CN106903970B - 制造射频识别器件的方法 - Google Patents
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Abstract
本发明涉及制造射频(RFID)标签的天线的方法。向至少一个切割台提供一幅材料,其中在该幅材料中产生第一图案。可以进行进一步的切割以形成另外改进,以提供微芯片连接位置以及针对具体最终用途应用选择性调节天线。切割可以通过激光、模切、冲压或其组合进行。
Description
本申请为分案申请,原申请的申请日是2011年6月14日,申请号是201180029130.2(PCT/US2011/040379),发明名称为“制造射频识别器件的方法”。
相关申请的交叉引用
本申请要求2010年6月14日提交的美国临时专利申请61/354380、2010年6月14日提交的美国临时专利申请61/354388和2010年6月14日提交的美国临时专利申请61/354393的权益,通过引用将其全部以其整体并入本文。
技术领域
本发明处于制造用于射频识别(“RFID”)标签、嵌入物、票据和标记的射频识别天线结构的领域。更具体而言,本发明涉及利用切割技术的组合,以连续和有效方式制造RFID器件的RFID天线的方法,其潜在地允许将微处理器直接放置在天线上而不需要微处理器接触延伸件例如条带、插件或载体。
背景技术
射频识别(RFID)标签的用途是众所周知的。RFID标签通常用于各种各样领域,例如汽车的安全锁、控制进出建筑物、其他安全应用、跟踪和管理库存以及提供对带标签物品的识别。
典型的RFID标签具有电连接到天线的微处理器。当用于跟踪或管理库存时,微处理器存储与库存关联的唯一识别数据。操作员可以使用外部接收器/读取器接收存储的数据并处理库存。
近来,随着公司探索保持和/或增加盈利能力的替代性业务流程,RFID标签的需求已增加。通常,公司试图预测商店特定物品的销售量,然后基于销售量预测,运送设定数量或金额的货物。由于销售量预测可能过度估算需求,导致商店不得不储备库存并保持该物品比预期时间更长的时间,因此这种业务流程具有降低公司盈利能力的可能性。一旦物品的可出售寿命接近终点或在食物的情况下接近或已经达到过期(例如,易腐货物、季节性物品、时尚趋势等),商店可能甚至被迫下调物品的价格。可选地,销售量预测可能低估需求,从而由于消费者被迫到其他地方商店购买脱销产品,降低了公司销售额并影响了盈利能力。
RFID标签通过允许公司连续监控商店产品的供应,具有增加公司盈利能力的可能性。利用RFID标签允许公司在没有必须进行实物库存盘点的情况下对低商店库存做出快速响应,以便确保足够的货物供应而又避免与过度库存产品有关的风险。此外,公司可以监控商店产品的销售率,这有助于公司预测未来销售趋势,以便公司能够根据需要在供应链内做出变更,从而保持适当供应和准备好货物的可用性。
RFID标签增加的需求已经产生对能够快速和有效生产RFID标签天线的制造方法的需要。一种这样的方法在美国专利申请2007/0171129A1中公开。该方法包括步骤:首先提供加固的金属箔层压片——其包括结合到加强层的箔,以及结合到金属箔层压片的载体层。其次,该方法包括步骤:利用旋转模切机穿过层压到载体层的金属箔切割出天线图案。该方法结束的步骤是,移走加强金属箔层压片的不期望的余料(matrix)部分,以便提供布置在载体层上的金属箔层压片天线。通过该方法产生的RFID标签5在图1中示出。
遍及本公开参考了出版物、专利和专利申请。所有本文引用的参考文献通过引用在此并入。
参考图1,RFID标签5具有由增强导电层形成的天线结构10。天线结构具有大致T形开口15,其限定由缝隙30彼此分隔的第一天线接触端20和第二天线接触端25。第一接触延伸件35和第二接触延伸件40基本上分别从第一天线接触端20和第二天线接触端25向缝隙延伸,并允许微处理器45电联接于天线结构5。应当理解,任何形状可以适合于天线开口,并且提及“T”形开口仅用于示例性说明目的。
切割RFID天线图案的旋转模切机是有优势的,这是因为旋转模切既快速又不昂贵。不过,旋转模切机具有差的分辨率,并且受限于切割线之间具有1mm的最小距离。因此,图1中RFID标签1的缝隙30在第一接触天线端20和第二接触天线端25之间最小形成1mm的空隙。这个距离对于微处理器芯片45桥接来说太大。因此,芯片45不能直接联接于天线结构10。而是,在芯片45可以电联接于天线结构10之前,第一接触延伸件35和第二接触延伸件40必须用于基本上桥接缝隙30。
利用旋转模切机切割RFID天线图案的另外问题是旋转模切机使用的圆柱形模具不能快速或轻易改变。因此,天线设计不容易改变,并因此特定天线设计的小批量生产不是经常经济上可行的,这是由于经常需要更换模头。而且,天线设计的任何改变会需要大量订货至交货的时间(lead-time),这是由于每当天线设计改变时必须制作新的圆柱形模具。这可能产生模头的大量库存。大量模头的存储可能占用有用的工厂房屋空间。
需要的是消除了现有方法各个缺点的制造RFID标签的改进方法。
发明内容
下述的本发明实施方式不意欲是穷举性的或将本发明限于下面详细描述中所公开的精确形式。而是,所述实施方式被选择和描述以便本领域的其他技术人员可以明白和理解本发明的原理和实践。
本发明提出使用激光切割机切割天线图案,以克服与旋转模切机关联的许多问题。激光切割机具有极高分辨率,从而能够形成复杂的、精确的切口。因此,激光切割机可以在天线结构中形成足够小的缝隙,以允许微处理器芯片和天线结构之间的直接连接。此外,控制激光切割路径的计算机可以容易地和快速地对于各种显著不同的切割路径进行编程。这使得具体天线设计的小批量生产经济上可行,并大大减少订货至交货的时间,这是因为全部需要的就是对新图案的程序化改变。不过,激光的切割速度有限,并且比旋转模切机的速度慢得多。
通过用激光切割机在通过旋转模切机或冷箔工艺(cold foil process)形成的天线结构中形成一个或多个缝隙或切口,以移除较大部分的设计,然后利用激光切割移除该设计的更复杂或精确部分,本发明克服了与仅用旋转模切机相关的上面指出的问题,从而形成用于RFID标签或标记的完整天线结构。
本发明涉及制造射频识别(RFID)天线的方法。该方法包括步骤:首先,提供导电层和载体层以形成金属箔层压片。导电层可以采用具有金属箔层的加强金属箔层压片的形式,金属箔层可以或可以不粘合至加强层。可选地,可以没有加强层而使用足够机械强度的箔。然后,第一切割机穿过导电层至载体层切割基本的天线图案或设计,以形成第一RFID天线结构。接下来,计算机控制的激光将金属箔层压片的一部分烧蚀至载体层,以在基本的天线图案中切割出微处理器连接部分和/或太复杂或精致以致第一切割机不能切割的其他区域。该方法的最后步骤涉及将导电层的不期望余料部分从RFID天线结构分离,以提供用于布置在载体层上的RFID天线结构的导电层。
在本发明的进一步示例性实施方式中,提供制造改进的RFID标签的方法,其包括步骤:首先,提供导电层和至少部分结合到导电层的载体层。可以是旋转模切机、冷箔工艺或激光的第一切割机用于切割出穿过导电层至载体层表面或上表面的基本天线图案。然后,利用可以是与第一切割机相同的计算机控制的切割激光烧蚀导电层,穿过导电层至载体层在基本天线图案中切割出微处理器连接部分或其他复杂部分,以形成RFID器件的天线结构。可以进行附加切割,以进一步精确天线设计。
如本文使用的,示例性冷箔工艺指的是在基底上印制粘合剂或其他可固化的图案,接着将箔层施加到该图案上,将箔层压到该图案上,以使箔粘结到图案上,然后剥掉箔,在覆以箔层的基底上留下图案。
在基本天线结构中作为待被激光切割的一种较复杂图案或区域的微处理器连接部分可以采取任何合适形状,以及在一个示例性实施方式中,是大致T形空隙,以形成偶极天线。微处理器连接部分限定了将第一接触天线端与第二天线接触端隔开的缝隙。接下来,必要时,将余料部分从导电层以及RFID天线结构分离出来,以提供布置在载体层上的导电层RFID天线结构。可选地,可以不将余料从天线结构移除,而是,切割在箔中形成足够宽的间隔,以使天线各段不接触,从而使在切割期间形成的电路不短路。
接着,微处理器直接连接于RFID天线结构的微处理器连接部分,以在切割完成后形成例如标签、票据或RFID标记或嵌入物的RFID器件。当延伸通过缝隙时,在第一天线接触端和第二天线接触端,微处理器直接连接至微处理器连接部分。为了形成连接区域,计算机控制的切割激光用于烧蚀标准RFID天线结构的选择部分或预先确定部分,以形成改进的RFID标签。该方法的最后步骤涉及将改进的RFID标签从载体层移除。应当明白,虽然本发明已经描述带有两个连接点或端口的微处理器,但相同原理适用于具有更大数量连接点或端口例如四个连接点或端口的微处理器。以这样的方式,微处理器可以直接连接于天线而不需要条带或导电延伸件施加到芯片上。
在当前描述发明的又进一步示例性实施方式中,提供用于RFID标签的导电结构,其包括具有第一和第二面(side)的导电层和第一天线图案,其中第一图案通过形成区别于第一天线图案的第二天线图案而改进。第二天线图案限定至少一个连接端口。第一和第二图案的每一个延伸穿过金属箔层的第一和第二面的每一个至载体层。载体层支撑金属箔层,以及微处理器芯片连接于第二天线图案的微处理器连接部分。
前述实施方式还可以包括区别于第一和第二天线图案中的每一个的第三天线图案。可选地,第三图案可以与第一或第二图案中的一个或两者部分一致。此外,第一、第二和/或第三图案可以协作形成RFID天线结构。第三图案还可以独立地起作用或使用并且可以不形成导电天线结构的任何部分,而且可以提供用于信息目的的另一个变化图案。
从下列详细描述,本发明的其他特征和优势将对于本领域的技术人员变得清楚。不过,应当理解,虽然指出了本发明优选的和其他实施方式,但是通过说明而非限制的方式给出各种实施方式和具体实例的详细描述。可以在不偏离本发明精神的情况下,做出在本发明范围内的许多变化和修改,并且本发明包括所有这样的修改。
附图说明
结合附图,通过参考本发明当前优选示例性实施方式的下面更详细描述,可以更加全面理解和了解本发明的这些目标和优势以及其他目标和优势,其中:
图1是由现有技术方法形成的天线的俯视图;
图2是由本发明公开方法形成的完整标准RFID标签的俯视图;
图3示出根据本发明方面的、用于制造标准RFID天线结构的卷到卷工艺;
图4是用于由本发明公开的卷到卷工艺的幅材(web)的横截面视图;
图5是本发明公开的旋转模切机使用的模具的俯视图;
图6是由图3所示模具切割的基本天线结构的俯视图;
图7是本发明使用的示例性主激光切割路径的俯视图;
图8是显示在图6所示基本天线结构上布置图7所示主激光路径的俯视图;
图9是标准天线结构的俯视图;
图10示出根据本发明方面的、用于制造改进RFID标签的卷到卷工艺;
图11是本发明使用的示例性第二切割路径的俯视图;
图12是显示在图2所示标准RFID标签上布置图10所示第二切割路径的俯视图;
图13是由本发明公开方法形成的完成的改进RFID标签的俯视图;
图14示出根据本发明方面的、用于制造改进RFID标签的另一种卷到卷工艺;
图15示出根据本发明方面的、形成标准RFID天线的方法;
图16示出根据本发明方面的、形成改进RFID标签的方法;
图17提供根据本发明产生的导电层压片的侧视图。
具体实施方式
在本文中公开的装置和方法通过实例并参考附图详细描述。除非另外指出,图中的相似数字指示参考图中相同、类似或相应的元件。应当明白,可以对公开和描述的实例、布置、构造、组件、元件、装置、方法、材料等做出修改,并且对于具体应用是期望的。在本公开中,具体形状、材料、技术、布置等的任何指定与陈述的具体实例相关,或仅仅是这样的形状、材料、技术、布置等的一般性描述。具体细节或实例的指定不意欲解释为并且不应该解释为强制性的或限制性的,除非特别如此指出。
现参考图2,其示出由本发明方法形成的完整示例性RFID标签50的俯视图。RFID标签50具有由导电层形成的天线结构55。天线结构55具有带有大致T形开口65的中心部分60。应当理解,根据最终用户应用的要求,可以生产任何构造或形状。
大致T形开口65限定将第一天线接触端75与第二天线接触端80隔开的缝隙70。接着,当延伸通过缝隙70时微处理器85可以直接电联接于第一和第二接触天线端75、80上。应当注意,作为用于形成标准天线结构55的方法的结果,微处理器85直接电联接于标准天线结构55,而没有使用任何接触延伸件例如条带,其将在下面详细解释。不过本发明考虑可以使用接触延伸件,但不要求。
现已描述RFID标签50,形成天线结构55的装置的示意图在图3中阐述,其示出根据本发明方面的用于制造RFID天线结构的卷到卷工艺。幅材90经由开卷机95从幅材卷100分发并送到具有旋转模具150的旋转模切机110。幅材90离开第一切割机110,并送到激光切割机175。激光切割路径215(在图7详细提供其示例性实施方式)被编程到控制激光切割机175的计算机400中。
可编程激光还可用于在材料中切割其他图案,例如徽标、名称、商标、图像或类似物,以便可以形成RFID器件,并且关于零售商、客户、制造商、营销或促销活动、主题等的信息可以包括在该器件中。
适用于本发明的示例性激光器包括镱激光器,其以1024nm的波长在大约48kHz脉冲。理想地,激光能量不从基底表面显现,以便不存在表面粗糙、变黑或模具撞击(diestrike)的区域,如用模切机可见的。
继续参考图3,幅材155离开激光切割机175,并且如果必要,送到剥离器180。当提供时,剥离器180将余料幅材190从天线结构分离,形成完成的天线结构幅材185。应当注意,当提供时,加强层135(图4)用于支撑导电层145的强度可以是必需的,以便如果导电层没有足够坚固以承受加工,在天线结构幅材185的加工/切割期间,防止导电层145的撕裂或裂开。可选地,可以使用具有足够机械强度的箔或其他导电结构例如电线幅材或电线网。在后一例子中,当收集时,箔余料是100%可回收的。天线结构幅材185具有布置在载体层130上的一连串天线结构。天线结构幅材185由第一重绕机200缠绕成天线结构卷195,而余料幅材190由第二重绕机205缠绕成余料卷210。
现参考图4,其示出用于卷到卷工艺的幅材115的横截面视图。幅材115可以选自纸张、织物(织造或非织造的、合成或天然的织物)、塑料或其他合适材料。幅材115可以包括由第一粘合层125粘结于载体层130的导电层120。在本发明的一个实施方式中,第一粘合层125可以具有用作对齐标记、布置在粘合层内的光学增亮剂图案(未示出),以便辅助激光的切割过程。光学增亮剂可由激光器检测并向激光器指示在何处为天线结构切割图案。光学增亮剂还可以印刷在粘合层上面,而不是存在于粘合层内。此外,光学增亮剂可以印刷在载体层130上,而非混合在粘合剂中,即,在粘合剂施加之前并且毗邻施加粘合剂的区域,光学增亮剂可以印刷、喷涂或以其他方式施加到载体层。在这个实施方式中,粘合层是清澈或透明的是优选的,以便可以穿过粘合层看见光学增亮剂。
可选地,该***可以使用其他触发器或元件,以允许激光开始切割,例如幅材的印刷和非印刷区域,涂布和未涂布的粘合区域,幅材中的冲孔、切口、缝隙,以及类似物。
在优选实施方式中,光学增亮剂是荧光粉,其量是按重量计粘合剂的大约1%,以及更优选地,按重量计粘合剂的大约0.5%。
在本发明的一个实施方式中,幅材可以具有沿第一粘合层的纵向和/或横向延伸面(取决于幅材行进的方向)的一系列印刷的对齐标记14。对齐标记有助于导电层中天线图案的对齐,并且通常以纵向提供,所述纵向是幅材或片材行进通过机器的方向。光学增亮剂可以用作对齐标记,或对齐标记可以用各种油墨印刷在各个光学增亮剂上面。在另一个实施方式中,对齐标记可以由光学增亮剂制成,以及光学增亮剂也可以合并在粘合层内,在粘合层上面,或在基底第一面上面。
在本发明的一个实施方式中,幅材或片材可以仅包括可由载体或支撑件支撑的单层箔,其中所述载体或支撑件在箔结合到载体之前是可移去的,并且在加工期间仅用于支撑箔。可选地,箔可以具有不需要支撑层的足够厚度,并且具有承受卷到卷工艺和连续切割的加工的足够强度。
载体层130可以由允许载体层130柔软的任何材料或材料(纸张、织物、塑料等)组合制成,以有利于载体层130作为可以缠绕为用于卷到卷工艺的卷形式的连续幅材进行制造。幅材还可以以折叠页(fanfold)或Z字形构造收集。这类材料的例子包括但不限于聚脂膜、聚对苯二甲酸乙二酯膜、聚酰亚胺膜、织物或布、或纸质材料(卡片纸、证券纸等)。粘合层125可以通过溢流涂布(flood coating)或辊涂施加到载体层130,并且可以是压力活化粘合剂(pressure activated adhesive)或压敏粘合剂。
应当理解,虽然本发明描述为利用幅材的卷到卷布置,但本发明可以以片材输送配置实践。在片材输送方法中,材料(纸张、塑料、织物等)片从进料斗或片材给料机提供,然后加工完成后收集片材。材料片通常以堆叠方式收集。
当加强层用于形成加强导电层120时,金属箔层145通过第二粘合层140粘结于加强层135。金属箔层145可以由任何合适导电材料构造,例如铝、铜、银、金及类似物。还可以使用导电材料的组合。此外,导电材料可以通过印刷导电油墨、涂布导电流体或溶液、薄片或其他合适方法形成。第二粘合层140可以是通用永久压敏粘合剂、压力活化粘合剂、或任何其他合适粘合剂。第二粘合层140可以通过仅在要形成天线的区域中溢流涂布、辊涂或图案涂布粘合剂被施加到加强层135。可选地,粘合剂可以是两部分粘合剂,其中一部分涂在幅材上并且是不粘的,接着在要形成天线的选择性区域中在涂布第二部分之后,粘合剂变成粘性的。两部分粘合剂还可以用于箔直接关联于载体上并且没有使用加强层的情况中。
本发明考虑光学增亮剂也可包含在第二粘合剂中或在第二粘合层上面,用于它们在第一粘合层125中的类似目的。与光学增亮剂23在第一粘合层125中相反或除了光学增亮剂23在第一粘合剂125中以外,光学增亮剂23还可以包含在第二粘合层20中。
当使用旋转模切机或冷箔工艺时,旋转模切机或冷箔工艺110配备有模具150(其示例性实施方式在图3中详细示出),其具有与待形成的天线结构的外形大致成镜像的形状,但是没有用于芯片连接的开口(例如T形开口)或将被赋予至设计的其他构造(其示例性实施方式在图5中详细示出)。当幅材90输送通过旋转模具110时,与冷箔工艺一样,旋转模具110促使模具150循环地切割或冲压幅材90,穿过金属箔层120和第一粘合层125到达载体层130,从而从称为余料幅材190的非期望部分勾画出(delineate)一连串天线结构。示例性天线结构165在图6中示出。天线结构165具有中心部分170。天线结构165在中心部分170还没有限定微处理器连接区域。应当理解,其他更复杂区域也可以不在第一切割期间形成,并且提及连接特征意欲是说明性的而非限制性的。
返回参看图3,幅材90离开旋转模切机110并输送到激光切割机175。激光切割路径215(在图7中详细显示其示例性实施方式)被编程到控制激光切割机175的计算机400。在幅材90输送通过激光切割机175时,激光切割机175将激光切割路径215定位在由旋转模具110形成的天线结构165的中心部分170上,如图8所示。在天线结构行进通过激光切割机175时,激光切割机175追寻激光切割路径215的位置,同时连续烧蚀导电层120和粘合层125以在基本天线结构的中心部分形成微处理器连接区域。激光可以形成或精制对于模切机来说太精细而不能处理的天线的其他区域。在加强层存在的情况中,激光还可以切割穿过加强层和第二粘合层。
一连串完成的天线结构在布置于载体层35上的导电层120中产生,同时该结构仍然被随后剥离的余料幅材190围绕。完成的天线结构在图9中示出。完成的天线结构具有带有开口230的中心部分500(例如,微处理器连接区域),其在本实例中是大致“T”形。开口230限定将第一天线接触端240与第二天线接触端250隔开的缝隙245。
应当明白,激光切割机175烧蚀导电层120和粘合层125,形成用于连接微处理器的开口。因此,在剥离器180将余料幅材190从用于形成一般天线结构幅材185的第一切割过程形成的天线结构分离时,没有材料存在于开口中要用剥离器180移除。天线结构的微处理器连接区域特别狭窄。因此,如果模具150被成形为也切割微处理器连接开口,则在天线结构幅材185与余料幅材190分离期间从微处理器连接区域移除的材料可能同样特别狭窄,并因此脆弱且特别易于撕裂。因为撕裂可能会损坏天线结构,这可能破坏天线的功能性,因此这可能存在问题。而且,这种性质的撕裂会导致必须手动去除的残留在微处理器连接中的材料,导致降低的生产率和提高的制造成本。
在这个实例中,虽然激光切割机175仅形成限定缝隙和两个接触天线端的微处理器连接,但应当理解,可以简单地通过将新的激光切割路径程序加载到计算机400,可以容易地和快速地改变激光切割路径215,以在该连接模式之后或者与该连接模式同时或者在该连接模式之前形成在天线结构中产生的其他切口或图案。因此,公开的卷到卷工艺使得具有示例性标准天线结构的非常独特变化的专用天线的小批量生产经济上可行,或使得非常复杂设计的生产对于这种有限批次天线更加切实可行。
现在参考图10,其示出根据本发明方面的、用于制造改进RFID标签的卷到卷工艺。如本文使用的,改进的天线结构指的是这样的方法:采用以前形成的天线结构——特别是因为其来自标准化图案集,然后进一步改变该结构以满足具体最终用途应用或完成具体设计的制造。
天线结构幅材275经由开卷机260从天线结构卷270分发。为了这个示例性实施方式的目的,假设在图10中示出的天线结构卷270由在图3中示出的卷到卷工艺形成。不过,可以采用任何其他合适方法形成天线结构,例如片材输送方法。天线结构幅材275被输送到微处理器连接装置280。微处理器连接装置280将微处理器固定于行进通过微处理器连接装置280的天线结构上,从而形成微处理器和天线结构之间的直接电连接。
返回参考图2,完成的标准RFID标签50示出微处理器连接装置280(图14)将微处理器85相对于天线结构55放置的情形。微处理器连接装置280将微处理器85的一端固定于天线结构55的第一接触端75,以及将微处理器85的另一端固定于第二接触端80,使得微处理器延伸跨过缝隙70。微处理器连接装置280可以通过导电粘合剂、焊接(例如点焊)、超声波焊接、机械压接或通过允许电流流过微处理器100并围绕天线结构55的任何其他合适方式将微处理器85固定于天线结构55。
应当理解,激光切割机175的高分辨率切割能力允许激光切割机175在没有使用任何接触延伸件的情况下,形成足够狭窄以允许将微处理器直接连接于标准天线结构的缝隙。接触延伸件的缺乏可以简化制造工艺,减少制造成本,并消除潜在失效点(例如,接触连接点)。不过,应当理解,接触延伸件或条带或引线框也可以结合本方法使用。在一些情况,根据条带或引线框的尺寸,通过利用相同天线但是不同尺寸的条带,可获得不同性能。
本发明还可以用于形成带有多个接触点(或分段接触点)的独特的或适应性的天线,其允许微处理器在不同点直接连接或用条带直接连接,而不改变天线的设计。
返回参考图10,天线结构幅材275离开微处理器连接机器280,作为RFID标签幅材605。RFID标签幅材605具有布置在载体层上的一连串RFID标签。RFID标签幅材605被输送到第二激光切割机或随后的激光切割机285,以对最初天线结构进行改进。补充的激光切割路径310(在图11中详细示出其示例性实施方式)被编程到控制第二激光切割机285的第二计算机600中。在RFID标签幅材605输送通过第二激光切割机285时,第二激光切割机285如图2所示将补充的激光切割路径310定位于RFID标签上。在RFID标签行进通过第二激光切割机285时,第二激光切割机285追踪被定位的补充激光切割路径310,同时连续烧蚀导电层和粘合层以改变RFID天线结构的形状,以便形成用于例如RFID标签、标记、票据或嵌入物的改进天线结构。
改进的RFID标签320在图13中示出。改进的RFID标签320享有与在图2中示出的RFID标签50相同的基本布局和结构。改进的RFID标签320具有改进的RFID天线结构650。改进的RFID标签320与RFID标签50不同之处仅在于,改进RFID标签320具有设置在改进RFID天线结构650周边部分中的多个扇形凹口330。除了扇形凹口以外,也可以容易形成天线的其他形状或其他部分,并且材料容易从导电材料中移除。
应当注意,补充切割路径310优选被设计成仅对标准天线结构的形状做出轻微改变,以便提供标准天线设计的进一步灵活性。可选地,第二激光切割机285还可以用于彻底改变标准天线结构的物理外观,以及必要时在标准化结构中进行实质性改变。
返回参考图10,RFID标签幅材605离开第二激光切割机,作为改进RFID标签幅材610。改进RFID标签幅材610具有布置在载体层上的一连串改进RFID标签。改进RFID标签幅材610被输送到分离器290。分离器290将完成的改进RFID标签从载体层130移走,以便可以进一步处理完成的改进RFID标签,例如添加微处理器、附加印刷及类似处理。接着,通过第三重绕机305,载体层615被缠绕成载体卷300。
考虑可以结合在图3中描述的卷到卷工艺和在图10中描述的卷到卷工艺,以形成制造改进RFID标签的另一种卷到卷工艺,其在图14中示出。
图15说明形成RFID天线结构的方法。该方法开始于800,其中提供布置在载体层上的导电层。导电层可以包括通过粘合层部分地粘合到载体层的金属箔层(铝、铜、各种合金等),或导电层仅本身单独存在。导电层可以通过粘合层粘合至载体或可以简单放在载体上。在805,模具用于穿过导电层切割基本天线结构——标准化模板之一——直至载体层。切割可以通过模切机、激光切割机或冷箔压印工艺完成。基本天线结构不包括微处理器连接部分。在810,通过在模具切割的基本天线结构中烧蚀导电层直至载体层,以形成微处理器连接部分,激光改进了基本天线结构,形成改进的天线结构。激光连接部分可以包括由缝隙隔开的至少两个微处理器接触端。该方法在815结束,微处理器连接于微处理器连接部分。可选地,在步骤817,在需要移除余料的情况下,剥离器将加强导电层的余料部分从天线结构移除,使得仅天线结构保留在载体层上。应当理解,可以没有余料移除,或者例如当使用旋转模切机时可以仅在过程的选择部分移除,以及在其他情况例如在使用激光切割设备时可以不移除。可选地,可以没有余料从结构移除并且烧蚀周围材料。
图16说明用于制造改进RFID标签的示例性实施方式。该方法开始于819,其提供载体层,接着在820将天线结构布置在载体层上。天线结构具有包括由缝隙隔开的至少两个微处理器接触端的微处理器连接部分。完成的天线结构可以通过图15图解的上面详细描述的方法形成,或通过形成足够狭窄缝隙以允许微处理器桥接缝隙的任何其他合适方法形成,而不使用接触延伸件。在825,微处理器被固定到天线结构,以形成天线结构与微处理器之间的直接电连接,从而形成RFID器件例如RFID标签。微处理器在缝隙上延伸并且同时被固定于至少两个接触端的两个上。在830,激光烧蚀天线结构的选择部分,以改进RFID天线的形状,形成改进的RFID标签。该方法在835结束,其中改进的RFID标签被从载体层移走,以允许进一步加工。
现参考图17,其通过参考数字401一般地示出用于RFID标签中的导电层压片的侧视图。层压片401包括微处理器450、第一天线图案410、第二天线图案420和第三天线图案430,其每一个布置在载体层440上。第一天线图案410和第二天线图案420彼此协作关联。天线图案例如通过激光切割形成,使得在基底的载体层表面可以不做出可见的标记。天线图案一般彼此相互区别、可以彼此配合或可以彼此部分一致。第三天线图案与第一和第二天线图案彼此协作关联,或者可选地,第三图案可以与天线的形式和功能不相关,而是可以提供其他形式的标识,例如商标、名称或其类似物。
在本发明的另一个实施方式中,用于条带连接机构而不是用于RFID器件的芯片连接的图案可以利用一种或多种本文所述方法在导电层中形成。
因此,可见已经公开了一种以连续和有效方式制造射频识别标签的新方法,其利用模切和激光切割的组合,允许微处理器直接放置在射频识别天线上。虽然本发明已结合目前被认为是最实用和优选的实施方式进行描述,但本领域的普通技术人员应当明白本发明不限于已经公开的实施方式,并且可以在本发明的范围内做出许多修改和等同布置,所述范围符合所附权利要求的最宽解释,以包括所有等同结构和产品。
Claims (21)
1.用于由两步切割工艺制成的RFID标签的导电结构,其包括:
金属箔层,其具有第一和第二面、第一天线图案、区别于所述第一天线图案的第二天线图案,其中所述第一和第二图案彼此协作关联,所述第二天线图案至少限定微处理器连接部分,以及所述第一和第二天线图案中的至少一个由激光烧蚀形成,所述第一和第二天线图案中的每一个延伸穿过所述金属箔层的所述第一和第二面的每一个;
支撑所述金属箔层的载体层;以及
微处理器,其连接于所述第二天线图案的所述微处理器连接部分;并且
其中所述两步切割工艺包括:
第一切割机,其穿过导电层至载体层切割基本的天线图案或设计,以形成第一RFID天线结构;和
激光切割机,其在基本的天线图案中切割出微处理器连接部分。
2.如权利要求1所述的导电结构,其包括区别于所述第一和第二天线图案中每一个的、与所述第一和第二天线图案中每一个协作关联的第三天线图案。
3.如权利要求1所述的导电结构,其包括与所述第一和第二天线图案中的一个至少部分一致的第三天线图案。
4.如权利要求1所述的导电结构,其中所述第一和第二天线部分协作形成RFID天线结构。
5.如权利要求1所述的导电结构,其中所述微处理器连接部分被限定在中心部分中,所述中心部分将第一天线接触端与第二天线接触端隔开。
6.如权利要求5所述的导电结构,其中所述微处理器直接电连接至所述天线接触端。
7.如权利要求1所述的导电结构,其中所述金属箔是100%可回收的。
8.如权利要求1所述的导电结构,其中所述载体层选自:聚酯膜、聚酰亚胺膜、织物或纸质材料。
9.如权利要求1所述的导电结构,其中加强层粘合至所述金属箔层。
10.如权利要求1所述的导电结构,其中所述金属箔层为铝、铜、银和/或金。
11.如权利要求1所述的导电结构,其中所述导电结构由卷到卷工艺制造。
12.如权利要求1所述的导电结构,其包括提供徽标或名称的第三天线图案。
13.如权利要求1所述的导电结构,其中利用条带连接所述微处理器至所述第二天线图案的所述微处理器连接部分。
14.由两步切割工艺制成的导电结构的幅材,其包括:
基底,其具有第一和第二面;
粘合层,其以对应于天线的形状的图案提供;
导电层,其提供在所述粘合层之上;
至少一个天线由所述导电层的激光切割形成;
其中所述至少一个天线具有集成电路连接点;并且
其中所述切割包括对上至载体层但是不通过载体层并且通过所述导电层和粘合层进行部分模切;并且
其中所述两步切割工艺包括:
第一切割机,其穿过导电层至载体层切割基本的天线图案或设计,以形成第一RFID天线结构;和
激光切割机,其在基本的天线图案中切割出微处理器连接部分。
15.权利要求14所述的幅材,其中所述导电层仅粘附至以所述图案提供的所述粘合层的区域。
16.权利要求14所述的幅材,其中所述导电层由选自铝、铜、银、金或金属的合金中的一种制造。
17.权利要求14所述的幅材,其中所述粘合层是透明的。
18.权利要求14所述的幅材,其中对齐标记以纵向方向提供在所述基底上。
19.权利要求14所述的幅材,其中所述粘合层被溢流涂布在所述基底上。
20.权利要求14所述的幅材,其中没有形成天线的粘合层的区域失活。
21.权利要求20所述的幅材,所述区域通过UV源失活。
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PCT/US2011/040379 WO2011159716A1 (en) | 2010-06-14 | 2011-06-14 | Method of manufacturing a radio frequency identification device |
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