JP4234635B2 - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP4234635B2 JP4234635B2 JP2004133535A JP2004133535A JP4234635B2 JP 4234635 B2 JP4234635 B2 JP 4234635B2 JP 2004133535 A JP2004133535 A JP 2004133535A JP 2004133535 A JP2004133535 A JP 2004133535A JP 4234635 B2 JP4234635 B2 JP 4234635B2
- Authority
- JP
- Japan
- Prior art keywords
- heat receiving
- heat
- guide
- heating element
- pump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
周囲に位置する電子部品によって表面に熱伝達部材を設けることが難しい場合がある。
図1は、電子機器としてのポータブルコンピュータ10を開示している。ポータブルコンピュータ10は、コンピュータ本体20と表示ユニット30とを備えている。コンピュータ本体20は、扁平な箱形の第1の筐体21を備えている。
ポータブルコンピュータ10の使用中、CPU24のICチップ24bが発熱する。ICチップ24bが発する熱は、受熱面83に伝わる。ポンプハウジング71のポンプ室84と、リザーブタンク86は、液状冷媒で満たされているので、液状冷媒は、受熱面83に伝わった熱の多くを吸収する。
Claims (10)
- 発熱体を有する筐体と、
放熱部と、
上記放熱部に熱的に接続されるとともに冷媒が循環する循環経路と、
上記発熱体に熱的に接続される受熱部およびポンプ室を有するハウジングと、上記ポンプ室内に設けられたインペラと、上記インペラを回転させるモータとを有するとともに、上記循環経路に上記冷媒を送り出すポンプと、
を具備し、
上記受熱部は、上記発熱体に熱的に接続される受熱面を備え、
上記ポンプは、上記ポンプ室内において上記インペラの回転軸から離れた位置が上記発熱体と対向するように配置され、
上記受熱面は、当該受熱面において上記発熱体と対向する領域である対向領域を示すガイドを備える
ことを特徴とする電子機器。 - 上記ガイドは、上記対向領域の外縁全域を示す
ことを特徴とする請求項1に記載の電子機器。 - 上記ガイドは、上記対向領域の外縁の一部を示す
ことを特徴とする請求項1に記載の電子機器。 - 発熱体を有する筐体と、
放熱部と、
上記放熱部に熱的に接続されるとともに冷媒が循環する循環経路と、
上記発熱体に熱的に接続される受熱部およびポンプ室を有するハウジングと、上記ポンプ室内に設けられたインペラと、上記インペラを回転させるモータとを有するとともに、上記循環経路に上記冷媒を送り出すポンプと、
を具備し、
上記受熱部は、上記発熱体に熱的に接続される受熱面を備え、
上記ポンプは、上記ポンプ室内において上記インペラの回転軸から離れた位置が上記発熱体と対向するように配置され、
上記受熱面は、当該受熱面において上記発熱体と対向する領域である対向領域の中央部を示すガイドを備える
ことを特徴とする電子機器。 - 発熱体を有する筐体と、
放熱部と、
上記放熱部に熱的に接続されるとともに冷媒が循環する循環経路と、
上記発熱体に熱的に接続される受熱部およびポンプ室を有するハウジングと、上記ポンプ室内に設けられたインペラと、上記インペラを回転させるモータとを有するとともに、上記循環経路に上記冷媒を送り出すポンプと、
を具備し、
上記受熱部は、上記発熱体に熱的に接続される受熱面を備え、
上記ポンプは、上記ポンプ室内において上記インペラの回転軸から離れた位置が上記発熱体と対向するように配置され、
上記受熱面は、当該受熱面において上記発熱体と対向する領域である対向領域を示す第1のガイドと、上記対向領域の中央部を示す第2のガイドとを備える
ことを特徴とする電子機器。 - 上記第1のガイドは、上記対向領域の外縁の全域を示す
ことを特徴とする請求項5に記載の電子機器。 - 上記第1のガイドは、上記対向領域の外縁の一部を示す
ことを特徴とする請求項5に記載の電子機器。 - 発熱体を有する筐体と、
放熱部と、
上記放熱部に熱的に接続されるとともに冷媒が循環する循環経路と、
上記発熱体に熱的に接続される受熱部およびポンプ室を有するハウジングと、上記ポンプ室内に設けられたインペラと、上記インペラを回転させるモータとを有するとともに、上記循環経路に上記冷媒を送り出すポンプと、
を具備し、
上記受熱部は、上記発熱体に熱的に接続される受熱面と、上記受熱面と上記発熱体との間に介在される熱伝達部材とを備え、
上記ポンプは、上記ポンプ室内において上記インペラの回転軸から離れた位置が上記発熱体と対向するように配置され、
上記受熱面は、当該受熱面において上記熱伝達部材が設けられる領域を示すガイドを備える
ことを特徴とする電子機器。 - 上記ガイドは、上記熱伝達部材が設けられる領域の外縁の全域を示す
ことを特徴とする請求項8に記載の電子機器。 - 上記ガイドは、上記熱伝達部材が設けられる領域の外縁の一部を示す
ことを特徴とする請求項8に記載の電子機器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004133535A JP4234635B2 (ja) | 2004-04-28 | 2004-04-28 | 電子機器 |
US11/083,267 US7301771B2 (en) | 2004-04-28 | 2005-03-17 | Heat-receiving apparatus and electronic equipment |
CNB2005100594655A CN100385370C (zh) | 2004-04-28 | 2005-03-25 | 热接收装置和电子设备 |
US11/875,737 US7548425B2 (en) | 2004-04-28 | 2007-10-19 | Heat-Receiving apparatus and electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004133535A JP4234635B2 (ja) | 2004-04-28 | 2004-04-28 | 電子機器 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005317746A JP2005317746A (ja) | 2005-11-10 |
JP2005317746A5 JP2005317746A5 (ja) | 2006-08-17 |
JP4234635B2 true JP4234635B2 (ja) | 2009-03-04 |
Family
ID=35186851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004133535A Expired - Fee Related JP4234635B2 (ja) | 2004-04-28 | 2004-04-28 | 電子機器 |
Country Status (3)
Country | Link |
---|---|
US (2) | US7301771B2 (ja) |
JP (1) | JP4234635B2 (ja) |
CN (1) | CN100385370C (ja) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1923771B1 (en) | 2003-11-07 | 2015-05-20 | Asetek A/S | Cooling system for a computer system |
TWI287700B (en) * | 2004-03-31 | 2007-10-01 | Delta Electronics Inc | Heat dissipation module |
US20090218072A1 (en) | 2005-05-06 | 2009-09-03 | Andre Sloth Eriksen | Cooling system for a computer system |
TWI296187B (en) * | 2005-07-29 | 2008-04-21 | Foxconn Tech Co Ltd | Integrated liquid cooling system |
US20070227707A1 (en) * | 2006-03-31 | 2007-10-04 | Machiroutu Sridhar V | Method, apparatus and system for providing for optimized heat exchanger fin spacing |
CN101122302B (zh) * | 2006-08-11 | 2010-11-10 | 富准精密工业(深圳)有限公司 | 泵 |
US7753662B2 (en) | 2006-09-21 | 2010-07-13 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Miniature liquid cooling device having an integral pump therein |
US7430119B2 (en) * | 2006-09-29 | 2008-09-30 | Intel Corporation | Impeller and aligned cold plate |
US7404433B1 (en) * | 2007-01-31 | 2008-07-29 | Man Zai Industrial Co., Ltd. | Liquid cooled heat sink |
US7934540B2 (en) * | 2007-02-01 | 2011-05-03 | Delphi Technologies, Inc. | Integrated liquid cooling unit for computers |
TW200912621A (en) * | 2007-08-07 | 2009-03-16 | Cooligy Inc | Method and apparatus for providing a supplemental cooling to server racks |
US9453691B2 (en) * | 2007-08-09 | 2016-09-27 | Coolit Systems, Inc. | Fluid heat exchange systems |
US8746330B2 (en) | 2007-08-09 | 2014-06-10 | Coolit Systems Inc. | Fluid heat exchanger configured to provide a split flow |
US9496200B2 (en) | 2011-07-27 | 2016-11-15 | Coolit Systems, Inc. | Modular heat-transfer systems |
US9943014B2 (en) | 2013-03-15 | 2018-04-10 | Coolit Systems, Inc. | Manifolded heat exchangers and related systems |
JP5170870B2 (ja) * | 2007-11-06 | 2013-03-27 | 古河電気工業株式会社 | 冷却装置 |
US9207023B2 (en) | 2007-12-18 | 2015-12-08 | Sandia Corporation | Heat exchanger device and method for heat removal or transfer |
US8988881B2 (en) * | 2007-12-18 | 2015-03-24 | Sandia Corporation | Heat exchanger device and method for heat removal or transfer |
JP5117287B2 (ja) * | 2008-06-06 | 2013-01-16 | 株式会社日立製作所 | 電子機器の冷却装置 |
US9005417B1 (en) | 2008-10-01 | 2015-04-14 | Sandia Corporation | Devices, systems, and methods for microscale isoelectric fractionation |
US8522569B2 (en) * | 2009-10-27 | 2013-09-03 | Industrial Idea Partners, Inc. | Utilization of data center waste heat for heat driven engine |
US9795961B1 (en) | 2010-07-08 | 2017-10-24 | National Technology & Engineering Solutions Of Sandia, Llc | Devices, systems, and methods for detecting nucleic acids using sedimentation |
US8962346B2 (en) | 2010-07-08 | 2015-02-24 | Sandia Corporation | Devices, systems, and methods for conducting assays with improved sensitivity using sedimentation |
US9261100B2 (en) | 2010-08-13 | 2016-02-16 | Sandia Corporation | Axial flow heat exchanger devices and methods for heat transfer using axial flow devices |
JP6156142B2 (ja) * | 2011-04-13 | 2017-07-05 | 日本電気株式会社 | 冷却装置の配管構造、その製造方法、及び配管接続方法 |
JP5383740B2 (ja) * | 2011-04-18 | 2014-01-08 | 株式会社ソニー・コンピュータエンタテインメント | 電子機器 |
WO2012172650A1 (ja) * | 2011-06-15 | 2012-12-20 | トヨタ自動車株式会社 | 半導体素子の冷却構造 |
JP5927539B2 (ja) * | 2011-07-25 | 2016-06-01 | パナソニックIpマネジメント株式会社 | 電子機器 |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
US9244065B1 (en) | 2012-03-16 | 2016-01-26 | Sandia Corporation | Systems, devices, and methods for agglutination assays using sedimentation |
US10364809B2 (en) | 2013-03-15 | 2019-07-30 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
JP6331771B2 (ja) * | 2014-06-28 | 2018-05-30 | 日本電産株式会社 | ヒートモジュール |
US10415597B2 (en) | 2014-10-27 | 2019-09-17 | Coolit Systems, Inc. | Fluid heat exchange systems |
US9677820B2 (en) * | 2015-05-11 | 2017-06-13 | Cooler Master Co., Ltd. | Electronic device and liquid cooling heat dissipation structure thereof |
WO2017123070A1 (ko) * | 2016-01-14 | 2017-07-20 | 엘지이노텍 주식회사 | 팬 모터 |
US20170347487A1 (en) * | 2016-05-25 | 2017-11-30 | Andreas Rudnicki | Reverse flow microstructure water cooling unit with included pump for cooling of an electrical or electronic component |
WO2018004526A1 (en) * | 2016-06-28 | 2018-01-04 | Thomson Licensing | Apparatus providing a thermal interface |
CN113202773A (zh) * | 2017-08-23 | 2021-08-03 | 浙江三花智能控制股份有限公司 | 电动泵 |
US20190107122A1 (en) * | 2017-10-05 | 2019-04-11 | Asia Vital Components (China) Co., Ltd. | Slim pump structure |
JP7247517B2 (ja) * | 2018-10-24 | 2023-03-29 | 日本電産株式会社 | 冷却装置 |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
EP4150216A4 (en) | 2020-05-11 | 2023-11-01 | Coolit Systems, Inc. | LIQUID PUMPING UNITS, AND ASSOCIATED SYSTEMS AND METHODS |
US11725886B2 (en) | 2021-05-20 | 2023-08-15 | Coolit Systems, Inc. | Modular fluid heat exchange systems |
Family Cites Families (141)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4712159A (en) * | 1986-04-14 | 1987-12-08 | Thermalloy Incorporated | Heat sink clip assembly |
US5283468A (en) * | 1988-05-30 | 1994-02-01 | Canon Kabushiki Kaisha | Electric circuit apparatus |
US5089936A (en) * | 1988-09-09 | 1992-02-18 | Hitachi, Ltd. | Semiconductor module |
US5268817A (en) | 1990-04-27 | 1993-12-07 | Kabushiki Kaisha Toshiba | Portable computer with keyboard and having display with coordinate input tablet rotatably mounted to face either toward or away from keyboard when closed over keyboard |
JP2816244B2 (ja) * | 1990-07-11 | 1998-10-27 | 株式会社日立製作所 | 積層型マルチチップ半導体装置およびこれに用いる半導体装置 |
US5168926A (en) * | 1991-09-25 | 1992-12-08 | Intel Corporation | Heat sink design integrating interface material |
DE59406013D1 (de) * | 1993-06-07 | 1998-06-25 | Melcher Ag | Befestigungsvorrichtung für halbleiter-schaltelemente |
JPH0749725A (ja) | 1993-08-06 | 1995-02-21 | Sharp Corp | 情報処理装置 |
JP3385482B2 (ja) | 1993-11-15 | 2003-03-10 | 株式会社日立製作所 | 電子機器 |
US6232152B1 (en) * | 1994-05-19 | 2001-05-15 | Tessera, Inc. | Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures |
JP3392527B2 (ja) | 1994-08-01 | 2003-03-31 | 富士通株式会社 | ヒートシンクの取付構造及び固定具 |
US5594617A (en) * | 1994-12-06 | 1997-01-14 | Digital Equipment Corporation | Rotating battery hinge for a notebook computer |
JP3258198B2 (ja) | 1995-04-28 | 2002-02-18 | 株式会社東芝 | 回路モジュールの冷却装置およびこの冷却装置を有する携帯形電子機器 |
DE69525081D1 (de) | 1995-06-08 | 2002-02-28 | Ibm | Mechanische struktur einer informationsverarbeitungsvorrichtung |
KR100230253B1 (ko) | 1996-02-14 | 1999-11-15 | 윤종용 | 대물렌즈 장치 및 이의 제작방법 및 이를 적용한 광픽업장치 |
US6094180A (en) | 1996-04-05 | 2000-07-25 | Fakespace, Inc. | Gimbal-mounted virtual reality display system |
JPH104161A (ja) | 1996-06-14 | 1998-01-06 | Nippon Keiki Seisakusho:Kk | ヒートシンク取り付け装置 |
US6016006A (en) * | 1996-06-24 | 2000-01-18 | Intel Corporation | Thermal grease insertion and retention |
JPH1055227A (ja) | 1996-08-09 | 1998-02-24 | Sharp Corp | 情報処理装置 |
US5825087A (en) * | 1996-12-03 | 1998-10-20 | International Business Machines Corporation | Integral mesh flat plate cooling module |
JPH10261884A (ja) | 1997-03-17 | 1998-09-29 | Nec Home Electron Ltd | 情報処理装置の冷却構造 |
JPH10303582A (ja) | 1997-04-22 | 1998-11-13 | Toshiba Corp | 回路モジュールの冷却装置および回路モジュールを搭載した携帯形情報機器 |
US6026888A (en) * | 1997-06-02 | 2000-02-22 | Compaq Computer Corporation | Molded heat exchanger structure for portable computer |
WO1998059278A1 (fr) * | 1997-06-20 | 1998-12-30 | Hitachi, Ltd. | Systeme optique d'afficheur pour projections |
JPH1139058A (ja) | 1997-07-14 | 1999-02-12 | Ricoh Co Ltd | ペン入力型電子機器 |
US6005767A (en) | 1997-11-14 | 1999-12-21 | Vadem | Portable computer having articulated display |
US20020053421A1 (en) | 1997-09-10 | 2002-05-09 | Kabushiki Kaisha Toshiba | Heat dissipating structure for electronic apparatus |
KR100286375B1 (ko) | 1997-10-02 | 2001-04-16 | 윤종용 | 전자 시스템의 방열장치 및 방열장치가 사용된 컴퓨터 시스템 |
US6049459A (en) * | 1997-11-17 | 2000-04-11 | Lucent Technologies, Inc. | Nesting clamps for electrical components |
JPH11166500A (ja) | 1997-12-03 | 1999-06-22 | Toshiba Ave Co Ltd | ポンプ |
US6464195B1 (en) | 1997-12-04 | 2002-10-15 | Raymond Hildebrandt | Ergonomic mounting for computer screen displays |
US5903436A (en) * | 1997-12-30 | 1999-05-11 | Intel Corporation | Emulative lid/heatspreader for processor die attached to an organic substrate |
JP3366244B2 (ja) | 1998-02-04 | 2003-01-14 | 富士通株式会社 | 電子機器 |
US6281573B1 (en) * | 1998-03-31 | 2001-08-28 | International Business Machines Corporation | Thermal enhancement approach using solder compositions in the liquid state |
US6148906A (en) * | 1998-04-15 | 2000-11-21 | Scientech Corporation | Flat plate heat pipe cooling system for electronic equipment enclosure |
US6288896B1 (en) * | 1998-07-02 | 2001-09-11 | Acer Incorporated | Heat dissipation system for a laptop computer using a heat pipe |
JP4128660B2 (ja) | 1998-07-27 | 2008-07-30 | 株式会社東芝 | 電子機器 |
US6282082B1 (en) | 1998-07-31 | 2001-08-28 | Qubit, Llc | Case for a modular tablet computer system |
TW399309B (en) * | 1998-09-30 | 2000-07-21 | World Wiser Electronics Inc | Cavity-down package structure with thermal via |
US6050785A (en) * | 1998-11-04 | 2000-04-18 | Sunonwealth Electric Machine Industry Co., Ltd. | Axle balance plates for miniature heat dissipating fan assemblies |
US6532152B1 (en) * | 1998-11-16 | 2003-03-11 | Intermec Ip Corp. | Ruggedized hand held computer |
US6377452B1 (en) | 1998-12-18 | 2002-04-23 | Furukawa Electric Co., Ltd. | Heat pipe hinge structure for electronic device |
US6483445B1 (en) | 1998-12-21 | 2002-11-19 | Intel Corporation | Electronic device with hidden keyboard |
US6121680A (en) * | 1999-02-16 | 2000-09-19 | Intel Corporation | Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments |
GB2348459B (en) | 1999-03-27 | 2003-03-19 | Ibm | Lid restraint for portable computer |
JP4203782B2 (ja) * | 1999-05-19 | 2009-01-07 | ソニー株式会社 | 情報処理装置及びバッテリ |
KR100553677B1 (ko) * | 1999-06-11 | 2006-02-24 | 삼성전자주식회사 | 커버를 지지하기 위한 구조를 갖는 휴대용 컴퓨터 |
US6231371B1 (en) | 1999-06-25 | 2001-05-15 | Hewlett-Packard Company | Docking station for multiple devices |
JP4270667B2 (ja) | 1999-08-17 | 2009-06-03 | 株式会社東芝 | 回路部品の冷却装置および電子機器 |
JP3283853B2 (ja) | 1999-09-17 | 2002-05-20 | 米沢日本電気株式会社 | ドッキングステーション |
US6166907A (en) | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
JP3881488B2 (ja) | 1999-12-13 | 2007-02-14 | 株式会社東芝 | 回路モジュールの冷却装置およびこの冷却装置を有する電子機器 |
US6570764B2 (en) * | 1999-12-29 | 2003-05-27 | Intel Corporation | Low thermal resistance interface for attachment of thermal materials to a processor die |
DE20001236U1 (de) | 2000-01-25 | 2000-04-27 | Hsieh Hsin Mao | Ventilator |
US6196850B1 (en) | 2000-02-10 | 2001-03-06 | International Business Machines Corporation | Rotatable docking station for an electronic device |
JP2001230356A (ja) | 2000-02-17 | 2001-08-24 | Showa Denko Kk | クリップ付き放熱器 |
JP2001251079A (ja) | 2000-03-03 | 2001-09-14 | Diamond Electric Mfg Co Ltd | ヒートパイプを用いたヒートシンクとヒートパイプの製造方法 |
US6658472B1 (en) | 2000-03-28 | 2003-12-02 | Hewlett-Packard Development Company, L.P. | Communication systems, firewall devices, and communication methods |
US6418017B1 (en) | 2000-03-30 | 2002-07-09 | Hewlett-Packard Company | Heat dissipating chassis member |
US6430038B1 (en) | 2000-04-18 | 2002-08-06 | Hewlett-Packard Company | Computer with articulated mechanism |
US6437973B1 (en) | 2000-04-18 | 2002-08-20 | Hewlett-Packard Company | Modular mechanism for movable display |
JP2001318732A (ja) * | 2000-05-09 | 2001-11-16 | Sony Corp | 情報処理装置 |
US6313990B1 (en) | 2000-05-25 | 2001-11-06 | Kioan Cheon | Cooling apparatus for electronic devices |
JP3302350B2 (ja) | 2000-06-29 | 2002-07-15 | 株式会社東芝 | 電子機器 |
US7086452B1 (en) * | 2000-06-30 | 2006-08-08 | Intel Corporation | Method and an apparatus for cooling a computer |
WO2002013266A1 (en) * | 2000-08-03 | 2002-02-14 | Fujitsu Limited | Device and method for placing on and fixing to substrate semiconductor device and heat sink disposed on the semiconductor device |
US6327145B1 (en) | 2000-09-01 | 2001-12-04 | Intel Corporation | Heat sink with integrated fluid circulation pump |
US6296048B1 (en) | 2000-09-08 | 2001-10-02 | Powerwave Technologies, Inc. | Heat sink assembly |
JP2002099356A (ja) * | 2000-09-21 | 2002-04-05 | Toshiba Corp | 電子機器用冷却装置および電子機器 |
US6469893B1 (en) * | 2000-09-29 | 2002-10-22 | Intel Corporation | Direct heatpipe attachment to die using center point loading |
US6396687B1 (en) | 2000-10-13 | 2002-05-28 | Dell Products, L.P. | Rotating portable computer docking station |
JP2002151638A (ja) | 2000-11-08 | 2002-05-24 | Hitachi Ltd | 電子機器の冷却装置 |
US6408937B1 (en) * | 2000-11-15 | 2002-06-25 | Sanjay K. Roy | Active cold plate/heat sink |
JP3607608B2 (ja) | 2000-12-19 | 2005-01-05 | 株式会社日立製作所 | ノート型パソコンの液冷システム |
JP2002232174A (ja) | 2001-02-06 | 2002-08-16 | Hitachi Ltd | 電子装置 |
US6717798B2 (en) | 2001-03-22 | 2004-04-06 | Intel Corporation | Docking digital picture displays |
US6798429B2 (en) * | 2001-03-29 | 2004-09-28 | Intel Corporation | Intuitive mobile device interface to virtual spaces |
US20020141159A1 (en) | 2001-03-29 | 2002-10-03 | Bloemen James Andrew | Sealed and passively cooled telecommunications customer service terminal |
JP3640347B2 (ja) * | 2001-04-27 | 2005-04-20 | インターナショナル・ビジネス・マシーンズ・コーポレーション | コンピュータ装置、電気機器、筐体およびカバー |
JP2002344186A (ja) | 2001-05-15 | 2002-11-29 | Sharp Corp | 電子機器 |
JP2002353670A (ja) | 2001-05-25 | 2002-12-06 | Toshiba Home Technology Corp | ヒートシンク装置 |
US6741470B2 (en) * | 2001-06-01 | 2004-05-25 | Intel Corporation | Reusable thermal solution attachment mechanism and methods of using same |
US6488483B1 (en) | 2001-06-14 | 2002-12-03 | Hsieh Hsin-Mao | Low power loss heat dissipation fan |
FR2827115B1 (fr) | 2001-07-06 | 2003-09-05 | Alstom | Coffre pour convertisseur de puissance |
TW558611B (en) | 2001-07-18 | 2003-10-21 | Matsushita Electric Ind Co Ltd | Small pump, cooling system and portable equipment |
US6480373B1 (en) | 2001-07-24 | 2002-11-12 | Compaq Information Technologies Group, L.P. | Multifunctional foldable computer |
US6873521B2 (en) | 2001-07-24 | 2005-03-29 | Hewlett-Packard Development Company, L.P. | Multiple environment foldable computer |
JP2003044169A (ja) | 2001-07-31 | 2003-02-14 | Casio Comput Co Ltd | 電子機器 |
JP4512296B2 (ja) * | 2001-08-22 | 2010-07-28 | 株式会社日立製作所 | 可搬型情報処理装置の液冷システム |
JP3925126B2 (ja) | 2001-08-28 | 2007-06-06 | 日産自動車株式会社 | 燃料電池 |
JP2003078270A (ja) | 2001-09-07 | 2003-03-14 | Hitachi Ltd | 電子装置 |
US6752204B2 (en) * | 2001-09-18 | 2004-06-22 | Intel Corporation | Iodine-containing thermal interface material |
JP3946018B2 (ja) | 2001-09-18 | 2007-07-18 | 株式会社日立製作所 | 液冷却式回路装置 |
JP3519710B2 (ja) | 2001-09-21 | 2004-04-19 | 株式会社東芝 | 冷却装置及び冷却装置を内蔵した電子機器 |
TW561226B (en) * | 2001-09-25 | 2003-11-11 | Matsushita Electric Ind Co Ltd | Ultra-thin pump and cooling system including the pump |
JP3741092B2 (ja) | 2001-09-25 | 2006-02-01 | 松下電器産業株式会社 | 超薄型ポンプとこれを備えた冷却システム |
US20030124000A1 (en) * | 2001-12-28 | 2003-07-03 | Po-Jen Shih | Heat dissipation fan |
JP2003223238A (ja) | 2002-01-28 | 2003-08-08 | Internatl Business Mach Corp <Ibm> | コンピュータ装置、モニタユニットおよび対面ユニットの支持構造物 |
JP3961843B2 (ja) | 2002-02-08 | 2007-08-22 | 株式会社日立製作所 | 液体冷却システムを有する小型電子計算機 |
US6926070B2 (en) * | 2002-03-22 | 2005-08-09 | Intel Corporation | System and method for providing cooling systems with heat exchangers |
US6741465B2 (en) * | 2002-03-29 | 2004-05-25 | Intel Corporation | Cooling method and apparatus for handheld devices |
US6668911B2 (en) | 2002-05-08 | 2003-12-30 | Itt Manufacturing Enterprises, Inc. | Pump system for use in a heat exchange application |
US6839234B2 (en) * | 2002-05-15 | 2005-01-04 | Matsushita Electric Industrial Co., Ltd. | Cooling device and an electronic apparatus including the same |
US20030214786A1 (en) * | 2002-05-15 | 2003-11-20 | Kyo Niwatsukino | Cooling device and an electronic apparatus including the same |
US7209355B2 (en) * | 2002-05-15 | 2007-04-24 | Matsushita Electric Industrial Co., Ltd. | Cooling device and an electronic apparatus including the same |
JP3431024B1 (ja) | 2003-01-15 | 2003-07-28 | 松下電器産業株式会社 | 冷却装置 |
JP3452059B1 (ja) | 2002-05-15 | 2003-09-29 | 松下電器産業株式会社 | 冷却装置とそれを備えた電子機器 |
US6652223B1 (en) * | 2002-05-30 | 2003-11-25 | Sunonwealth Electric Machine Industry | Fan structure having horizontal convection |
JP4168669B2 (ja) | 2002-05-31 | 2008-10-22 | 松下電工株式会社 | 薄型ポンプ |
DE10225993A1 (de) * | 2002-06-12 | 2003-12-24 | Bosch Gmbh Robert | Kühlkörper |
US6856506B2 (en) | 2002-06-19 | 2005-02-15 | Motion Computing | Tablet computing device with three-dimensional docking support |
US6674642B1 (en) * | 2002-06-27 | 2004-01-06 | International Business Machines Corporation | Liquid-to-air cooling system for portable electronic and computer devices |
JP3885679B2 (ja) * | 2002-06-28 | 2007-02-21 | 株式会社日立製作所 | 電子機器 |
US6757170B2 (en) * | 2002-07-26 | 2004-06-29 | Intel Corporation | Heat sink and package surface design |
JP2004071882A (ja) * | 2002-08-07 | 2004-03-04 | Toshiba Corp | 電子機器 |
US6894899B2 (en) * | 2002-09-13 | 2005-05-17 | Hong Kong Cheung Tat Electrical Co. Ltd. | Integrated fluid cooling system for electronic components |
US6788530B2 (en) | 2002-09-24 | 2004-09-07 | International Business Machines Corporation | User friendly computer equipment, monitor unit, and monitor unit setting base |
US6829139B1 (en) | 2002-10-01 | 2004-12-07 | Danger, Inc. | Adjustable data processing display |
EP1333492B1 (en) * | 2002-11-08 | 2006-03-01 | Agilent Technologies Inc. a Delaware Corporation | Cooling a microchip on a circuit board |
TW545104B (en) * | 2002-11-28 | 2003-08-01 | Quanta Comp Inc | Cooling apparatus |
JP3981628B2 (ja) * | 2002-11-28 | 2007-09-26 | 株式会社東芝 | 冷却用ポンプ並びに電気機器及びパーソナルコンピュータ |
JP2003216278A (ja) | 2002-12-10 | 2003-07-31 | Toshiba Corp | 電子機器 |
US6924978B2 (en) * | 2002-12-27 | 2005-08-02 | Intel Corporation | Method and system for computer system ventilation |
US7079394B2 (en) * | 2003-01-08 | 2006-07-18 | Lenovo (Singapore) Pte. Ltd. | Compact cooling device |
JP2004246403A (ja) * | 2003-02-10 | 2004-09-02 | Toshiba Corp | 情報処理装置、電子機器及び電子機器の冷却方法 |
US6702007B1 (en) * | 2003-04-30 | 2004-03-09 | Kuan-Da Pan | Heat sink structure |
JP2004348650A (ja) | 2003-05-26 | 2004-12-09 | Toshiba Corp | 電子機器 |
US7055581B1 (en) * | 2003-06-24 | 2006-06-06 | Roy Sanjay K | Impeller driven active heat sink |
US7035090B2 (en) | 2003-09-04 | 2006-04-25 | Kabushiki Kaisha Toshiba | Interlocking mechanism for a display |
JP2005107122A (ja) | 2003-09-30 | 2005-04-21 | Toshiba Corp | 電子機器 |
JP2005116762A (ja) * | 2003-10-07 | 2005-04-28 | Fujitsu Ltd | 半導体装置の保護方法及び半導体装置用カバー及び半導体装置ユニット及び半導体装置の梱包構造 |
US6958910B2 (en) * | 2003-11-18 | 2005-10-25 | Kabushiki Kaisha Toshiba | Cooling apparatus for electronic apparatus |
US7019979B2 (en) * | 2003-11-21 | 2006-03-28 | Waffer Technology Corp. | Heat dissipating device having improved fastening structure |
JP2005190316A (ja) | 2003-12-26 | 2005-07-14 | Toshiba Corp | 電子機器 |
JP2005228237A (ja) * | 2004-02-16 | 2005-08-25 | Hitachi Ltd | 液冷システム及びそれを備えた電子機器 |
US7006353B2 (en) * | 2004-03-11 | 2006-02-28 | International Business Machines Corporation | Apparatus and method for attaching a heat sink to an integrated circuit module |
US7095614B2 (en) * | 2004-04-20 | 2006-08-22 | International Business Machines Corporation | Electronic module assembly |
CN2701074Y (zh) | 2004-04-29 | 2005-05-18 | 鸿富锦精密工业(深圳)有限公司 | 液冷散热装置 |
US7149087B2 (en) * | 2004-09-08 | 2006-12-12 | Thermal Corp. | Liquid cooled heat sink with cold plate retention mechanism |
US7124811B2 (en) * | 2004-12-31 | 2006-10-24 | Intel Corporation | Systems for integrated pump and cold plate |
US7077189B1 (en) * | 2005-01-21 | 2006-07-18 | Delphi Technologies, Inc. | Liquid cooled thermosiphon with flexible coolant tubes |
-
2004
- 2004-04-28 JP JP2004133535A patent/JP4234635B2/ja not_active Expired - Fee Related
-
2005
- 2005-03-17 US US11/083,267 patent/US7301771B2/en not_active Expired - Fee Related
- 2005-03-25 CN CNB2005100594655A patent/CN100385370C/zh not_active Expired - Fee Related
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2007
- 2007-10-19 US US11/875,737 patent/US7548425B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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US20080259558A1 (en) | 2008-10-23 |
CN1690920A (zh) | 2005-11-02 |
US20050243518A1 (en) | 2005-11-03 |
CN100385370C (zh) | 2008-04-30 |
US7548425B2 (en) | 2009-06-16 |
JP2005317746A (ja) | 2005-11-10 |
US7301771B2 (en) | 2007-11-27 |
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