CN102947083B - 箔层压片半成品和制造方法 - Google Patents
箔层压片半成品和制造方法 Download PDFInfo
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- CN102947083B CN102947083B CN201180029075.7A CN201180029075A CN102947083B CN 102947083 B CN102947083 B CN 102947083B CN 201180029075 A CN201180029075 A CN 201180029075A CN 102947083 B CN102947083 B CN 102947083B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/14—Printing or colouring
- B32B38/145—Printing
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- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
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- G06K19/07773—Antenna details
- G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
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- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
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Abstract
本发明涉及制造金属箔层压片的方法,其可用于例如生产射频(RFID)标签的天线、电子电路、光伏模块或类似物。提供材料的幅材至至少一个切割站,其中在材料的幅材中产生第一图案。可进行进一步切割以形成另外改进,以便提供另外的特征,用于产品的预期终端用途。切割可仅通过激光或通过激光与其他切割技术结合进行。
Description
相关申请的交叉引用
本申请要求2010年6月14日提交的美国临时专利申请61/354380、2010年6月14日提交的美国临时专利申请61/354388和2010年6月14日提交的美国临时专利申请61/354393的权益,通过引用将其全部以其整体并入本文。
技术领域
本发明处于箔层压片组件和制造这种组件的方法的领域。更具体地,本发明涉及通过激光切割生产或完成有图案的箔半成品组件,其可用于形成各种传导性结构、光伏装置、反射组件或其他构造。
背景技术
箔层压片和各种半成品组件目前用于许多应用中,范围从微波包装的容器到智能卡。这种层压片常规地通过模切、冲压和其他机械方法制造,这类方法通常非常有助于可形成相对简单的形状或图案的高速情况。
电路增加的需求已经产生对能够快速和有效生产这种电路的制造方法的需要。一种这样的方法在美国专利申请2007/0171129A1中公开。该方法包括步骤:首先提供加固的金属箔层压片——其具有结合到加强层的金属箔层,以及结合到金属箔层压片的载体层。该方法包括步骤:利用旋转模切机穿过金属箔层压片到载体层切割出天线图案。该方法结束的步骤是,移走加强金属箔层压片的不期望余料部分,以便提供布置在载体层上的金属箔层压片天线。
使用旋转模切机切割电路图案可以是有优势的,因为旋转模切又快速又不昂贵。但是,旋转模切机的分辨率差并且限于切割线之间最小的距离为1mm。利用旋转模切机切割电路或其他要求高精度的构造的另外问题是旋转模切机使用的圆柱形模具不能快速或容易地改变。因此,电路设计不容易改变,并因此特定电路设计的小批量生产不经常是经济可行的,这是由于需要经常更换外模头。而且,电路设计的任何改变会需要大量订货至交货的时间(lead-time),这是由于每当电路设计改变时必须制作新的圆柱形模具。具有大量的设计可能导致模头的大量库存,其存储可能占用有用的工厂房屋空间。
常规的冲压技术也具有类似的缺点,因为冲压模具对于新的设计不容易改变并且冲压模具一般不可能能够生产具有非常小公差的设计。冲压箔的一个例子由US 2002/0018880显示。遍及本公开提及出版物、专利和专利申请。本文引用的所有参考文献通过引用并入本文。
因此,需要的是制造小批量复杂结构的改进方法,其可用于各种目的而没有前述缺点。
发明内容
下面描述的本发明实施方式不意欲是穷尽性的或将本发明限于在下面详细描述中公开的精确形式。而是,选择并且描述实施方式以使本领域技术人员可认识到并且理解本发明的原理和实践。
本发明涉及使用计算机控制的激光在金属箔层中切割一个或多个图案,以形成可随后改进用于各种应用的结构。本发明允许形成非常复杂的设计和形状以及提供生产变化数量的结构的能力。
在目前描述发明的一个示例性实施方式中,提供箔层压片半成品组件并且其包括具有第一面和第二面的基底。将粘合剂图案布置在基底的第一面上。将金属箔施加在粘合剂图案上。金属箔具有至少第一图案,所述至少第一图案对应至少部分粘合剂图案。
在进一步示例性实施方式中,描述制造有图案的金属箔层压片或传导性层压片的方法,并且该方法包括初始提供具有第一面和第二面的金属箔或传导性材料的步骤。接下来,使粘合剂与金属箔的第二面接触。接着在金属箔或传导性材料中切割第一图案,以形成第一箔图案和余料(matrix)。将余料从第一箔图案去除并且接着在金属箔中切割第二图案,以形成第二箔图案。第一图案和第二图案可彼此配合或可以起彼此不同的作用。
在进一步示例性实施方式中,描述制造传导性图案的方法,并且该方法包括初始提供金属箔或传导性材料层压片的步骤,所述金属箔层压片具有箔层、在箔层下方的粘合剂层和在粘合剂层下方的基底。在金属箔层压片中进行第一切割,以仅在箔层中形成第一图案。即,切割仅延伸箔层的厚度,而不是整个层压片的厚度或进入载体层的表面。如果层压片立即进行进一步加工,激光产生的能量可在金属箔层压片中形成弱点,并且因此使得能量消散,以及在金属箔层压片中进行第二切割,以仅在箔或传导性层中形成第二图案。第二图案不同于第一图案。
在仍进一步的示例性实施方式中,描述箔层压片或传导性层压片半成品组件的幅材(web)并且该幅材包括具有第一面和第二面的幅材。多个箔层压片半成品设置在该幅材上。每个箔层压片半成品组件包括具有第一面和第二面的基底、布置在基底的第一面上的粘合剂图案和施加在粘合剂图案上方的金属箔。金属箔具有至少第一图案,所述至少第一图案对应于粘合剂图案的至少一部分。
从下列详细描述,本发明的其他特征和优势对于本领域的技术人员来说是清楚的。不过,应当理解,虽然指出了本发明优选的和其他实施方式,但是通过说明而非限制的方式给出各种实施方式和具体实例的详细描述。可以在不偏离本发明精神的情况下,做出在本发明范围内的许多变化和修改,并且本发明包括所有这样的修改。
附图说明
结合附图,通过参考本发明当前优选示例性实施方式的下面更详细描述,可以更加全面理解和了解本发明的这些目标和优势以及其他目标和优势,其中:
图1示出幅材的局部部分,该幅材具有多个箔层压片或传导性层压片布置在所述幅材的表面上;
图2是显示形成图1中描绘的幅材的方法的示意图;
图3示出根据本发明方面的、用于制造标准RFID天线结构的卷到卷(roll-to-roll)工艺;
图4是用于由本发明公开的卷到卷工艺的幅材的横截面视图;
图5是本发明公开的旋转模切机使用模具的俯视图;
图6是图3所示模具切割的基础天线结构的俯视图;
图7是本发明使用的示例性主激光切割路径的俯视图;
图8是在图6所示基础天线结构上布置图7所示主激光路径的俯视图;
图9是标准天线结构的俯视图;
图10示出根据本发明方面的、用于制造改进RFID标签的卷到卷工艺;
图11是本发明使用的示例性次切割路径的俯视图;
图12是显示在图9所示传导性结构上布置图10所示次切割路径的俯视图;
图13是本发明公开方法形成的完成的改进传导性结构的俯视图;
图14示出根据本发明方面的、用于制造改进传导性结构的另一种卷到卷工艺;
图15示出根据本发明方面的、形成标准传导性结构的方法;
图16示出根据本发明方面的、形成改进传导性结构的方法;
图17提供根据本发明生产的传导性层压片的侧视图;
图18显示如根据本发明生产的示例性光伏半成品;
图19图解如根据本发明生产的示例性RFID电路半成品;和
图20图解本发明的幅材在形成图案之前的横截面。
发明详述
在本文中公开的装置和方法通过实例并参考附图详细描述。除非另外指出,图中的相似数字指示参考图中相同、类似或相应的元件。应当明白,可以对公开和描述的实例、布置、构造、组件、元件、装置、方法、材料等做出修改,并且对于具体应用是期望的。在本公开中,具体形状、材料、技术、布置等的任何指定与陈述的具体实例相关,或仅仅是这样的形状、材料、技术、布置等的一般性描述。具体细节或实例的指定不意欲解释为并且不应该解释为强制性的或限制性的,除非特别如此指出。选择的装置和方法的例子在后面参看附图详细公开和描述。
本发明涉及用于生产半成品组件的独特和有效的方法,所述半成品组件可用于形成复杂形成的电路、天线、光伏模块和其他专用应用或设备比如带。
现参看图1,其显示具有许多箔层压片22的幅材10,所述箔层压片22设置在幅材10的表面12上。幅材10沿着第一和第二纵向延伸的侧边缘16和18之一设置有一系列印刷的对齐标记14。对齐标记14也可印刷在幅材的横向延伸的边缘上(未显示)。对齐标记14有助于对准箔层压片22和有助于本文将要描述的切割。如显示的,邻近对齐标记14并且沿着每个纵向边缘16、18以及横向延伸边缘印刷粘合剂图案20(显示为虚影)。印刷的粘合剂图案20进一步有助于对准箔层压片22以及有助于切割。粘合剂可包括光学增亮剂23。在优选的实施方式中,光学增亮剂23是荧光粉,其按重量计为粘合剂的约1%并且更优选地按重量计为粘合剂的约.5%。其他触发器或信号可用于启动激光和记录将在幅材中形成的图案,比如幅材中的切口或裂缝、追踪油墨(taggant ink)、印刷油墨和类似物。
光学增亮剂23可设置在箔层压片或传导性层压片22的至少一个图案24将要在箔层压片层145中进行切割的区域。光学增亮剂23可印刷在粘合剂层20上面,而不是混合在粘合剂层中。另外,本发明考虑光学增亮剂23可印刷在基底上面,而非混合粘合剂层20或在粘合剂层20上面。在该实施方式中,优选的是粘合剂层20是清澈的或透明的,从而光学增亮剂23透过粘合剂层可见。
另外,在本发明的一种实施方式中,光学增亮剂23可印刷为将要由箔或传导性层或材料构造的箔层压片或传导性层压片22的形状。
本发明也考虑光学增亮剂本身可用作沿着粘合剂图案20的纵向和/或横向延伸面形成图案的对齐标记14。当加载在载体幅材上时,箔层145不覆盖由光学增亮剂形成的对齐标记14,以允许切割机探测到对齐标记以便对准多个箔层压片22。即,箔或传导性层145布置在设置在例如载体幅材的页边或边缘部分上的对齐标记之间。
在另一种实施方式中,对齐标记14可使用多种油墨印刷,施加在各光学增亮剂23上面。可选地,对齐标记14也可由传导性层的部分或箔层压片的片段,或可选地幅材中的裂缝、孔或切口形成。
如在图20中所图解,幅材10在通过切割机形成图案之前包括基底11,其具有第一面13和第二面15,粘合剂层设置在幅材的第一面13上。粘合剂层20可形成图案在基底11的第一面13上或溢流涂布(flood coating)在基底的第一面上。图案可包括设置在基底11的第一面13上的多种几何形状。将基底11的第一面13的指定部分用粘合剂覆盖并且基底11的第一面13的其他部分不用粘合剂覆盖。接下来,幅材10行进,并且将印刷清漆设置在粘合剂层的区域上,以便钝化(deaden)将不产生箔或传导性结构22的粘合剂区域。即,在用印刷清漆或其他可固化材料涂布之后,粘合剂图案形成或保留,这将精确地使形成箔层压片的区域成镜像。不对粘合剂图案进行钝化,以便粘合剂保持粘性。如果粘合剂层形成图案在基底11的第一面13上,可避免粘合剂层的某些区域的钝化,即,将在匹配天线结构或为天线结构镜像的图案中形成粘合剂图案。
接下来,将箔片,比如具有约15微米厚度的铝,施加在幅材10上并且箔的部分附着至将形成箔层压片或传导性层压片的活性粘合剂区域而不附着至将形成箔层压片的幅材的剩余部分。在箔已经层压至幅材10之后,瞄准的光照耀以探测对齐标记,以提供第一切割图案24的对齐,这优选地通过激光进行。但是,应当理解,当可能合适时,第一切割图案可通过其他切割设备比如模切机、压印机、冷箔工艺或其他激光控制的切割设备完成。
如本文使用的,示例性冷箔工艺指的是在基底上印制粘合剂或其他可固化的图案,接着将箔层施加到该图案上,将箔层压到该图案上,以使箔粘结到图案,然后剥掉箔,留下图案在覆以箔层的基底上。
切割出第一图案24并且在该示例性实施方式中形成100微米宽的迹线。接着,将形成结构的区域周围的多余箔通过剥离去除,如将在本文进一步描述的。
激光切割设备可进一步用于形成箔材料中的对准区域,以有助于集成电路如芯片的连接、完成其他图案的切割、等等。就芯片的布置而言,可在箔中形成尺寸约.5mm的基准(fiducial),以提供芯片的对准以便其可连接至连接点。
现注意力转向图2,其提供生产图1中图解的幅材10的示意图。材料比如PET的幅材10从辊30展开。幅材10经过印刷站32下方,其提供可见的对齐标记。粘合剂涂布器34施加粘合剂层并且形成粘合剂图案20。接下来,将UV源36引导至粘合剂上方,以钝化粘合剂的选择区域,留下将形成箔天线22的活性区域。箔幅材38通过辊40部分层压至涂布粘合剂的幅材10。激光切割机42探测对齐标记14和/或涂布粘合剂标记20的图案,以在箔38中切割第一图案24。应当注意,来自激光的能量不刻划或标记下方的基底幅材。
一旦第一图案24切割入箔38,将其余箔45通过剥离器44剥离并且在46重新缠绕。因为箔38未充分层压至幅材,因此箔的去除产生100%完全可回收的材料,这是因为箔未被粘合剂污染,也不具有连接箔的基底部分。
箔38残留是因为产生以形成各个箔天线层压片22的粘合剂图案,其是未被钝化的粘合剂区域。幅材10接着在48缠绕。幅材10在形成各个天线/层压片22之后可以可选地输送通过切割机,以将各个箔天线22彼此分离,或幅材10可以在稍后日子当形成各个器件时切割。如本文将描述,根据由箔层压片22制作的具体最终应用,幅材10也可进行第二或第三或更多次切割。
附加的切割可用于在材料中形成某些水平的个性化,比如标识、名字、商标和类似物,或用于指示制造商的身份、生产日期或类似物。这可通过计算机控制的激光切割机完成。
形成结构22的装置的进一步示意图阐释在图3中,其显示根据本发明方面的制造传导性结构22的卷到卷工艺。应当理解,该工艺容易与片材输送类型的加工操作互换。
幅材90经由开卷机95从幅材卷100分发并送到第一切割站例如激光器、旋转模切机、冷箔工艺110,如果该站是模切单元或冷箔工艺的印刷板,其具有旋转模具150。幅材90离开第一切割机110,并送到激光切割机175。激光切割路径215(未示出,在图7详细提供其示例性实施方式)被编程到控制激光切割机175的计算机400中。
适用于本发明的示例性激光器包括镱激光器,其以1024nm的波长在大约48kHz脉冲。理想地,激光能量不从基底表面显现,即,不存在变黑区域、烧灼、模具撞击(die strike)或任何表面粗糙或不规则。
继续参考图3,幅材90离开激光切割机175并且如果需要时进料至剥离器180。当提供时,剥离器180将余料幅材或传导性材料(例如箔)190与形成的传导性结构22分离,以形成传导性结构幅材185。箔是100%可回收的。应当注意,当必要时,可提供加强层135(图4)以支撑金属箔层145的强度,以便防止在传导性结构幅材185的加工/切割期间金属箔层145的撕裂或破裂。加强层可具有与施加的箔相同的宽度,或可仅仅用作材料带以加强箔幅材的选择区域。
传导性结构幅材185具有一连串布置在载体层130上的结构。通过第一重绕机200传导性结构幅材185缠绕成卷195,而通过第二重绕机205余料幅材190缠绕成余料卷210。
现参考图4,显示在卷到卷工艺中使用的幅材115的横截面视图。幅材115可包括通过第一粘合剂层125结合至载体层130的加强的金属箔层压片层120。可选地,幅材可仅仅包括单层箔,其可由在加工期间可去除以支撑箔的载体或支撑体支撑或不支撑。
载体层130可由使载体层130为柔韧性的任何材料或材料的组合制造,以有利于载体层130作为可以缠绕为用于卷到卷工艺的卷形式的连续幅材进行制造。这种材料的例子包括但不限于聚酯膜、聚对苯二甲酸乙二酯膜、聚酰亚胺膜、织物(织造的、非织造的、天然的和合成的)和布料或纸材料(卡纸、证劵纸等)。
加强的金属箔层压片层120包括通过第二粘合剂层140结合至层135(其可以是加强层)的金属箔层145。金属箔层145可由任何合适的传导性材料制造,比如铝、铜、银、金、各种金属的合金和类似物。也可以使用传导性材料的组合。另外,传导性材料可通过印刷传导性油墨、刻蚀或其他适合的方法形成。第二粘合剂层140可以是通用永久性压敏粘合剂、压力活化粘合剂,或任何其他合适的粘合剂。第二粘合剂层140可通过溢流涂布或辊涂施加至层135。
第一切割设备110用于在传导性材料箔/层压片(其示例性实施方式详细显示在图3中)中形成第一图案,生产第一半成品形状。第一半成品形状没有必要展示最终设计,最终设计具有例如用于连接将赋予设计以形成用于最终RFID器件的天线的微处理器芯片、集成电路或任何其他构造的孔。随着幅材90输送通过第一切割机110,切割机110穿过金属层120和第一粘合剂层125切割幅材90直到载体层130,从而将一连串传导性结构从称为余料190的金属箔层压片层的非期望部分勾画出(delineate)。示例性结构165,例如天线结构,显示在图6中。天线结构165具有中心部分170。天线结构165在中心部分170还没有限定孔,该孔将由第二切割图案形成,如将在本文描述的。
返回参看图3,幅材90离开第一切割机110并且输送至第二切割机175,其优选地为激光切割机。激光切割路径215(其示例性实施方式详细显示在图7中)被编程至控制激光切割机175的计算机400中。随着幅材90输送通过激光切割机175,激光切割机175将激光定位或瞄准入由第一切割机110形成的在结构165(例如天线结构)中心部分170的切割路径215上,如图8中所显示。随着结构行进通过激光切割机175,激光切割机175追踪定位的激光切割路径215,同时连续烧蚀金属箔层压片层120和第一粘合剂层125,以在第一结构的中心部分或天线的其他切口或区域中形成开孔,从而在布置在载体层35上仍被余料幅材190围绕的金属箔层压片层180中产生一连串完成的结构。完成的结构220,再次为了本实例的目的,是用于RFID器件的天线,显示在图9中。完成的天线结构具有中心部分500,其具有将接收微处理器芯片或集成电路的大体T形开孔230,但是,应当理解,根据最终设计或产品的需要,可使用任何其他形状。大体T形开孔230限定将第一天线接触端240与第二天线接触端250分开的缝隙245。应当理解,前面的形成天线的实例仅仅是个例子并且该方法可用于形成光伏模块和其他电路、传导性结构和构造。
在箔层中由激光切割的图案也可包括可从天线或形成的其他结构分开的其他特征。例如,可添加名称、标识、商标、设计、形状等,以提供广告或销售信息或形成具体的主题或将产品与具体的制造商相关联。
应当理解,激光切割机175烧蚀金属箔层压片层120和第一粘合剂层125以形成开孔。因此,在剥离器180将余料幅材190从用于形成结构幅材185的第一切割过程形成的结构分离时,没有材料存在于开孔中要用剥离器180移除。开孔特别狭窄。因此,如果模具150被成形为也切割开孔,则在天线结构幅材185与余料幅材190分离期间从开孔移除的材料会同样特别狭窄,并因此脆弱且特别易于撕裂。因为撕裂可能会损坏标准天线结构,这可能例如通过使电路短路毁坏天线功能,因此留下材料可能存在问题。而且,这种性质的撕裂会导致必须手动去除的残留在开孔中的材料,导致降低的生产率和提高的制造成本或者材料因为有缺陷而被放弃。但是,如果一些材料残留在烧蚀的区域(一个或多个)中是可接受的,比如尺寸小于1/4波长的材料,更优选地尺寸小于1/5波长的材料和仍更优选地小于1/10波长的材料。
虽然激光切割机175形成限定缝隙和两个接触端的开孔,但应当理解,简单地通过将新的激光切割路径程序加载到计算机400,可以容易地和快速地改变激光切割路径215,以形成在天线结构中产生的其他切口或图案。因此,公开的卷到卷工艺使得示例性标准天线结构的非常基础的变型的小批量生产经济可行,或使得非常复杂设计的生产更加切实可行。该方法也可用于对形成的器件/设计添加个性化的和独特的特征。
现在参考图10,其示出根据本发明方面的、用于制造改进传导性结构的卷到卷工艺。如本文使用的,改进的结构指的是这样的方法:采用以前形成的结构——在本实例中为用于RFID标签的天线,然后进一步改变该结构以满足具体最终用途应用或完成具体设计的制造。应当理解,除了卷到卷工艺,前述制造方法可在片材输送过程中进行,其中含有传导性层的各个片被切割并且接着通过例如堆叠进行收集。
传导性结构幅材275经由开卷机260从卷270分发。为了这个示例性实施方式的目的,假设在图10中示出的传导性结构卷270由在图3中示出的卷到卷工艺形成。但是,任何其他合适的方法可用于形成传导性结构卷270,并且如在目前实例中所使用,只要微处理器可直接连接至布置在天线结构幅材275上的天线结构而不使用接触延伸件。天线结构幅材275输送至集成电路(IC)连接装置280。IC连接装置280将IC固定至行进通过IC连接装置280的结构,从而形成IC和结构之间的直接电连接。应当理解,尽管直接的芯片连接是本发明的一种应用,但是带也可用于该方法并且可有助于能够快速改变或设计正制作的器件。
在离开IC连接之后,RFID标签,通常是50,具有结构55、具有开孔65的中心部分60,所述开孔限定缝隙70。IC连接或放置装置280将IC 85固定在结构55的第一接触端75并且将IC 85的另一端固定在第二接触端80,这样IC延伸跨过缝隙70(见图13和14)。IC连接或放置装置280可以通过导电粘合剂、焊接(例如点焊)、超声波焊接、机械压接或通过允许电流流过微处理器100并围绕天线结构55的任何其他合适方式将微处理器85固定于结构55。
应当理解,激光切割机175的高分辨率切割能力允许激光切割机175在没有使用任何接触延伸件的情况下,形成足够狭窄以允许将IC直接连接于标准结构的缝隙。接触延伸件的缺乏可以是有优势的,因为它简化了制造工艺、减少制造成本并消除潜在失效点。但是,带或接触延伸件可用于本方法。
回到图10,在一种示例性实施方式中天线结构幅材275作为RFID标签幅材605离开IC连接机280。RFID标签幅材605具有布置在载体层上的一连串RFID标签。应当理解,前述方法可用于制造任何数量的产品或传导性组件,比如光伏装置、反射组件或其他构造。
RFID标签幅材605被输送到第二激光切割机或随后的激光切割机285,以对最初天线结构进行改进。补充的激光切割路径310(在图11中详细示出其示例性实施方式)被编程到控制第二激光切割机285的第二计算机600中。在幅材605输送通过第二激光切割机285时,第二激光切割机285如图12所示将补充的激光切割路径310定位于传导性结构上。在传导性结构行进通过第二激光切割机285时,第二激光切割机285追踪被定位的补充激光切割路径310,同时连续烧蚀金属箔层压片层和第一粘合剂层以改变传导性结构——在本实例中为改进的天线结构——的形状,以用于例如RFID标签。
改进的天线结构320在图13中示出。改进的RFID器件320享有与在图12中示出的RFID标签50相同的基本布局和结构。改进的RFID器件320具有改进的RFID天线结构650。改进的RFID器件320与RFID50不同之处仅在于,改进RFID标签320具有设置在改进RFID天线结构650周边部分中的多个扇形凹口330。应当理解,在天线结构中可制作任何设计或另外的切口,以形成预想的最终设计。
应当注意,补充切割路径310被设计成仅对标准天线结构形状做出改变,以便提供标准天线设计的进一步灵活性。第二激光切割机285还可以用于彻底改变标准天线结构的物理外观。
返回参考图10,RFID标签幅材605离开第二激光切割机,作为改进RFID标签幅材610。改进RFID标签幅材610具有布置在载体层上的一连串改进RFID标签。改进RFID标签幅材610被输送到分离器290中。分离器290将完成的改进RFID标签从载体层130移走,以便完成的改进RFID标签可以进一步处理。接着,通过第三重绕机305,载体层615被缠绕成载体卷300。
考虑在图3中描述的卷到卷工艺和在图10中描述的卷到卷工艺可以结合,以形成制造改进RFID标签的另一种卷到卷工艺,其在图14中示出。应当理解,尽管本发明描述为使用幅材的卷到卷布置,但是本发明可以以片材输送配置实施。
图15说明形成传导性结构的方法。该方法开始于800,其中提供布置在载体层上的金属箔层压片。金属箔层压片可以包括通过粘合剂层结合到加强层的金属箔层,或可选地,箔层可以具有足够强度以便加工而不撕裂。加强金属箔层压片可以通过粘合剂层粘合至载体。在805,第一次切割产生例如从金属箔层压片直至载体层制作的天线结构。最初的结构——这里为天线——例如不包括最终的设计例如微处理器连接部分。在810,通过烧蚀第一切割机切割的第一传导性结构中加强金属箔层压片直至载体层,以在本实例中形成微处理器连接部分,激光改进了第一传导性结构,形成标准结构。激光连接部分可以包括由缝隙隔开的至少两个微处理器接触端。该方法在815结束,微处理器连接于微处理器连接部分。可选地,在步骤817,在需要移除余料的情况下,剥离器将加强金属箔层压片的余料部分从天线结构移除,使得仅天线结构保留在载体层上。应当理解,可以没有余料移除,或者例如当使用旋转模切机或冷箔工艺时可以仅在过程的选择部分移除,以及在其他情况例如在使用激光切割设备时可以不移除。可选地,可以没有余料从结构移除并且可以烧蚀掉全部材料。
图16说明用于制造改进RFID标签的示例性实施方式。该方法开始于819,其提供载体层,接着在820将传导性结构布置在载体层上。传导性结构具有多个完成的结构,例如在本实例中为具有包括由缝隙隔开的至少两个微处理器接触端的微处理器连接部分的天线结构。完成的天线结构可以通过图15图解的上面详细描述的方法形成,或通过形成足够狭窄缝隙以允许微处理器桥接缝隙的任何其他合适方法形成,而不使用接触延伸件。在825,微处理器被固定到天线结构,以形成天线结构与微处理器之间的直接电连接,从而形成RFID标签。微处理器在缝隙上延伸并且同时被固定于至少两个接触端的两个上。在830,激光烧蚀天线结构的选择部分,以改进RFID天线的形状,形成改进的RFID标签。该方法在835结束,其中改进的RFID标签被从载体层移走,以允许进一步加工。
现参考图17,其中通过参考数字401一般地示出传导性层压片的侧视图。层压片401包括第一图案410、第二图案420和第三图案430,其每一个布置在载体层440上。图案例如通过激光切割形成,使得在基底的载体层表面上可以不做出可见的标记、烧灼、不规则。图案一般彼此相互区别、可以彼此配合或可以彼此部分一致。
图18显示用于芯片450尤其RFID芯片的传导性结构半成品,传导性图案455形成在基底453上的箔层中。图19提供用于电路460例如与智能卡一起使用的传导性结构,其包括设置在基底463上的传导性图案465。
本发明也考虑箔层压片可以以比如可用于RFID器件的带连接机构的弓形的几何形状形成图案在箔层压片层中。
因此,根据本发明将可见已经提供了非常有优势的生产传导性层压片结构的方法。虽然本发明结合目前被认为是最实用和优选的实施方式进行描述,但本领域的普通技术人员应当明白本发明不限于已经公开的实施方式,并且可以在本发明的范围内做出许多修改和等同布置,所述范围符合所附权利要求的最宽解释,以包括所有等同结构和产品。
Claims (21)
1.箔层压片半成品组件,其包含:
具有第一面和第二面的载体层;
第一粘合剂图案,其以电路的至少一部分的形式提供,布置在所述载体层的第一面上;
施加在所述第一粘合剂图案上的金属箔;
所述金属箔具有对应于所述第一粘合剂图案的至少第一图案,使得所述金属箔的所述第一图案通过切穿所述金属箔和所述第一粘合剂图案但没有切穿所述载体层形成,以便所述半成品组件用于形成天线结构,所述天线结构具有多个接触点,用于微处理器的直接连接点或带连接点之一,
其中所述金属箔包括不同于所述第一图案的至少第二图案并且其中所述第二图案与所述第一图案至少部分重叠并且一致。
2.如权利要求1所述的箔层压片半成品组件,其中加强层设置在所述金属箔和所述第一粘合剂图案之间。
3.如权利要求1所述的箔层压片半成品组件,其中所述第一粘合剂图案包括以图案化的光学增亮剂设置的对应于所述金属箔中的至少所述第一图案的光学增亮剂。
4.如权利要求1所述的箔层压片半成品组件,其中所述第一粘合剂图案包括按重量计为所述第一粘合剂图案的范围从0.1%至1%的光学增亮剂。
5.如权利要求1所述的箔层压片半成品组件,其中所述金属箔的所述第一图案由旋转模切、激光切割或冷箔加工之一形成。
6.如权利要求1所述的箔层压片半成品组件,其中第一图案用于射频识别器件、光伏模块或电子电路的至少一种。
7.制造传导性金属箔层压片的方法,包含下述步骤:
提供具有第一面和第二面的基底;
施加粘合剂图案至所述基底的第一面;
提供具有第一面和第二面的金属箔,以便所述金属箔的第二面与所述粘合剂图案接触;
在所述金属箔中仅穿过所述金属箔和所述粘合剂图案切割出与所述粘合剂图案一致的第一图案,以形成第一传导性箔图案和余料;
从所述第一传导性箔图案去除所述余料;
在所述金属箔中切割出第二图案以形成与所述第一图案一致的第二传导性箔图案;和
在施加所述粘合剂图案的步骤之后在所述金属箔中所述第一图案和第二图案之外的区域中钝化粘合剂图案的部分。
8.如权利要求7所述的方法,其中所述粘合剂图案包括光学增亮剂。
9.如权利要求7所述的方法,包括在切割出所述第二图案之后去除余料的进一步步骤。
10.如权利要求7所述的方法,其中所述第一图案和所述第二图案的切割通过激光完成。
11.如权利要求7所述的方法,其中所述金属箔中的所述第一图案形成为100微米宽迹线。
12.权利要求7所述的方法,其中所述粘合剂图案包括光学增亮剂,并且所述光学增亮剂提供在图案中仅仅在金属箔中所述第一图案和所述第二图案被切割出的区域中。
13.权利要求7所述的方法,其中第一图案和第二图案用于射频识别器件、光伏模块或电子电路的至少一种。
14.制造传导性图案的方法,包括下述步骤:
提供金属箔层压片,所述金属箔层压片具有箔层、所述箔层下方的粘合剂层和所述粘合剂层下方的基底;
在所述粘合剂层或基底之一的上面提供多个对齐标记;
仅穿过所述箔层和所述粘合剂层在金属箔层压片中进行第一切割,以形成第一传导性图案;
使所述金属箔层压片中的能量/弱点消散;和
在所述金属箔层压片中提供第二切割以仅在所述箔层中形成第二传导性图案,所述第二传导性图案不同于所述第一传导性图案。
15.权利要求14所述的方法,其中将光学增亮剂提供在所述粘合剂层中的对应于所述箔层中所述第一传导性图案和第二传导性图案的图案中。
16.权利要求14所述的方法,其中所述切割通过使用镱激光器的激光切割进行。
17.权利要求14所述的方法,包括在提供金属箔层压片的步骤之后在所述箔层中所述第一传导性图案和所述第二传导性图案之外的区域中钝化所述粘合剂的进一步步骤。
18.权利要求14所述的方法,其中所述第一传导性图案和所述第二传导性图案用于射频识别器件、光伏模块或电子电路的至少一种。
19.箔层压片半成品组件幅材,其包含:
具有第一面和第二面的幅材;和
设置在所述幅材上的多个箔层压片半成品组件,每个所述箔层压片半成品组件包括;
具有第一面和第二面的基底;
布置在所述基底的第一面上的粘合剂图案;
施加在所述粘合剂图案上的金属箔;并且
所述金属箔具有至少第一图案,所述至少第一图案对应于所述粘合剂图案,使得所述金属箔中的所述第一图案用第一切割机通过切穿所述金属箔和所述粘合剂图案但没有切穿所述载体层制造,以便所述半成品组件用于形成天线结构,所述天线结构具有多个接触点,用于微处理器的直接连接点或带连接点之一;和
其中通过第二切割机在每个箔层压片半成品组件的中心中形成开口。
20.如权利要求19所述的箔层压片半成品组件幅材,其中所述第一图案是用于射频识别器件的天线图案。
21.如权利要求19所述的箔层压片半成品组件幅材,其中所述第一图案用在光伏模块中。
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CN201180029075.7A Active CN102947083B (zh) | 2010-06-14 | 2011-06-14 | 箔层压片半成品和制造方法 |
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