WO2008123488A1 - 半導体素子の放熱器及びその製造方法 - Google Patents

半導体素子の放熱器及びその製造方法 Download PDF

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Publication number
WO2008123488A1
WO2008123488A1 PCT/JP2008/056288 JP2008056288W WO2008123488A1 WO 2008123488 A1 WO2008123488 A1 WO 2008123488A1 JP 2008056288 W JP2008056288 W JP 2008056288W WO 2008123488 A1 WO2008123488 A1 WO 2008123488A1
Authority
WO
WIPO (PCT)
Prior art keywords
radiator
fixation
section
fixed
producing
Prior art date
Application number
PCT/JP2008/056288
Other languages
English (en)
French (fr)
Inventor
Takumi Koyama
Tadashi Yoshimura
Yousuke Watanabe
Mitsuya Miyamoto
Original Assignee
Mizutani Electric Ind.Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mizutani Electric Ind.Co., Ltd. filed Critical Mizutani Electric Ind.Co., Ltd.
Priority to JP2009509241A priority Critical patent/JP5368973B2/ja
Publication of WO2008123488A1 publication Critical patent/WO2008123488A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/12—Fastening; Joining by methods involving deformation of the elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

　放熱器１Ａは、支持基板１０と複数の放熱フィン２０と、を主に有する。支持基板１０は、上面部１１側に固定溝１３を複数本有する。固定溝１３には、突起１４が複数本凸設される。放熱器１Ａは、突起１４を押圧してなる第１曲折部１５ａと第２曲折部１５ｂ（フィン固定部）を有し、第１曲折部１５ａにより、一の放熱フィン２０の第２被固定部２５を固定溝１３に固定し、第２曲折部１５ｂにより、他の放熱フィン２０´の第１被固定部２４´を固定溝１３に固定している。放熱器１Ａの製造方法は、基板製造段階と、フィン成形段階と、固定段階とを含む。本発明によれば、部品点数が少なく、簡易な構成で安価に製造できる半導体素子の放熱器及びその製造方法を提供することができる。
PCT/JP2008/056288 2007-03-30 2008-03-31 半導体素子の放熱器及びその製造方法 WO2008123488A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009509241A JP5368973B2 (ja) 2007-03-30 2008-03-31 半導体素子の放熱器及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007091855 2007-03-30
JP2007-091855 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008123488A1 true WO2008123488A1 (ja) 2008-10-16

Family

ID=39830966

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056288 WO2008123488A1 (ja) 2007-03-30 2008-03-31 半導体素子の放熱器及びその製造方法

Country Status (2)

Country Link
JP (1) JP5368973B2 (ja)
WO (1) WO2008123488A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010006875A1 (en) * 2008-06-23 2010-01-21 Amer S.P.A. Improved heat sink, frequency converter comprising said heat sink and method for producing said heat sink
JP2010219428A (ja) * 2009-03-18 2010-09-30 Delong Chen Ｌｅｄ放熱器の構造
EP2503593A1 (en) * 2009-11-17 2012-09-26 Mitsubishi Electric Corporation Heat dissipating device and method for manufacturing heat dissipating device
JP2015099904A (ja) * 2013-11-18 2015-05-28 崇賢 ▲黄▼ ヒートシンク
KR101654052B1 (ko) * 2016-04-05 2016-09-05 주식회사 금오산업 조립식 방열체
CN111902020A (zh) * 2020-07-16 2020-11-06 深圳市飞荣达科技股份有限公司 一种散热组件及其安装方法
WO2024024372A1 (ja) * 2022-07-25 2024-02-01 ローム株式会社 半導体装置、電力変換ユニットおよび半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07193383A (ja) * 1993-12-27 1995-07-28 Nippon Light Metal Co Ltd ヒートシンク及びその製造方法並びにその加工用治具
JPH08111480A (ja) * 1994-08-18 1996-04-30 Fuji Electric Co Ltd 冷却フィン及びその形成方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS617039U (ja) * 1984-06-19 1986-01-16 住友軽金属工業株式会社 ヒ−トシンク
JP3033066U (ja) * 1996-07-01 1997-01-17 水谷電機工業株式会社 放熱器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07193383A (ja) * 1993-12-27 1995-07-28 Nippon Light Metal Co Ltd ヒートシンク及びその製造方法並びにその加工用治具
JPH08111480A (ja) * 1994-08-18 1996-04-30 Fuji Electric Co Ltd 冷却フィン及びその形成方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010006875A1 (en) * 2008-06-23 2010-01-21 Amer S.P.A. Improved heat sink, frequency converter comprising said heat sink and method for producing said heat sink
JP2010219428A (ja) * 2009-03-18 2010-09-30 Delong Chen Ｌｅｄ放熱器の構造
EP2503593A1 (en) * 2009-11-17 2012-09-26 Mitsubishi Electric Corporation Heat dissipating device and method for manufacturing heat dissipating device
EP2503593A4 (en) * 2009-11-17 2014-01-15 Mitsubishi Electric Corp THERMAL DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THERMAL DISSIPATION DEVICE
US9134076B2 (en) 2009-11-17 2015-09-15 Mitsubishi Electric Corporation Radiator and method of manufacturing radiator
JP2015099904A (ja) * 2013-11-18 2015-05-28 崇賢 ▲黄▼ ヒートシンク
KR101654052B1 (ko) * 2016-04-05 2016-09-05 주식회사 금오산업 조립식 방열체
WO2017175940A1 (ko) * 2016-04-05 2017-10-12 주식회사 금오산업 조립식 방열체
CN111902020A (zh) * 2020-07-16 2020-11-06 深圳市飞荣达科技股份有限公司 一种散热组件及其安装方法
WO2024024372A1 (ja) * 2022-07-25 2024-02-01 ローム株式会社 半導体装置、電力変換ユニットおよび半導体装置の製造方法

Also Published As

Publication number Publication date
JPWO2008123488A1 (ja) 2010-07-15
JP5368973B2 (ja) 2013-12-18

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