SG171468A1 - Exposure apparatus and method for producing device - Google Patents
Exposure apparatus and method for producing deviceInfo
- Publication number
- SG171468A1 SG171468A1 SG200704277-3A SG2007042773A SG171468A1 SG 171468 A1 SG171468 A1 SG 171468A1 SG 2007042773 A SG2007042773 A SG 2007042773A SG 171468 A1 SG171468 A1 SG 171468A1
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- liquid
- exposure apparatus
- chamber
- producing device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/146—Laser beam
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002357957 | 2002-12-10 | ||
| JP2003305279 | 2003-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG171468A1 true SG171468A1 (en) | 2011-06-29 |
Family
ID=32510635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG200704277-3A SG171468A1 (en) | 2002-12-10 | 2003-12-05 | Exposure apparatus and method for producing device |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US20050225735A1 (zh) |
| EP (1) | EP1571694A4 (zh) |
| JP (1) | JP4525827B2 (zh) |
| KR (2) | KR101037057B1 (zh) |
| AU (1) | AU2003289199A1 (zh) |
| SG (1) | SG171468A1 (zh) |
| TW (1) | TW200416497A (zh) |
| WO (1) | WO2004053952A1 (zh) |
Families Citing this family (179)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG121822A1 (en) | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| DE60335595D1 (de) | 2002-11-12 | 2011-02-17 | Asml Netherlands Bv | Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung |
| US9482966B2 (en) | 2002-11-12 | 2016-11-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| SG121819A1 (en) | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| US10503084B2 (en) | 2002-11-12 | 2019-12-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| CN101424881B (zh) | 2002-11-12 | 2011-11-30 | Asml荷兰有限公司 | 光刻投射装置 |
| TWI232357B (en) | 2002-11-12 | 2005-05-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| US7110081B2 (en) | 2002-11-12 | 2006-09-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| SG131766A1 (en) | 2002-11-18 | 2007-05-28 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| TWI255971B (en) | 2002-11-29 | 2006-06-01 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| JP4525062B2 (ja) * | 2002-12-10 | 2010-08-18 | 株式会社ニコン | 露光装置及びデバイス製造方法、露光システム |
| US7242455B2 (en) | 2002-12-10 | 2007-07-10 | Nikon Corporation | Exposure apparatus and method for producing device |
| EP1571694A4 (en) * | 2002-12-10 | 2008-10-15 | Nikon Corp | EXPOSURE APPARATUS AND METHOD FOR MANUFACTURING THE DEVICE |
| EP3301511A1 (en) | 2003-02-26 | 2018-04-04 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
| EP3226073A3 (en) | 2003-04-09 | 2017-10-11 | Nikon Corporation | Exposure method and apparatus, and method for fabricating device |
| SG10201803122UA (en) | 2003-04-11 | 2018-06-28 | Nikon Corp | Immersion lithography apparatus and device manufacturing method |
| TWI295414B (en) | 2003-05-13 | 2008-04-01 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| WO2004102646A1 (ja) | 2003-05-15 | 2004-11-25 | Nikon Corporation | 露光装置及びデバイス製造方法 |
| TWI518742B (zh) | 2003-05-23 | 2016-01-21 | 尼康股份有限公司 | A method of manufacturing an exposure apparatus and an element |
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| US6867844B2 (en) | 2003-06-19 | 2005-03-15 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
| DE60308161T2 (de) | 2003-06-27 | 2007-08-09 | Asml Netherlands B.V. | Lithographischer Apparat und Verfahren zur Herstellung eines Artikels |
| US6809794B1 (en) | 2003-06-27 | 2004-10-26 | Asml Holding N.V. | Immersion photolithography system and method using inverted wafer-projection optics interface |
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| WO2005006418A1 (ja) | 2003-07-09 | 2005-01-20 | Nikon Corporation | 露光装置及びデバイス製造方法 |
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| DE60302897T2 (de) | 2003-09-29 | 2006-08-03 | Asml Netherlands B.V. | Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung |
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| JP5154006B2 (ja) * | 2004-12-06 | 2013-02-27 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| US7248334B2 (en) | 2004-12-07 | 2007-07-24 | Asml Netherlands B.V. | Sensor shield |
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| KR20160135859A (ko) | 2005-01-31 | 2016-11-28 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
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| US7291850B2 (en) | 2005-04-08 | 2007-11-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US20060232753A1 (en) | 2005-04-19 | 2006-10-19 | Asml Holding N.V. | Liquid immersion lithography system with tilted liquid flow |
| KR101479392B1 (ko) | 2005-04-28 | 2015-01-05 | 가부시키가이샤 니콘 | 노광 방법 및 노광 장치, 그리고 디바이스 제조 방법 |
| US8248577B2 (en) | 2005-05-03 | 2012-08-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7317507B2 (en) | 2005-05-03 | 2008-01-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7433016B2 (en) | 2005-05-03 | 2008-10-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| EP1881521B1 (en) | 2005-05-12 | 2014-07-23 | Nikon Corporation | Projection optical system, exposure apparatus and exposure method |
| US7652746B2 (en) | 2005-06-21 | 2010-01-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7751027B2 (en) | 2005-06-21 | 2010-07-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7468779B2 (en) | 2005-06-28 | 2008-12-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7474379B2 (en) | 2005-06-28 | 2009-01-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7834974B2 (en) * | 2005-06-28 | 2010-11-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7535644B2 (en) | 2005-08-12 | 2009-05-19 | Asml Netherlands B.V. | Lens element, lithographic apparatus, device manufacturing method, and device manufactured thereby |
| US8054445B2 (en) | 2005-08-16 | 2011-11-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP4937559B2 (ja) * | 2005-09-14 | 2012-05-23 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置および基板処理方法 |
| US7411658B2 (en) | 2005-10-06 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2007109741A (ja) * | 2005-10-11 | 2007-04-26 | Canon Inc | 露光装置及び露光方法 |
| US7929109B2 (en) | 2005-10-20 | 2011-04-19 | Nikon Corporation | Apparatus and method for recovering liquid droplets in immersion lithography |
| US7804577B2 (en) | 2005-11-16 | 2010-09-28 | Asml Netherlands B.V. | Lithographic apparatus |
| US7656501B2 (en) | 2005-11-16 | 2010-02-02 | Asml Netherlands B.V. | Lithographic apparatus |
| US7864292B2 (en) | 2005-11-16 | 2011-01-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7633073B2 (en) | 2005-11-23 | 2009-12-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7773195B2 (en) | 2005-11-29 | 2010-08-10 | Asml Holding N.V. | System and method to increase surface tension and contact angle in immersion lithography |
| US8125610B2 (en) | 2005-12-02 | 2012-02-28 | ASML Metherlands B.V. | Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus |
| JP2007173695A (ja) * | 2005-12-26 | 2007-07-05 | Sokudo:Kk | 基板処理方法、基板処理システムおよび基板処理装置 |
| US7420194B2 (en) | 2005-12-27 | 2008-09-02 | Asml Netherlands B.V. | Lithographic apparatus and substrate edge seal |
| US7839483B2 (en) | 2005-12-28 | 2010-11-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and a control system |
| US7649611B2 (en) | 2005-12-30 | 2010-01-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US8045134B2 (en) | 2006-03-13 | 2011-10-25 | Asml Netherlands B.V. | Lithographic apparatus, control system and device manufacturing method |
| US9477158B2 (en) | 2006-04-14 | 2016-10-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7969548B2 (en) | 2006-05-22 | 2011-06-28 | Asml Netherlands B.V. | Lithographic apparatus and lithographic apparatus cleaning method |
| JPWO2007139017A1 (ja) * | 2006-05-29 | 2009-10-08 | 株式会社ニコン | 液体回収部材、基板保持部材、露光装置、及びデバイス製造方法 |
| US8045135B2 (en) | 2006-11-22 | 2011-10-25 | Asml Netherlands B.V. | Lithographic apparatus with a fluid combining unit and related device manufacturing method |
| US9632425B2 (en) | 2006-12-07 | 2017-04-25 | Asml Holding N.V. | Lithographic apparatus, a dryer and a method of removing liquid from a surface |
| US8634053B2 (en) | 2006-12-07 | 2014-01-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7791709B2 (en) | 2006-12-08 | 2010-09-07 | Asml Netherlands B.V. | Substrate support and lithographic process |
| US20080212050A1 (en) * | 2007-02-06 | 2008-09-04 | Nikon Corporation | Apparatus and methods for removing immersion liquid from substrates using temperature gradient |
| US8817226B2 (en) | 2007-02-15 | 2014-08-26 | Asml Holding N.V. | Systems and methods for insitu lens cleaning using ozone in immersion lithography |
| US8654305B2 (en) | 2007-02-15 | 2014-02-18 | Asml Holding N.V. | Systems and methods for insitu lens cleaning in immersion lithography |
| US9013672B2 (en) | 2007-05-04 | 2015-04-21 | Asml Netherlands B.V. | Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method |
| US7866330B2 (en) | 2007-05-04 | 2011-01-11 | Asml Netherlands B.V. | Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method |
| US8947629B2 (en) | 2007-05-04 | 2015-02-03 | Asml Netherlands B.V. | Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method |
| US8451427B2 (en) | 2007-09-14 | 2013-05-28 | Nikon Corporation | Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method |
| JP5267029B2 (ja) | 2007-10-12 | 2013-08-21 | 株式会社ニコン | 照明光学装置、露光装置及びデバイスの製造方法 |
| EP2179330A1 (en) | 2007-10-16 | 2010-04-28 | Nikon Corporation | Illumination optical system, exposure apparatus, and device manufacturing method |
| EP2179329A1 (en) | 2007-10-16 | 2010-04-28 | Nikon Corporation | Illumination optical system, exposure apparatus, and device manufacturing method |
| US8379187B2 (en) | 2007-10-24 | 2013-02-19 | Nikon Corporation | Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method |
| US9116346B2 (en) | 2007-11-06 | 2015-08-25 | Nikon Corporation | Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method |
| KR101695034B1 (ko) | 2008-05-28 | 2017-01-10 | 가부시키가이샤 니콘 | 공간 광 변조기의 검사 장치, 조명 광학계, 노광 장치, 검사 방법, 조명 광학계의 조정 방법, 조명 방법, 노광 방법, 및 디바이스 제조 방법 |
| TWI438577B (zh) | 2008-12-08 | 2014-05-21 | Asml Netherlands Bv | 微影裝置及器件製造方法 |
| NL2005207A (en) | 2009-09-28 | 2011-03-29 | Asml Netherlands Bv | Heat pipe, lithographic apparatus and device manufacturing method. |
| NL2005717A (en) * | 2009-12-18 | 2011-06-21 | Asml Netherlands Bv | A lithographic apparatus and a device manufacturing method. |
| JPWO2011125975A1 (ja) * | 2010-04-05 | 2013-07-11 | 株式会社ニコン | フィルタボックス、露光装置、及びデバイス製造方法 |
| EP2381310B1 (en) | 2010-04-22 | 2015-05-06 | ASML Netherlands BV | Fluid handling structure and lithographic apparatus |
| WO2015193036A1 (en) * | 2014-06-16 | 2015-12-23 | Asml Netherlands B.V. | Lithographic apparatus, method of transferring a substrate and device manufacturing method |
| KR102206992B1 (ko) * | 2015-02-27 | 2021-01-25 | 가부시키가이샤 니콘 | 기판 처리 장치, 디바이스 제조 방법 |
| CN106298602B (zh) * | 2015-06-03 | 2019-02-15 | 沈阳芯源微电子设备有限公司 | 半导体接口单元的接口密封装置 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01120023A (ja) * | 1987-11-02 | 1989-05-12 | Seiko Epson Corp | スピン現像装置 |
| US5209180A (en) * | 1991-03-28 | 1993-05-11 | Dainippon Screen Mfg. Co., Ltd. | Spin coating apparatus with an upper spin plate cleaning nozzle |
| JPH09199470A (ja) * | 1996-01-17 | 1997-07-31 | Hiroshima Nippon Denki Kk | スピンドライヤー |
| EP0805000A1 (en) * | 1996-05-02 | 1997-11-05 | MEMC Electronic Materials, Inc. | Semiconductor wafer post-polish clean and dry method and apparatus |
| US5896875A (en) * | 1995-09-01 | 1999-04-27 | Matsushita Electronics Corporation | Equipment for cleaning, etching and drying semiconductor wafer and its using method |
| US6423642B1 (en) * | 1998-03-13 | 2002-07-23 | Semitool, Inc. | Reactor for processing a semiconductor wafer |
Family Cites Families (169)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5586116A (en) * | 1978-12-25 | 1980-06-28 | Hitachi Ltd | Drier |
| US4346164A (en) * | 1980-10-06 | 1982-08-24 | Werner Tabarelli | Photolithographic method for the manufacture of integrated circuits |
| JPS57153433A (en) | 1981-03-18 | 1982-09-22 | Hitachi Ltd | Manufacturing device for semiconductor |
| JPS58202448A (ja) | 1982-05-21 | 1983-11-25 | Hitachi Ltd | 露光装置 |
| JPS5919912A (ja) | 1982-07-26 | 1984-02-01 | Hitachi Ltd | 液浸距離保持装置 |
| DD221563A1 (de) * | 1983-09-14 | 1985-04-24 | Mikroelektronik Zt Forsch Tech | Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur |
| DD224448A1 (de) | 1984-03-01 | 1985-07-03 | Zeiss Jena Veb Carl | Einrichtung zur fotolithografischen strukturuebertragung |
| US4892102A (en) * | 1984-04-16 | 1990-01-09 | Astrinsky Eliezer A | Cardiac pacing and/or sensing lead and method of use |
| US4589420A (en) * | 1984-07-13 | 1986-05-20 | Spacelabs Inc. | Method and apparatus for ECG rhythm analysis |
| US4804614A (en) * | 1984-10-01 | 1989-02-14 | The Aerospace Corporation | Photoresist process of fabricating microelectronic circuits using water processable diazonium compound containing contrast enhancement layer |
| JPS6265326A (ja) * | 1985-09-18 | 1987-03-24 | Hitachi Ltd | 露光装置 |
| US4751931A (en) * | 1986-09-22 | 1988-06-21 | Allegheny-Singer Research Institute | Method and apparatus for determining his-purkinje activity |
| JPH0695508B2 (ja) * | 1986-11-28 | 1994-11-24 | 大日本スクリ−ン製造株式会社 | 基板の両面洗浄装置 |
| JPS63157419A (ja) | 1986-12-22 | 1988-06-30 | Toshiba Corp | 微細パタ−ン転写装置 |
| JP2592475B2 (ja) * | 1987-12-30 | 1997-03-19 | 株式会社日立製作所 | 投影露光装置及びそのパターンオフセツト補正方法 |
| JPH0831513B2 (ja) | 1988-02-22 | 1996-03-27 | 株式会社ニコン | 基板の吸着装置 |
| JPH03215867A (ja) | 1990-01-19 | 1991-09-20 | Fujitsu Ltd | ポジレジストの現像処理方法 |
| JPH04305917A (ja) | 1991-04-02 | 1992-10-28 | Nikon Corp | 密着型露光装置 |
| JPH04305915A (ja) | 1991-04-02 | 1992-10-28 | Nikon Corp | 密着型露光装置 |
| US5313953A (en) * | 1992-01-14 | 1994-05-24 | Incontrol, Inc. | Implantable cardiac patient monitor |
| JPH05304072A (ja) * | 1992-04-08 | 1993-11-16 | Nec Corp | 半導体装置の製造方法 |
| JPH06124873A (ja) * | 1992-10-09 | 1994-05-06 | Canon Inc | 液浸式投影露光装置 |
| JP2753930B2 (ja) * | 1992-11-27 | 1998-05-20 | キヤノン株式会社 | 液浸式投影露光装置 |
| JP3345093B2 (ja) * | 1993-05-11 | 2002-11-18 | 積水化学工業株式会社 | ポリオレフィン系樹脂発泡体の製造方法 |
| JPH06332167A (ja) * | 1993-05-24 | 1994-12-02 | Shin Etsu Chem Co Ltd | ポジ型フォトレジスト組成物及びパターン形成方法 |
| JPH07220990A (ja) * | 1994-01-28 | 1995-08-18 | Hitachi Ltd | パターン形成方法及びその露光装置 |
| US5626913A (en) * | 1994-03-09 | 1997-05-06 | Tokyo Electron Limited | Resist processing method and apparatus |
| US5874820A (en) * | 1995-04-04 | 1999-02-23 | Nikon Corporation | Window frame-guided stage mechanism |
| US5528118A (en) * | 1994-04-01 | 1996-06-18 | Nikon Precision, Inc. | Guideless stage with isolated reaction stage |
| US5623853A (en) * | 1994-10-19 | 1997-04-29 | Nikon Precision Inc. | Precision motion stage with single guide beam and follower stage |
| US5853961A (en) * | 1995-04-19 | 1998-12-29 | Tokyo Electron Limited | Method of processing substrate and apparatus for processing substrate |
| US5609158A (en) * | 1995-05-01 | 1997-03-11 | Arrhythmia Research Technology, Inc. | Apparatus and method for predicting cardiac arrhythmia by detection of micropotentials and analysis of all ECG segments and intervals |
| JPH08316124A (ja) * | 1995-05-19 | 1996-11-29 | Hitachi Ltd | 投影露光方法及び露光装置 |
| US5762749A (en) * | 1995-07-21 | 1998-06-09 | Dainippon Screen Mfg. Co., Ltd. | Apparatus for removing liquid from substrates |
| US5733323A (en) * | 1995-11-13 | 1998-03-31 | Cordis Corporation | Electrically conductive unipolar vascular sheath |
| US20020032467A1 (en) * | 2000-05-04 | 2002-03-14 | Itsik Shemer | Signal delivery through the right ventricular septum |
| TW324834B (en) * | 1996-02-01 | 1998-01-11 | Tokyo Electron Co Ltd | Method for forming membrane |
| US5728140A (en) * | 1996-06-17 | 1998-03-17 | Cardiac Pacemakers, Inc. | Method for evoking capture of left ventricle using transeptal pacing lead |
| US5871506A (en) * | 1996-08-19 | 1999-02-16 | Mower; Morton M. | Augmentation of electrical conduction and contractility by biphasic cardiac pacing |
| US6341235B1 (en) * | 1996-08-19 | 2002-01-22 | Mower Chf Treatment Irrevocable Trust | Augmentation of electrical conduction and contractility by biphasic cardiac pacing administered via the cardiac blood pool |
| US5810887A (en) * | 1996-08-23 | 1998-09-22 | Rhythm Technologies, Inc. | Temporary catheter |
| JPH1074818A (ja) * | 1996-09-02 | 1998-03-17 | Tokyo Electron Ltd | 処理装置 |
| US5800464A (en) * | 1996-10-03 | 1998-09-01 | Medtronic, Inc. | System for providing hyperpolarization of cardiac to enhance cardiac function |
| US5814079A (en) * | 1996-10-04 | 1998-09-29 | Medtronic, Inc. | Cardiac arrhythmia management by application of adnodal stimulation for hyperpolarization of myocardial cells |
| US5825043A (en) * | 1996-10-07 | 1998-10-20 | Nikon Precision Inc. | Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus |
| DE69738910D1 (de) * | 1996-11-28 | 2008-09-25 | Nikon Corp | Ausrichtvorrichtung und belichtungsverfahren |
| JP4029183B2 (ja) * | 1996-11-28 | 2008-01-09 | 株式会社ニコン | 投影露光装置及び投影露光方法 |
| WO1998028665A1 (en) * | 1996-12-24 | 1998-07-02 | Koninklijke Philips Electronics N.V. | Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device |
| JPH10255319A (ja) * | 1997-03-12 | 1998-09-25 | Hitachi Maxell Ltd | 原盤露光装置及び方法 |
| JP3070511B2 (ja) * | 1997-03-31 | 2000-07-31 | 日本電気株式会社 | 基板乾燥装置 |
| JP3747566B2 (ja) * | 1997-04-23 | 2006-02-22 | 株式会社ニコン | 液浸型露光装置 |
| JPH10303106A (ja) * | 1997-04-30 | 1998-11-13 | Toshiba Corp | 現像処理装置およびその処理方法 |
| JP3817836B2 (ja) * | 1997-06-10 | 2006-09-06 | 株式会社ニコン | 露光装置及びその製造方法並びに露光方法及びデバイス製造方法 |
| JPH1157615A (ja) * | 1997-08-26 | 1999-03-02 | Kansai Paint Co Ltd | 塗膜形成方法 |
| AU2747999A (en) * | 1998-03-26 | 1999-10-18 | Nikon Corporation | Projection exposure method and system |
| US6254936B1 (en) * | 1998-09-14 | 2001-07-03 | Silicon Valley Group, Inc. | Environment exchange control for material on a wafer surface |
| IL127720A0 (en) * | 1998-12-24 | 1999-10-28 | Oramir Semiconductor Ltd | Local particle cleaning |
| US6267778B1 (en) * | 1999-04-12 | 2001-07-31 | Fred Michael Cohen | Pacing systems for treating functional ventricular conduction abnormalities of intrinsic origin |
| US6536964B1 (en) * | 1999-09-03 | 2003-03-25 | Tokyo Electron Limited | Substrate processing system and substrate processing method |
| JP2001085295A (ja) * | 1999-09-09 | 2001-03-30 | Tokyo Electron Ltd | 基板処理装置び基板処理方法 |
| US6485203B2 (en) | 1999-12-20 | 2002-11-26 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
| US7187503B2 (en) * | 1999-12-29 | 2007-03-06 | Carl Zeiss Smt Ag | Refractive projection objective for immersion lithography |
| US6995930B2 (en) * | 1999-12-29 | 2006-02-07 | Carl Zeiss Smt Ag | Catadioptric projection objective with geometric beam splitting |
| JP3362781B2 (ja) * | 2000-02-03 | 2003-01-07 | 日本電気株式会社 | 現像処理方法および装置、現像制御装置、情報記憶媒体 |
| US6421932B2 (en) * | 2000-02-14 | 2002-07-23 | Hitachi Electronics Engineering Co., Ltd. | Method and apparatus for drying substrate plates |
| DE10011572A1 (de) * | 2000-03-02 | 2001-09-06 | Biotronik Mess & Therapieg | Elektrodenanordnung |
| US6606517B1 (en) * | 2000-04-12 | 2003-08-12 | Pacesetter, Inc. | Methods and apparatus for preventing atrial arrhythmias by overdrive pacing and prolonging atrial refractoriness using an implantable cardiac stimulation device |
| TW594835B (en) * | 2000-05-09 | 2004-06-21 | Tokyo Electron Ltd | System for coating and developing |
| US6488040B1 (en) | 2000-06-30 | 2002-12-03 | Lam Research Corporation | Capillary proximity heads for single wafer cleaning and drying |
| US7234477B2 (en) * | 2000-06-30 | 2007-06-26 | Lam Research Corporation | Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces |
| US6535766B1 (en) * | 2000-08-26 | 2003-03-18 | Medtronic, Inc. | Implanted medical device telemetry using integrated microelectromechanical filtering |
| EP1470268A2 (en) * | 2000-10-03 | 2004-10-27 | Applied Materials, Inc. | Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| KR100866818B1 (ko) * | 2000-12-11 | 2008-11-04 | 가부시키가이샤 니콘 | 투영광학계 및 이 투영광학계를 구비한 노광장치 |
| US6643546B2 (en) * | 2001-02-13 | 2003-11-04 | Quetzal Biomedical, Inc. | Multi-electrode apparatus and method for treatment of congestive heart failure |
| US6609027B2 (en) * | 2001-02-23 | 2003-08-19 | Pacesetter, Inc. | His Bundle sensing device and associated method |
| WO2002091078A1 (en) | 2001-05-07 | 2002-11-14 | Massachusetts Institute Of Technology | Methods and apparatus employing an index matching medium |
| US7674245B2 (en) * | 2001-06-07 | 2010-03-09 | Cardiac Pacemakers, Inc. | Method and apparatus for an adjustable shape guide catheter |
| US7027876B2 (en) * | 2001-10-12 | 2006-04-11 | Medtronic, Inc. | Lead system for providing electrical stimulation to the Bundle of His |
| US6718206B2 (en) * | 2001-10-23 | 2004-04-06 | Medtronic, Inc. | Permanent atrial-his-ventricular sequential pacing |
| US6768923B2 (en) * | 2001-12-05 | 2004-07-27 | Cardiac Pacemakers, Inc. | Apparatus and method for ventricular pacing triggered by detection of early ventricular excitation |
| US7092069B2 (en) * | 2002-03-08 | 2006-08-15 | Carl Zeiss Smt Ag | Projection exposure method and projection exposure system |
| DE10210899A1 (de) * | 2002-03-08 | 2003-09-18 | Zeiss Carl Smt Ag | Refraktives Projektionsobjektiv für Immersions-Lithographie |
| DE10229818A1 (de) * | 2002-06-28 | 2004-01-15 | Carl Zeiss Smt Ag | Verfahren zur Fokusdetektion und Abbildungssystem mit Fokusdetektionssystem |
| US6957105B2 (en) * | 2002-03-26 | 2005-10-18 | Cardiac Pacemakers, Inc. | Method and apparatus for detecting oscillations in cardiac rhythm with electrogram signals |
| US7039462B2 (en) * | 2002-06-14 | 2006-05-02 | Cardiac Pacemakers, Inc. | Method and apparatus for detecting oscillations in cardiac rhythm |
| US7362508B2 (en) | 2002-08-23 | 2008-04-22 | Nikon Corporation | Projection optical system and method for photolithography and exposure apparatus and method using same |
| US7096051B1 (en) * | 2002-09-27 | 2006-08-22 | Lawrence Alder | Enhancing signals in a two-way radio system |
| US7093375B2 (en) * | 2002-09-30 | 2006-08-22 | Lam Research Corporation | Apparatus and method for utilizing a meniscus in substrate processing |
| US6954993B1 (en) * | 2002-09-30 | 2005-10-18 | Lam Research Corporation | Concentric proximity processing head |
| US7082335B2 (en) * | 2002-09-30 | 2006-07-25 | Medtronic, Inc. | Multipolar pacing method and apparatus |
| US6937897B2 (en) * | 2002-09-30 | 2005-08-30 | Medtronic, Inc. | Electrode for His bundle stimulation |
| US6988326B2 (en) * | 2002-09-30 | 2006-01-24 | Lam Research Corporation | Phobic barrier meniscus separation and containment |
| US7367345B1 (en) | 2002-09-30 | 2008-05-06 | Lam Research Corporation | Apparatus and method for providing a confined liquid for immersion lithography |
| US6788477B2 (en) * | 2002-10-22 | 2004-09-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus for method for immersion lithography |
| DE60335595D1 (de) * | 2002-11-12 | 2011-02-17 | Asml Netherlands Bv | Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung |
| EP1420299B1 (en) * | 2002-11-12 | 2011-01-05 | ASML Netherlands B.V. | Immersion lithographic apparatus and device manufacturing method |
| SG121819A1 (en) * | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| CN101424881B (zh) * | 2002-11-12 | 2011-11-30 | Asml荷兰有限公司 | 光刻投射装置 |
| SG121822A1 (en) * | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| EP2495613B1 (en) * | 2002-11-12 | 2013-07-31 | ASML Netherlands B.V. | Lithographic apparatus |
| US7110081B2 (en) * | 2002-11-12 | 2006-09-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US6829035B2 (en) | 2002-11-12 | 2004-12-07 | Applied Materials Israel, Ltd. | Advanced mask cleaning and handling |
| TWI232357B (en) * | 2002-11-12 | 2005-05-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| US7317950B2 (en) * | 2002-11-16 | 2008-01-08 | The Regents Of The University Of California | Cardiac stimulation system with delivery of conductive agent |
| DE10253679A1 (de) * | 2002-11-18 | 2004-06-03 | Infineon Technologies Ag | Optische Einrichtung zur Verwendung bei einem Lithographie-Verfahren, insbesondere zur Herstellung eines Halbleiter-Bauelements, sowie optisches Lithographieverfahren |
| SG131766A1 (en) * | 2002-11-18 | 2007-05-28 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| DE10258718A1 (de) * | 2002-12-09 | 2004-06-24 | Carl Zeiss Smt Ag | Projektionsobjektiv, insbesondere für die Mikrolithographie, sowie Verfahren zur Abstimmung eines Projektionsobjektives |
| EP1571694A4 (en) * | 2002-12-10 | 2008-10-15 | Nikon Corp | EXPOSURE APPARATUS AND METHOD FOR MANUFACTURING THE DEVICE |
| JP4184346B2 (ja) | 2002-12-13 | 2008-11-19 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 層上のスポットを照射するための方法及び装置における液体除去 |
| USRE48515E1 (en) | 2002-12-19 | 2021-04-13 | Asml Netherlands B.V. | Method and device for irradiating spots on a layer |
| DE60307322T2 (de) | 2002-12-19 | 2007-10-18 | Koninklijke Philips Electronics N.V. | Verfahren und anordnung zum bestrahlen einer schicht mittels eines lichtpunkts |
| US7010958B2 (en) * | 2002-12-19 | 2006-03-14 | Asml Holding N.V. | High-resolution gas gauge proximity sensor |
| US6781670B2 (en) * | 2002-12-30 | 2004-08-24 | Intel Corporation | Immersion lithography |
| US7090964B2 (en) * | 2003-02-21 | 2006-08-15 | Asml Holding N.V. | Lithographic printing with polarized light |
| US7206059B2 (en) * | 2003-02-27 | 2007-04-17 | Asml Netherlands B.V. | Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems |
| US6943941B2 (en) * | 2003-02-27 | 2005-09-13 | Asml Netherlands B.V. | Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems |
| US7029832B2 (en) * | 2003-03-11 | 2006-04-18 | Samsung Electronics Co., Ltd. | Immersion lithography methods using carbon dioxide |
| US20050164522A1 (en) | 2003-03-24 | 2005-07-28 | Kunz Roderick R. | Optical fluids, and systems and methods of making and using the same |
| KR101177331B1 (ko) | 2003-04-09 | 2012-08-30 | 가부시키가이샤 니콘 | 액침 리소그래피 유체 제어 시스템 |
| WO2004090633A2 (en) | 2003-04-10 | 2004-10-21 | Nikon Corporation | An electro-osmotic element for an immersion lithography apparatus |
| KR101409565B1 (ko) | 2003-04-10 | 2014-06-19 | 가부시키가이샤 니콘 | 액침 리소그래피 장치용 운반 영역을 포함하는 환경 시스템 |
| EP2921905B1 (en) | 2003-04-10 | 2017-12-27 | Nikon Corporation | Run-off path to collect liquid for an immersion lithography apparatus |
| SG10201604762UA (en) | 2003-04-10 | 2016-08-30 | Nikon Corp | Environmental system including vacuum scavange for an immersion lithography apparatus |
| SG10201803122UA (en) * | 2003-04-11 | 2018-06-28 | Nikon Corp | Immersion lithography apparatus and device manufacturing method |
| WO2004090577A2 (en) | 2003-04-11 | 2004-10-21 | Nikon Corporation | Maintaining immersion fluid under a lithographic projection lens |
| WO2004092830A2 (en) | 2003-04-11 | 2004-10-28 | Nikon Corporation | Liquid jet and recovery system for immersion lithography |
| ATE542167T1 (de) | 2003-04-17 | 2012-02-15 | Nikon Corp | Lithographisches immersionsgerät |
| JP4146755B2 (ja) * | 2003-05-09 | 2008-09-10 | 松下電器産業株式会社 | パターン形成方法 |
| JP4025683B2 (ja) * | 2003-05-09 | 2007-12-26 | 松下電器産業株式会社 | パターン形成方法及び露光装置 |
| TWI518742B (zh) * | 2003-05-23 | 2016-01-21 | 尼康股份有限公司 | A method of manufacturing an exposure apparatus and an element |
| JP4054285B2 (ja) * | 2003-06-12 | 2008-02-27 | 松下電器産業株式会社 | パターン形成方法 |
| JP4084710B2 (ja) * | 2003-06-12 | 2008-04-30 | 松下電器産業株式会社 | パターン形成方法 |
| US6867844B2 (en) * | 2003-06-19 | 2005-03-15 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
| JP4084712B2 (ja) * | 2003-06-23 | 2008-04-30 | 松下電器産業株式会社 | パターン形成方法 |
| JP4029064B2 (ja) * | 2003-06-23 | 2008-01-09 | 松下電器産業株式会社 | パターン形成方法 |
| US6809794B1 (en) * | 2003-06-27 | 2004-10-26 | Asml Holding N.V. | Immersion photolithography system and method using inverted wafer-projection optics interface |
| WO2005006026A2 (en) | 2003-07-01 | 2005-01-20 | Nikon Corporation | Using isotopically specified fluids as optical elements |
| US7384149B2 (en) | 2003-07-21 | 2008-06-10 | Asml Netherlands B.V. | Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system |
| US7006209B2 (en) | 2003-07-25 | 2006-02-28 | Advanced Micro Devices, Inc. | Method and apparatus for monitoring and controlling imaging in immersion lithography systems |
| US7579135B2 (en) * | 2003-08-11 | 2009-08-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lithography apparatus for manufacture of integrated circuits |
| US7700267B2 (en) * | 2003-08-11 | 2010-04-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Immersion fluid for immersion lithography, and method of performing immersion lithography |
| US7061578B2 (en) | 2003-08-11 | 2006-06-13 | Advanced Micro Devices, Inc. | Method and apparatus for monitoring and controlling imaging in immersion lithography systems |
| US7085075B2 (en) | 2003-08-12 | 2006-08-01 | Carl Zeiss Smt Ag | Projection objectives including a plurality of mirrors with lenses ahead of mirror M3 |
| US6844206B1 (en) | 2003-08-21 | 2005-01-18 | Advanced Micro Devices, Llp | Refractive index system monitor and control for immersion lithography |
| US20050049516A1 (en) * | 2003-08-26 | 2005-03-03 | Ideker Raymond E. | Methods, systems and computer program products for selectively initiating interventional therapy to reduce the risk of arrhythmia |
| US7070915B2 (en) * | 2003-08-29 | 2006-07-04 | Tokyo Electron Limited | Method and system for drying a substrate |
| US6954256B2 (en) * | 2003-08-29 | 2005-10-11 | Asml Netherlands B.V. | Gradient immersion lithography |
| US7014966B2 (en) * | 2003-09-02 | 2006-03-21 | Advanced Micro Devices, Inc. | Method and apparatus for elimination of bubbles in immersion medium in immersion lithography systems |
| JP4288426B2 (ja) | 2003-09-03 | 2009-07-01 | 株式会社ニコン | 液浸リソグラフィのための流体の供給装置及び方法 |
| US6961186B2 (en) * | 2003-09-26 | 2005-11-01 | Takumi Technology Corp. | Contact printing using a magnified mask image |
| US7369217B2 (en) | 2003-10-03 | 2008-05-06 | Micronic Laser Systems Ab | Method and device for immersion lithography |
| US7184833B2 (en) * | 2003-10-07 | 2007-02-27 | Medtronic, Inc. | Multiple pacing output channels |
| KR20060126949A (ko) * | 2003-10-08 | 2006-12-11 | 가부시키가이샤 니콘 | 기판 반송 장치와 기판 반송 방법, 노광 장치와 노광 방법,및 디바이스 제조 방법 |
| US7678527B2 (en) * | 2003-10-16 | 2010-03-16 | Intel Corporation | Methods and compositions for providing photoresist with improved properties for contacting liquids |
| US7924397B2 (en) * | 2003-11-06 | 2011-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Anti-corrosion layer on objective lens for liquid immersion lithography applications |
| US8854602B2 (en) | 2003-11-24 | 2014-10-07 | Asml Netherlands B.V. | Holding device for an optical element in an objective |
| US7545481B2 (en) | 2003-11-24 | 2009-06-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7125652B2 (en) * | 2003-12-03 | 2006-10-24 | Advanced Micro Devices, Inc. | Immersion lithographic process using a conforming immersion medium |
| US7245973B2 (en) * | 2003-12-23 | 2007-07-17 | Cardiac Pacemakers, Inc. | His bundle mapping, pacing, and injection lead |
| KR100557222B1 (ko) * | 2004-04-28 | 2006-03-07 | 동부아남반도체 주식회사 | 이머전 리소그라피 공정의 액체 제거 장치 및 방법 |
| US7616383B2 (en) * | 2004-05-18 | 2009-11-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2006080143A (ja) * | 2004-09-07 | 2006-03-23 | Matsushita Electric Ind Co Ltd | 露光装置及びパターン形成方法 |
| US20060116596A1 (en) * | 2004-12-01 | 2006-06-01 | Xiaohong Zhou | Method and apparatus for detection and monitoring of T-wave alternans |
| US8010192B2 (en) * | 2004-12-20 | 2011-08-30 | Cardiac Pacemakers, Inc. | Endocardial pacing relating to conduction abnormalities |
| US8423139B2 (en) * | 2004-12-20 | 2013-04-16 | Cardiac Pacemakers, Inc. | Methods, devices and systems for cardiac rhythm management using an electrode arrangement |
| US8290586B2 (en) * | 2004-12-20 | 2012-10-16 | Cardiac Pacemakers, Inc. | Methods, devices and systems for single-chamber pacing using a dual-chamber pacing device |
| AR047851A1 (es) * | 2004-12-20 | 2006-03-01 | Giniger Alberto German | Un nuevo marcapasos que restablece o preserva la conduccion electrica fisiologica del corazon y un metodo de aplicacion |
| US7697985B2 (en) * | 2005-07-26 | 2010-04-13 | Medtronic, Inc. | System and method for providing alternative pacing modality selection |
| US7359837B2 (en) * | 2006-04-27 | 2008-04-15 | Medtronic, Inc. | Peak data retention of signal data in an implantable medical device |
-
2003
- 2003-12-05 EP EP03777282A patent/EP1571694A4/en not_active Withdrawn
- 2003-12-05 KR KR1020057009359A patent/KR101037057B1/ko active IP Right Grant
- 2003-12-05 WO PCT/JP2003/015587 patent/WO2004053952A1/ja active Application Filing
- 2003-12-05 AU AU2003289199A patent/AU2003289199A1/en not_active Abandoned
- 2003-12-05 KR KR1020107027419A patent/KR101085372B1/ko active IP Right Grant
- 2003-12-05 SG SG200704277-3A patent/SG171468A1/en unknown
- 2003-12-10 TW TW092134794A patent/TW200416497A/zh unknown
-
2005
- 2005-06-08 US US11/147,356 patent/US20050225735A1/en not_active Abandoned
-
2006
- 2006-03-02 US US11/365,869 patent/US20060154183A1/en not_active Abandoned
-
2007
- 2007-02-23 US US11/709,856 patent/US8034539B2/en not_active Expired - Fee Related
-
2009
- 2009-02-18 JP JP2009035767A patent/JP4525827B2/ja not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01120023A (ja) * | 1987-11-02 | 1989-05-12 | Seiko Epson Corp | スピン現像装置 |
| US5209180A (en) * | 1991-03-28 | 1993-05-11 | Dainippon Screen Mfg. Co., Ltd. | Spin coating apparatus with an upper spin plate cleaning nozzle |
| US5896875A (en) * | 1995-09-01 | 1999-04-27 | Matsushita Electronics Corporation | Equipment for cleaning, etching and drying semiconductor wafer and its using method |
| JPH09199470A (ja) * | 1996-01-17 | 1997-07-31 | Hiroshima Nippon Denki Kk | スピンドライヤー |
| EP0805000A1 (en) * | 1996-05-02 | 1997-11-05 | MEMC Electronic Materials, Inc. | Semiconductor wafer post-polish clean and dry method and apparatus |
| US6423642B1 (en) * | 1998-03-13 | 2002-07-23 | Semitool, Inc. | Reactor for processing a semiconductor wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004053952A1 (ja) | 2004-06-24 |
| KR20050086771A (ko) | 2005-08-30 |
| JP2009105473A (ja) | 2009-05-14 |
| KR20110003577A (ko) | 2011-01-12 |
| KR101085372B1 (ko) | 2011-11-21 |
| EP1571694A4 (en) | 2008-10-15 |
| EP1571694A1 (en) | 2005-09-07 |
| US20060154183A1 (en) | 2006-07-13 |
| AU2003289199A1 (en) | 2004-06-30 |
| US8034539B2 (en) | 2011-10-11 |
| US20050225735A1 (en) | 2005-10-13 |
| TW200416497A (en) | 2004-09-01 |
| JP4525827B2 (ja) | 2010-08-18 |
| KR101037057B1 (ko) | 2011-05-26 |
| US20070171391A1 (en) | 2007-07-26 |
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