper-clad plate, equal printed wire figure in described the second copper-clad plate upper and lower surface and described insert hole, electroplate a corrosion-resistant protective layer on described line pattern, then electroplate a copper plate on described corrosion-resistant protective layer;

(3) with described top layer and bottom lamination, make described groove and insert hole contraposition and be communicated with, then sink copper, electroplating technology, remove at last the copper plate of described bottom outside by outer alkaline etching technique, expose described corrosion-resistant protective layer.

Preferably, described corrosion-resistant protective layer is nickel-gold layer.

The present invention is when making bottom, in advance power on the plating nickel gold layer as corrosion-resistant protective layer at line pattern, in the techniques such as follow-up heavy copper, plating, when corrosive solution leaks in groove from insert hole, owing to the plating nickel gold floor being arranged as corrosion-resistant protective layer on the figure of road, therefore, corrosive solution can't damage the line pattern in groove; Without the lamination copper coin, the bottom of bottom is very smooth, has avoided causing the bad phenomenon of microwave signal transmission because of the bottom of bottom because difference in height appears in the lamination copper coin due to the bottom of the bottom of PCB stepped plate; The present invention has also avoided adopting anticorrosive to block the phenomenon of insert hole.

Description of drawings

Fig. 1 is the structure chart of the PCB stepped plate that provides of prior art;

Fig. 2 is the structure chart of the top layer that provides of the embodiment of the present invention;

Fig. 3 is the structure chart of the bottom that provides of the embodiment of the present invention;

Fig. 4 is the structure chart after top layer in Fig. 2 and the bottom in Fig. 3 carry out lamination;

Fig. 5 is the structure chart of a copper plate in nickel-gold layer re-plating on bottom in Fig. 4.

Embodiment

In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.

The manufacturing process of a kind of PCB stepped plate 1 that provides as the figure embodiment of the present invention is as follows:

(1) make top layer 11: as shown in Figure 2, a plurality of the first copper-clad plates 111 are set, printed wire figure (not shown) in each first copper-clad plate 111, with a plurality of the first copper-clad plate 111 laminations, offer the groove 112 of perforation in a plurality of the first copper-clad plates 111 after lamination, groove 112 sidewalls are non-metallic;

(2) make bottom 12: as shown in Figure 3 and Figure 4, one second copper-clad plate 124 is set, offer the insert hole 121 of perforation in the second copper-clad plate 124, at the second copper-clad plate 124 upper and lower surfaces and the interior equal printed wire figure 122 of insert hole 121, electroplate a corrosion-resistant protective layer 123 on line pattern 122, then electroplating a copper plate 125 (namely thickening copper-plating technique on corrosion-resistant protective layer 123) on corrosion-resistant protective layer 123;

(3) as shown in Figure 4 and Figure 5; with top layer 11 and bottom 12 laminations; groove 112 and insert hole 121 are communicated with; then sink copper, electroplating technology; remove at last the copper plate 125 of bottom 12 outsides by outer alkaline etching technique; expose corrosion-resistant protective layer 123, namely made PCB stepped plate 1 of the present invention.

Preferably, the preferred nickel-gold layer 123 of corrosion-resistant protective layer 123 is namely electroplated a nickel-gold layer 123 by chemical nickel and gold technique on line pattern 122, and nickel-gold layer 123 has very strong antiacid caustic corrosion effect, is widely used in the PCB industry.

Should be appreciated that to also have other old process in PCB stepped plate 1 manufacture process, because these old process are all the basic procedures that those skilled in the art know, repeat no more here.

The manufacturing process of PCB stepped plate 1 of the present invention and the difference of prior art are:

1, the present invention is when making bottom 12; in advance power on plating nickel gold layer 123 as corrosion-resistant protective layer at line pattern 122; nickel-gold layer 123 is for the protection of line pattern 122; line pattern 122 is in the techniques such as follow-up heavy copper, plating; corrosive solution leaks in groove 112 also not from insert hole 121 can damaged line figure 122, and this technological process effect is fully different from existing plating nickel gold technique.And existing technique can't solve in the techniques such as heavy copper, plating corrosive solution and leaks into groove from insert hole and cause the impaired problem of line pattern in groove.

2, the present invention is before heavy process for copper; re-plating one copper plate 125 on the nickel-gold layer 123 on the line pattern 122 of bottom 12; the effect of this technological process is that the line pattern 122 that protection plates nickel-gold layer 123 can be by any solution institute corrosion failure before outer alkaline etching, and guarantees not pollute tank liquor.

3, the present invention increases outer alkaline etching technique after heavy copper, electroplating technology; the flow process of outer alkaline etching and chemical nickel and gold, to thicken copper-plated technique corresponding; final stage in 1 processing of PCB stepped plate adds outer alkaline etching technique; its objective is that the copper plate 125 in order to protect nickel-gold layer 123 etches away to expose nickel-gold layer 123, has so just made PCB stepped plate 1.And existing outer alkaline etching technique is in conventional PCB stepped plate flow process after electroplating, with the line pattern etching out.

Compared with prior art, PCB stepped plate 1 of the present invention has following technique effect:

(1) the present invention is when making bottom 12; in advance power on plating nickel gold layer 123 as corrosion-resistant protective layer at line pattern 122; in the techniques such as follow-up heavy copper, plating; when corrosive solution leaks in groove 112 from insert hole 121; owing to plating nickel gold layer 123 being arranged as corrosion-resistant protective layer on line pattern 122; therefore, corrosive solution can't damage the line pattern 122 in groove 112.

(2) the present invention has avoided the employing anticorrosive to block insert hole 121, and insert hole 121 can be used for placing components, and like this, PCB stepped plate 1 can integrated more multi-part, has realized that PCB stepped plate 1 has multi-functional purpose.

(3) the present invention has also avoided having guaranteed that at copper coin of the bottom of bottom 12 lamination the bottom of bottom 12 is smooth, has solved the problem that occurs difference in height in the bottom of bottom 12, thereby makes PCB stepped plate 1 can normally carry out the microwave signal transmission.

The above is only preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., within all should being included in protection scope of the present invention.

Claims (2)

1. a PCB stepped plate manufacturing process, is characterized in that comprising the steps:

(1) make top layer: a plurality of the first copper-clad plates are set, printed wire figure in described each first copper-clad plate, with described a plurality of the first superimposed laminations of copper-clad plate, offer the groove of perforation in described a plurality of the first copper-clad plates after lamination, described recess sidewall is non-metallic;

(2) make bottom: one second copper-clad plate is set, offer the insert hole of perforation in described the second copper-clad plate, equal printed wire figure in described the second copper-clad plate upper and lower surface and described insert hole, electroplate a corrosion-resistant protective layer on described line pattern, then electroplate a copper plate on described corrosion-resistant protective layer;

(3) with described top layer and bottom lamination, make described groove and insert hole contraposition and be communicated with, then sink copper, electroplating technology, remove at last the copper plate of described bottom outside by outer alkaline etching technique, expose described corrosion-resistant protective layer.

2. PCB stepped plate manufacturing process as claimed in claim 1, it is characterized in that: described corrosion-resistant protective layer is nickel-gold layer.

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