CN103343366A - Electrotinning method for printed circuit board - Google Patents
Electrotinning method for printed circuit board Download PDFInfo
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- CN103343366A CN103343366A CN 201310311922 CN201310311922A CN103343366A CN 103343366 A CN103343366 A CN 103343366A CN 201310311922 CN201310311922 CN 201310311922 CN 201310311922 A CN201310311922 A CN 201310311922A CN 103343366 A CN103343366 A CN 103343366A
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Abstract
The invention discloses an electrotinning method for a printed circuit board. The electrotinning method comprises the following steps of: (1) tinning pre-processing process; (2) tinning process and (3) tinning post-processing process, wherein the tinning process in the step (2) comprises the following steps of: (J) primary tinning: carrying out tinning on a workpiece in a tinning cylinder by utilizing tinning liquid, so as to obtain a second workpiece, wherein the soaking time of the workpiece in the tinning liquid is 1-3 seconds; and (K) secondary tinning: carrying out the secondary tinning on the second workpiece in the tinning cylinder by utilizing the tinning liquid. According to the electrotinning method disclosed by the invention, the tinning process comprises two tinning steps; by utilizing the tinning method, when the costs of the time and raw materials are scarcely increased, the liquid medicine wettability is increased, the bubbles are reduced, the tinning is uniform in holes, a copper-free state in tinning bubble holes is avoided, and the quality requirements of electroplating can be well met.
Description
Technical field
The present invention relates to wiring board and make the field, especially relate to a kind of method of electric tinning of printed circuit board.
Background technology
Along with the electronic technology develop rapidly, no matter be ordnance or communication wiring board, wiring board is all towards the miniaturization integrated development.And wiring board requires the aperture to diminish gradually day by day, and the number of plies and thickness of slab improve constantly, thereby causes the active demand day by day of high aspect ratio technology.Comparatively ripe about the test of PCB deep hole copper facing aspect and the measure taked in the industry, but the research to zinc-plated etch resistant properties is few, in the course of processing of PCB deep hole, zinc-plated etch resistant properties is faced with acid test, how effectively to improve the coating resistance to corrosion, no copper is scrapped ratio in the reduction hole, raising plate quality is the pressing issues that the PCB industry need solve.
Existing P CB plate tin plating technique flow process is: upper plate → oil removing → washing → microetch → washing → pickling → copper facing → washing → preimpregnation → zinc-plated → washing → lower plate.In zinc-plated process, easily hide bubble in the deep hole, except the equipment circulation, liquid medicine mainly relies on concussion and waves and enters in the hole in the hole, and just definite substantially when equipment is installed because waving intensity and frequency, general being difficult to changes.Once crossing under the situation about drawing, often owing to have air in the pcb board hole, the liquid medicine wetting property is not enough, causes zinc-plated badly, poor plating defectives such as no copper occur in the hole in, accepts standard or client's standard above IPC, has a strong impact on quality problem.
Summary of the invention
Based on this, be necessary the defective at above-mentioned prior art, a kind of method of electric tinning of printed circuit board is provided.
For achieving the above object, the present invention has taked following technical scheme:
A kind of method of electric tinning of printed circuit board may further comprise the steps:
(1) zinc-plated pretreatment procedure; (2) zinc-plated operation; (3) zinc-plated postprocessing working procedures, the zinc-plated operation of described step (2) comprises that (J) is once zinc-plated: it is zinc-plated to utilize tin plating electrolyte to carry out work package in zinc-plated cylinder, obtains second work package, and the soak time of wherein said work package in tin plating electrolyte is 1-3s; And (K) secondary is zinc-plated: it is zinc-plated second work package to be utilized tin plating electrolyte to carry out secondary in zinc-plated cylinder.
Described (1) zinc-plated pretreatment procedure mainly comprises:
(A) upper plate: work package is placed on the platen;
(B) oil removing: with degreaser work package is carried out oil removing, this step makes the PCB surface clean.Degreaser mainly is made up of acidic substance and anion surfactant, concentration span of control 80-120ml/l, and temperature is 35-45 ℃;
(C) washing: this step is used for and will removes fully through the degreaser on the work package surface that step (B) is handled;
(D) microetch: with micro-etching solution the work package surface of handling through step (C) is slightly corroded, remove the PCB oxide on surface and make surface coarsening simultaneously; Every liter of described micro-etching solution main component comprises: Na
2S
2O
8: 40-60g, 98wt%H
2SO
4: 10-30ml, Cu
2+: 3-15g, above-mentioned Cu
2+Derive from CuSO
45H
2O; Temperature is 28-32 ℃, and the microetch rate-controlling is at 15-35mg/cm
2
(E) washing: this step is used for and will removes fully through the micro-etching solution on the work package surface that step (D) is handled;
(F) pickling adopts acid solution that the work package of handling through step (E) is cleaned; In every liter of described acid solution, 98wt%H
2SO
4Content is 80-120ml;
(G) copper facing: in the copper facing cylinder, will utilize copper plating solution to carry out copper facing through the work package that step (F) is handled; Contain in every liter of copper plating solution: CuSO
4: 60-90g, 98wt%H
2SO
4: 108.7ml-130.4ml, Cl
-: 40-70mg, above-mentioned Cl
-Derive from hydrochloric acid; Copper plating additive content 0.5-1.5ml, copper facing auxiliary content 6-18ml, described copper plating additive main component is methyl alcohol, polyethers, organic salt; Described copper facing auxiliary main component is poly-methyl glycol.Processing parameter is: 21～30 ℃ of temperature;
(H) washing: this step is used for and will removes fully through the copper plating bath on the work package surface that step (G) is handled;
(I) preimpregnation, this step are used for activation PCB copper face, and the soup when preventing pre-treatment is simultaneously brought in the zinc-plated major trough and polluted tin plating electrolyte, 98wt%H in every liter of presoak
2SO
4Content is 80-120ml.
Described zinc-plated operation comprises:
(J) once zinc-plated: it is zinc-plated to utilize tin plating electrolyte to carry out through the work package that step (I) is handled in zinc-plated cylinder, obtains second work package, and the soak time of wherein said work package in tin plating electrolyte is 1-3s; And (K) secondary is zinc-plated: it is zinc-plated second work package to be utilized tin plating electrolyte to carry out secondary in zinc-plated cylinder.
Described zinc-plated postprocessing working procedures comprises:
(L) washing: this step is used for the tin plating electrolyte on the work package surface after the zinc-plated processing of secondary is removed fully;
(M) lower plate.
Therein among some embodiment, the component concentration in every liter of described tin plating electrolyte is: SnSO
4: 35-45g, 98wt%H
2SO
4: 80-120ml, pure tin additive A: 15-25ml, pure tin additive B: 30-50ml; Pure tin additive A main component is methyl alcohol and a little tea phenol, and pure tin additive B main component is alkyl aryl polyether alcohol.
Therein among some embodiment, the component concentration in every liter of described tin plating electrolyte is: SnSO
4: 40g, 98wt%H
2SO
4: 100ml, pure tin additive A: 20ml, pure tin additive B: 40ml.
Among some embodiment, the processing parameter in the zinc-plated operation of described step (2) is therein: temperature 19-25 ℃, be preferably 22 ℃.
The present invention is with respect to the advantage of prior art:
The method of electric tinning of above-mentioned printed circuit board provided by the invention, it is at all plates, especially foraminous plate, it has increased once zinc-plated process on zinc-plated existing technology basis, in electroplating the overhead traveling crane working procedure the tin cylinder do twice zinc-plated, plate promotes rapidly after entering soup when once zinc-plated, and then enters that to carry out secondary zinc-plated.Be intended to drive away bubble in the hole when once zinc-plated, secondary is zinc-plated be intended in PCB surface and the hole zinc-plated.By tin plating technique flow process of the present invention, can increase the liquid medicine wetting property, reduce bubble, make and zinc-plated evenly avoid the interior no copper of zinc-plated crafters in the hole in, satisfy the electroplating quality requirement better.
In the application's method of electric tinning, every consumption 200 ± 40AH electric weight need add pure tin additive A 100 ± 20ml, needs to add pure tin additive B 50 ± 10ml.Electric weight is the product of electric current and electroplating time, and electric current is current density and is subjected to the long-pending product of surfacing.The setting of above-mentioned current density is to calculate according to the size of producing plate, thickness of coating to draw different production plate data differences; The above-mentioned second time electroplating tin time draws different production plate data differences according to the size of producing plate and thickness of coating calculating.In actual production, when electroplating 1-3s to the consumption of additive seldom.Equally, used time 1-3s is with respect to the time loss of second time electroplating tin when once electroplating, and increase is very little.
Though the zinc-plated operation in the method for electric tinning that the present invention takes comprise twice zinc-plated, but it is very little that the zinc-plated liquid measure of its consumption and spent time and the existing tin plating method that only comprises once zinc-plated process are compared increasing amount, substantially do not have under the prerequisite of increase in spent time and material cost, method of electric tinning of the present invention has remedied the interior bubble of aperture plate hole and has driven defect of insufficient, liquid medicine exchange capacity in the reinforced hole, can avoid no copper defective in the hole, and improve zinc-plated etch resistant properties greatly.
Description of drawings
Fig. 1 is the design sketch of the embodiment of the invention 1;
Fig. 2 is the design sketch of Comparative Examples 1 of the present invention;
Fig. 3 is the design sketch of the embodiment of the invention 2;
Fig. 4 is the design sketch of the embodiment of the invention 3.
Embodiment
The present invention is further illustrated below in conjunction with embodiment and accompanying drawing.
PCB wiring board plate is GA-170-LL among the embodiment, and the minimum-value aperture is 0.20+0.08/-0.1mil, and in the following example, the various raw materials of use all are the conventional raw materials that uses in the art technology, and electroplating auxiliary and additive etc. also is conventional raw material.Below be the supply of raw material merchant who uses in the present embodiment:
The pure tin additive A, trade name is: RONASTAN EC pure tin additive A, available from ROHM AND HAAS electronic material (Dongguan) company limited;
The pure tin additive B, trade name is: RONASTAN EC pure tin additive B, available from ROHM AND HAAS electronic material (Dongguan) company limited;
Copper plating additive, trade name is: COPPER GLEAM2001 copper additives, available from ROHM AND HAAS electronic material (Dongguan) company limited;
The copper facing auxiliary, trade name is: COPPER GLEAM2001 copper auxiliary, available from ROHM AND HAAS electronic material (Dongguan) company limited;
Micro-etching solution, trade name: micro-etching solution YH-36, available from Guangzhou Nansha Huazhuo Chemical Co., Ltd.;
Degreaser, trade name: electroplate degreaser, available from the modest chemical industry technology of Zhongshan city horse company limited;
Embodiment 1
A kind of method of electric tinning of printed circuit board, it comprises following steps:
(1) zinc-plated pretreatment procedure:
(A) upper plate: work package is placed on the platen;
(B) oil removing: with degreaser work package is carried out oil removing, make the PCB surface clean, the concentration of degreaser is 100ml/l, and temperature is 40 ℃;
(C) washing: will remove fully through the degreaser on the work package surface that step (B) is handled;
(D) microetch: with micro-etching solution the work package surface of handling through step (C) is slightly corroded, remove the PCB oxide on surface and make surface coarsening simultaneously, every liter of micro-etching solution main component comprises: Na
2S
2O
8Content 50g, 98wt%H
2SO
4Content 20ml, Cu
2+Content 9g(derives from CuSO
45H
2O), temperature is 30 ℃, and the microetch rate-controlling is at 25mg/cm
2
(E) washing: will remove fully through the micro-etching solution on the work package surface that step (D) is handled;
(F) pickling: adopt acid solution that the work package of handling through step (E) is cleaned, in every liter of described acid solution, 98wt%H
2SO
4Content is 100ml;
(G) copper facing: in the copper facing cylinder, will utilize copper plating solution to carry out copper facing through the work package that step (F) is handled; CuSO in every liter of copper plating solution
4Content is 75g, 98wt%H
2SO
4Content is 119.55ml, Cl
-Content is that 55mg(derives from hydrochloric acid), copper plating additive content 0.85ml, copper facing auxiliary content 10ml, temperature is 25 ℃; The plating condition is: current density is 15ASF(ampere/square feet), electroplating time 75min;
(H) washing: will remove fully through the copper plating bath on the work package surface that step (G) is handled;
(I) preimpregnation: this step is used for activation PCB copper face, and the soup when preventing pre-treatment is simultaneously brought in the zinc-plated major trough and polluted tin plating electrolyte, 98wt%H in every liter of presoak
2SO
4Content is 100ml;
(2) zinc-plated operation:
(J) once zinc-plated: it is zinc-plated to utilize tin plating electrolyte to carry out through the work package that step (I) is handled in zinc-plated cylinder, obtains second work package, the SnSO in every liter of tin plating electrolyte
4Content be 40g, 98wt%H
2SO
4Content be 100ml, the content of pure tin additive A is: 20ml, the content of pure tin additive B is: 40ml, 22 ℃ of temperature; The soak time of work package in tin plating electrolyte is 2s; Current density is 12ASF; Electroplating area: C/S is 0.528ft
2, S/S is 0.389ft
2
(K) secondary is zinc-plated: it is zinc-plated second work package to be utilized tin plating electrolyte to carry out secondary in zinc-plated cylinder, the SnSO in every liter of tin plating electrolyte
4Content be 40g, 98wt%H
2SO
4Content be 100ml, the content of pure tin additive A is: 20ml, the content of pure tin additive B is: 40ml, 22 ℃ of temperature; The soak time of second work package in tin plating electrolyte is 8min; Current density is 12ASF; Electroplating area: C/S is 0.528ft
2, S/S is 0.389ft
2
The zinc-plated process of above-mentioned secondary consumes altogether that the pure tin additive A is about 919.73ml in the tin plating electrolyte, and the pure tin additive B is about 459.86ml;
(3) zinc-plated postprocessing working procedures:
(L) washing: will remove fully through the tin plating electrolyte on the work package surface that step (K) is handled;
(M) lower plate.
In order to show the effect of present embodiment, after secondary was zinc-plated, sheet material to doing slicing treatment in its hole, obtained design sketch 1 through moving back tin.As shown in Figure 1, hole wall copper facing is complete as can be seen, does not have disconnected copper phenomenon.This result proves that to use present embodiment 1 method to carry out zinc-plated, no copper phenomenon in the hole can not occur, has improved zinc-plated etch resistant properties.
Comparative Examples 1 adopts existing PCB tin plating technique to carry out zinc-plated
Adopt existing P CB plate tin plating technique flow process, use identical plate GA-170-LL, the minimum-value aperture is 0.20+0.08/-0.1mil, the assessment effect.
Plate process following steps:
(1) zinc-plated pretreatment procedure:
(A) upper plate: work package is placed on the platen;
(B) oil removing: with degreaser work package is carried out oil removing, make the PCB surface clean, the concentration of degreaser is 100ml/l, and temperature is 40 ℃;
(C) washing: will remove fully through the degreaser on the work package surface that step (B) is handled;
(D) microetch: with micro-etching solution the work package surface of handling through step (C) is slightly corroded, remove the PCB oxide on surface and make surface coarsening simultaneously, every liter of micro-etching solution main component comprises: Na
2S
2O
8Content 50g, 98wt%H
2SO
4Content 20ml, Cu
2+Content 9g(derives from CuSO
45H
2O), temperature is 30 ℃, and the microetch rate-controlling is at 25mg/cm
2
(E) washing: will remove fully through the micro-etching solution on the work package surface that step (D) is handled;
(F) pickling: adopt acid solution that the work package of handling through step (E) is cleaned, in every liter of described acid solution, 98wt%H
2SO
4Content is 100ml;
(G) copper facing: in the copper facing cylinder, will utilize copper plating solution to carry out copper facing through the work package that step (F) is handled; CuSO in every liter of copper plating solution
4Content is 75g, 98wt%H
2SO
4Content is 119.55ml, Cl
-Content is that 55mg(derives from hydrochloric acid), copper plating additive content 0.85ml, copper facing auxiliary content 10ml, temperature is 25 ℃, the plating condition is: current density is 15ASF, electroplating time 75min;
(H) washing: will remove fully through the copper plating bath on the work package surface that step (G) is handled;
(I) preimpregnation: this step is used for activation PCB copper face, and the soup when preventing pre-treatment is simultaneously brought in the zinc-plated major trough and polluted tin plating electrolyte, 98wt%H in every liter of presoak
2SO
4Content is 100ml;
(2) zinc-plated operation:
(J) once zinc-plated: it is zinc-plated to utilize tin plating electrolyte to carry out through the work package that step (I) is handled in zinc-plated cylinder, the SnSO in every liter of tin plating electrolyte
4Content be 40g, 98wt%H
2SO
4Content be 100ml, the content of pure tin additive A is: 20ml, the content of pure tin additive B is: 40ml, 22 ℃ of temperature; The soak time of work package in tin plating electrolyte is 8min; Current density is 12ASF; Electroplating area: C/S is 0.528ft
2, S/S is 0.389ft
2
The pure tin additive A is about 916.67ml in the above-mentioned zinc-plated process consumption tin plating electrolyte, and the pure tin additive B is about 458.33ml;
(3) zinc-plated postprocessing working procedures:
(K) washing: will remove fully through the tin plating electrolyte on the work package surface that step (J) is handled;
(L) lower plate.
With the method for Comparative Examples 1 carry out zinc-plated after, sheet material to doing slicing treatment in its hole, obtains design sketch 2 through moving back tin.As shown in Figure 2, zinc-plated bad making produces the ring-type cavity in the hole, and its obvious characteristics is that the copper layer thickness in the hole is normal, and there is obvious etched vestige at the tomography edge.
Embodiment 2
A kind of method of electric tinning of printed circuit board, it comprises following steps:
(1) zinc-plated pretreatment procedure:
(A) upper plate: work package is placed on the platen;
(B) oil removing: with degreaser work package is carried out oil removing, make the PCB surface clean.The concentration of degreaser is 80ml/l, and temperature is 35 ℃;
(C) washing: will remove fully through the degreaser on the work package surface that step (B) is handled;
(D) microetch: with micro-etching solution the work package surface of handling through step (C) is slightly corroded, remove the PCB oxide on surface and make surface coarsening simultaneously, every liter of micro-etching solution main component comprises: Na
2S
2O
8Content 40g, 98wt%H
2SO
4Content is 10ml, Cu
2+Content 3g(derives from CuSO
45H
2O), temperature is 28 ℃, and the microetch rate-controlling is at 15mg/cm
2
(E) washing: the micro-etching solution through the work package surface that step (D) is handled is removed fully;
(F) pickling: adopt acid solution that the work package of handling through step (E) is cleaned, in every liter of acid solution, 98wt%H
2SO
4Content is 80ml;
(G) copper facing: in the copper facing cylinder, will utilize copper plating solution to carry out copper facing through the work package that step (F) is handled; CuSO in every liter of copper plating solution
4Content is 60g, 98wt%H
2SO
4Content is 108.7ml, Cl
-Content is that 40mg(derives from hydrochloric acid), copper plating additive content 0.5ml, copper facing auxiliary content 6ml, temperature is 21 ℃; The plating condition is: current density is 15ASF, electroplating time 75min;
(H) washing: will remove fully through the copper plating bath on the work package surface that step (G) is handled;
(I) preimpregnation: this step is used for activation PCB copper face, and the soup when preventing pre-treatment is simultaneously brought in the zinc-plated major trough and polluted tin plating electrolyte, 98wt%H in every liter of presoak
2SO
4Content is 80ml;
(2) zinc-plated operation:
(J) once zinc-plated: it is zinc-plated to utilize tin plating electrolyte to carry out through the work package that step (I) is handled in zinc-plated cylinder, obtains second work package, the SnSO in every liter of tin plating electrolyte
4Content be 35g, 98wt%H
2SO
4Content be 80ml, the content of pure tin additive A is: 15ml, the content of pure tin additive B is: 30ml, 19 ℃ of temperature; The soak time of work package in tin plating electrolyte is 1s; Current density is 12ASF; Electroplating area: C/S is 0.528ft
2, S/S is 0.389ft
2
(K) secondary is zinc-plated: it is zinc-plated second work package to be utilized tin plating electrolyte to carry out secondary in zinc-plated cylinder, and the content of the SnSO4 in every liter of tin plating electrolyte is 35g, 98wt%H
2SO
4Content be 80ml, the content of pure tin additive A is: 15ml, the content of pure tin additive B is: 30ml, 19 ℃ of temperature; The soak time of second work package in tin plating electrolyte is 8min; Current density is 12ASF; Electroplating area: C/S is 0.528ft
2, S/S is 0.389ft
2
The zinc-plated process of above-mentioned secondary consumes altogether that the pure tin additive A is about 918.20ml in the tin plating electrolyte, and the pure tin additive B is about 459.10ml;
(3) zinc-plated postprocessing working procedures:
(L) washing: will remove fully through the tin plating electrolyte on the work package surface that step (K) is handled;
(M) lower plate.
In order to show the effect of present embodiment 2, after secondary was zinc-plated, sheet material to doing slicing treatment in its hole, obtained Fig. 3 through moving back tin.As shown in Figure 3, hole wall copper facing is complete as can be seen, does not have disconnected copper phenomenon.This result proves that the method for using present embodiment 2 carries out zinc-platedly, no copper phenomenon in the hole can not occur, has improved zinc-plated etch resistant properties.
Embodiment 3
A kind of method of electric tinning of printed circuit board, it comprises following steps:
(1) zinc-plated pretreatment procedure:
(A) upper plate: work package is placed on the platen;
(B) oil removing: with degreaser work package is carried out oil removing, make the PCB surface clean, the concentration of degreaser is 120ml/l, and temperature is 45 ℃;
(C) washing: will remove fully through the degreaser on the work package surface that step (B) is handled;
(D) microetch: with micro-etching solution the work package surface of handling through step (C) is slightly corroded, remove the PCB oxide on surface and make surface coarsening simultaneously, every liter of micro-etching solution main component comprises: Na
2S
2O
8Content 60g, 98wt%H
2SO
4Content is 30ml, Cu
2+Content 15g(derives from CuSO
45H
2O), temperature is 32 ℃, and the microetch rate-controlling is at 35mg/cm
2
(E) washing: will remove fully through the micro-etching solution on the work package surface that step (D) is handled;
(F) pickling: adopt acid solution that the work package of handling through step (E) is cleaned, in every liter of acid solution, 98wt%H
2SO
4Content is 120ml;
(G) copper facing: in the copper facing cylinder, will utilize copper plating solution to carry out copper facing through the work package that step (F) is handled; CuSO in every liter of copper plating solution
4Content is 90g, 98wt%H
2SO
4Content is 130.4.ml, and Cl-content is that 70mg(derives from hydrochloric acid), copper plating additive content 1.5ml, copper facing auxiliary content 18ml, temperature is 30 ℃; The plating condition is: current density is 15ASF, electroplating time 75min;
(H) washing: will remove fully through the copper plating bath on the work package surface that step (G) is handled;
(I) preimpregnation: this step is used for activation PCB copper face, and the soup when preventing pre-treatment is simultaneously brought in the zinc-plated major trough and polluted tin plating electrolyte, 98wt%H in every liter of presoak
2SO
4Content is 120ml;
(2) zinc-plated operation:
(J) once zinc-plated: it is zinc-plated to utilize tin plating electrolyte to carry out through the work package that step (I) is handled in zinc-plated cylinder, obtains second work package, the SnSO in every liter of tin plating electrolyte
4Content is 45g, 98wt%H
2SO
4Content be 120ml, the content of pure tin additive A is 25ml, the content of pure tin additive B is 50ml, 25 ℃ of temperature; The soak time of work package in tin plating electrolyte is 3s; Current density is 12ASF; Electroplating area: C/S is 0.528ft
2, S/S is 0.389ft
2
(K) secondary is zinc-plated: it is zinc-plated second work package to be utilized tin plating electrolyte to carry out secondary in zinc-plated cylinder, the SnSO in every liter of tin plating electrolyte
4Content is 45g, 98wt%H
2SO
4Content be 120ml, the content of pure tin additive A is 25ml, the content of pure tin additive B is 50ml, 25 ℃ of temperature; The soak time of second work package in tin plating electrolyte is 8min; Current density is 12ASF; Electroplating area: C/S is 0.528ft
2, S/S is 0.389ft
2
The pure tin additive A is about 920.26ml in the above-mentioned zinc-plated process consumption tin plating electrolyte, and the pure tin additive B is about 460.13ml;
(3) zinc-plated postprocessing working procedures:
(L) washing: will remove fully through the tin plating electrolyte on the work package surface that step (K) is handled;
(M) lower plate.
In order to show the effect of present embodiment 3, after secondary was zinc-plated, sheet material to doing slicing treatment in its hole, obtained Fig. 4 through moving back tin.As shown in Figure 4, hole wall copper facing is complete as can be seen, does not have disconnected copper phenomenon.This result proves the method for using present embodiment 3, no copper phenomenon in the hole can not occur, has improved zinc-plated etch resistant properties.
Table 1 the embodiment of the present application and the zinc-plated process of Comparative Examples consume the contrast of tin plating electrolyte main component amount
| ? | Embodiment 2 | Embodiment 1 | Embodiment 3 | Comparative Examples 1 |
| Pure tin additive A consumption | 918.20ml | 919.73ml | 920.26ml | 916.67ml |
| Pure tin additive B consumption | 459.10ml | 459.86ml | 460.13ml | 458.33ml |
The elapsed time contrast of the zinc-plated process of table 2 the embodiment of the present application 1 and Comparative Examples 1 institute
| ? | Embodiment 1 | Comparative Examples 1 |
| Zinc-plated time once | 2s | 0 |
| The zinc-plated time of secondary | 8min | 8min |
| When zinc-plated operation is total | 8min2s | 8min |
From table 1,2 as can be seen, electroplating under the identical situation of area, though the zinc-plated operation of embodiment 1-3 comprise twice zinc-plated, but the final zinc-plated liquid measure that consumes and spent time and Comparative Examples 1 difference are very little, and according to Fig. 1-4 as can be seen, the copper facing of embodiment 1-3 hole wall is complete, does not have disconnected copper phenomenon; And zinc-plated bad the making of Comparative Examples 1 produces the ring-type cavity in the hole.Therefore method of electric tinning of the present invention can consume zinc-plated liquid measure and spent time compare with existing tin plating method do not have substantially increase situation under, improved zinc-plated etch resistant properties greatly, avoid no copper in the zinc-plated crafters, satisfy the electroplating quality requirement better.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (6)
1. the method for electric tinning of a printed circuit board may further comprise the steps:
(1) zinc-plated pretreatment procedure; (2) zinc-plated operation; (3) zinc-plated postprocessing working procedures, it is characterized in that, the zinc-plated operation of described step (2) comprises that (J) is once zinc-plated: it is zinc-plated to utilize tin plating electrolyte to carry out work package in zinc-plated cylinder, obtains second work package, and the soak time of wherein said work package in tin plating electrolyte is 1-3s; And (K) secondary is zinc-plated: it is zinc-plated second work package to be utilized tin plating electrolyte to carry out secondary in zinc-plated cylinder.
2. the method for electric tinning of a kind of printed circuit board as claimed in claim 1 is characterized in that, the component concentration in every liter of described tin plating electrolyte is: SnSO
4: 35-45g, 98wt%H
2SO
4: 80-120ml, pure tin additive A: 15-25ml, pure tin additive B: 30-50ml.
3. the method for electric tinning of a kind of printed circuit board as claimed in claim 2 is characterized in that, the component concentration in every liter of described tin plating electrolyte is: SnSO
4: 40g, 98wt%H
2SO
4: 100ml, pure tin additive A: 20ml, pure tin additive B: 40ml.
4. the method for electric tinning of a kind of printed circuit board as claimed in claim 1 is characterized in that, the processing parameter in the zinc-plated operation of described step (2) is: temperature 19-25 ℃.
5. as the method for electric tinning of each described a kind of printed circuit board of claim 1-4, it is characterized in that, comprise (G) copper facing operation in the zinc-plated pretreatment procedure of described step (1), contain in every liter of copper plating solution using in described (G) copper facing operation: CuSO
4: 60-90g, 98wt%H
2SO
4: 108.7ml-130.4ml, Cl
-: 40-70mg, copper plating additive: 0.5-1.5ml, copper facing auxiliary: 6-18ml.
6. the method for electric tinning of a kind of printed circuit board as claimed in claim 5 is characterized in that, the processing parameter in described (G) copper facing operation is: temperature 21-30 ℃.
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| CN 201310311922 CN103343366A (en) | 2013-07-23 | 2013-07-23 | Electrotinning method for printed circuit board |
| CN201410350192.9A CN104152962B (en) | 2013-07-23 | 2014-07-22 | The method of electric tinning of printed wiring board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201310311922 CN103343366A (en) | 2013-07-23 | 2013-07-23 | Electrotinning method for printed circuit board |
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|---|---|
| CN103343366A true CN103343366A (en) | 2013-10-09 |
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| CN 201310311922 Pending CN103343366A (en) | 2013-07-23 | 2013-07-23 | Electrotinning method for printed circuit board |
| CN201410350192.9A Active CN104152962B (en) | 2013-07-23 | 2014-07-22 | The method of electric tinning of printed wiring board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104195610A (en) * | 2014-09-16 | 2014-12-10 | 四川海英电子科技有限公司 | Tin-plating method for high-order and high density circuit board |
| CN105088289A (en) * | 2015-08-12 | 2015-11-25 | 深圳市环翔精饰工业有限公司 | Method for electroplating or deplating aluminum-based copper-inlaid workpiece |
| CN105132960A (en) * | 2015-08-12 | 2015-12-09 | 深圳市环翔精饰工业有限公司 | Method for preventing solder paste from diffusing during wettability detecting of tin-electroplated workpiece |
| CN111029032A (en) * | 2019-11-18 | 2020-04-17 | 西部超导材料科技股份有限公司 | Method for improving surface quality of NbTi superconducting wire |
| CN114990651A (en) * | 2022-04-29 | 2022-09-02 | 沈阳飞机工业（集团）有限公司 | Multiple electroplating process method for copper plating, cadmium plating and tin plating |
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| CN108365371B (en) | 2017-11-07 | 2020-10-02 | 得意精密电子(苏州)有限公司 | Electric connector and manufacturing method thereof |
| CN109487308A (en) * | 2018-12-11 | 2019-03-19 | 湖北工程学院 | The method of neutral tin plating electrolyte and preparation method thereof and copper-based material surface tinning |
| CN117042338B (en) * | 2023-10-09 | 2024-01-12 | 深圳明阳电路科技股份有限公司 | Printed circuit board production process for high-end server and printed circuit board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2543674B2 (en) * | 1975-09-30 | 1978-11-23 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Process for tinning printed circuit boards |
| JP4864256B2 (en) * | 2001-09-26 | 2012-02-01 | 石原薬品株式会社 | Tin plating bath for preventing whisker and tin plating method |
| CN101899664B (en) * | 2009-05-27 | 2012-06-20 | 比亚迪股份有限公司 | Electroplating method |
| CN102115862B (en) * | 2010-12-31 | 2012-09-05 | 周开勇 | Circulating tin plating process and device |
-
2013
- 2013-07-23 CN CN 201310311922 patent/CN103343366A/en active Pending
-
2014
- 2014-07-22 CN CN201410350192.9A patent/CN104152962B/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104195610A (en) * | 2014-09-16 | 2014-12-10 | 四川海英电子科技有限公司 | Tin-plating method for high-order and high density circuit board |
| CN105088289A (en) * | 2015-08-12 | 2015-11-25 | 深圳市环翔精饰工业有限公司 | Method for electroplating or deplating aluminum-based copper-inlaid workpiece |
| CN105132960A (en) * | 2015-08-12 | 2015-12-09 | 深圳市环翔精饰工业有限公司 | Method for preventing solder paste from diffusing during wettability detecting of tin-electroplated workpiece |
| CN111029032A (en) * | 2019-11-18 | 2020-04-17 | 西部超导材料科技股份有限公司 | Method for improving surface quality of NbTi superconducting wire |
| CN114990651A (en) * | 2022-04-29 | 2022-09-02 | 沈阳飞机工业（集团）有限公司 | Multiple electroplating process method for copper plating, cadmium plating and tin plating |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104152962A (en) | 2014-11-19 |
| CN104152962B (en) | 2016-08-24 |
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