HK1149804A1 - Methods and processes for modifying polymer material surface interactions - Google Patents
Methods and processes for modifying polymer material surface interactionsInfo
- Publication number
- HK1149804A1 HK1149804A1 HK11104086.4A HK11104086A HK1149804A1 HK 1149804 A1 HK1149804 A1 HK 1149804A1 HK 11104086 A HK11104086 A HK 11104086A HK 1149804 A1 HK1149804 A1 HK 1149804A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- processes
- methods
- polymer material
- material surface
- modifying polymer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Polymerisation Methods In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13903008P | 2008-12-19 | 2008-12-19 | |
EP08172342.1A EP2199855B1 (en) | 2008-12-19 | 2008-12-19 | Methods and processes for modifying polymer material surface interactions |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1149804A1 true HK1149804A1 (en) | 2011-10-14 |
Family
ID=40521956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK11104086.4A HK1149804A1 (en) | 2008-12-19 | 2011-04-21 | Methods and processes for modifying polymer material surface interactions |
Country Status (8)
Country | Link |
---|---|
US (1) | US9063408B2 (ko) |
EP (1) | EP2199855B1 (ko) |
JP (2) | JP5725465B2 (ko) |
KR (1) | KR101767179B1 (ko) |
CN (1) | CN101872115B (ko) |
HK (1) | HK1149804A1 (ko) |
SG (1) | SG162674A1 (ko) |
TW (1) | TWI515510B (ko) |
Families Citing this family (28)
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JP5321228B2 (ja) * | 2009-04-28 | 2013-10-23 | Jsr株式会社 | ナノインプリントリソグラフィー用光硬化性組成物及びナノインプリント方法 |
KR101653626B1 (ko) * | 2009-07-13 | 2016-09-02 | 주식회사 동진쎄미켐 | 광경화형 함불소 수지 조성물 및 이를 이용한 수지 몰드의 제조방법 |
CN102713752A (zh) * | 2010-02-05 | 2012-10-03 | 奥博杜卡特股份公司 | 大面积纳米图案的金属冲压复制方法与工艺 |
EP2546041B1 (en) * | 2010-03-10 | 2018-10-03 | Asahi Kasei Kabushiki Kaisha | Resin mold and method for manufacturing a resin mold |
SG187703A1 (en) * | 2010-08-06 | 2013-03-28 | Soken Kagaku Kk | Resin mold for nanoimprinting and manufacturing method thereof |
US9372399B2 (en) | 2010-08-26 | 2016-06-21 | Asml Netherlands B.V. | Imprint lithography method and imprintable medium |
JP5306404B2 (ja) * | 2011-03-25 | 2013-10-02 | 株式会社東芝 | パターン形成方法 |
JP6162145B2 (ja) * | 2012-01-13 | 2017-07-12 | エーエスエムエル ネザーランズ ビー.ブイ. | 自己組織化可能な重合体及びリソグラフィにおける使用方法 |
JP5959865B2 (ja) | 2012-02-09 | 2016-08-02 | キヤノン株式会社 | 光硬化物及びその製造方法 |
JP6090732B2 (ja) * | 2012-05-14 | 2017-03-08 | 東洋合成工業株式会社 | 光インプリント方法 |
DK2856258T3 (da) * | 2012-05-25 | 2021-04-06 | Micro Resist Tech Gesellschaft Fuer Chemische Materialien Spezieller Photoresistsysteme Mbh | Fremgangsmåde til fremstilling af en nanostruktureret artikel under anvendelse af nanotrykningslitografi, nanostruktureret artikel og anvendelse deraf |
JP6071255B2 (ja) * | 2012-06-04 | 2017-02-01 | キヤノン株式会社 | 光硬化物 |
WO2014041846A1 (en) | 2012-09-14 | 2014-03-20 | Pola Pharma Inc. | Use of surface free energy for differential evaluation of crystal, crystal evaluated on basis of surface free energy as index, and phrmaceutical composition prepared by containing the crystal |
KR101332323B1 (ko) * | 2013-04-01 | 2013-11-25 | 한국기계연구원 | 롤스탬프 제조장치, 이를 이용한 롤스탬프 제조방법 및 복제스탬프 제조방법 |
CN110764365B (zh) * | 2013-06-19 | 2023-10-27 | Ev 集团 E·索尔纳有限责任公司 | 用于压印光刻的压印物料 |
JP5985442B2 (ja) * | 2013-07-26 | 2016-09-06 | 株式会社東芝 | レジスト材料及びそれを用いたパターン形成方法 |
EP3074819B1 (de) * | 2013-11-29 | 2023-04-12 | EV Group E. Thallner GmbH | Stempel mit einer stempelstruktur sowie verfahren zu dessen herstellung |
JP6371076B2 (ja) * | 2014-02-24 | 2018-08-08 | 旭化成株式会社 | フィルム状モールドの製造方法 |
US10754244B2 (en) * | 2016-03-31 | 2020-08-25 | Canon Kabushiki Kaisha | Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold |
JP6754344B2 (ja) * | 2017-09-26 | 2020-09-09 | 富士フイルム株式会社 | インプリント用下層膜形成用組成物、キット、積層体、積層体の製造方法、硬化物パターンの製造方法、回路基板の製造方法 |
JP2018166222A (ja) * | 2018-07-13 | 2018-10-25 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | スタンパ構造を備えたスタンパ並びにその製造方法 |
US11549020B2 (en) | 2019-09-23 | 2023-01-10 | Canon Kabushiki Kaisha | Curable composition for nano-fabrication |
CN112731764A (zh) * | 2020-12-29 | 2021-04-30 | 苏州理硕科技有限公司 | 负性光刻胶组合物和形成光刻胶图案的方法 |
US11884977B2 (en) | 2021-03-12 | 2024-01-30 | Singular Genomics Systems, Inc. | Nanoarrays and methods of use thereof |
EP4263868A1 (en) | 2021-03-12 | 2023-10-25 | Singular Genomics Systems, Inc. | Nanoarrays and methods of use thereof |
EP4294920A1 (en) | 2021-04-27 | 2023-12-27 | Singular Genomics Systems, Inc. | High density sequencing and multiplexed priming |
WO2023034920A2 (en) | 2021-09-03 | 2023-03-09 | Singular Genomics Systems, Inc. | Amplification oligonucleotides |
WO2023172665A2 (en) | 2022-03-10 | 2023-09-14 | Singular Genomics Systems, Inc. | Nucleic acid delivery scaffolds |
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-
2008
- 2008-12-19 EP EP08172342.1A patent/EP2199855B1/en active Active
-
2009
- 2009-12-04 SG SG200908085-4A patent/SG162674A1/en unknown
- 2009-12-10 US US12/635,329 patent/US9063408B2/en active Active
- 2009-12-14 JP JP2009283148A patent/JP5725465B2/ja active Active
- 2009-12-16 TW TW098143041A patent/TWI515510B/zh active
- 2009-12-17 CN CN200910261311.2A patent/CN101872115B/zh active Active
- 2009-12-18 KR KR1020090126769A patent/KR101767179B1/ko active IP Right Grant
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2011
- 2011-04-21 HK HK11104086.4A patent/HK1149804A1/xx unknown
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2015
- 2015-02-06 JP JP2015022431A patent/JP5838002B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
KR101767179B1 (ko) | 2017-08-10 |
TWI515510B (zh) | 2016-01-01 |
JP5838002B2 (ja) | 2015-12-24 |
JP2010183064A (ja) | 2010-08-19 |
US20100160478A1 (en) | 2010-06-24 |
EP2199855B1 (en) | 2016-07-20 |
SG162674A1 (en) | 2010-07-29 |
CN101872115A (zh) | 2010-10-27 |
TW201027251A (en) | 2010-07-16 |
JP2015097293A (ja) | 2015-05-21 |
KR20100071925A (ko) | 2010-06-29 |
CN101872115B (zh) | 2015-09-30 |
JP5725465B2 (ja) | 2015-05-27 |
EP2199855A1 (en) | 2010-06-23 |
US9063408B2 (en) | 2015-06-23 |
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