JP6021986B2 - リソグラフィ装置およびデバイス製造方法 - Google Patents
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- Engineering & Computer Science (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
Claims (14)
- 液浸露光中に基板を保持する基板テーブルと、
前記液浸露光中に前記基板の半径方向外側に位置するカバープレートと、
前記基板テーブルと前記カバープレートとの間に配置された複数の節と、
前記基板テーブル内に配置された複数の温度センサと、を備え、
前記複数の温度センサの読み取り値に基づき、前記基板テーブル及び/又は前記カバープレートの一部の温度を、ある範囲のターゲット温度内に維持するように構成される液浸リソグラフィ装置。 - 前記複数の温度センサは、前記基板テーブル及び/又は前記カバープレートの一部の温度を測定する、請求項1に記載の液浸リソグラフィ装置。
- 前記基板テーブル及び/又は前記カバープレートの一部を熱的に調整する複数のヒータをさらに備える、請求項1又は2に記載の液浸リソグラフィ装置。
- 前記複数のヒータは、前記カバープレート内に埋め込まれる又は前記カバープレートの表面に取り付けられる、請求項3に記載の液浸リソグラフィ装置。
- 液浸露光中に基板を保持する基板テーブルと、
前記液浸露光中に前記基板の半径方向外側に位置するカバープレートと、
前記基板テーブルと前記カバープレートとの間に配置された複数の節と、
前記基板テーブル及び/又は前記カバープレートの一部を熱的に調整する複数のヒータと、を備え、
前記複数のヒータによる熱的な調整に基づき、前記基板テーブル及び/又は前記カバープレートの一部の温度を、ある範囲のターゲット温度内に維持するように構成される液浸リソグラフィ装置。 - 前記基板と前記基板テーブルとの間に位置し、前記基板を支持するように配置された基板ホルダをさらに備える、請求項1〜5のいずれか1項に記載の液浸リソグラフィ装置。
- 前記基板と前記基板ホルダとの間、及び/又は、前記基板ホルダと前記基板テーブルとの間に配置された複数の節をさらに備える、請求項6に記載の装置。
- 前記カバープレート及び前記基板ホルダの下の前記複数の節の支持面が平面を形成する、請求項7に記載の装置。
- 前記カバープレートと前記基板テーブルとの間に断熱材をさらに備える、請求項1〜8のいずれか1項に記載の液浸リソグラフィ装置。
- 前記基板テーブル、前記カバープレート、又は、前記基板テーブル及び前記カバープレートの両方に適用されて、前記カバープレートへの又は前記カバープレートからの熱伝導を減少させる反射性コーティングをさらに備える、請求項1〜9のいずれか1項に記載の液浸リソグラフィ装置。
- 前記カバープレートは前記複数の節に対して着脱可能である、請求項1〜10のいずれか1項に記載の液浸リソグラフィ装置。
- 前記基板と前記基板上に放射ビームを投影する投影システムとの間の領域に液体を提供する液体供給システムを備える、請求項1〜11のいずれか1項に記載の液浸リソグラフィ装置。
- 液浸露光中、基板テーブル上に保持された基板上に液体を通して放射ビームを投影するステップと、
カバープレートを、前記基板テーブルと前記カバープレートとの間に配置された複数の節を用いて、前記基板の半径方向外側の位置で前記基板テーブル上に支持するステップと、を含み、
複数の温度センサが前記基板テーブル内に配置され、
前記複数の温度センサの読み取り値に基づき、前記基板テーブル及び/又は前記カバープレートの一部の温度を、ある範囲のターゲット温度に維持する、デバイス製造方法。 - 液浸露光中、基板テーブル上に保持された基板上に液体を通して放射ビームを投影するステップと、
カバープレートを、前記基板テーブルと前記カバープレートとの間に配置された複数の節を用いて、前記基板の半径方向外側の位置で前記基板テーブル上に支持するステップと、を含み、
複数のヒータが、前記基板テーブル及び/又は前記カバープレートの一部を熱的に調整するように配置され、
前記複数のヒータによる熱的な調整に基づき、前記基板テーブル及び/又は前記カバープレートの一部の温度を、ある範囲のターゲット温度に維持する、デバイス製造方法。
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US11/321,461 US7649611B2 (en) | 2005-12-30 | 2005-12-30 | Lithographic apparatus and device manufacturing method |
US11/321,461 | 2005-12-30 |
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JP2020115237A (ja) * | 2005-12-30 | 2020-07-30 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置およびデバイス製造方法 |
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