JP2012084900A - 発光ダイオードパッケージ及びその製造方法 - Google Patents
発光ダイオードパッケージ及びその製造方法 Download PDFInfo
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- Engineering & Computer Science (AREA)
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- Led Device Packages (AREA)
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Abstract
【解決手段】LEDパッケージ30は上面40および底面を有し、その上面40上に複数の上部導電性要素および上部導熱性要素を有するサブマウント32を備える。LED34が、上部要素に印加された電気信号がLED34を発光させるように、上部要素の1つの上に設けられる。導電性要素は、LEDからの熱をサブマウントの上面の大部分にわたって拡散する。下部導熱性要素が、サブマウントの底面上に設けられ、サブマウントからの熱を拡散し、レンズ70が、LEDの上に直接に形成される。
【選択図】図2a
Description
lead)、コンタクトまたはトレース(trace)を備える。図1aに図示される典型的なLEDパッケージ10においては、LEDチップ12が、はんだ接合剤(solder bond)または導電性エポキシ樹脂(conductive epoxy)を用いて反射カップ13上に取り付けられる。1つ又は複数のワイヤボンド11が、リード15Aおよび/または15BにLEDチップ12のオーミックコンタクトを接続しており、リード15Aおよび/または15Bは、反射カップ13に付着されていても、反射カップ13と一体化されていてもよい。反射カップ13は、燐光体などの波長変換物質を含む封入材料(encapsulant material)16を充填されていてもよい。LEDによって第1の波長で発せられた光が燐光体によって吸収されてもよく、燐光体はそれに応答して第2の波長で光を発してもよい。次に、アセンブリ全体が、透明の保護樹脂14内に封入されるが、透明の保護樹脂14は、LEDチップ12から発せられる光を平行にするために、レンズ形状に成形されてもよい。反射カップ13は上方向に光を方向付けることができるが、光が反射される際に光学的損失が生じる場合がある(すなわち、光の幾分かが反射されずに、反射体カップに吸収される場合がある。)。さらに、図1aに図示されるパッケージ10などのパッケージに関して、リード15A、15Bを介して熱を取り出すことが困難な場合があるため、保熱(heat retention)が問題となることがある。
用することが可能であり、以下の実施形態を参照する本発明の説明は、そのような特定の実施形態または同様の実施形態に限定するものとして解釈されるべきではない。
族窒化物ベースの材料系である。III族窒化物とは、窒素と、周期表のIII族中の元素(通常はアルミニウム(Al)、ガリウム(Ga)およびインジウム(In))との間で形成される半導体化合物を指す。また、III族窒化物という語は、アルミニウムガリウム窒化物(AlGaN)及びアルミニウムインジウムガリウム窒化物(AlInGaN)などの三元化合物および四元化合物を指す。好ましい実施形態においては、ドープ層はガリウム窒化物(GaN)であり、活性領域はInGaNである。代替実施形態においては、ドープ層は、AlGaN、アルミニウムガリウムヒ化物(AlGaAs)またはアルミニウムガリウムインジウムヒ化リン化物(AlGaInAsP)であってもよい。
ドを介してなど、パッド38に印加され、電気信号は、電流拡散構造体36のフィンガー37とLEDの上面とを介して、LED34内に拡散する。電流拡散構造体は、LEDにおいてしばしば使用され、上面はp型であるが、n型材料についても使用することが可能である。
に記載されており、これらは共に参照により本明細書に組み込まれる。あるいは、電気泳動堆積法(EPD)などの他の方法を使用してLEDを被覆することが可能であり、1つの適切なEPD方法が、「Close Loop Electrophoretic Deposition of Semiconductor Devices」と題された特許文献6に記載されており、これもまたは参照により本明細書に組み込まれる。また、本発明によるLEDパッケージは、種々の色の複数のLEDを有することが可能であり、それらの中の1つ又は複数が白色発光であってもよいことが理解される。
m×3.2mmであることが可能であり、どちらの場合でも概して正方形の形状である。さらに、サブマウントは、円形、矩形または他の多辺形の形状を含む他の形状を有することが可能であることが理解される。
あることが理解される。
料を含むことが可能であり、適切な材料は金(Au)である。ESD素子/ダイオードを伴わずに、またはLEDパッケージ30の外部に存在するESD素子/ダイオードを伴って、本発明によるLEDパッケージの他の実施形態を提供することが可能であることが理解される。
下の図4aおよび図4bにおいて同一の参照番号が使用される。LEDパッケージ100は、サブマウント32、LED34、レンズ70およびワイヤボンド64、65を備える。LEDパッケージ30と同様に、LEDパッケージ100は、表面実装用に構成されるが、サブマウント32の一側部での接触を可能にする導電性パッドについて異なる構成を有する。
第1および第2のコンタクトパッド50、52に印加される電気信号が、LED34に伝達され、LED34を発光させる。
実装することが可能である。これらの実施形態においては、変換材料は、ワイヤボンディングの後にLED上に堆積させることが可能である。任意の212において、従来の材料または燐光体をLED上に堆積するが、電気泳動堆積またはEPDなどの多数の様々な既知の燐光体堆積方法を使用することが可能である。多数の様々な燐光体堆積プロセスを、上述の特許文献中に説明される適切なEPDプロセスと共に用いることが可能である。
Claims (11)
- 上面および底面を有するサブマウントと、
前記サブマウントの前記上面の上の複数の上部導電性要素および上部導熱性要素と、
前記上部要素のうちの1つの上のLEDであって、前記上部要素に印加された電気信号が前記LEDを発光させ、前記導電性要素は前記LEDからの熱を前記サブマウントの前記上面の大部分にわたって拡散するものであるLEDと、
前記上部要素と電気的接触状態になく、前記サブマウントからの熱を伝達する、前記底面の上の下部導熱性要素と、
前記LEDの上に直接に形成されたレンズと
を備えることを特徴とするLEDパッケージ。 - 前記上部要素は、一体化された第1のコンタクトパッドと、第2のコンタクトパッドとを有する付着パッドを備えることを特徴とする請求項1に記載のLEDパッケージ。
- 前記LEDは、前記付着パッドに取り付けられ、
前記付着パッドは、前記サブマウントの前記上面の上で、前記LEDの端部を越えて延在することを特徴とする請求項2に記載のLEDパッケージ。 - 前記付着パッドは、前記上面の上で、前記LEDの前記端部を越えて径方向に延在することを特徴とする請求項3に記載のLEDパッケージ。
- 前記上部要素は、前記上面の50%超を覆うことを特徴とする請求項1に記載のLEDパッケージ。
- 前記底面の上の第1および第2の実装パッドと、
前記サブマウントを貫通して延在する複数の導電性ビアと
をさらに備えることを特徴とする請求項1に記載のLEDパッケージ。 - 前記第1および第2の実装パッドは、前記第1および第2のコンタクトパッドと少なくとも部分的にそれぞれ整列され、
前記ビアは、前記実装パッドと前記コンタクトパッドとの間の電気パスの間を延在すること、および、前記電気パスを提供することを特徴とする請求項6に記載のLEDパッケージ。 - 静電放電から前記LEDを保護するためにESD素子をさらに備えることを特徴とする請求項1に記載のLEDパッケージ。
- 前記上部要素の少なくとも一部分を覆うソルダマスクをさらに備えることを特徴とする請求項1に記載のLEDパッケージ。
- 前記レンズの端部と前記上面の端部との間に存在し、前記上面および前記上部要素を覆う保護層をさらに備えることを特徴とする請求項1に記載のLEDパッケージ。
- LEDパッケージを製造する方法であって
複数のLEDパッケージサブマウントに分離されるように寸法を設定されたサブマウントパネルを設けるステップと、
複数のLEDパッケージのための前記サブマウントパネルの1つの表面の上に上部導電性要素を形成するステップと、
前記上部要素にLEDを付着するステップであって、前記LEDは前記上部導電性要素
に電気的に接続されるステップと、
前記LEDの上にレンズを成形するステップと、
前記基板パネルを個片化して、複数のLEDパッケージに分離するステップと
を含むことを特徴とする方法。
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JP2009111395A (ja) | 2009-05-21 |
US20150236219A1 (en) | 2015-08-20 |
US20090108281A1 (en) | 2009-04-30 |
US20210143302A1 (en) | 2021-05-13 |
US9070850B2 (en) | 2015-06-30 |
JP2013093604A (ja) | 2013-05-16 |
EP2056363A2 (en) | 2009-05-06 |
EP2056363A3 (en) | 2014-09-10 |
EP2056363B1 (en) | 2022-01-12 |
US11791442B2 (en) | 2023-10-17 |
US10892383B2 (en) | 2021-01-12 |
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