JP5418601B2 - 放熱機器及び放熱機器の製造方法 - Google Patents
放熱機器及び放熱機器の製造方法 Download PDFInfo
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- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
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Description
さらに、上記突起および上記フィン溝は、それぞれ上記フィン溝の長手方向に複数個に分割されるように形成したことにより、周囲温度が極めて低い環境下においても、上記フィン溝および上記突起それぞれの膨張収縮量を減らすことができ、上記放熱フィンと上記フィン溝の側面との接触面および上記放熱フィンと上記突起の上部との接触面における接触面積を大きく確保することができる。
図3は、実施の形態1における放熱機器の正面図を示すものである。このうち、図3(a)は、放熱フィン支持基盤1に形成された複数の平行なフィン溝2に、一個のフィン溝2に対して一個の放熱フィン4が装着されている状態を示す図である。また、フィン溝2の底面から所定の高さを有する第一の突起3が露出している。ここで第一の突起3の高さは、フィン溝2の上端部よりも低くなるように構成されている。このため、放熱フィン4をフィン溝2の高さ方向に対して斜めに傾けた状態でも、フィン溝2や第一の突起3と干渉することなく挿入することができ、放熱機器の製造工程において放熱フィン4の挿入が容易になる。
図8は、実施の形態2における放熱機器の正面図を示すものである。なお、図3と同一の構成には同一の符号を付し、それらの説明を省略する。実施の形態1との違いは、一個のフィン溝に対して二個の放熱フィンを装着する点及び突起の形状である。
実施の形態1及び実施の形態2においては、第一の突起3、第二の突起11及びフィン溝2それぞれの溝長手方向の長さは、放熱フィン支持基盤1の溝長手方向の長さと同じでかつそれぞれが一連のものであった。この実施の形態3では、例えば実施の形態1における第一の突起3及びフィン溝2をそれぞれ溝長手方向に複数個に分割し、分割された第一の突起3とフィン溝2がそれぞれ同じ長さで対をなして配置されている。
実施の形態3においては、フィン溝2及び第一の突起3それぞれ溝長手方向に二個に分割したが、それぞれを例えば溝長手方向に三個に分割し、分割したフィン溝及び突起それぞれの高さを変えることも可能である。
2 フィン溝
3 第一の突起
4 放熱フィン
5 プレス刃
9 発熱素子
11 第二の突起
12 第三の突起
Claims (4)
- 複数の放熱フィンと、
上記放熱フィンを装着する複数の平行なフィン溝とこのフィン溝の底面から所定の高さ露出して上記放熱フィンの固定に使用する突起とが形成された放熱フィン支持基盤と、を備え、
上記突起の上部が上記放熱フィンの一側面を押し付けることにより、
上記放熱フィンの他側面が上記フィン溝の側面に押圧され、
上記放熱フィンが上記突起の上部と上記フィン溝の側面との間に固定されるようにした放熱機器において、
上記突起および上記フィン溝は、それぞれ上記フィン溝の長手方向に複数個に分割されたことを特徴とする放熱機器。 - 上記フィン溝の長手方向に複数個に分割された突起は、突起の高さが異なることを特徴と
する請求項1に記載の放熱機器。 - 上記フィン溝の長手方向に3個以上に分割された上記突起のうち、上記放熱フィン支持
基盤の上記フィン溝の長手方向の両側に配置された突起の高さよりも、上記放熱フィン支
持基盤の上記フィン溝の長手方向の中央部に配置された突起の高さの方が高いことを特長
とする請求項1に記載の放熱機器。 - 放熱フィン支持基盤の一面に複数の平行なフィン溝と突起とを同時に形成する工程と、
一個のフィン溝に対して一または二個の放熱フィンを上記フィン溝に装着する工程と、
上記放熱フィン支持基盤に、上記突起および上記フィン溝を、それぞれ上記フィン溝の長手方向に分割する工程と、
放熱フィンの上部にプレス刃を当接させ、同時に上記フィン溝の側面のうち放熱フィンが装着されていない側の側面と、上記突起の側面のうち上記放熱フィンの側面に対向していない側の側面の間にプレス刃を挿入する工程と、
上記プレス刃をプレス機により加重することにより、上記突起を放熱フィン側に傾倒させて、上記突起の上部を放熱フィンの一側面に押し付けて放熱フィンをカシメる工程と、
を含む放熱機器の製造方法。
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PCT/JP2009/006141 WO2011061779A1 (ja) | 2009-11-17 | 2009-11-17 | 放熱機器及び放熱機器の製造方法 |
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JP5418601B2 true JP5418601B2 (ja) | 2014-02-19 |
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US (1) | US9134076B2 (ja) |
EP (1) | EP2503593B1 (ja) |
JP (1) | JP5418601B2 (ja) |
CN (1) | CN102668066B (ja) |
TW (1) | TWI434020B (ja) |
WO (1) | WO2011061779A1 (ja) |
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CN104145331B (zh) * | 2012-01-31 | 2017-09-29 | 三菱电机株式会社 | 半导体装置和其制造方法 |
TWI454333B (zh) * | 2012-03-16 | 2014-10-01 | Inventec Corp | 熱交換器的製造方法 |
JP6009209B2 (ja) * | 2012-04-26 | 2016-10-19 | 三菱電機株式会社 | ヒートシンクの製造方法およびヒートシンク一体型半導体モジュールの製造方法 |
US20130308273A1 (en) * | 2012-05-21 | 2013-11-21 | Hamilton Sundstrand Space Systems International | Laser sintered matching set radiators |
US20130306293A1 (en) * | 2012-05-21 | 2013-11-21 | Hamilton Sundstrand Space Systems International | Extruded matching set radiators |
JP5784546B2 (ja) * | 2012-05-29 | 2015-09-24 | 三菱電機株式会社 | フィン嵌合装置 |
EP2854169B1 (en) * | 2012-07-31 | 2017-09-06 | Mitsubishi Electric Corporation | Electric power semiconductor device |
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US20120227952A1 (en) | 2012-09-13 |
WO2011061779A1 (ja) | 2011-05-26 |
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US9134076B2 (en) | 2015-09-15 |
EP2503593A4 (en) | 2014-01-15 |
TW201118331A (en) | 2011-06-01 |
CN102668066B (zh) | 2015-04-29 |
TWI434020B (zh) | 2014-04-11 |
EP2503593A1 (en) | 2012-09-26 |
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CN102668066A (zh) | 2012-09-12 |
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