WO2002009478A1 - Dispositif luminescent - Google Patents

Dispositif luminescent Download PDF

Info

Publication number
WO2002009478A1
WO2002009478A1 PCT/JP2001/006366 JP0106366W WO0209478A1 WO 2002009478 A1 WO2002009478 A1 WO 2002009478A1 JP 0106366 W JP0106366 W JP 0106366W WO 0209478 A1 WO0209478 A1 WO 0209478A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
transparency
luminescent device
resistance
polysilazane
Prior art date
Application number
PCT/JP2001/006366
Other languages
English (en)
French (fr)
Inventor
Yuichi Kubota
Michio Arai
Original Assignee
Tdk Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corporation filed Critical Tdk Corporation
Publication of WO2002009478A1 publication Critical patent/WO2002009478A1/ja
Priority to US10/103,888 priority Critical patent/US6781148B2/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Led Device Packages (AREA)
PCT/JP2001/006366 2000-07-24 2001-07-24 Dispositif luminescent WO2002009478A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/103,888 US6781148B2 (en) 2000-07-24 2002-03-25 Light emitting device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000-222496 2000-07-24
JP2000222496 2000-07-24
JP2000-358352 2000-11-24
JP2000358352 2000-11-24

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/103,888 Continuation US6781148B2 (en) 2000-07-24 2002-03-25 Light emitting device

Publications (1)

Publication Number Publication Date
WO2002009478A1 true WO2002009478A1 (fr) 2002-01-31

Family

ID=26596560

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/006366 WO2002009478A1 (fr) 2000-07-24 2001-07-24 Dispositif luminescent

Country Status (4)

Country Link
US (1) US6781148B2 (ja)
CN (1) CN1222195C (ja)
TW (1) TW515223B (ja)
WO (1) WO2002009478A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060223208A1 (en) * 2002-10-10 2006-10-05 Cambridge Display Technology Limited Optical device
CN110911582A (zh) * 2019-11-28 2020-03-24 云谷（固安）科技有限公司 显示面板及显示装置
DE10392604B4 (de) 2002-05-23 2023-03-09 Global Oled Technology Llc Organische EL-Anzeige

Families Citing this family (126)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001111076A (ja) * 1999-10-08 2001-04-20 Tdk Corp コーティング体および太陽電池モジュール
US6664563B2 (en) * 2001-03-30 2003-12-16 Sanyo Electric Co., Ltd. Electroluminescence device with shock buffer function and sealing member with shock buffer function for the same
JP3942017B2 (ja) * 2002-03-25 2007-07-11 富士フイルム株式会社 発光素子
JP2004014311A (ja) * 2002-06-07 2004-01-15 Sony Corp 有機薄膜の形成方法
KR100662297B1 (ko) * 2002-10-18 2007-01-02 엘지전자 주식회사 유기 ｅｌ 소자
JP2004196649A (ja) * 2002-12-06 2004-07-15 Sumitomo Electric Ind Ltd 蛍光性ガラス、光増幅用導波路および光増幅モジュール
KR100892357B1 (ko) * 2002-12-09 2009-04-08 엘지디스플레이 주식회사 액정표시장치용 컬러필터 기판 및 그 제조방법
DE502004003677D1 (de) * 2003-01-21 2007-06-14 Polyic Gmbh & Co Kg Organisches elektronikbauteil und verfahren zur herstellung organischer elektronik
US6962835B2 (en) 2003-02-07 2005-11-08 Ziptronix, Inc. Method for room temperature metal direct bonding
US20040166692A1 (en) * 2003-02-26 2004-08-26 Loboda Mark Jon Method for producing hydrogenated silicon oxycarbide films
JP3877692B2 (ja) * 2003-03-28 2007-02-07 三洋電機株式会社 有機エレクトロルミネッセンス素子およびその製造方法
WO2004090195A1 (en) * 2003-04-07 2004-10-21 Fuji Photo Film Co. Ltd. Crystalline-si-layer-bearing substrate and its production method, and crystalline si device
US20040206953A1 (en) * 2003-04-16 2004-10-21 Robert Morena Hermetically sealed glass package and method of fabrication
US6998776B2 (en) 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US7344901B2 (en) * 2003-04-16 2008-03-18 Corning Incorporated Hermetically sealed package and method of fabricating of a hermetically sealed package
US7037601B2 (en) * 2003-05-28 2006-05-02 Eastman Kodak Company White light-emitting device structures
JP2004362912A (ja) * 2003-06-04 2004-12-24 Toyota Industries Corp 有機エレクトロルミネッセンス素子及びその製造方法
WO2005005571A1 (en) * 2003-07-09 2005-01-20 Ciba Specialty Chemicals Holding Inc. Colour changing media for light emitting display devices
JP2005056587A (ja) * 2003-08-01 2005-03-03 Toyota Industries Corp Ｅｌ装置及びその製造方法
US7291967B2 (en) * 2003-08-29 2007-11-06 Semiconductor Energy Laboratory Co., Ltd. Light emitting element including a barrier layer and a manufacturing method thereof
KR100544131B1 (ko) 2003-09-03 2006-01-23 삼성에스디아이 주식회사 유기 전계 발광 소자 및 그 제조방법
US7816863B2 (en) * 2003-09-12 2010-10-19 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and method for manufacturing the same
JP4823478B2 (ja) * 2003-09-19 2011-11-24 株式会社半導体エネルギー研究所 発光装置の作製方法
US7492090B2 (en) * 2003-09-19 2009-02-17 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
US7520790B2 (en) * 2003-09-19 2009-04-21 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method of display device
US20050070196A1 (en) * 2003-09-29 2005-03-31 Colombo Frank J. Protecting electro-optical devices with a fluoropolymer
US7205716B2 (en) * 2003-10-20 2007-04-17 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
US7902747B2 (en) 2003-10-21 2011-03-08 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device having a thin insulating film made of nitrogen and silicon and an electrode made of conductive transparent oxide and silicon dioxide
JP3994994B2 (ja) * 2003-10-23 2007-10-24 セイコーエプソン株式会社 有機ｅｌ装置の製造方法、有機ｅｌ装置、電子機器
JP3935886B2 (ja) * 2004-02-02 2007-06-27 シャープ株式会社 有機エレクトロルミネッセンス素子
US7521378B2 (en) * 2004-07-01 2009-04-21 Micron Technology, Inc. Low temperature process for polysilazane oxidation/densification
US7709050B2 (en) * 2004-08-02 2010-05-04 Hewlett-Packard Development Company, L.P. Surface treatment for OLED material
TWI467531B (zh) * 2004-09-16 2015-01-01 Semiconductor Energy Lab 顯示裝置和其驅動方法
KR100741967B1 (ko) * 2004-11-08 2007-07-23 삼성에스디아이 주식회사 평판표시장치
KR101108148B1 (ko) * 2005-02-03 2012-02-09 삼성모바일디스플레이주식회사 유기 전계 발광 소자 및 이의 제조 방법
DE102005008857A1 (de) * 2005-02-26 2006-09-07 Clariant International Limited Verwendung von Polysilazanen als permanente Anit-Fingerprint-Beschichtung
GB0505517D0 (en) * 2005-03-17 2005-04-27 Dupont Teijin Films Us Ltd Coated polymeric substrates
US8999836B2 (en) * 2005-05-13 2015-04-07 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing display device
GB0510721D0 (en) * 2005-05-25 2005-06-29 Cambridge Display Tech Ltd Electroluminescent device
US8718437B2 (en) 2006-03-07 2014-05-06 Qd Vision, Inc. Compositions, optical component, system including an optical component, devices, and other products
US7705346B2 (en) * 2005-06-06 2010-04-27 Xerox Corporation Barrier layer for an organic electronic device
JP4867055B2 (ja) * 2005-06-30 2012-02-01 富士フイルム株式会社 分散型エレクトロルミネッセンス素子
DE102005034817A1 (de) * 2005-07-26 2007-02-01 Clariant International Limited Verfahren zur Herstellung einer dünnen glasartigen Beschichtung auf Substraten zur Verringerung der Gaspermeation
US7485968B2 (en) * 2005-08-11 2009-02-03 Ziptronix, Inc. 3D IC method and device
EP1760800B1 (en) * 2005-09-02 2017-01-04 OSRAM OLED GmbH Radiation emitting device and method of manufacturing the same
KR20070029526A (ko) * 2005-09-10 2007-03-14 삼성전자주식회사 자발광형 액정 표시장치
JP5006203B2 (ja) * 2005-10-19 2012-08-22 パナソニック株式会社 金属酸化膜の形成方法、金属酸化膜及び光学電子デバイス
GB0524082D0 (en) * 2005-11-25 2006-01-04 Isis Innovation Photovoltaic devices with improved efficiency
EP1984434A4 (en) * 2006-01-27 2014-01-15 Kolon Inc HEAT SHRINKABLE POLYESTER FOIL
US9874674B2 (en) 2006-03-07 2018-01-23 Samsung Electronics Co., Ltd. Compositions, optical component, system including an optical component, devices, and other products
EP2041478B1 (en) 2006-03-07 2014-08-06 QD Vision, Inc. An article including semiconductor nanocrystals
US20080080204A1 (en) * 2006-06-23 2008-04-03 Faurecia Interior Systems U.S.A., Inc. Molded panel and method of manufacture
US8836212B2 (en) 2007-01-11 2014-09-16 Qd Vision, Inc. Light emissive printed article printed with quantum dot ink
WO2009014707A2 (en) 2007-07-23 2009-01-29 Qd Vision, Inc. Quantum dot light enhancement substrate and lighting device including same
US8128249B2 (en) 2007-08-28 2012-03-06 Qd Vision, Inc. Apparatus for selectively backlighting a material
JP2010006039A (ja) * 2007-09-05 2010-01-14 Fujifilm Corp ガスバリアフィルムおよびガスバリアフィルムを用いて表示素子を封止する方法。
JP5015705B2 (ja) * 2007-09-18 2012-08-29 ルネサスエレクトロニクス株式会社 層間絶縁膜形成方法、層間絶縁膜、半導体デバイス、および半導体製造装置
WO2009045437A1 (en) * 2007-10-04 2009-04-09 E. I. Du Pont De Nemours And Company Vehicular suspension components
EP2234459B1 (en) * 2007-12-28 2018-01-31 Sumitomo Chemical Company, Limited Polymer light-emitting device, method for manufacturing the same and polymer light-emitting display device
US8721149B2 (en) 2008-01-30 2014-05-13 Qualcomm Mems Technologies, Inc. Illumination device having a tapered light guide
WO2009099547A2 (en) 2008-01-30 2009-08-13 Digital Optics International, Llc Thin illumination system
KR101445878B1 (ko) * 2008-04-04 2014-09-29 삼성전자주식회사 보호 필름 및 이를 포함하는 봉지 재료
KR20090107882A (ko) * 2008-04-10 2009-10-14 삼성전자주식회사 고정층을 포함하는 경사 조성 봉지 박막 및 그의 제조방법
WO2009151515A1 (en) 2008-05-06 2009-12-17 Qd Vision, Inc. Solid state lighting devices including quantum confined semiconductor nanoparticles
US9207385B2 (en) 2008-05-06 2015-12-08 Qd Vision, Inc. Lighting systems and devices including same
WO2009137053A1 (en) 2008-05-06 2009-11-12 Qd Vision, Inc. Optical components, systems including an optical component, and devices
US8358266B2 (en) 2008-09-02 2013-01-22 Qualcomm Mems Technologies, Inc. Light turning device with prismatic light turning features
KR101542915B1 (ko) * 2008-10-10 2015-08-07 퀄컴 엠이엠에스 테크놀로지스, 인크. 분산 조명 시스템
JP2012505518A (ja) * 2008-10-10 2012-03-01 クォルコム・メムズ・テクノロジーズ・インコーポレーテッド 分散照明制御システム
US20100095705A1 (en) 2008-10-20 2010-04-22 Burkhalter Robert S Method for forming a dry glass-based frit
JP2010102994A (ja) * 2008-10-24 2010-05-06 Hitachi Displays Ltd 有機エレクトロルミネッセンス装置
KR101040175B1 (ko) * 2008-12-11 2011-06-16 한국전자통신연구원 연성 기판 및 그의 제조 방법
KR20100071650A (ko) * 2008-12-19 2010-06-29 삼성전자주식회사 가스차단성박막, 이를 포함하는 전자소자 및 이의 제조방법
KR20110104090A (ko) 2009-01-13 2011-09-21 퀄컴 엠이엠스 테크놀로지스, 인크. 대면적 광 패널 및 스크린
US8520331B2 (en) * 2009-02-16 2013-08-27 Sharp Kabushiki Kaisha Color conversion filter manufacturing method
DE102009003225A1 (de) * 2009-05-19 2010-11-25 Evonik Degussa Gmbh Transparente, witterungsbeständige Barrierefolie, Herstellung durch Lamination, Extrusionslamination oder Extrusionsbeschichtung
JP5535583B2 (ja) * 2009-05-25 2014-07-02 ＡｚエレクトロニックマテリアルズＩｐ株式会社 トレンチ・アイソレーション構造の形成方法
JP5442113B2 (ja) 2009-05-29 2014-03-12 クォルコム・メムズ・テクノロジーズ・インコーポレーテッド 照明デバイスおよび該照明デバイスの製造方法
KR101700989B1 (ko) * 2009-06-24 2017-01-31 미쓰비시 가가꾸 가부시키가이샤 유기 전자 디바이스 및 그 제조 방법
EP2434838A4 (en) * 2009-06-29 2013-08-28 Sharp Kk ORGANIC EL DISPLAY BOARD AND METHOD FOR THE PRODUCTION THEREOF
JP2012004349A (ja) 2010-06-17 2012-01-05 Az Electronic Materials Kk シリコンオキシナイトライド膜の形成方法およびそれにより製造されたシリコンオキシナイトライド膜付き基板
JP2012019062A (ja) * 2010-07-08 2012-01-26 Shin Etsu Chem Co Ltd 発光半導体装置、実装基板及びそれらの製造方法
US8402647B2 (en) 2010-08-25 2013-03-26 Qualcomm Mems Technologies Inc. Methods of manufacturing illumination systems
US20130220682A1 (en) * 2010-11-17 2013-08-29 3M Innovative Properties Company Method of Reducing Electromigration of Silver and Article Made Thereby
JP6132770B2 (ja) 2010-11-18 2017-05-24 スリーエム イノベイティブ プロパティズ カンパニー ポリシラザン接合層を含む発光ダイオードコンポーネント
JP2013001721A (ja) * 2011-06-13 2013-01-07 Adeka Corp 無機ポリシラザン、これを含有してなるシリカ膜形成用塗布液及びシリカ膜の形成方法
KR101736888B1 (ko) * 2011-06-22 2017-05-17 메르크 파텐트 게엠베하 실리콘 옥시나이트라이드 막의 형성 방법 및 이 방법에 의해 제조된 실리콘 옥시나이트라이드 막을 가지는 기판
JP5749344B2 (ja) 2011-09-08 2015-07-15 リンテック株式会社 変性ポリシラザンフィルム、および、ガスバリアフィルムの製造方法
CN103917364A (zh) * 2011-11-11 2014-07-09 三菱瓦斯化学株式会社 透明耐热阻气性薄膜的制造方法
DE102011086689B4 (de) 2011-11-21 2017-02-16 Osram Oled Gmbh Verfahren zum Herstellen eines opto-elektronischen Bauelements
WO2013108487A1 (ja) 2012-01-20 2013-07-25 リンテック株式会社 ガスバリアフィルムおよびガスバリアフィルムの製造方法
KR102039390B1 (ko) * 2012-02-21 2019-11-04 린텍 가부시키가이샤 유기 전자 소자 및 유기 전자 소자의 제조 방법
JP5360335B1 (ja) * 2012-04-13 2013-12-04 東レ株式会社 カラーフィルター基板、およびそれを用いた画像表示装置
WO2013177626A1 (en) * 2012-05-30 2013-12-05 Rubicon Research Pty Ltd Silt control in fluid networks
WO2014003211A1 (en) * 2012-06-25 2014-01-03 Kolon Industries, Inc. Transparent polyimide substrate and method of manufacturing the same
US20140154518A1 (en) * 2012-12-03 2014-06-05 Samsung Electronics Co., Ltd. Barrier film and method of manufacturing the same
KR102113600B1 (ko) * 2012-12-07 2020-05-21 엘지디스플레이 주식회사 유기 발광 다이오드 표시 장치 및 이의 제조 방법
KR101537845B1 (ko) * 2012-12-12 2015-07-17 코오롱인더스트리 주식회사 투명 폴리이미드 기판 및 그 제조방법
KR101556672B1 (ko) * 2012-12-27 2015-10-01 제일모직 주식회사 실리카계 절연층 형성용 조성물, 실리카계 절연층 형성용 조성물의 제조방법, 실리카계 절연층 및 실리카계 절연층의 제조방법
KR101545779B1 (ko) * 2013-04-02 2015-08-19 코오롱인더스트리 주식회사 폴리이미드 커버기판
KR101579645B1 (ko) * 2013-04-10 2015-12-22 코오롱인더스트리 주식회사 폴리이미드 커버기판
KR102030996B1 (ko) * 2013-04-30 2019-10-11 요코하마 고무 가부시키가이샤 자외선 경화형 수지 조성물 및 이것을 이용하는 적층체
US20140356789A1 (en) * 2013-05-31 2014-12-04 Orthogonal, Inc. Fluorinated photopolymer with integrated anthracene sensitizer
US9991182B2 (en) 2013-07-19 2018-06-05 Az Electronic Materials (Luxembourg) S.A.R.L. Encapsulation material for light emitting diodes
CN104752631B (zh) * 2013-12-26 2017-02-22 昆山工研院新型平板显示技术中心有限公司 有机电致发光器件的封装结构及封装方法
WO2015120025A1 (en) 2014-02-07 2015-08-13 Orthogonal, Inc. Cross-linkable fluorinated photopolymer
US9953941B2 (en) 2015-08-25 2018-04-24 Invensas Bonding Technologies, Inc. Conductive barrier direct hybrid bonding
CN105185790B (zh) * 2015-09-24 2019-03-12 深圳市华星光电技术有限公司 阵列基板及其制作方法
CN105552248A (zh) * 2016-01-26 2016-05-04 纳晶科技股份有限公司 一种电致发光器件的封装结构及其封装方法
US10182497B1 (en) * 2016-06-08 2019-01-15 Northrop Grumman Systems Corporation Transparent and antistatic conformal coating for internal ESD mitigation in space environment
CN106328797A (zh) * 2016-09-08 2017-01-11 深圳市佑明光电有限公司 一种led封装用耐硫化耐uv涂层及其制备方法
CN110249443A (zh) * 2016-12-13 2019-09-17 沙特基础工业全球技术公司 量子点薄膜及其应用
US10840205B2 (en) 2017-09-24 2020-11-17 Invensas Bonding Technologies, Inc. Chemical mechanical polishing for hybrid bonding
CN107768524B (zh) * 2017-12-04 2024-02-09 湖南师范大学 一种高效稳定的钙钛矿太阳能电池及其制备方法
CN109959995A (zh) * 2017-12-14 2019-07-02 惠州海格光学技术有限公司 新型滤光片支架贴合工艺方法
KR102192462B1 (ko) * 2017-12-14 2020-12-17 삼성에스디아이 주식회사 실리카 막 형성용 조성물, 실리카 막, 및 전자소자
US11056348B2 (en) 2018-04-05 2021-07-06 Invensas Bonding Technologies, Inc. Bonding surfaces for microelectronics
EP3807927A4 (en) 2018-06-13 2022-02-23 Invensas Bonding Technologies, Inc. TSV AS A HIDEPAD
US11393779B2 (en) 2018-06-13 2022-07-19 Invensas Bonding Technologies, Inc. Large metal pads over TSV
CN108878287A (zh) * 2018-06-29 2018-11-23 苏州研材微纳科技有限公司 硅衬底的加工钝化保护方法
US11011494B2 (en) 2018-08-31 2021-05-18 Invensas Bonding Technologies, Inc. Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
US11158573B2 (en) 2018-10-22 2021-10-26 Invensas Bonding Technologies, Inc. Interconnect structures
CN109596676A (zh) * 2018-11-26 2019-04-09 北京市劳动保护科学研究所 基于CexMn1-xO2-SnO2材料的气体传感器及其制备和应用
US20210095138A1 (en) * 2019-09-27 2021-04-01 B&B Blending, Llc Use of a fluorescent optical brightener or phosphorescent indicator within ceramic coatings for visual detection and identification
CN110943177A (zh) * 2019-11-25 2020-03-31 深圳市华星光电半导体显示技术有限公司 发光器件及其制备方法
US11264357B1 (en) 2020-10-20 2022-03-01 Invensas Corporation Mixed exposure for large die

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08236274A (ja) * 1994-12-28 1996-09-13 Tonen Corp エレクトロルミネッセンス素子
JPH1024519A (ja) * 1996-07-10 1998-01-27 Mitsui Petrochem Ind Ltd 透明導電性積層体及びそれを用いたｅｌ素子
JPH1154266A (ja) * 1997-07-31 1999-02-26 Seiko Epson Corp 発光ディスプレイ
JPH1174083A (ja) * 1997-09-01 1999-03-16 Seiko Epson Corp 電界発光素子およびその製造方法
JP2000058256A (ja) * 1998-08-07 2000-02-25 Canon Inc 有機発光素子
JP2000353592A (ja) * 1999-06-08 2000-12-19 Gunze Ltd エレクトロルミネッセンス素子

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68926260T2 (de) * 1988-02-29 1996-08-22 Toa Nenryo Kogyo Kk Formkörper aus Keramik auf Siliciumnitrid-Basis und Verfahren zu ihrer Herstellung
JPH06163958A (ja) * 1992-02-21 1994-06-10 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP2601603B2 (ja) * 1992-09-25 1997-04-16 日本製紙株式会社 感光性シート
JP3534445B2 (ja) * 1993-09-09 2004-06-07 隆一 山本 ポリチオフェンを用いたｅｌ素子
JP4049841B2 (ja) 1996-12-27 2008-02-20 Ａｚエレクトロニックマテリアルズ株式会社 窒化珪素薄膜の形成方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08236274A (ja) * 1994-12-28 1996-09-13 Tonen Corp エレクトロルミネッセンス素子
JPH1024519A (ja) * 1996-07-10 1998-01-27 Mitsui Petrochem Ind Ltd 透明導電性積層体及びそれを用いたｅｌ素子
JPH1154266A (ja) * 1997-07-31 1999-02-26 Seiko Epson Corp 発光ディスプレイ
JPH1174083A (ja) * 1997-09-01 1999-03-16 Seiko Epson Corp 電界発光素子およびその製造方法
JP2000058256A (ja) * 1998-08-07 2000-02-25 Canon Inc 有機発光素子
JP2000353592A (ja) * 1999-06-08 2000-12-19 Gunze Ltd エレクトロルミネッセンス素子

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10392604B4 (de) 2002-05-23 2023-03-09 Global Oled Technology Llc Organische EL-Anzeige
US20060223208A1 (en) * 2002-10-10 2006-10-05 Cambridge Display Technology Limited Optical device
CN110911582A (zh) * 2019-11-28 2020-03-24 云谷（固安）科技有限公司 显示面板及显示装置

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US6781148B2 (en) 2004-08-24

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