KR100465042B1 - 유기 el소자 - Google Patents
유기 el소자 Download PDFInfo
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- KR100465042B1 KR100465042B1 KR10-2001-0024845A KR20010024845A KR100465042B1 KR 100465042 B1 KR100465042 B1 KR 100465042B1 KR 20010024845 A KR20010024845 A KR 20010024845A KR 100465042 B1 KR100465042 B1 KR 100465042B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- organic
- formula
- drying member
- desiccant
- Prior art date
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- 239000002274 desiccant Substances 0.000 claims abstract description 69
- 238000001035 drying Methods 0.000 claims abstract description 60
- 150000002902 organometallic compounds Chemical class 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 150000001875 compounds Chemical class 0.000 claims description 19
- 125000002252 acyl group Chemical group 0.000 claims description 16
- 125000002524 organometallic group Chemical group 0.000 claims description 16
- 125000003118 aryl group Chemical group 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 125000003342 alkenyl group Chemical group 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 12
- 125000000623 heterocyclic group Chemical group 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 150000002894 organic compounds Chemical group 0.000 claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 238000001179 sorption measurement Methods 0.000 claims description 8
- 125000004429 atom Chemical group 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 48
- 230000012010 growth Effects 0.000 abstract description 42
- 239000000126 substance Substances 0.000 abstract description 20
- 239000003795 chemical substances by application Substances 0.000 abstract description 18
- 239000012298 atmosphere Substances 0.000 abstract description 15
- 238000004020 luminiscence type Methods 0.000 abstract description 10
- 230000002411 adverse Effects 0.000 abstract 1
- -1 9, 10- diphenyl anthranyl group Chemical group 0.000 description 77
- 239000010410 layer Substances 0.000 description 58
- 239000000758 substrate Substances 0.000 description 29
- 239000010408 film Substances 0.000 description 25
- 229920000642 polymer Polymers 0.000 description 22
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 238000007789 sealing Methods 0.000 description 18
- 230000000694 effects Effects 0.000 description 17
- 239000000243 solution Substances 0.000 description 16
- 239000012044 organic layer Substances 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
- 230000016574 developmental growth Effects 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 10
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 10
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 10
- WWZKQHOCKIZLMA-UHFFFAOYSA-M octanoate Chemical compound CCCCCCCC([O-])=O WWZKQHOCKIZLMA-UHFFFAOYSA-M 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- 239000010409 thin film Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 7
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 7
- 239000000292 calcium oxide Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000003814 drug Substances 0.000 description 7
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 239000005394 sealing glass Substances 0.000 description 6
- 125000001424 substituent group Chemical group 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 5
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- 229910021536 Zeolite Inorganic materials 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 125000005427 anthranyl group Chemical group 0.000 description 4
- XJHCXCQVJFPJIK-UHFFFAOYSA-M caesium fluoride Chemical compound [F-].[Cs+] XJHCXCQVJFPJIK-UHFFFAOYSA-M 0.000 description 4
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 230000005525 hole transport Effects 0.000 description 4
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000008096 xylene Substances 0.000 description 4
- 239000010457 zeolite Substances 0.000 description 4
- UGUHFDPGDQDVGX-UHFFFAOYSA-N 1,2,3-thiadiazole Chemical group C1=CSN=N1 UGUHFDPGDQDVGX-UHFFFAOYSA-N 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 3
- 125000000355 1,3-benzoxazolyl group Chemical group O1C(=NC2=C1C=CC=C2)* 0.000 description 3
- XJKSTNDFUHDPQJ-UHFFFAOYSA-N 1,4-diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=C(C=2C=CC=CC=2)C=C1 XJKSTNDFUHDPQJ-UHFFFAOYSA-N 0.000 description 3
- SHJASYAPFSVYHD-UHFFFAOYSA-N 1-oxofluorene-2,3-dicarbonitrile Chemical group C1=CC=C2C3=CC(C#N)=C(C#N)C(=O)C3=CC2=C1 SHJASYAPFSVYHD-UHFFFAOYSA-N 0.000 description 3
- FRPZMMHWLSIFAZ-UHFFFAOYSA-N 10-undecenoic acid Chemical compound OC(=O)CCCCCCCCC=C FRPZMMHWLSIFAZ-UHFFFAOYSA-N 0.000 description 3
- YQTCQNIPQMJNTI-UHFFFAOYSA-N 2,2-dimethylpropan-1-one Chemical group CC(C)(C)[C]=O YQTCQNIPQMJNTI-UHFFFAOYSA-N 0.000 description 3
- 125000004801 4-cyanophenyl group Chemical group [H]C1=C([H])C(C#N)=C([H])C([H])=C1* 0.000 description 3
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 3
- 229910001148 Al-Li alloy Inorganic materials 0.000 description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- 229910018663 Mn O Inorganic materials 0.000 description 3
- 229910003176 Mn-O Inorganic materials 0.000 description 3
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 3
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical group C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 3
- 125000002339 acetoacetyl group Chemical group O=C([*])C([H])([H])C(=O)C([H])([H])[H] 0.000 description 3
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical group C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 3
- 239000002635 aromatic organic solvent Substances 0.000 description 3
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 3
- 125000002511 behenyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000003785 benzimidazolyl group Chemical group N1=C(NC2=C1C=CC=C2)* 0.000 description 3
- WZJYKHNJTSNBHV-UHFFFAOYSA-N benzo[h]quinoline Chemical group C1=CN=C2C3=CC=CC=C3C=CC2=C1 WZJYKHNJTSNBHV-UHFFFAOYSA-N 0.000 description 3
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 description 3
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 3
- 125000006267 biphenyl group Chemical group 0.000 description 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- 239000000872 buffer Substances 0.000 description 3
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000004063 butyryl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000000609 carbazolyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3NC12)* 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 125000003897 citraconoyl group Chemical group C(\C(\C)=C/C(=O)*)(=O)* 0.000 description 3
- 150000004696 coordination complex Chemical class 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 3
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical group C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 3
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 3
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 description 3
- 125000004031 fumaroyl group Chemical group C(\C=C\C(=O)*)(=O)* 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 125000003745 glyceroyl group Chemical group C(C(O)CO)(=O)* 0.000 description 3
- 125000000350 glycoloyl group Chemical group O=C([*])C([H])([H])O[H] 0.000 description 3
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000003651 hexanedioyl group Chemical group C(CCCCC(=O)*)(=O)* 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 238000006460 hydrolysis reaction Methods 0.000 description 3
- 125000002883 imidazolyl group Chemical group 0.000 description 3
- 125000001041 indolyl group Chemical group 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000011630 iodine Substances 0.000 description 3
- 229910052740 iodine Inorganic materials 0.000 description 3
- 125000002183 isoquinolinyl group Chemical group C1(=NC=CC2=CC=CC=C12)* 0.000 description 3
- 125000000400 lauroyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 125000003099 maleoyl group Chemical group C(\C=C/C(=O)*)(=O)* 0.000 description 3
- 125000000346 malonyl group Chemical group C(CC(=O)*)(=O)* 0.000 description 3
- 125000002828 maloyl group Chemical group C(C(O)CC(=O)*)(=O)* 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 125000001419 myristoyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- JULPEDSLKXGZKK-UHFFFAOYSA-N n,n-dimethyl-1h-imidazole-5-carboxamide Chemical group CN(C)C(=O)C1=CN=CN1 JULPEDSLKXGZKK-UHFFFAOYSA-N 0.000 description 3
- 125000001038 naphthoyl group Chemical group C1(=CC=CC2=CC=CC=C12)C(=O)* 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- 125000001196 nonadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- UMRZSTCPUPJPOJ-KNVOCYPGSA-N norbornane Chemical group C1C[C@H]2CC[C@@H]1C2 UMRZSTCPUPJPOJ-KNVOCYPGSA-N 0.000 description 3
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000002811 oleoyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- WCPAKWJPBJAGKN-UHFFFAOYSA-N oxadiazole Chemical group C1=CON=N1 WCPAKWJPBJAGKN-UHFFFAOYSA-N 0.000 description 3
- 125000002971 oxazolyl group Chemical group 0.000 description 3
- 125000001312 palmitoyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 3
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 3
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical class OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 3
- 125000001792 phenanthrenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C=CC12)* 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 125000000612 phthaloyl group Chemical group C(C=1C(C(=O)*)=CC=CC1)(=O)* 0.000 description 3
- 125000001501 propionyl group Chemical group O=C([*])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 125000000561 purinyl group Chemical group N1=C(N=C2N=CNC2=C1)* 0.000 description 3
- 125000003373 pyrazinyl group Chemical group 0.000 description 3
- 125000002755 pyrazolinyl group Chemical group 0.000 description 3
- 125000003226 pyrazolyl group Chemical group 0.000 description 3
- 125000001725 pyrenyl group Chemical group 0.000 description 3
- PBMFSQRYOILNGV-UHFFFAOYSA-N pyridazine Chemical group C1=CC=NN=C1 PBMFSQRYOILNGV-UHFFFAOYSA-N 0.000 description 3
- 125000000714 pyrimidinyl group Chemical group 0.000 description 3
- 125000001422 pyrrolinyl group Chemical group 0.000 description 3
- 125000000168 pyrrolyl group Chemical group 0.000 description 3
- 125000002943 quinolinyl group Chemical group N1=C(C=CC2=CC=CC=C12)* 0.000 description 3
- 125000001567 quinoxalinyl group Chemical group N1=C(C=NC2=CC=CC=C12)* 0.000 description 3
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 125000003696 stearoyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000002730 succinyl group Chemical group C(CCC(=O)*)(=O)* 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 125000005425 toluyl group Chemical group 0.000 description 3
- 125000003944 tolyl group Chemical group 0.000 description 3
- 125000001425 triazolyl group Chemical group 0.000 description 3
- 125000004784 trichloromethoxy group Chemical group ClC(O*)(Cl)Cl 0.000 description 3
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000000876 trifluoromethoxy group Chemical group FC(F)(F)O* 0.000 description 3
- 229940075466 undecylenate Drugs 0.000 description 3
- 125000003774 valeryl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical group C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000000755 henicosyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000006038 hexenyl group Chemical group 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- OBOSXEWFRARQPU-UHFFFAOYSA-N 2-n,2-n-dimethylpyridine-2,5-diamine Chemical compound CN(C)C1=CC=C(N)C=N1 OBOSXEWFRARQPU-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- 229910020366 ClO 4 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 1
- MPCRDALPQLDDFX-UHFFFAOYSA-L Magnesium perchlorate Chemical compound [Mg+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O MPCRDALPQLDDFX-UHFFFAOYSA-L 0.000 description 1
- 229910019015 Mg-Ag Inorganic materials 0.000 description 1
- 101100496858 Mus musculus Colec12 gene Proteins 0.000 description 1
- 229910019800 NbF 5 Inorganic materials 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- SGUXGJPBTNFBAD-UHFFFAOYSA-L barium iodide Chemical compound [I-].[I-].[Ba+2] SGUXGJPBTNFBAD-UHFFFAOYSA-L 0.000 description 1
- OOULUYZFLXDWDQ-UHFFFAOYSA-L barium perchlorate Chemical compound [Ba+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O OOULUYZFLXDWDQ-UHFFFAOYSA-L 0.000 description 1
- WGEFECGEFUFIQW-UHFFFAOYSA-L calcium dibromide Chemical compound [Ca+2].[Br-].[Br-] WGEFECGEFUFIQW-UHFFFAOYSA-L 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- MOOUSOJAOQPDEH-UHFFFAOYSA-K cerium(iii) bromide Chemical compound [Br-].[Br-].[Br-].[Ce+3] MOOUSOJAOQPDEH-UHFFFAOYSA-K 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- FZFYOUJTOSBFPQ-UHFFFAOYSA-M dipotassium;hydroxide Chemical compound [OH-].[K+].[K+] FZFYOUJTOSBFPQ-UHFFFAOYSA-M 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910003472 fullerene Inorganic materials 0.000 description 1
- SBDRYJMIQMDXRH-UHFFFAOYSA-N gallium;sulfuric acid Chemical compound [Ga].OS(O)(=O)=O SBDRYJMIQMDXRH-UHFFFAOYSA-N 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 125000005980 hexynyl group Chemical group 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- FUJCRWPEOMXPAD-UHFFFAOYSA-N lithium oxide Chemical compound [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 1
- 229910001947 lithium oxide Inorganic materials 0.000 description 1
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- OTCKOJUMXQWKQG-UHFFFAOYSA-L magnesium bromide Chemical compound [Mg+2].[Br-].[Br-] OTCKOJUMXQWKQG-UHFFFAOYSA-L 0.000 description 1
- BLQJIBCZHWBKSL-UHFFFAOYSA-L magnesium iodide Chemical compound [Mg+2].[I-].[I-] BLQJIBCZHWBKSL-UHFFFAOYSA-L 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 125000003452 oxalyl group Chemical group *C(=O)C(*)=O 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- AOLPZAHRYHXPLR-UHFFFAOYSA-I pentafluoroniobium Chemical compound F[Nb](F)(F)(F)F AOLPZAHRYHXPLR-UHFFFAOYSA-I 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229910001631 strontium chloride Inorganic materials 0.000 description 1
- AHBGXTDRMVNFER-UHFFFAOYSA-L strontium dichloride Chemical compound [Cl-].[Cl-].[Sr+2] AHBGXTDRMVNFER-UHFFFAOYSA-L 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- YRGLXIVYESZPLQ-UHFFFAOYSA-I tantalum pentafluoride Chemical compound F[Ta](F)(F)(F)F YRGLXIVYESZPLQ-UHFFFAOYSA-I 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- HDUMBHAAKGUHAR-UHFFFAOYSA-J titanium(4+);disulfate Chemical compound [Ti+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O HDUMBHAAKGUHAR-UHFFFAOYSA-J 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- ZOYIPGHJSALYPY-UHFFFAOYSA-K vanadium(iii) bromide Chemical compound [V+3].[Br-].[Br-].[Br-] ZOYIPGHJSALYPY-UHFFFAOYSA-K 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/917—Electroluminescent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/239—Complete cover or casing
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Drying Of Gases (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
Description
Claims (10)
- 유기 EL재료층이 서로 대향하는 한쌍의 전극 사이에 끼워진 구조를 갖는 적층체, 상기 적층체가 배치되는 기밀용기 및 상기 기밀용기 내에 설치되어 상기 유기 EL재료층이 수분에 의해 오염되는 것을 방지하는 건조부재를 갖는 유기 EL소자에 있어서,상기 건조부재가 유기금속화합물로 구성되어 있는 것을 특징으로 하는 유기 EL소자.
- 유기 EL재료층이 서로 대향하는 한쌍의 전극 사이에 끼워진 구조를 갖는 적층체, 상기 적층체가 배치되는 기밀용기 및 상기 기밀용기 내에 설치되어 상기 유기 EL재료층이 수분에 의해 오염되는 것을 방지하는 건조부재를 갖는 유기 EL소자에 있어서,상기 건조부재가 하기 화학식 1로 나타내는 유기금속화합물로 구성되어 있는 것을 특징으로 하는 유기 EL소자.(화학식 1)[상기 화학식 1 중, R은 탄소수 1개 이상의 알킬기, 알케닐기, 아릴기, 시클로알킬기, 복소고리기 및 아실기를 포함하는 유기화합물. M은 3가의 금속원자를 나타내고, n은 1 이상의 정수를 나타낸다.]
- 유기 EL재료층이 서로 대향하는 한쌍의 전극 사이에 끼워진 구조를 갖는 적층체, 상기 적층체가 배치되는 기밀용기 및 상기 기밀용기 내에 설치되어 상기 유기 EL재료층이 수분에 의해 오염되는 것을 방지하는 건조부재를 갖는 유기 EL소자에 있어서,상기 건조부재가 하기 화학식 2로 나타내는 유기금속 착체화합물로 구성되어 있는 것을 특징으로 하는 유기 EL소자.(화학식 2)[상기 화학식 2 중, R1, R2, R3, R4및 R5는 탄소수 1개 이상의 알킬기, 알케닐기, 아릴기, 시클로알킬기, 복소고리기 및 아실기를 포함하는 유기화합물. M은 3가의 금속원자를 나타낸다.]
- 유기 EL재료층이 서로 대향하는 한쌍의 전극 사이에 끼워진 구조를 갖는 적층체, 상기 적층체가 배치되는 기밀용기 및 상기 기밀용기 내에 설치되어 상기 유기 EL재료층이 수분에 의해 오염되는 것을 방지하는 건조부재를 갖는 유기 EL소자에 있어서,상기 건조부재가 하기 화학식 3으로 나타내는 유기금속 착체화합물로 구성되어 있는 것을 특징으로 하는 유기 EL소자.(화학식 3)[상기 화학식 3 중, R1, R2, R3및 R4는 탄소수 1개 이상의 알킬기, 알케닐기, 아릴기, 시클로알킬기, 복소고리기 및 아실기를 포함하는 유기화합물. M은 4가의 금속원자를 나타낸다.]
- 제 1 항 내지 제 4 항 중 어느 한 항에 있어서,상기 유기금속화합물로 이루어지는 건조부재가 기밀용기의 내면에 배치되어 있는 것을 특징으로 하는 유기 EL소자.
- 제 1 항 내지 제 4 항 중 어느 한 항에 있어서,상기 건조부재가 상기 유기 EL층을 덮는 보호부재로 작용하도록 설치되어 있는 것을 특징으로 하는 유기 EL소자.
- 제 1 항 내지 제 4 항 중 어느 한 항에 기재된 건조부재와 무기계 건조제를병용하는 것을 특징으로 하는 유기 EL소자.
- 제 7 항에 있어서,상기 무기계 건조제가 물리적 흡착을 이용한 건조제인 것을 특징으로 하는 유기 EL소자.
- 제 7 항에 있어서,상기 무기 건조제가 화학 반응을 이용한 건조제인 것을 특징으로 하는 유기 EL소자.
- 제 1 항 내지 제 4 항 중 어느 한 항에 기재된 건조부재와, 물리적 흡착을 이용한 무기계 건조제 및 화학 반응을 이용한 무기계 건조제를 병용하는 것을 특징으로 하는 유기 EL소자.
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JP2001-101437 | 2001-03-30 | ||
JP2001101437A JP3936151B2 (ja) | 2000-05-08 | 2001-03-30 | 有機el素子 |
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KR100465042B1 true KR100465042B1 (ko) | 2005-01-13 |
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JP (1) | JP3936151B2 (ko) |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101238215B1 (ko) | 2010-12-27 | 2013-03-04 | 웅진케미칼 주식회사 | 유기전계 발광소자용 충전제 및 이를 활용한 유기전계 발광장치 |
Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100330748A1 (en) | 1999-10-25 | 2010-12-30 | Xi Chu | Method of encapsulating an environmentally sensitive device |
US7198832B2 (en) * | 1999-10-25 | 2007-04-03 | Vitex Systems, Inc. | Method for edge sealing barrier films |
JP4770013B2 (ja) * | 2000-10-13 | 2011-09-07 | ソニー株式会社 | 表示装置及びその製造方法 |
US7178927B2 (en) * | 2000-11-14 | 2007-02-20 | Semiconductor Energy Laboratory Co., Ltd. | Electroluminescent device having drying agent |
JP4023655B2 (ja) * | 2001-11-07 | 2007-12-19 | 双葉電子工業株式会社 | 透明膜状乾燥剤及び透明液状乾燥剤 |
JP2003168555A (ja) * | 2001-11-29 | 2003-06-13 | Sumitomo Electric Ind Ltd | エレクトロルミネッセンス表示装置 |
SG126714A1 (en) | 2002-01-24 | 2006-11-29 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
JP3977669B2 (ja) * | 2002-03-07 | 2007-09-19 | 双葉電子工業株式会社 | 有機el素子 |
EP1343206B1 (en) * | 2002-03-07 | 2016-10-26 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting apparatus, electronic apparatus, illuminating device and method of fabricating the light emitting apparatus |
TWI362128B (en) * | 2002-03-26 | 2012-04-11 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
US8808457B2 (en) * | 2002-04-15 | 2014-08-19 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
US8900366B2 (en) | 2002-04-15 | 2014-12-02 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
KR100474001B1 (ko) * | 2002-08-14 | 2005-03-10 | 엘지.필립스 엘시디 주식회사 | 듀얼패널타입 유기전계발광 소자 및 그의 제조방법 |
KR100858803B1 (ko) * | 2002-08-23 | 2008-09-17 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치 |
TWI304706B (ko) * | 2002-08-30 | 2008-12-21 | Au Optronics Corp | |
US20040048033A1 (en) * | 2002-09-11 | 2004-03-11 | Osram Opto Semiconductors (Malaysia) Sdn. Bhd. | Oled devices with improved encapsulation |
US6887733B2 (en) * | 2002-09-11 | 2005-05-03 | Osram Opto Semiconductors (Malaysia) Sdn. Bhd | Method of fabricating electronic devices |
US7224116B2 (en) | 2002-09-11 | 2007-05-29 | Osram Opto Semiconductors Gmbh | Encapsulation of active electronic devices |
US7193364B2 (en) * | 2002-09-12 | 2007-03-20 | Osram Opto Semiconductors (Malaysia) Sdn. Bhd | Encapsulation for organic devices |
US20040091741A1 (en) * | 2002-10-25 | 2004-05-13 | Hsien-Chang Lin | Organic electroluminescent device and method for manufacturing the same |
US7648925B2 (en) | 2003-04-11 | 2010-01-19 | Vitex Systems, Inc. | Multilayer barrier stacks and methods of making multilayer barrier stacks |
US20040238846A1 (en) * | 2003-05-30 | 2004-12-02 | Georg Wittmann | Organic electronic device |
JP3817235B2 (ja) | 2003-06-17 | 2006-09-06 | 双葉電子工業株式会社 | 捕水剤及び有機el素子 |
KR20060113884A (ko) * | 2003-08-05 | 2006-11-03 | 테크니체 우니베르시테트 브라운츠바이그 차롤오-빌헬미나 | 친유성의, 선형 또는 이차원적 다환 방향족을 포함하는층의 방지층 또는 봉지로서의 사용 및 이런 유형의 층으로구성되며 유기 중합체를 포함하는 전기 부품 |
KR100544126B1 (ko) * | 2003-08-26 | 2006-01-23 | 삼성에스디아이 주식회사 | 유기 전계 발광 소자 및 그 제조방법 |
KR100544127B1 (ko) * | 2003-08-27 | 2006-01-23 | 삼성에스디아이 주식회사 | 수분 흡수층을 구비한 유기 전계 발광 표시 장치 |
KR100544128B1 (ko) * | 2003-08-28 | 2006-01-23 | 삼성에스디아이 주식회사 | 다공성 물질층을 구비한 유기 전계 발광 표시 장치 |
KR100544131B1 (ko) * | 2003-09-03 | 2006-01-23 | 삼성에스디아이 주식회사 | 유기 전계 발광 소자 및 그 제조방법 |
TWI255153B (en) * | 2003-10-20 | 2006-05-11 | Hitachi Displays Ltd | Organic EL display device |
US20050238803A1 (en) * | 2003-11-12 | 2005-10-27 | Tremel James D | Method for adhering getter material to a surface for use in electronic devices |
US20060283546A1 (en) * | 2003-11-12 | 2006-12-21 | Tremel James D | Method for encapsulating electronic devices and a sealing assembly for the electronic devices |
US7685783B2 (en) * | 2004-01-30 | 2010-03-30 | Certainteed Corporation | Kit of parts for band joist insulation and method of manufacture |
JP2005235403A (ja) * | 2004-02-17 | 2005-09-02 | Hitachi Displays Ltd | 有機・el表示装置 |
KR100647598B1 (ko) * | 2004-04-06 | 2006-11-23 | 삼성에스디아이 주식회사 | 유기 전계 발광 소자 및 그 제조방법 |
JP5062648B2 (ja) * | 2004-04-08 | 2012-10-31 | 双葉電子工業株式会社 | 有機el素子用水分吸収剤 |
DE102004024676A1 (de) * | 2004-05-18 | 2005-12-15 | Süd-Chemie AG | Filmförmige sorbenshaltige Zusammensetzungen |
US7316756B2 (en) | 2004-07-27 | 2008-01-08 | Eastman Kodak Company | Desiccant for top-emitting OLED |
JP4573240B2 (ja) * | 2004-08-03 | 2010-11-04 | セイコーエプソン株式会社 | ラインヘッド及びこれを備えた画像形成装置 |
US20060060086A1 (en) * | 2004-09-21 | 2006-03-23 | Eastman Kodak Company | Desiccant having a reactive salt |
US20070271808A9 (en) * | 2004-09-21 | 2007-11-29 | Eastman Kodak Company | Lewis acid organometallic desiccant |
US20060087230A1 (en) * | 2004-10-22 | 2006-04-27 | Eastman Kodak Company | Desiccant film in top-emitting OLED |
US20060093795A1 (en) * | 2004-11-04 | 2006-05-04 | Eastman Kodak Company | Polymeric substrate having a desiccant layer |
JPWO2006070449A1 (ja) * | 2004-12-28 | 2008-06-12 | 大阪瓦斯株式会社 | 生産活動管理システム |
JP5596250B2 (ja) * | 2005-03-02 | 2014-09-24 | スリーエム イノベイティブ プロパティズ カンパニー | 湿気反応性組成物及び有機el素子 |
JP4717670B2 (ja) | 2005-03-24 | 2011-07-06 | 双葉電子工業株式会社 | 乾燥剤及びこれを用いた電界発光素子。 |
US7767498B2 (en) | 2005-08-25 | 2010-08-03 | Vitex Systems, Inc. | Encapsulated devices and method of making |
US8173995B2 (en) | 2005-12-23 | 2012-05-08 | E. I. Du Pont De Nemours And Company | Electronic device including an organic active layer and process for forming the electronic device |
JP5213303B2 (ja) * | 2006-01-17 | 2013-06-19 | スリーエム イノベイティブ プロパティズ カンパニー | 光硬化性吸湿性組成物及び有機el素子 |
CN101426856B (zh) * | 2006-04-18 | 2012-11-21 | 小松精练株式会社 | 热熔型构件以及有机el显示面板 |
JP5801522B2 (ja) * | 2006-08-31 | 2015-10-28 | スリーエム イノベイティブ プロパティズ カンパニー | 湿気反応性組成物及び有機el素子 |
JP4274219B2 (ja) | 2006-09-27 | 2009-06-03 | セイコーエプソン株式会社 | 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置 |
CN101165937A (zh) * | 2006-10-18 | 2008-04-23 | 清华大学 | 有机复合物p-n结及其制备方法以及应用该p-n结的有机复合物二极管 |
KR100846597B1 (ko) * | 2007-01-24 | 2008-07-16 | 삼성에스디아이 주식회사 | 함불소 화합물 및 탄소계 화합물을 포함하는 유기 발광소자 |
US7812531B2 (en) | 2007-07-25 | 2010-10-12 | Global Oled Technology Llc | Preventing stress transfer in OLED display components |
JP5348869B2 (ja) * | 2007-10-17 | 2013-11-20 | 小松精練株式会社 | 有機電子デバイス用ホットメルト型部材、バリアフィルム封止部材、それらを用いた有機電子デバイス封止パネル |
JP4920548B2 (ja) | 2007-10-31 | 2012-04-18 | 株式会社 日立ディスプレイズ | 表示装置 |
KR100981969B1 (ko) * | 2008-08-18 | 2010-09-13 | 삼성모바일디스플레이주식회사 | 유기 발광 소자 |
TWI503169B (zh) * | 2009-08-21 | 2015-10-11 | Kolon Inc | 吸收劑及包含該吸收劑的光學元件用鈍化層 |
KR20120002365A (ko) * | 2010-06-30 | 2012-01-05 | 코오롱인더스트리 주식회사 | 흡습제 및 이를 포함하는 광학소자용 보호막 |
KR101203260B1 (ko) * | 2010-08-10 | 2012-11-21 | 후다바 덴시 고교 가부시키가이샤 | 포수제와 이를 이용한 유기 전자 디바이스 |
JP2012038660A (ja) * | 2010-08-10 | 2012-02-23 | Futaba Corp | 捕水剤及びこれを用いた有機電子デバイス |
CN103718646B (zh) * | 2011-08-05 | 2016-06-29 | 三菱化学株式会社 | 有机电致发光装置及其制造方法 |
DE102012200273A1 (de) * | 2012-01-11 | 2013-07-11 | Robert Bosch Gmbh | Elektronisches Bauteil mit korrosionsgeschützter Bondverbindung und Verfahren zur Herstellung des Bauteils |
JP5889174B2 (ja) | 2012-01-31 | 2016-03-22 | 双葉電子工業株式会社 | 乾燥剤及びこれを用いた有機el素子 |
WO2014074606A1 (en) * | 2012-11-06 | 2014-05-15 | University Of Pittsburgh-Of The Commonwealth System Of Higher Education | Adjustable liposuction cannula |
WO2014156593A1 (ja) * | 2013-03-29 | 2014-10-02 | 古河電気工業株式会社 | 有機電子デバイス用素子封止用樹脂組成物、有機電子デバイス用素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置 |
JP6002075B2 (ja) * | 2013-04-09 | 2016-10-05 | 双葉電子工業株式会社 | 錯化合物、乾燥剤、封止構造及び有機el素子 |
JP5667281B1 (ja) | 2013-12-27 | 2015-02-12 | 古河電気工業株式会社 | 有機電界発光素子用充填材料及び有機電界発光素子の封止方法 |
JP5667282B1 (ja) | 2013-12-27 | 2015-02-12 | 古河電気工業株式会社 | 有機電界発光素子用充填材料及び有機電界発光素子の封止方法 |
JP6317624B2 (ja) * | 2014-05-22 | 2018-04-25 | 双葉電子工業株式会社 | 乾燥剤、封止構造及び有機el素子 |
FR3061404B1 (fr) * | 2016-12-27 | 2022-09-23 | Packaging Sip | Procede de fabrication collective de modules electroniques hermetiques |
JP6762912B2 (ja) | 2017-06-26 | 2020-09-30 | 双葉電子工業株式会社 | 有機el表示装置 |
KR20200143443A (ko) * | 2018-04-16 | 2020-12-23 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 유기 el용 투명 건조제 및 그 사용 방법 |
WO2020110534A1 (ja) * | 2018-11-30 | 2020-06-04 | コニカミノルタ株式会社 | 封止方法、封止層、封止層形成用の混合液、封止層の製造方法及び半導体装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0114258A1 (en) * | 1982-11-30 | 1984-08-01 | Kabushiki Kaisha Toshiba | Resin encapsulation type photo-semiconductor devices |
US4560716A (en) * | 1983-08-30 | 1985-12-24 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Rust preventing epoxy resin compositions |
JPH04132778A (ja) * | 1990-09-21 | 1992-05-07 | Toyo Ink Mfg Co Ltd | 印刷インキ |
JPH0665570A (ja) * | 1992-06-17 | 1994-03-08 | Toshiba Corp | 電場発光蛍光体およびその製造方法 |
JPH10147724A (ja) * | 1996-11-19 | 1998-06-02 | Kao Corp | 高吸水性樹脂組成物 |
KR19980071030A (ko) * | 1997-02-03 | 1998-10-26 | 가네꼬히사시 | 유기 el 소자 |
JP2000113990A (ja) * | 1998-10-07 | 2000-04-21 | Tdk Corp | 有機el素子および有機el表示装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5999782A (ja) * | 1982-11-30 | 1984-06-08 | Toshiba Corp | 樹脂封止型発光装置及びその製造法 |
JPS60224250A (ja) * | 1984-04-20 | 1985-11-08 | Toshiba Chem Corp | 樹脂封止形発光装置 |
JPS61160981A (ja) * | 1985-01-08 | 1986-07-21 | Toshiba Silicone Co Ltd | 樹脂封止型発光装置及びその製造方法 |
US5268145A (en) * | 1988-09-01 | 1993-12-07 | Tdk Corporation | Chemical substance-sensing element |
JPH04249590A (ja) * | 1990-12-28 | 1992-09-04 | Nissha Printing Co Ltd | 分散型エレクトロルミネッセンスシート |
JPH04255693A (ja) * | 1991-02-06 | 1992-09-10 | Nissha Printing Co Ltd | 分散型エレクトロルミネッセンスシートとその製造方法 |
JP3274527B2 (ja) * | 1992-09-22 | 2002-04-15 | 株式会社日立製作所 | 有機発光素子とその基板 |
US6111357A (en) * | 1998-07-09 | 2000-08-29 | Eastman Kodak Company | Organic electroluminescent display panel having a cover with radiation-cured perimeter seal |
JP2000324407A (ja) * | 1999-05-10 | 2000-11-24 | Matsushita Electric Ind Co Ltd | 撮像装置 |
-
2001
- 2001-03-30 JP JP2001101437A patent/JP3936151B2/ja not_active Expired - Lifetime
- 2001-05-02 TW TW090110686A patent/TW504944B/zh not_active IP Right Cessation
- 2001-05-04 US US09/848,319 patent/US6656609B2/en not_active Expired - Lifetime
- 2001-05-04 GB GB0111018A patent/GB2368192B/en not_active Expired - Fee Related
- 2001-05-08 KR KR10-2001-0024845A patent/KR100465042B1/ko active IP Right Grant
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0114258A1 (en) * | 1982-11-30 | 1984-08-01 | Kabushiki Kaisha Toshiba | Resin encapsulation type photo-semiconductor devices |
US4560716A (en) * | 1983-08-30 | 1985-12-24 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Rust preventing epoxy resin compositions |
JPH04132778A (ja) * | 1990-09-21 | 1992-05-07 | Toyo Ink Mfg Co Ltd | 印刷インキ |
JPH0665570A (ja) * | 1992-06-17 | 1994-03-08 | Toshiba Corp | 電場発光蛍光体およびその製造方法 |
JPH10147724A (ja) * | 1996-11-19 | 1998-06-02 | Kao Corp | 高吸水性樹脂組成物 |
KR19980071030A (ko) * | 1997-02-03 | 1998-10-26 | 가네꼬히사시 | 유기 el 소자 |
JP2000113990A (ja) * | 1998-10-07 | 2000-04-21 | Tdk Corp | 有機el素子および有機el表示装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101238215B1 (ko) | 2010-12-27 | 2013-03-04 | 웅진케미칼 주식회사 | 유기전계 발광소자용 충전제 및 이를 활용한 유기전계 발광장치 |
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JP3936151B2 (ja) | 2007-06-27 |
US6656609B2 (en) | 2003-12-02 |
JP2002033187A (ja) | 2002-01-31 |
TW504944B (en) | 2002-10-01 |
US20020015818A1 (en) | 2002-02-07 |
GB0111018D0 (en) | 2001-06-27 |
KR20010102945A (ko) | 2001-11-17 |
GB2368192B (en) | 2004-06-23 |
GB2368192A (en) | 2002-04-24 |
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