CN107735834B - 具有改进的可靠性的盘驱动器头部悬架结构 - Google Patents

具有改进的可靠性的盘驱动器头部悬架结构 Download PDF

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CN107735834B
CN107735834B CN201680038786.3A CN201680038786A CN107735834B CN 107735834 B CN107735834 B CN 107735834B CN 201680038786 A CN201680038786 A CN 201680038786A CN 107735834 B CN107735834 B CN 107735834B
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dielectric layer
disk drive
head suspension
drive head
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CN107735834A (zh
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M·C·克里斯滕松
D·M·格勒申
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Hutchinson Technology Inc
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49025—Making disc drive

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)

Abstract

一种盘驱动器头部悬挂或挠曲件及其制造方法。实施例包括诸如端子焊盘或悬空引线的部分，其包括基底层，基底层上的电介质层，导体层，电介质层和导体层之间的种子层以及导体层的种子层侧上的抗腐蚀性金属层。种子层具有延伸超过电介质层的边缘的条带。抗腐蚀性金属层在种子层的条带上方延伸并与电介质层的边缘接触。

Description

具有改进的可靠性的盘驱动器头部悬架结构
相关申请的交叉引用
本申请要求享有2015年6月30日提交的题为“DISK DRIVE HEAD SUSPENSIONSTRUCTURES HAVING IMPROVED GOLD-DIELECTRIC JOINT RELIABILITY”的美国临时申请No.62/186721的权益，其出于所有目的以引用的方式整体并入本文中。
技术领域
本发明总体上涉及盘驱动器头部悬架(head suspension)和挠曲件(flexure)。本发明的实施例涉及具有金(和其它耐腐蚀材料)-电介质界面的结构和制造方法。
背景技术
集成的引线或无线盘驱动器头部悬架和挠曲件通常包括具有相对抗腐蚀性材料(例如金和/或镍)的结构，该材料被镀覆或以其他方式施加到相对更易受腐蚀的导体(例如铜或铜合金)的表面上。金有时通过聚酰亚胺或其他电介质层中的开口镀覆到导体上。在这些类型的结构中，金镀层的边缘可以与电介质形成接合面或界面。例如，Yonekura等人的美国专利申请公开2013/0242436在图19C中公开了具有这类结构的“背面接入(backsideaccess)”挠曲端子。布线层上的端子面被金属层和绝缘层中的通孔暴露，并且端子面被镀金。
不幸的是，这些类型的结构中的金镀层和电介质层之间的接合易于分离。在金镀层和电介质层之间形成的任何空隙或缝隙可以提供湿气或其他物质通向导体的通路，使导体容易受到不希望的腐蚀。因此，持续需要具有增强的金-电介质接合面可靠性的改进结构。特别期望有可以高效制造的这些类型的结构。
发明内容
本发明的实施例包括具有诸如端子焊盘或悬空迹线(flying trace)的部分的盘驱动器头部悬架或挠曲件，其包括电介质层、导体层、电介质层和导体层之间的种子层以及在导体层的种子层侧的抗腐蚀层。种子层具有延伸超过电介质层的边缘的条带。抗腐蚀层在种子层的条带上方延伸并与电介质层的边缘接触。其他实施例包括在电介质层的与种子层相对的一侧上的基底层。
附图说明
图1是根据本发明实施例的具有抗腐蚀性材料-电介质接合面的挠曲件的部分的详细图示。
图2a-2e是根据本发明的实施例在制造图1中所示的挠曲件的部分的过程中的一系列过程步骤的结构的详细图示。
具体实施方式
图1是根据本发明的实施例的具有抗腐蚀性材料-电介质界面或接合面的集成引线悬架或挠曲件8的部分10的图示。如图所示，部分10包括可以是诸如不锈钢的弹簧金属的基底层12，以及在基底层的表面上的聚酰亚胺或其它电介质层14。导体层16在电介质层14的与基底层12相对的一侧上。导体层16在实施例中包括铜或铜合金，一种在暴露于湿气和其他物质时相对易受腐蚀的金属。在实施例中包括铬的种子层18位于电介质层14和导体层16之间。在所示实施例中，电介质层14的至少一部分和基体层12的一部分限定了边缘。种子层18的部分或条带22延伸超过电介质层14的边缘20。抗腐蚀性层24位于导体层16的面向种子层18的表面上，并且包括覆盖种子层的条带22并且接触电介质层14的部分26，以在边缘20处形成与电介质层的接合面或界面。在实施例中，抗腐蚀性层24包括金和/或镍，其当暴露于湿气和其他物质时相对于导体层16而言更耐腐蚀。
部分10可以是挠曲件8上的几个不同结构中的任何一个。在实施例中，例如，抗腐蚀性层24以及导体层16的相邻部分可以是集成引线的背面接入端子焊盘(例如用于连接到挠曲件上的第二级致动器电机(未示出)，或者在挠曲件的尾部上，用于连接到至盘驱动器电子器件的其它连接器(未示出))。在这些和其它实施例中，抗腐蚀性层24以及导体层16的相邻部分在挠曲件8上也可以是基底层未支撑的或悬空引线。挠曲件8的这些和其他实施例可以包括具有诸如10的部分的其他结构，其具有根据本发明的实施例的抗腐蚀性材料-电介质界面。
种子层18的部分或条带22提供了抗腐蚀性层24附着到其上的表面，由此增强了抗腐蚀性材料-电介质界面的强度和完整性。因此，抗腐蚀性材料-电介质界面不易分离，并降低了界面处导体层16上的腐蚀可能性。在实施例中，条带22可以具有大约300nm的深度(例如，条带的边缘与电介质层14之间的距离)。在其他实施例中，条带22的深度可以是更大或更小的距离。条带22的深度和其它尺寸例如可以基于多个因素中的任何一个来确定，所述因素例如电介质层14、导体层16、种子层18和/或抗腐蚀性层24的性质和/或尺寸，和/或部分10的性质(例如，部分10受到可能趋于损害界面完整性的应力的程度)。
可以参照图2a-2e描述包括用于形成具有部分10的挠曲件8的一系列步骤的方法的实施例。图2a是处于制造的中间阶段的挠曲件8'和部分10'的图示，包括具有上覆的基底层12、电介质层14、种子层18和导体层16的结构。传统的加成沉积和/或减成工艺，例如结合光刻(例如，使用图案化和/或未图案化的光刻胶掩模)的湿法(例如化学)和干法(例如等离子体)蚀刻、电镀和无电式镀覆以及溅射工艺可以用于制造挠曲件8以及挠曲件的中间结构8'。这些类型的加成和减成工艺例如大体上在以下美国专利中公开，出于所有目的，所有这些以引用的方式并入本文：Bennin等人的题为Low Resistance Ground Joints for DualStage Actuation Disk Drive Suspensions的美国专利8885299，Rice等人的题为Integrated Lead Suspension with Multiple Trace Configurations的美国专利8169746，Hentges等人的题为Multi-Layer Ground Plane Structures for IntegratedLead Suspensions的美国专利8144430，Hentges等人的题为Multi-Layer Ground PlaneStructures for Integrated Lead Suspensions的美国专利7929252，Swanson等人的题为Method for Making Noble Metal Conductive Leads for Suspension Assemblies的美国专利7388733，Peltoma等人的题为Plated Ground Features for Integrated LeadSuspensions的美国专利7384531。
如图2b所示，可以从部分10'处的挠曲件8'的结构中去除基底层12的部分(例如，使用图案化的光致抗蚀剂掩模和化学蚀刻)。如图2c所示，在去除基底层12的部分之后，可以去除部分10'处的电介质层14的部分(例如，借助通过图案化掩模的激光蚀刻)。如图2d所示，然后可以去除种子层18的不希望有的部分(例如通过化学蚀刻)。如图2e所示，然后可以通过去除种子层18上方的电介质层14的暴露边缘的部分来形成条带22(例如，通过大气等离子体蚀刻)。在用条带22形成部分10'之后，可以施加(即通过镀覆)抗腐蚀性层24以产生图1所示的结构。
这些类型的制造方法提供了重要的优点。它们能够有效地制造部分10。
尽管已经参考优选实施例描述了本发明，但是本领域技术人员将认识到，在不脱离本发明的精神和范围的情况下，可以在形式和细节上进行改变。例如，可以使用其他方法来制造挠曲件8的部分10。

Claims (10)

1.一种盘驱动器头部悬架或挠曲件，具有部分，所述部分包括：
电介质层，所述电介质层具有边缘；
导体层；
种子层，所述种子层在所述电介质层和所述导体层之间，所述种子层具有延伸超过所述电介质层的边缘的条带；以及
抗腐蚀层，所述抗腐蚀层在所述导体层的种子层侧上，所述抗腐蚀层在所述种子层的条带上方延伸并与所述电介质层的边缘接触。
2.根据权利要求1所述的盘驱动器头部悬架或挠曲件，其中，所述部分还包括在所述电介质层的与所述种子层相对的一侧上的基底层。
3.根据权利要求2所述的盘驱动器头部悬架或挠曲件，具有包括所述部分的端子焊盘。
4.根据权利要求1所述的盘驱动器头部悬架或挠曲件，具有包括所述部分的端子焊盘。
5.根据权利要求2所述的盘驱动器头部悬架或挠曲件，具有包括所述部分的悬空引线。
6.根据权利要求1所述的盘驱动器头部悬架或挠曲件，具有包括所述部分的悬空引线。
7.一种用于制造盘驱动器头部悬架或挠曲件的方法，包括：
提供包括由种子层分隔的导体层和电介质层的结构，其中，所述电介质层具有第一边缘；
去除所述电介质层的与所述第一边缘相邻的部分，以暴露从所述电介质层的被去除所述部分之后所形成的第二边缘延伸的所述种子层的条带；以及
将抗腐蚀性层施加到所述导体层的种子层侧以及所述种子层的条带上方并使所述抗腐蚀性层与所述电介质层的第二边缘接触。
8.根据权利要求7所述的方法，其中，去除所述电介质层的所述部分包括蚀刻所述电介质层。
9.根据权利要求8所述的方法，其中，施加抗腐蚀性层包括镀覆所述抗腐蚀性层。
10.根据权利要求7所述的方法，其中，施加抗腐蚀性层包括镀覆所述抗腐蚀性层。
CN201680038786.3A 2015-06-30 2016-06-22 具有改进的可靠性的盘驱动器头部悬架结构 Active CN107735834B (zh)

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PCT/US2016/038677 WO2017003782A1 (en) 2015-06-30 2016-06-22 Disk drive head suspension structures having improved gold-dielectric joint reliability

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US20180286438A1 (en) 2018-10-04
US9984708B2 (en) 2018-05-29
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CN107735834A (zh) 2018-02-23
US10748566B2 (en) 2020-08-18

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