TWI461277B - 印紋用模板及其製造方法 - Google Patents

印紋用模板及其製造方法 Download PDF

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Publication number
TWI461277B
TWI461277B TW098138018A TW98138018A TWI461277B TW I461277 B TWI461277 B TW I461277B TW 098138018 A TW098138018 A TW 098138018A TW 98138018 A TW98138018 A TW 98138018A TW I461277 B TWI461277 B TW I461277B
Authority
TW
Taiwan
Prior art keywords
printing
template
side chain
crystalline polymer
fine pattern
Prior art date
Application number
TW098138018A
Other languages
English (en)
Chinese (zh)
Other versions
TW201043427A (en
Inventor
Shinichi Nakano
Shinichiro Kawahara
Shinji Matsui
Makoto Okada
Original Assignee
Nitta Corp
Hyogo Ken
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitta Corp, Hyogo Ken filed Critical Nitta Corp
Publication of TW201043427A publication Critical patent/TW201043427A/zh
Application granted granted Critical
Publication of TWI461277B publication Critical patent/TWI461277B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/38Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/38Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842Manufacturing moulds, e.g. shaping the mould surface by machining
    • B29C33/3857Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts
    • B29C33/3878Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts used as masters for making successive impressions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • C08L33/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
TW098138018A 2009-06-08 2009-11-10 印紋用模板及其製造方法 TWI461277B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009137553 2009-06-08

Publications (2)

Publication Number Publication Date
TW201043427A TW201043427A (en) 2010-12-16
TWI461277B true TWI461277B (zh) 2014-11-21

Family

ID=43308585

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098138018A TWI461277B (zh) 2009-06-08 2009-11-10 印紋用模板及其製造方法

Country Status (5)

Country Link
JP (1) JP5329661B2 (ko)
KR (1) KR101355036B1 (ko)
CN (1) CN102458800B (ko)
TW (1) TWI461277B (ko)
WO (1) WO2010143321A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5463072B2 (ja) * 2009-05-12 2014-04-09 ニッタ株式会社 微細構造の製造方法
JP5463087B2 (ja) * 2009-06-22 2014-04-09 ニッタ株式会社 微細構造の製造方法
JP2012143915A (ja) * 2011-01-10 2012-08-02 Scivax Kk インプリント用型
JP6304735B2 (ja) * 2013-05-10 2018-04-04 ニッタ株式会社 インプリント用レジスト材およびそれを用いた微細構造の製造方法
JP7245973B2 (ja) * 2019-02-04 2023-03-27 パナソニックIpマネジメント株式会社 パターンの形成方法および装置
CN110316694B (zh) * 2019-07-09 2022-03-15 嘉兴学院 一种具有微纳米形态模具的加工方法
CN113189840A (zh) * 2021-04-16 2021-07-30 深圳先进技术研究院 微纳结构制作方法及微纳结构制作装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4944076A (ko) * 1972-09-01 1974-04-25
JPS63202685A (ja) * 1987-02-18 1988-08-22 Nitto Electric Ind Co Ltd アクリル系剥離剤
JPS6422907A (en) * 1987-07-17 1989-01-25 Dainippon Printing Co Ltd Heat mold release agent
TW440519B (en) * 1999-04-23 2001-06-16 Dainippon Printing Co Ltd Shaped sheet and method for producing the same
JP2006523728A (ja) * 2003-04-14 2006-10-19 ミヌタ・テクノロジー・カンパニー・リミテッド 微細パターンの形成に用いられるモールド用樹脂組成物およびそれからの有機モールドの製作方法
TWI280159B (en) * 2005-03-29 2007-05-01 Li Bing Huan Method for fabricating nano-adhesive
JP2009119695A (ja) * 2007-11-14 2009-06-04 Hitachi High-Technologies Corp ナノプリント用樹脂スタンパ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4394248B2 (ja) * 1999-04-23 2010-01-06 大日本印刷株式会社 賦型シート及びその製造方法
KR20080031514A (ko) * 2004-02-04 2008-04-08 스미도모쥬기가이고교 가부시키가이샤 가압성형장치, 금형 및 가압성형방법
JP2009001002A (ja) * 2007-05-24 2009-01-08 Univ Waseda モールド、その製造方法および転写微細パターンを有する基材の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4944076A (ko) * 1972-09-01 1974-04-25
JPS63202685A (ja) * 1987-02-18 1988-08-22 Nitto Electric Ind Co Ltd アクリル系剥離剤
JPS6422907A (en) * 1987-07-17 1989-01-25 Dainippon Printing Co Ltd Heat mold release agent
TW440519B (en) * 1999-04-23 2001-06-16 Dainippon Printing Co Ltd Shaped sheet and method for producing the same
JP2006523728A (ja) * 2003-04-14 2006-10-19 ミヌタ・テクノロジー・カンパニー・リミテッド 微細パターンの形成に用いられるモールド用樹脂組成物およびそれからの有機モールドの製作方法
TWI280159B (en) * 2005-03-29 2007-05-01 Li Bing Huan Method for fabricating nano-adhesive
JP2009119695A (ja) * 2007-11-14 2009-06-04 Hitachi High-Technologies Corp ナノプリント用樹脂スタンパ

Also Published As

Publication number Publication date
WO2010143321A1 (ja) 2010-12-16
JP5329661B2 (ja) 2013-10-30
JPWO2010143321A1 (ja) 2012-11-22
TW201043427A (en) 2010-12-16
CN102458800B (zh) 2014-04-23
KR20120014022A (ko) 2012-02-15
KR101355036B1 (ko) 2014-01-24
CN102458800A (zh) 2012-05-16

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