JP5417323B2 - 感光性ポリイミド前駆体組成物、感光性ドライフィルム及びフレキシブルプリント配線基板 - Google Patents

感光性ポリイミド前駆体組成物、感光性ドライフィルム及びフレキシブルプリント配線基板 Download PDF

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Publication number
JP5417323B2
JP5417323B2 JP2010511044A JP2010511044A JP5417323B2 JP 5417323 B2 JP5417323 B2 JP 5417323B2 JP 2010511044 A JP2010511044 A JP 2010511044A JP 2010511044 A JP2010511044 A JP 2010511044A JP 5417323 B2 JP5417323 B2 JP 5417323B2
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polyimide precursor
photosensitive
bis
group
film
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Expired - Fee Related
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Japanese (ja)
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JPWO2009136557A1 (ja
Inventor
久遠 宮崎
隆志 早川
明宏 加藤
秀明 高橋
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Asahi Kasei E Materials Corp
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Asahi Kasei E Materials Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Engineering & Computer Science (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2010511044A 2008-05-09 2009-04-24 感光性ポリイミド前駆体組成物、感光性ドライフィルム及びフレキシブルプリント配線基板 Expired - Fee Related JP5417323B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010511044A JP5417323B2 (ja) 2008-05-09 2009-04-24 感光性ポリイミド前駆体組成物、感光性ドライフィルム及びフレキシブルプリント配線基板

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008124016 2008-05-09
JP2008124016 2008-05-09
PCT/JP2009/058159 WO2009136557A1 (fr) 2008-05-09 2009-04-24 Précurseur de polyimide, composition de précurseur de polyimide photosensible, film sec photosensible et carte de circuits imprimés flexible utilisant ces matières
JP2010511044A JP5417323B2 (ja) 2008-05-09 2009-04-24 感光性ポリイミド前駆体組成物、感光性ドライフィルム及びフレキシブルプリント配線基板

Related Child Applications (1)

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JP2013142501A Division JP5603977B2 (ja) 2008-05-09 2013-07-08 ポリイミド前駆体

Publications (2)

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JPWO2009136557A1 JPWO2009136557A1 (ja) 2011-09-08
JP5417323B2 true JP5417323B2 (ja) 2014-02-12

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JP2010511044A Expired - Fee Related JP5417323B2 (ja) 2008-05-09 2009-04-24 感光性ポリイミド前駆体組成物、感光性ドライフィルム及びフレキシブルプリント配線基板
JP2013142501A Expired - Fee Related JP5603977B2 (ja) 2008-05-09 2013-07-08 ポリイミド前駆体

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JP (2) JP5417323B2 (fr)
KR (1) KR101308811B1 (fr)
CN (1) CN102015835A (fr)
TW (1) TWI384015B (fr)
WO (1) WO2009136557A1 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI440656B (zh) * 2009-11-16 2014-06-11 Asahi Kasei E Materials Corp A polyimide precursor and a photosensitive resin composition comprising the polyimide precursor
JP4878662B2 (ja) * 2010-04-28 2012-02-15 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP5691657B2 (ja) * 2011-03-04 2015-04-01 日油株式会社 感光性樹脂組成物およびその用途
WO2012133826A1 (fr) * 2011-03-31 2012-10-04 日産化学工業株式会社 Agent d'alignement de cristaux liquides et film d'alignement de cristaux liquides utilisant ledit agent
JP5751025B2 (ja) * 2011-05-31 2015-07-22 住友ベークライト株式会社 ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜、半導体装置、および表示体装置
JP5748638B2 (ja) * 2011-11-04 2015-07-15 旭化成イーマテリアルズ株式会社 ポリイミド前駆体又はポリイミド及び感光性樹脂組成物
TWI486335B (zh) * 2011-12-29 2015-06-01 Eternal Materials Co Ltd 鹼產生劑
JP5884551B2 (ja) * 2012-02-27 2016-03-15 日油株式会社 感光性樹脂組成物およびその用途
JP6343989B2 (ja) * 2013-03-21 2018-06-20 東洋紡株式会社 透明ポリエステルイミド樹脂フィルム、並びにこれに用いる樹脂および樹脂組成物
TWI671343B (zh) * 2014-06-27 2019-09-11 日商富士軟片股份有限公司 熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法以及半導體裝置
JP2016080803A (ja) * 2014-10-14 2016-05-16 太陽インキ製造株式会社 ドライフィルムおよびフレキシブルプリント配線板
TWI754734B (zh) * 2017-03-29 2022-02-11 日商富士軟片股份有限公司 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體裝置
JP6968196B2 (ja) * 2017-11-28 2021-11-17 旭化成株式会社 ネガ型感光性樹脂組成物及びその製造方法、並びに硬化レリーフパターンの製造方法
JP6810677B2 (ja) * 2017-12-05 2021-01-06 信越化学工業株式会社 新規テトラカルボン酸二無水物、ポリイミド樹脂及びその製造方法、感光性樹脂組成物、パターン形成方法及び硬化被膜形成方法、層間絶縁膜、表面保護膜、電子部品
JP6958332B2 (ja) * 2017-12-20 2021-11-02 Ｈｄマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
CN110857332B (zh) * 2018-08-22 2022-10-21 臻鼎科技股份有限公司 高分子树脂、高分子树脂组合物及覆铜板
KR20220015327A (ko) 2020-07-30 2022-02-08 주식회사 엘지화학 바인더 수지, 포지티브형 감광성 수지 조성물, 절연막 및 반도체 장치
CN115698854A (zh) * 2020-08-17 2023-02-03 东丽株式会社 感光性树脂组合物、硬化物、显示装置、半导体装置及硬化物的制造方法
CN116789590B (zh) * 2023-06-25 2024-02-02 波米科技有限公司 一种含哌啶基团的二胺化合物及其制备方法和应用

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JPH08100061A (ja) * 1994-09-28 1996-04-16 Hitachi Chem Co Ltd ブロックコポリマ、その製造法、液晶配向材料、液晶配向膜、液晶挾持基板及び液晶表示素子
JPH10330723A (ja) * 1997-05-28 1998-12-15 Hitachi Chem Co Ltd 接着フィルム
JP2007217476A (ja) * 2006-02-14 2007-08-30 Kaneka Corp 新規なポリイミド樹脂
JP2008231420A (ja) * 2007-02-22 2008-10-02 New Japan Chem Co Ltd 溶剤可溶性ポリイミド共重合体及びそれを含有するポリイミドワニス
JP2009109590A (ja) * 2007-10-26 2009-05-21 Asahi Kasei Corp 感光性樹脂組成物、感光性ドライフィルム、感光性積層フィルムおよびそれらを用いたカバーレイ
JP2009109591A (ja) * 2007-10-26 2009-05-21 Asahi Kasei Corp 感光性ポリアミド樹脂組成物、感光性ドライフィルムおよびそれらを用いたカバーレイ
JP2009109592A (ja) * 2007-10-26 2009-05-21 Asahi Kasei Corp 感光性樹脂組成物、感光性ドライフィルム、感光性積層フィルムおよびそれらを用いたカバーレイ

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JP2006206756A (ja) * 2005-01-28 2006-08-10 Sony Chem Corp ポリイミド化合物及びフレキシブル配線板
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JP2008156425A (ja) * 2006-12-21 2008-07-10 Asahi Kasei Corp ポリイミド及びそれを用いた感光性樹脂組成物
WO2008096601A1 (fr) * 2007-02-09 2008-08-14 Sony Chemical & Information Device Corporation Composition photosensible de résine polyimide

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Publication number Priority date Publication date Assignee Title
JPH08100061A (ja) * 1994-09-28 1996-04-16 Hitachi Chem Co Ltd ブロックコポリマ、その製造法、液晶配向材料、液晶配向膜、液晶挾持基板及び液晶表示素子
JPH10330723A (ja) * 1997-05-28 1998-12-15 Hitachi Chem Co Ltd 接着フィルム
JP2007217476A (ja) * 2006-02-14 2007-08-30 Kaneka Corp 新規なポリイミド樹脂
JP2008231420A (ja) * 2007-02-22 2008-10-02 New Japan Chem Co Ltd 溶剤可溶性ポリイミド共重合体及びそれを含有するポリイミドワニス
JP2009109590A (ja) * 2007-10-26 2009-05-21 Asahi Kasei Corp 感光性樹脂組成物、感光性ドライフィルム、感光性積層フィルムおよびそれらを用いたカバーレイ
JP2009109591A (ja) * 2007-10-26 2009-05-21 Asahi Kasei Corp 感光性ポリアミド樹脂組成物、感光性ドライフィルムおよびそれらを用いたカバーレイ
JP2009109592A (ja) * 2007-10-26 2009-05-21 Asahi Kasei Corp 感光性樹脂組成物、感光性ドライフィルム、感光性積層フィルムおよびそれらを用いたカバーレイ

Also Published As

Publication number Publication date
TW201006867A (en) 2010-02-16
TWI384015B (zh) 2013-02-01
JP5603977B2 (ja) 2014-10-08
CN102015835A (zh) 2011-04-13
KR20100125467A (ko) 2010-11-30
JP2013241607A (ja) 2013-12-05
KR101308811B1 (ko) 2013-09-13
WO2009136557A1 (fr) 2009-11-12
JPWO2009136557A1 (ja) 2011-09-08

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