JP6387226B2 - 複合基板 - Google Patents

複合基板 Download PDF

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Publication number
JP6387226B2
JP6387226B2 JP2013230463A JP2013230463A JP6387226B2 JP 6387226 B2 JP6387226 B2 JP 6387226B2 JP 2013230463 A JP2013230463 A JP 2013230463A JP 2013230463 A JP2013230463 A JP 2013230463A JP 6387226 B2 JP6387226 B2 JP 6387226B2
Authority
JP
Japan
Prior art keywords
layer
substrate
connection terminal
rigid
wiring layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013230463A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015090931A (ja
Inventor
宮崎　政志
政志 宮崎
杉山　裕一
裕一 杉山
豊 秦
豊 秦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP2013230463A priority Critical patent/JP6387226B2/ja
Priority to CN201410636928.9A priority patent/CN104640382B/zh
Publication of JP2015090931A publication Critical patent/JP2015090931A/ja
Application granted granted Critical
Publication of JP6387226B2 publication Critical patent/JP6387226B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2013230463A 2013-11-06 2013-11-06 複合基板 Expired - Fee Related JP6387226B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013230463A JP6387226B2 (ja) 2013-11-06 2013-11-06 複合基板
CN201410636928.9A CN104640382B (zh) 2013-11-06 2014-11-06 复合基板和刚性基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013230463A JP6387226B2 (ja) 2013-11-06 2013-11-06 複合基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018137957A Division JP6735793B2 (ja) 2018-07-23 2018-07-23 複合基板及びリジッド基板

Publications (2)

Publication Number Publication Date
JP2015090931A JP2015090931A (ja) 2015-05-11
JP6387226B2 true JP6387226B2 (ja) 2018-09-05

Family

ID=53194316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013230463A Expired - Fee Related JP6387226B2 (ja) 2013-11-06 2013-11-06 複合基板

Country Status (2)

Country Link
JP (1) JP6387226B2 (zh)
CN (1) CN104640382B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113261161A (zh) * 2019-03-21 2021-08-13 深圳市柔宇科技股份有限公司 电连接组件、电子设备及电连接组件的制备方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59158823A (ja) * 1983-03-02 1984-09-08 Kunimitsu Yamada 地中プレストレストコンクリ−ト部材の構築工法
JP3107419B2 (ja) * 1991-07-23 2000-11-06 株式会社東海理化電機製作所 ドアロック解除装置
JPH05225965A (ja) * 1992-05-27 1993-09-03 Sony Corp バッテリー装着装置
JP3956204B2 (ja) * 2002-06-27 2007-08-08 日本特殊陶業株式会社 積層樹脂配線基板及びその製造方法、積層樹脂配線基板用金属板
JP2005259860A (ja) * 2004-03-10 2005-09-22 Mitsubishi Electric Corp 電子回路装置
JP4574288B2 (ja) * 2004-04-09 2010-11-04 大日本印刷株式会社 リジッド−フレキシブル基板の製造方法
WO2005122657A1 (ja) * 2004-06-11 2005-12-22 Ibiden Co., Ltd. フレックスリジッド配線板とその製造方法
JP4574310B2 (ja) * 2004-09-30 2010-11-04 大日本印刷株式会社 リジッド−フレキシブル基板の製造方法
JP4792747B2 (ja) * 2004-11-29 2011-10-12 大日本印刷株式会社 配線基板ユニットの製造装置
JP3993211B2 (ja) * 2005-11-18 2007-10-17 シャープ株式会社 多層プリント配線板およびその製造方法
JP2008186843A (ja) * 2007-01-26 2008-08-14 Olympus Corp フレキシブル基板の接合構造
US8648263B2 (en) * 2007-05-17 2014-02-11 Ibiden Co., Ltd. Wiring board and method of manufacturing wiring board
JPWO2010140214A1 (ja) * 2009-06-02 2012-11-15 ソニーケミカル＆インフォメーションデバイス株式会社 多層プリント配線板の製造方法
JP2011159855A (ja) * 2010-02-02 2011-08-18 Panasonic Corp 局所多層回路基板、および局所多層回路基板の製造方法
JPWO2011102561A1 (ja) * 2010-02-22 2013-06-17 三洋電機株式会社 多層プリント配線基板およびその製造方法
JP2012009478A (ja) * 2010-06-22 2012-01-12 Sumitomo Electric Printed Circuit Inc 接続構造、電子機器
KR101095161B1 (ko) * 2010-10-07 2011-12-16 삼성전기주식회사 전자부품 내장형 인쇄회로기판
JP5539150B2 (ja) * 2010-10-25 2014-07-02 矢崎総業株式会社 配線基板の製造方法

Also Published As

Publication number Publication date
JP2015090931A (ja) 2015-05-11
CN104640382B (zh) 2018-06-01
CN104640382A (zh) 2015-05-20

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