CN101946323B - 新型热电转换材料及其制备方法,以及使用该新型热电转换材料的热电转换元件 - Google Patents
新型热电转换材料及其制备方法,以及使用该新型热电转换材料的热电转换元件 Download PDFInfo
- Publication number
- CN101946323B CN101946323B CN2008801266927A CN200880126692A CN101946323B CN 101946323 B CN101946323 B CN 101946323B CN 2008801266927 A CN2008801266927 A CN 2008801266927A CN 200880126692 A CN200880126692 A CN 200880126692A CN 101946323 B CN101946323 B CN 101946323B
- Authority
- CN
- China
- Prior art keywords
- thermo
- converting material
- electric converting
- general formula
- cuote
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 title claims abstract description 63
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims description 19
- 229910052745 lead Inorganic materials 0.000 claims abstract description 19
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 18
- 229910052712 strontium Inorganic materials 0.000 claims abstract description 18
- 229910052785 arsenic Inorganic materials 0.000 claims abstract description 17
- 229910052711 selenium Inorganic materials 0.000 claims abstract description 15
- 229910052788 barium Inorganic materials 0.000 claims abstract description 10
- 229910052792 caesium Inorganic materials 0.000 claims abstract description 10
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 10
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 10
- 229910052738 indium Inorganic materials 0.000 claims abstract description 10
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 10
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 10
- 229910052700 potassium Inorganic materials 0.000 claims abstract description 10
- 229910052716 thallium Inorganic materials 0.000 claims abstract description 10
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims description 17
- 238000002360 preparation method Methods 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 11
- 238000005245 sintering Methods 0.000 claims description 11
- 229910052797 bismuth Inorganic materials 0.000 claims description 10
- 229910052714 tellurium Inorganic materials 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 229910052793 cadmium Inorganic materials 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 2
- -1 Wherein Substances 0.000 claims 2
- 238000002441 X-ray diffraction Methods 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000004570 mortar (masonry) Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 239000013078 crystal Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- 238000000634 powder X-ray diffraction Methods 0.000 description 4
- 238000002050 diffraction method Methods 0.000 description 3
- WKBPZYKAUNRMKP-UHFFFAOYSA-N 1-[2-(2,4-dichlorophenyl)pentyl]1,2,4-triazole Chemical compound C=1C=C(Cl)C=C(Cl)C=1C(CCC)CN1C=NC=N1 WKBPZYKAUNRMKP-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G29/00—Compounds of bismuth
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B19/00—Selenium; Tellurium; Compounds thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G3/00—Compounds of copper
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/88—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing selenium, tellurium or unspecified chalcogen elements
- C09K11/881—Chalcogenides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/88—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing selenium, tellurium or unspecified chalcogen elements
- C09K11/881—Chalcogenides
- C09K11/885—Chalcogenides with alkaline earth metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/10—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances sulfides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0272—Selenium or tellurium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type
- H01L31/0725—Multiple junction or tandem solar cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/853—Thermoelectric active materials comprising inorganic compositions comprising arsenic, antimony or bismuth
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/855—Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
本发明涉及由以下通式表示的热电转换材料:Bi1-xMxCu1-wOa-yQ1yTeb-zQ2z。在此,M为选自Ba、Sr、Ca、Mg、Cs、K、Na、Cd、Hg、Sn、Pb、Mn、Ga、In、Tl、As和Sb中的至少一种元素;Q1和Q2为选自S、Se、As和Sb中的至少一种元素;x、y、z、w、a和b为0≤x<1、0≤w<1、0.2<a<4、0≤y<4、0.2<b<4和0≤z<4。这些热电转换材料可用于热电转换元件,其中它们可以取代常规使用的热电转换材料,或者与常规使用的热电转换材料一起使用。
Description
技术领域
本发明提供了一类新型热电转换材料及其制备方法,以及使用该新型热电转换材料的热电转换元件。
背景技术
热电转换元件应用于热电转换发电或热电转换冷却。例如,对于热电转换发电,在热电转换元件上施加温度差以产生温差电动势,然后此温差电动势用于将热能转换为电能。
热电转换元件的能量转换效率取决于热电转换材料的性能指标ZT值。ZT值取决于塞贝克系数(Seebeck coefficient)、电导率和热导率。更具体地说,ZT值与电导率和塞贝克系数的平方成正比,与热导率成反比。因此,为了提高热电转换元件的能量转换效率,需要开发具有高塞贝克系数、高电导率或低热导率的热电转换材料。
发明内容
技术问题
本发明的一个目的是提供一类具有优异的热电转换性能的热电转换材料。
本发明的另一目的是提供一种制备上述新型热电转换材料的方法。
此外,本发明的再一目的是提供一种使用该新型热电转换材料的热电转换元件。
技术方案
作为热电转换材料的研究结果,本发明提出了通式1的组合物。结果发现,这些新型化合物可以用作热电转换元件的热电转换材料等。
通式1
Bi1-xMxCu1-wOa-yQ1yTeb-zQ2z
其中,M为选自Ba、Sr、Ca、Mg、Cs、K、Na、Cd、Hg、Sn、Pb、Mn、Ga、In、Tl、As和Sb中的至少一种元素,Q1和Q2为选自S、Se、As和Sb中的至少一种元素,且0≤x<1、0≤w<1、0.2<a<4、0≤y<4、0.2<b<4、0≤z<4、b>z且x+y+z+w>0。
根据本发明,通式1中的x、y和z满足x+y+z>0,且优选地,a、y、b和z分别为a=1、0≤y<1、b=1和0≤z<1。
在其他情况下,x、w、a、y、b和z分别优选为0≤x<0.15、0≤w≤0.2、a=1、0≤y<0.2、b=1和0≤z<0.5。在此,M优选为选自Sr、Cd、Pb和Tl中的任意一种,且Q1和Q2分别优选为Se或Sb。
在本发明的另一个实施方式中,提供了一种通过加热Bi2O3、Bi、Cu和Te的混合物制备由以上通式1表示的热电转换材料的方法。
或者,本发明提供了通过加热Bi2O3、Bi、Cu、Te和选自Ba、Sr、Ca、Mg、Cs、K、Na、Cd、Hg、Sn、Pb、Mn、Ga、In、Tl、As和Sb元素或其氧化物中的至少一种的混合物制备由通式1表示的热电转换材料的方法。
又或者,本发明提供了通过加热Bi2O3、Bi、Cu、Te、选自S、Se、As和Sb元素或其氧化物中的至少一种、以及非必须地选自Ba、Sr、Ca、Mg、Cs、K、Na、Cd、Hg、Sn、Pb、Mn、Ga、In、Tl、As和Sb元素或其氧化物中的至少一种的混合物制备由通式1表示的热电转换材料的方法。
在根据本发明的方法中,烧结工艺优选在400~570℃温度下进行。
有益效果
本发明的新型热电转换材料可以取代常规使用的热电转换材料,或者与常规使用的热电转换材料一起使用。特别地,该热电转换材料由于其优异的热电转换性能可用于热电转换元件。
附图说明
参照附图,从下面对实施方式的描述中,本发明的其他目的和技术方案将更明晰:
图1显示出比较X射线衍射图与由结构模型计算出的图的BiCuOTe的Rietveld精修图谱;
图2显示出BiCuOTe的晶体结构;
图3显示出比较X射线衍射图与由结构模型计算出的图的Bi0.98Pb0.02CuOTe的Rietveld精修图谱;
图4显示出Bi0.98Pb0.02CuOTe的晶体结构;
图5显示出Bi0.9Pb0.1CuOTe的X射线衍射图;
图6显示出Bi0.9Cd0.1CuOTe的X射线衍射图;
图7显示出Bi0.9Sr0.1CuOTe的X射线衍射图;
图8显示出比较X射线衍射图与由结构模型计算出的图的BiCuOSe0.5Te0.5的Rietveld精修图谱;
图9显示出BiCuOSe0.5Te0.5的晶体结构;
图10显示出Bi0.9Tl0.1CuOTe的X射线衍射图;
图11显示出BiCuOTe0.9Sb0.1的X射线衍射图;
图12显示出BiCuOTe在不同温度下的电导率、塞贝克系数、热导率和ZT值;
图13显示出Bi0.9Sr0.1CuOTe在不同温度下的电导率、塞贝克系数、热导率和ZT值;
图14显示出Bi0.9Cd0.1CuOTe在不同温度下的电导率、塞贝克系数、热导率和ZT值;
图15显示出Bi0.9Pb0.1CuOTe在不同温度下的电导率、塞贝克系数、热导率和ZT值;
图16显示出Bi0.98Pb0.02CuOTe在不同温度下的电导率、塞贝克系数、热导率和ZT值;
图17显示出Bi0.9Tl0.1CuOTe在不同温度下的电导率、塞贝克系数、热导率和ZT值。
具体实施方式
本发明的热电转换材料的组成由以下通式1表示。
通式1
Bi1-xMxCu1-wOa-yQ1yTeb-zQ2z
在通式1中,M为选自Ba、Sr、Ca、Mg、Cs、K、Na、Cd、Hg、Sn、Pb、Mn、Ga、In、Tl、As和Sb中的至少一种元素,Q1和Q2为选自S、Se、As和Sb中的至少一种元素,且0≤x<1、0≤w<1、0.2<a<4、0≤y<4、0.2<b<4、0≤z<4、b>z且x+y+z+w>0。
在通式1中,x、y和z分别优选为0≤x≤1/2、0≤y≤a/2和0≤z≤b/2。
在通式1中,x、y和z可以分别为x=0、y=0和z=0。通式1的热电转换材料优选为BiCuOTe。
在通式1中,x、y和z满足x+y+z>0,且优选地,通式1中的a、y、b和z分别为a=1、0≤y<1、b=1和0≤z<1。在其他情况下,x、w、a、y、b和z可以分别为0≤x<0.15、0≤w≤0.2、a=1、0≤y<0.2、b=1和0≤z<0.5。在此,M优选为选自Sr、Cd、Pb和Tl中的任意一种,且Q1和Q2分别优选为Se或Sb。更优选地,通式1中的x、w、a、y、b和z分别为0≤x<0.15、0≤w≤0.2、a=1、0≤y<0.2、b=1和0≤z<0.5,M为选自Sr、Cd、Pb和Tl中的任意一种,且Q1和Q2分别为Se或Sb。
对于通式1的热电转换材料,更优选地,通式1中的x、w、a、y、b和z分别为0<x<0.15、w=0、a=1、y=0、b=1和z=0,且M为选自Sr、Cd、Pb和Tl中的任意一种。此外,在通式1中,当通式1中的x、w、y和z分别为x=0、w=0、a=1、y=0、b=1和0<z≤0.5,且Q2为Se或Sb时,更优选地,通式1中的x、w、a、y、b和z分别为0<x<0.15、w=0、a=1、y=0、b=1和z=0,且M为选自Sr、Cd、Pb和Tl中的任意一种。
同时,由通式1表示的热电转换材料可以通过混合Bi2O3、Bi、Cu和Te粉末,然后真空烧结该混合物来制备,但本发明并不限于此。
此外,由通式1表示的热电转换材料可以通过在真空石英管中加热Bi2O3、Bi、Cu、Te和选自Ba、Sr、Ca、Mg、Cs、K、Na、Cd、Hg、Sn、Pb、Mn、Ga、In、Tl、As和Sb或其氧化物中的至少一种的混合物以制备,然而本发明并不限于此。
此外,由通式1表示的热电转换材料可以通过在真空石英管中加热Bi2O3、Bi、Cu、Te、选自S、Se、As和Sb或其氧化物中的至少一种、以及非必须地选自Ba、Sr、Ca、Mg、Cs、K、Na、Cd、Hg、Sn、Pb、Mn、Ga、In、Tl、As和Sb或其氧化物中的至少一种的混合物以制备,然而本发明并不限于此。
本发明的热电转换材料可以通过在流动气体(如部分包括氢或不包括氢的Ar、He或N2)中烧结混合物以制备。烧结工艺优选在400~750℃,更优选在400~570℃下进行。
实施例
以下将基于实施例详述本发明的优选实施方式。然而,本发明的实施方式可以以不同方式修改,且本发明的范围不应解释为限于这些实施例。本发明提供的实施方式仅用于向所属领域的技术人员更完善的解释本发明。
实施例1
BiCuOTe
为了制备BiCuOTe,通过使用玛瑙研钵充分混合1.1198g的Bi2O3(Aldrich,99.9%,100目)、0.5022g的Bi(Aldrich,99.99%,<10m),0.4581g的Cu(Aldrich,99.7%,3m)和0.9199g的Te(Aldrich,99.99%,约100目),然后在510℃真空石英管中加热15小时,以获得BiCuOTe粉末。
使用TOPAS程序(R.W.Cheary,A.Coelho,J.Appl.Crystallogr.25(1992)109-121;Bruker AXS,TOPAS 3,Karlsruhe,Germany(2000))以测定得到的材料的晶体结构。分析结果示于表1和图2中。
【表1】
原子 | 位置 | x | y | z | 占有率 | Beq |
Bi | 2c | 0.25 | 0.25 | 0.37257(5) | 1 | 0.56(1) |
Cu | 2a | 0.75 | 0.25 | 0 | 1 | 0.98(3) |
O | 2b | 0.75 | 0.25 | 0.5 | 1 | 0.26(12) |
Te | 2c | 0.25 | 0.25 | 0.81945(7) | 1 | 0.35(1) |
图1显示出比较观察到的BiCuOTe的X射线衍射图与由结构模型计算出的X射线衍射图的Rietveld精修图谱。图1显示出测量的图与根据表1计算的图良好吻合,这说明此实施例中得到的材料为BiCuOTe。
如图2所示,BiCuOTe显示出天然超晶格结构,其中,Cu2Te2层和Bi2O2层沿c晶轴重复。
实施例2
Bi
0.98
Pb
0.02
CuOTe
为了制备Bi0.98Pb0.02CuOTe,通过使用玛瑙研钵充分混合2.5356g的Bi2O3(Aldrich,99.9%,100目)、1.1724g的Bi(Aldrich,99.99%,<10m),1.0695g的Cu(Aldrich,99.7%,3m)、0.0751g的PbO(Canto,99.5%)和2.1475g的Te(Aldrich,99.99%,约100目),然后在510℃真空石英管中加热15小时,以获得Bi0.98Pb0.02CuOTe粉末。
使用TOPAS程序(R.W.Cheary,A.Coelho,J.Appl.Crystallogr.25(1992)109-121;Bruker AXS,TOPAS 3,Karlsruhe,Germany(2000))以测定得到的材料的晶体结构。分析结果示于表2和图4中。
【表2】
原子 | 位置 | x | y | z | 占有率 | Beq |
Bi | 2c | 0.25 | 0.25 | 0.37225(12) | 0.98 | 0.59(4) |
Pb | 2c | 0.25 | 0.25 | 0.37225(12) | 0.02 | 0.59(4) |
Cu | 2a | 0.75 | 0.25 | 0 | 1 | 1.29(10) |
O | 2b | 0.75 | 0.25 | 0.5 | 1 | 0.9(4) |
Te | 2c | 0.25 | 0.25 | 0.81955(17) | 1 | 0.55(5) |
图3显示出比较观察到的Bi0.98Pb0.02CuOTe的X射线衍射图与由结构模型计算出的图的Rietveld精修图谱。图3显示出测量的图与根据表2计算的图良好吻合,这说明此实施例中得到的材料为Bi0.98Pb0.02CuOTe。
如图4所示,Bi0.98Pb0.02CuOTe显示出天然超晶格结构,其中,Cu2Te2层和由Pb部分取代了Bi的(Bi,Pb)2O2层沿c晶轴重复。
实施例3
Bi
0.9
Pb
0.1
CuOTe
为了制备Bi0.9Pb0.1CuOTe,通过使用玛瑙研钵充分混合1.2721g的Bi2O3(Aldrich,99.9%,100目)、0.6712g的Bi(Aldrich,99.99%,<10m),0.6133g的Cu(Aldrich,99.7%,3m)、0.215g的PbO(Canto,99.5%)和1.2294g的Te(Aldrich,99.99%,约100目),然后在510℃真空石英管中加热15小时,以获得Bi0.9Pb0.1CuOTe粉末。
此样品的X射线衍射分析以与实施例2相同的方法进行。如图5所示,在实施例3中得到的材料被鉴定为Bi0.9Pb0.1CuOTe。
实施例4
Bi
0.9
Cd
0.1
CuOTe
为了制备Bi0.9Cd0.1CuOTe,通过使用玛瑙研钵充分混合1.3018g的Bi2O3(Aldrich,99.9%,100目)、0.6869g的Bi(Aldrich,99.99%,<10m),0.6266g的Cu(Aldrich,99.7%,3m)、0.1266g的CdO(Strem,99.999%)和1.2582g的Te(Aldrich,99.99%,约100目),然后在510℃真空石英管中加热15小时,以获得Bi0.9Cd0.1CuOTe粉末。
此样品的X射线衍射分析以与实施例2相同的方法进行。如图6所示,在实施例4中得到的材料被鉴定为Bi0.9Cd0.1CuOTe。
实施例5
Bi
0.9
Sr
0.1
CuOTe
为了制备Bi0.9Sr0.1CuOTe,通过使用玛瑙研钵充分混合1.0731g的Bi2O3(Aldrich,99.9%,100目)、0.5662g的Bi(Aldrich,99.99%,<10m),0.5165g的Cu(Aldrich,99.7%,3m),1.0372g的Te(Aldrich,99.99%,约100目)和0.0842g的SrO。在此,SrO是通过在1125℃下在空气中热处理SrCO3(Alfa,99.994%)12小时制备的。通过热处理获得的材料由X射线衍射分析被确定为SrO。
然后将该混合物在510℃的真空石英管中加热15小时,以获得Bi0.9Cd0.1CuOTe粉末。
在室温下在Bragg-Brentano衍射仪(Bruker D8Advance XRD)上用Cu X射线管(50kV,40mA)测定粉末X射线衍射(XRD)数据。步长为0.02度。图7显示出在实施例5中得到的材料为Bi0.9Sr0.1CuOTe。
实施例6
BiCuOSe
0.5
Te
0.5
为了制备BiCuOSe0.5Te0.5,通过使用玛瑙研钵充分混合1.9822g的Bi2O3(Aldrich,99.9%,100目)、0.889g的Bi(Aldrich,99.99%,<10m),0.811g的Cu(Aldrich,99.7%,3m)、0.5036g的Se(Aldrich,99.99%)和0.8142g的Te(Aldrich,99.99%,约100目),然后在510℃真空石英管中加热15小时,以获得BiCuOSe0.5Te0.5粉末。
在室温下在Bragg-Brentano衍射仪(Bruker D4-Endeavor XRD)上用Cu X射线管(40kV,40mA)测定粉末X射线衍射(XRD)数据。步长为0.02度。同时,使用可变的6mm狭缝作为发散狭缝。其结果示于图8中。晶体结构分析以与实施例2相同的方法进行。分析结果示于表3和图9中。
【表3】
原子 | 位置 | x | y | z | 占有率 | Beq |
Bi | 2c | 0.25 | 0.25 | 0.36504(9) | 1 | 0.86(2) |
Cu | 2a | 0.75 | 0.25 | 0 | 1 | 2.00(9) |
O | 2b | 0.75 | 0.25 | 0.5 | 1 | 1.9(3) |
Te | 2c | 0.25 | 0.25 | 0.82272(14) | 0.5 | 0.61(4) |
Se | 2c | 0.25 | 0.25 | 0.82252(14) | 0.5 | 0.55(5) |
图8显示出测量的图与根据表3计算的图良好吻合,因此,在此实施例中得到的材料被鉴定为BiCuOSe0.5Te0.5。
如图9所示,BiCuOSe0.5Te0.5显示出天然超晶格结构,其中,Cu2(Te,Se)2层和Bi2O2层沿c晶轴重复。
实施例7
Bi
0.9
Tl
0.1
CuOTe
为了制备Bi0.9Tl0.1CuOTe,通过使用玛瑙研钵充分混合1.227g的Bi2O3(Aldrich,99.9%,100目)、0.7114g的Bi(Aldrich,99.99%,<10m),0.6122g的Cu(Aldrich,99.7%,3m),1.2293g的Te(Aldrich,99.99%,约100目)和0.22g的Tl2O3(Aldrich)。
然后将该混合物在510℃的真空石英管中加热15小时,以获得Bi0.9Tl0.1CuOTe粉末。
此样品的X射线衍射分析以与实施例2相同的方法进行。如图10所示,在实施例7中得到的材料被鉴定为Bi0.9Tl0.1CuOTe。
实施例8
BiCuOTe
0.9
Sb
0.1
为了制备BiCuOTe0.9Sb0.1,通过使用玛瑙研钵充分混合1.4951g的Bi2O3(Aldrich,99.9%,100目)、0.6705g的Bi(Aldrich,99.99%,<10m),0.6117g的Cu(Aldrich,99.7%,3m),1.1054g的Te(Aldrich,99.99%,约100目)和0.1172g的Sb(Kanto chemical,Cat.No.01420-02)。
然后将该混合物在510℃的真空石英管中加热15小时,以获得BiCuOTe0.9Sb0.1粉末。
此样品的X射线衍射分析以与实施例2相同的方法进行。如图11所示,在实施例8中得到的材料被鉴定为BiCuOTe0.9Sb0.1。
热电转换性能的评价
通过使用CIP在200MPa的压力下将粉末样品成型以得到直径4mm且长度15mm的圆柱形(以测量电导率及塞贝克系数),以及直径10mm且厚度1mm的圆盘形(以测量热导率)。随后,将得到的圆盘和圆柱在510℃真空石英管中加热10小时。
对于烧结的圆柱,通过使用ZEM-2(Ulvac-Rico有限公司)测量电导率和塞贝克系数。测量结果示于图12~17中。例如,在346K下,测得BiCuOTe和Bi0.98Pb0.02CuOTe的热导率分别为0.25W/m/K和0.35W/m/K,其显著低于典型的热电转换材料Bi2Te3的热导率(1.9W/m/K,T.M.Tritt,M.A.Subramanian,MRS Bulletin 31(2006)188-194)和Co4Sb12:In0.2(2W/m/K,T.He,J.Chen,D.Rosenfeld,M.A.Subramanian,Chem.Mater.18(2006)759-762)。
同时,对于烧结的圆盘,通过使用TC-9000(Ulvac-Rico有限公司)测量热导率。测量结果示于图12~17中。
使用测得的值计算各个样品的ZT值。计算结果示于图12~17中。
Claims (18)
1.由以下通式1表示的热电转换材料:
通式1
Bi1-xMxCu1-wOa-yQ1yTeb-zQ2z
其中,M为选自Ba、Sr、Ca、Mg、Cs、K、Na、Cd、Hg、Sn、Pb、Mn、Ga、In、Tl、As和Sb中的至少一种元素;Q1和Q2为选自S、Se、As和Sb中的至少一种元素;x、y、z、w、a和b为0≤x<1、0≤w<1、0.2<a<4、0≤y<4、0.2<b<4、0≤z<4、b>z且x+y+z+w>0。
2.根据权利要求1所述的热电转换材料,
其中,通式1中的x、y和z分别为0≤x≤1/2、0≤y≤a/2和0≤z≤b/2。
3.根据权利要求1所述的热电转换材料,
其中,通式1中的x、y和z分别为x=0、y=0和z=0。
4.根据权利要求1所述的热电转换材料,
其中,通式1中的x、y和z为x+y+z>0。
5.根据权利要求4所述的热电转换材料,
其中,通式1中的a、y、b和z分别为a=1、0≤y<1、b=1和0≤z<1。
6.根据权利要求4所述的热电转换材料,
其中,通式1中的x、w、a、y、b和z分别为0≤x<0.15、0≤w≤0.2、a=1、0≤y<0.2、b=1和0≤z<0.5。
7.根据权利要求4所述的热电转换材料,
其中,通式1中的M为选自Sr、Cd、Pb和Tl中的任意一种。
8.根据权利要求4所述的热电转换材料,
其中,通式1中的Q1和Q2分别为Se或Sb。
9.根据权利要求4所述的热电转换材料,
其中,通式1中的x、w、a、y、b和z分别为0≤x<0.15、0≤w≤0.2、a=1、0≤y<0.2、b=1和0≤z<0.5;M为选自Sr、Cd、Pb和Tl中的任意一种;且Q1和Q2分别为Se或Sb。
10.根据权利要求9所述的热电转换材料,
其中,通式1中的x、w、a、y、b和z分别为0<x<0.15、w=0、a=1、y=0、b=1和z=0,且M为选自Sr、Cd、Pb和Tl中的任意一种。
11.根据权利要求9所述的热电转换材料,
其中,通式1中的x、w、y和z分别为x=0、w=0、a=1、y=0、b=1和0<z≤0.5,且Q2为Se或Sb。
12.一种制备热电转换材料的方法,
其中,混合然后烧结Bi2O3、Bi、Cu和Te的粉末以制备由权利要求1中的通式1表示的热电转换材料。
13.一种制备热电转换材料的方法,
其中,混合然后烧结Bi2O3、Bi、Cu、Te和选自Ba、Sr、Ca、Mg、Cs、K、Na、Cd、Hg、Sn、Pb、Mn、Ga、In、Tl、As和Sb或其氧化物中的至少一种以制备由权利要求1中的通式1表示的热电转换材料。
14.一种制备热电转换材料的方法,
其中,将Bi2O3、Bi、Cu和Te与选自S、Se、As和Sb或其氧化物中的至少一种混合,然后选择性地向其中进一步混入选自Ba、Sr、Ca、Mg、Cs、K、Na、Cd、Hg、Sn、Pb、Mn、Ga、In、Tl、As和Sb或其氧化物中的至少一种,然后烧结以制备由权利要求1中的通式1表示的热电转换材料。
15.根据权利要求12所述的制备热电转换材料的方法,
其中,所述烧结工序在400~570℃的温度下进行。
16.根据权利要求13所述的制备热电转换材料的方法,
其中,所述烧结工序在400~570℃的温度下进行。
17.根据权利要求14所述的制备热电转换材料的方法,
其中,所述烧结工序在400~570℃的温度下进行。
18.一种热电转换元件,其包括权利要求1所述的热电转换材料。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310309148.9A CN103400932B (zh) | 2008-08-29 | 2008-11-28 | 新型热电转换材料及其制备方法,以及使用该新型热电转换材料的热电转换元件 |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20080085240 | 2008-08-29 | ||
KR10-2008-0085240 | 2008-08-29 | ||
KR10-2008-0097779 | 2008-10-06 | ||
KR20080097779 | 2008-10-06 | ||
KR20080111557 | 2008-11-11 | ||
KR10-2008-0111557 | 2008-11-11 | ||
PCT/KR2008/007041 WO2010024500A1 (en) | 2008-08-29 | 2008-11-28 | New compound semiconductor and producing method thereof, and solar cell and thermoelectric conversion element using the same |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310309148.9A Division CN103400932B (zh) | 2008-08-29 | 2008-11-28 | 新型热电转换材料及其制备方法,以及使用该新型热电转换材料的热电转换元件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101946323A CN101946323A (zh) | 2011-01-12 |
CN101946323B true CN101946323B (zh) | 2013-08-21 |
Family
ID=41721647
Family Applications (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310309148.9A Active CN103400932B (zh) | 2008-08-29 | 2008-11-28 | 新型热电转换材料及其制备方法,以及使用该新型热电转换材料的热电转换元件 |
CN2008801266927A Active CN101946323B (zh) | 2008-08-29 | 2008-11-28 | 新型热电转换材料及其制备方法,以及使用该新型热电转换材料的热电转换元件 |
CN201310021769.7A Active CN103130199B (zh) | 2008-08-29 | 2009-08-31 | 化合物半导体及其制备方法以及使用该化合物半导体的热电转换器件 |
CN201310054899.0A Active CN103178202B (zh) | 2008-08-29 | 2009-08-31 | 新型热电转换材料及其制备方法,以及使用该热电转换材料的热电转换器件 |
CN2009801103604A Active CN101977846B (zh) | 2008-08-29 | 2009-08-31 | 化合物半导体及其制备方法以及使用该化合物半导体的热电转换器件 |
CN2009801080161A Active CN101960627B (zh) | 2008-08-29 | 2009-08-31 | 新型热电转换材料及其制备方法,以及使用该热电转换材料的热电转换器件 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310309148.9A Active CN103400932B (zh) | 2008-08-29 | 2008-11-28 | 新型热电转换材料及其制备方法,以及使用该新型热电转换材料的热电转换元件 |
Family Applications After (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310021769.7A Active CN103130199B (zh) | 2008-08-29 | 2009-08-31 | 化合物半导体及其制备方法以及使用该化合物半导体的热电转换器件 |
CN201310054899.0A Active CN103178202B (zh) | 2008-08-29 | 2009-08-31 | 新型热电转换材料及其制备方法,以及使用该热电转换材料的热电转换器件 |
CN2009801103604A Active CN101977846B (zh) | 2008-08-29 | 2009-08-31 | 化合物半导体及其制备方法以及使用该化合物半导体的热电转换器件 |
CN2009801080161A Active CN101960627B (zh) | 2008-08-29 | 2009-08-31 | 新型热电转换材料及其制备方法,以及使用该热电转换材料的热电转换器件 |
Country Status (7)
Country | Link |
---|---|
US (7) | US8173097B2 (zh) |
EP (3) | EP2319082B1 (zh) |
JP (4) | JP5414700B2 (zh) |
KR (3) | KR101117845B1 (zh) |
CN (6) | CN103400932B (zh) |
TW (1) | TWI472487B (zh) |
WO (3) | WO2010024500A1 (zh) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103400932B (zh) * | 2008-08-29 | 2016-08-10 | Lg化学株式会社 | 新型热电转换材料及其制备方法,以及使用该新型热电转换材料的热电转换元件 |
US9660165B2 (en) | 2008-08-29 | 2017-05-23 | Lg Chem, Ltd. | Thermoelectric conversion material and producing method thereof, and thermoelectric conversion element using the same |
KR101114252B1 (ko) * | 2010-05-21 | 2012-02-20 | 부경대학교 산학협력단 | 열전재료의 제조방법 |
CN102339946B (zh) * | 2010-07-20 | 2014-06-18 | 中国科学院上海硅酸盐研究所 | 一种高性能热电复合材料及其制备方法 |
CN103502144B (zh) * | 2011-04-28 | 2015-11-25 | Lg化学株式会社 | 化合物半导体及其用途 |
JP5774130B2 (ja) * | 2011-04-28 | 2015-09-02 | エルジー・ケム・リミテッド | 新規な化合物半導体及びその活用 |
KR101431771B1 (ko) * | 2011-05-13 | 2014-08-19 | 주식회사 엘지화학 | 신규한 화합물 반도체 및 그 활용 |
JP5774201B2 (ja) * | 2011-05-13 | 2015-09-09 | エルジー・ケム・リミテッド | 新規な化合物半導体及びその活用 |
CN103534201B (zh) * | 2011-05-13 | 2016-10-19 | Lg化学株式会社 | 新的化合物半导体及其用途 |
WO2012157905A1 (ko) * | 2011-05-13 | 2012-11-22 | 주식회사 엘지화학 | 신규한 화합물 반도체 및 그 활용 |
EP2708496B1 (en) * | 2011-05-13 | 2018-02-28 | LG Chem, Ltd. | Novel compound semiconductor and usage for same |
CN103050618B (zh) * | 2011-10-17 | 2015-08-12 | 中国科学院福建物质结构研究所 | 一种热电材料及其制备方法 |
KR102001062B1 (ko) | 2012-01-16 | 2019-10-01 | 삼성전자주식회사 | 나노복합체형 열전재료, 이를 포함하는 열전모듈과 열전장치 |
KR101323321B1 (ko) * | 2012-02-10 | 2013-10-29 | 한국전기연구원 | Sb가 도핑된 MnTe계 열전재료 및 그 제조방법 |
KR20130126035A (ko) * | 2012-05-10 | 2013-11-20 | 삼성전자주식회사 | 왜곡된 전자 상태 밀도를 갖는 열전소재, 이를 포함하는 열전모듈과 열전 장치 |
KR101995917B1 (ko) | 2012-05-14 | 2019-07-03 | 삼성전자주식회사 | 파워팩터 증대된 열전소재 및 그 제조 방법 |
FR2996355B1 (fr) * | 2012-09-28 | 2016-04-29 | Rhodia Operations | Oxydes et sulfures mixtes de bismuth et cuivre pour application photovoltaique |
KR101446424B1 (ko) * | 2013-04-15 | 2014-10-30 | 서강대학교산학협력단 | 열전 변환 물질 |
CN103236493B (zh) * | 2013-05-13 | 2017-10-24 | 中国科学院福建物质结构研究所 | TmCuTe2化合物及其制备和用途 |
KR101612494B1 (ko) * | 2013-09-09 | 2016-04-14 | 주식회사 엘지화학 | 열전 재료 |
US9705060B2 (en) | 2013-09-09 | 2017-07-11 | Lg Chem, Ltd. | Thermoelectric materials |
KR101612489B1 (ko) * | 2013-09-27 | 2016-04-14 | 주식회사 엘지화학 | 신규한 화합물 반도체 및 그 활용 |
US9561959B2 (en) | 2013-10-04 | 2017-02-07 | Lg Chem, Ltd. | Compound semiconductors and their applications |
KR101629509B1 (ko) * | 2013-10-17 | 2016-06-10 | 주식회사 엘지화학 | 열전 재료 및 그 제조 방법 |
KR101626933B1 (ko) * | 2013-11-29 | 2016-06-02 | 주식회사 엘지화학 | 신규한 화합물 반도체 및 그 활용 |
KR102138527B1 (ko) * | 2014-01-20 | 2020-07-28 | 엘지전자 주식회사 | 상분리를 이용한 열전소재, 상기 열전소재를 이용한 열전소자 및 그 제조방법 |
FR3019539B1 (fr) * | 2014-04-04 | 2016-04-29 | Rhodia Operations | Oxydes et sulfures mixtes de bismuth et cuivre pour application photovoltaique |
FR3019540A1 (fr) * | 2014-04-04 | 2015-10-09 | Rhodia Operations | Oxydes et sulfures mixtes de bismuth et argent pour application photovoltaique |
CN104674046B (zh) * | 2015-02-03 | 2017-11-03 | 河南理工大学 | 一种BiCuζO热电材料的制备方法 |
JP6704577B2 (ja) * | 2015-02-23 | 2020-06-03 | 国立大学法人 奈良先端科学技術大学院大学 | カーボンナノチューブ−ドーパント組成物複合体の製造方法およびカーボンナノチューブ−ドーパント組成物複合体 |
CN104831344A (zh) * | 2015-04-29 | 2015-08-12 | 河南鸿昌电子有限公司 | 一种半导体晶棒的拉晶方法 |
KR101917914B1 (ko) | 2015-08-26 | 2018-11-12 | 주식회사 엘지화학 | 화합물 반도체 및 그 제조방법 |
CN105552202B (zh) * | 2015-12-08 | 2018-04-10 | 中国科学院福建物质结构研究所 | 晶体材料、制备方法以及含有该晶体材料的热电材料、其制备方法及热电转换器和应用 |
CN107146676B (zh) * | 2016-03-01 | 2019-03-08 | 中国科学院物理研究所 | 镉基铁磁半导体材料及其制备方法 |
CN106601837B (zh) * | 2016-11-23 | 2018-06-22 | 中山大学 | 一种超宽光谱光敏材料和应用该光敏材料的光电探测器 |
CN106784038B (zh) * | 2017-01-05 | 2018-03-13 | 上海应用技术大学 | 一种组分可调光电薄膜的制备方法 |
KR102381761B1 (ko) * | 2017-12-15 | 2022-03-31 | 주식회사 엘지화학 | 칼코겐 화합물, 이의 제조 방법 및 이를 포함하는 열전 소자 |
CN109776093B (zh) * | 2018-04-04 | 2021-07-27 | 苏州普轮电子科技有限公司 | 纳米复合热电材料的制备方法 |
CN109273584B (zh) * | 2018-07-16 | 2022-06-28 | 永康市天峰工具有限公司 | 一种汽车尾气温差发电装置用热电材料及发电装置 |
US20220033273A1 (en) * | 2018-12-04 | 2022-02-03 | Sumitomo Chemical Company, Limited | Compound and Thermoelectric Conversion Material |
CN110627502B (zh) * | 2019-10-22 | 2020-12-22 | 中南大学 | 一种低温p型复合热电材料及制备方法 |
CN112397634B (zh) * | 2020-11-16 | 2023-02-28 | 昆明理工大学 | 一种提升Bi-Sb-Te基热电材料性能的方法 |
CN114133245B (zh) * | 2021-11-15 | 2022-12-20 | 清华大学 | 热电陶瓷材料及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5726381A (en) * | 1994-10-11 | 1998-03-10 | Yamaha Corporation | Amorphous thermoelectric alloys and thermoelectric couple using same |
WO2008028852A2 (de) * | 2006-09-05 | 2008-03-13 | Basf Se | Dotierte bi-te-verbindungen für thermoelektrische generatoren und peltier-anordnungen |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4366336A (en) * | 1980-10-16 | 1982-12-28 | Chevron Research Company | Age and heat stabilized photovoltaic cells |
US4661071A (en) * | 1984-04-03 | 1987-04-28 | Denpac Corp. | Vacuum sintered powder alloy dental prosthetic device and oven to form same |
US5336558A (en) * | 1991-06-24 | 1994-08-09 | Minnesota Mining And Manufacturing Company | Composite article comprising oriented microstructures |
WO1994012833A1 (en) * | 1992-11-27 | 1994-06-09 | Pneumo Abex Corporation | Thermoelectric device for heating and cooling air for human use |
KR960006241B1 (ko) * | 1993-11-20 | 1996-05-11 | 국방과학연구소 | p-n 전이방지 특성을 갖는 Bi₂Te₃계 열전재료 조성물 |
US6458319B1 (en) * | 1997-03-18 | 2002-10-01 | California Institute Of Technology | High performance P-type thermoelectric materials and methods of preparation |
JP3572939B2 (ja) * | 1997-05-15 | 2004-10-06 | ヤマハ株式会社 | 熱電材料及びその製造方法 |
CN1162920C (zh) * | 1997-10-24 | 2004-08-18 | 住友特殊金属株式会社 | 热电转换材料及其制造方法 |
JP3484960B2 (ja) * | 1997-12-22 | 2004-01-06 | 松下電工株式会社 | 熱電変換素子及び熱電変換素子の製造方法 |
JP2002518287A (ja) * | 1998-06-18 | 2002-06-25 | インダストリアル リサーチ リミテッド | 最大フラックスピンニングおよび臨界電流を得るための、高−Tc超伝導体における臨界ドーピング |
JP2000261043A (ja) * | 1999-03-10 | 2000-09-22 | Sumitomo Special Metals Co Ltd | 熱電変換材料とその製造方法 |
US6091014A (en) * | 1999-03-16 | 2000-07-18 | University Of Kentucky Research Foundation | Thermoelectric materials based on intercalated layered metallic systems |
DE19955788A1 (de) * | 1999-11-19 | 2001-05-23 | Basf Ag | Thermoelektrisch aktive Materialien und diese enthaltende Generatoren |
US6251701B1 (en) * | 2000-03-01 | 2001-06-26 | The United States Of America As Represented By The United States Department Of Energy | All-vapor processing of p-type tellurium-containing II-VI semiconductor and ohmic contacts thereof |
JP3594008B2 (ja) * | 2000-11-30 | 2004-11-24 | ヤマハ株式会社 | 熱電材料、その製造方法及びペルチェモジュール |
US6384312B1 (en) * | 2000-12-07 | 2002-05-07 | International Business Machines Corporation | Thermoelectric coolers with enhanced structured interfaces |
US7091136B2 (en) * | 2001-04-16 | 2006-08-15 | Basol Bulent M | Method of forming semiconductor compound film for fabrication of electronic device and film produced by same |
US6660925B1 (en) * | 2001-06-01 | 2003-12-09 | Marlow Industries, Inc. | Thermoelectric device having co-extruded P-type and N-type materials |
US7166796B2 (en) * | 2001-09-06 | 2007-01-23 | Nicolaou Michael C | Method for producing a device for direct thermoelectric energy conversion |
WO2003105244A1 (ja) * | 2002-01-01 | 2003-12-18 | 古河電気工業株式会社 | 熱電素子モジュール及びその作製方法 |
JP2004288841A (ja) * | 2003-03-20 | 2004-10-14 | Rikogaku Shinkokai | オキシカルコゲナイドおよび熱電材料 |
US7649139B2 (en) | 2004-03-25 | 2010-01-19 | National Institute Of Advanced Industrial Science And Technology | Thermoelectric conversion element and thermoelectric conversion module |
CN1278941C (zh) * | 2004-12-08 | 2006-10-11 | 浙江大学 | 一种Bi2Te3纳米囊及其制备方法 |
JP2007158191A (ja) * | 2005-12-07 | 2007-06-21 | Toshiba Corp | 熱電材料およびこの材料を用いた熱電変換素子 |
JP2007258200A (ja) * | 2006-03-20 | 2007-10-04 | Univ Nagoya | 熱電変換材料及びそれを用いた熱電変換膜 |
JP4967772B2 (ja) * | 2006-08-24 | 2012-07-04 | 住友化学株式会社 | 熱電変換材料およびその製造方法 |
JP2008085309A (ja) * | 2006-08-29 | 2008-04-10 | Okano Electric Wire Co Ltd | 熱電変換モジュールおよびその製造方法ならびに熱電変換モジュールに用いられる熱電変換材料 |
KR101008035B1 (ko) * | 2007-06-14 | 2011-01-13 | 주식회사 엘지화학 | 신규한 화합물 반도체 물질 및 그 제조 방법과, 이를이용한 태양 전지 |
CN103400932B (zh) * | 2008-08-29 | 2016-08-10 | Lg化学株式会社 | 新型热电转换材料及其制备方法,以及使用该新型热电转换材料的热电转换元件 |
-
2008
- 2008-11-28 CN CN201310309148.9A patent/CN103400932B/zh active Active
- 2008-11-28 JP JP2010547553A patent/JP5414700B2/ja active Active
- 2008-11-28 EP EP08876837.9A patent/EP2319082B1/en active Active
- 2008-11-28 CN CN2008801266927A patent/CN101946323B/zh active Active
- 2008-11-28 WO PCT/KR2008/007041 patent/WO2010024500A1/en active Application Filing
- 2008-12-03 TW TW97146934A patent/TWI472487B/zh active
-
2009
- 2009-08-31 CN CN201310021769.7A patent/CN103130199B/zh active Active
- 2009-08-31 WO PCT/KR2009/004872 patent/WO2010024637A2/ko active Application Filing
- 2009-08-31 KR KR1020090081518A patent/KR101117845B1/ko active IP Right Grant
- 2009-08-31 EP EP09810246.0A patent/EP2320485B1/en active Active
- 2009-08-31 CN CN201310054899.0A patent/CN103178202B/zh active Active
- 2009-08-31 KR KR1020090081462A patent/KR101128304B1/ko active IP Right Grant
- 2009-08-31 JP JP2010549589A patent/JP5283713B2/ja active Active
- 2009-08-31 WO PCT/KR2009/004883 patent/WO2010024641A2/ko active Application Filing
- 2009-08-31 CN CN2009801103604A patent/CN101977846B/zh active Active
- 2009-08-31 EP EP09810242.9A patent/EP2316793B1/en active Active
- 2009-08-31 KR KR1020090081473A patent/KR101117847B1/ko active IP Right Grant
- 2009-08-31 JP JP2011500715A patent/JP5462858B2/ja active Active
- 2009-08-31 CN CN2009801080161A patent/CN101960627B/zh active Active
-
2010
- 2010-10-07 US US12/900,240 patent/US8173097B2/en active Active
- 2010-10-12 US US12/902,927 patent/US8029703B2/en active Active
- 2010-10-18 US US12/906,917 patent/US8226843B2/en active Active
-
2012
- 2012-05-03 US US13/463,511 patent/US8535637B2/en active Active
- 2012-06-22 US US13/531,186 patent/US8715538B2/en active Active
-
2013
- 2013-02-25 JP JP2013034238A patent/JP5537688B2/ja active Active
- 2013-08-29 US US14/014,088 patent/US20140000671A1/en not_active Abandoned
-
2014
- 2014-02-07 US US14/175,513 patent/US9620696B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5726381A (en) * | 1994-10-11 | 1998-03-10 | Yamaha Corporation | Amorphous thermoelectric alloys and thermoelectric couple using same |
WO2008028852A2 (de) * | 2006-09-05 | 2008-03-13 | Basf Se | Dotierte bi-te-verbindungen für thermoelektrische generatoren und peltier-anordnungen |
Non-Patent Citations (3)
Title |
---|
Ch=S, Se, Te): Effects of Electronic Configurations of M3+ Ions.《Chem. Mater.》.2007,第20卷(第1期),326-334. * |
Hidenori Hiramatsu, et al..Crystal Structures, Optoelectronic Properties, and Electronic Structures of Layered Oxychalcogenides MCuOCh (M=Bi, La * |
HidenoriHiramatsu et al..Crystal Structures |
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101946323B (zh) | 新型热电转换材料及其制备方法,以及使用该新型热电转换材料的热电转换元件 | |
JP6164627B2 (ja) | 新規な化合物半導体及びその活用 | |
Yang et al. | Realizing high thermoelectric performance in BaCu2–x Ag x Te2 through enhanced carrier effective mass and point-defect scattering | |
TW201305057A (zh) | 新穎化合物半導體及其應用 | |
JP5774130B2 (ja) | 新規な化合物半導体及びその活用 | |
TWI469927B (zh) | 新穎化合物半導體及其應用 | |
JP5759616B2 (ja) | 新規な化合物半導体及びその活用 | |
JP5774199B2 (ja) | 新規な化合物半導体及びその活用 | |
US9660165B2 (en) | Thermoelectric conversion material and producing method thereof, and thermoelectric conversion element using the same | |
TW201305060A (zh) | 新穎化合物半導體及其應用 | |
TWI467788B (zh) | 新穎化合物半導體及其應用 | |
JP2002026407A (ja) | 熱電材料の製造方法 | |
Shawon et al. | Alloying-Induced Structural Transition in the Promising Thermoelectric Compound CaAgSb | |
JP2007165616A (ja) | 充填4配位結合化合物および充填4配位結合化合物を含む熱電変換素子 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |