CN102939802B - 制造传导性结构的方法 - Google Patents
制造传导性结构的方法 Download PDFInfo
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Abstract
本发明涉及制造多个传导性结构的幅材的方法,其可以用于例如制造天线、电子电路、光伏模块等。该方法包括利用多个对齐标记在传导性层中同时图案化至少一个图案。对齐标记起到对齐和引导多个传导性结构的生成的作用。在本发明的粘合剂层和对齐标记内还可以利用光学增亮剂,以便检测要放置传导性结构的位置。
Description
相关申请的交叉引用
本申请要求2010年6月14日提交的美国临时申请号61/354,380、2010年6月14日提交的美国临时申请号61/354,388、和2010年6月14日提交的美国临时申请号61/354,393的权益,以上申请的全部通过引用以其整体并入本文。
技术领域
本发明涉及传导性组件和制造这些组件的方法的领域。更具体地,本发明涉及通过激光切割产生图案化的(patterned)传导性结构的方法。传导性结构可以用于生产RFID电路的天线、光伏装置、反射组件、或其他结构。
背景技术
诸如箔层压片的传导性层压片用于许多应用,范围从微波预装件的容器到智能卡。这种层压片常规地通过冲切、冲压和其他机械方法制造,这类方法通常非常有助于可形成相对简单的形状或图案的高速情况。
增加的电路需求已经产生可以迅速和有效地产生这种电路的制造方法的需求。曾经在美国专利申请号2007/0171129A1中公开该方法。该方法包括提供增强金属箔层压片的步骤,其具有结合至增强层的金属箔层和结合至金属箔层压片的载体层。该方法包括步骤:利用旋转模切机将天线图案切割通过金属箔层压片至载体层。该方法的结果是,移除增强金属箔层压片的不期望余材(matrix)部分,以便提供布置在载体层上的金属箔层压片天线。
旋转模切机由于其快速和廉价而被用于生产各种结构。然而,旋转模切机分辨率差,目前限制切割线之间的最小距离为大约1mm。利用旋转模切机切割要求高精度和公差的结构的额外问题是,无法快速或容易地改变旋转模切机使用的圆柱形模具。因此,不容易改变设计,并因此特定电路设计的小批量生产经济上通常是不可行的,这是由于需要经常更换外模头。而且,设计的任何改变会需要大量订货至交货的时间(lead-time),这是由于每当电路设计改变时必须制作新的圆柱形模具。这可能导致模头的大量库存,其存储可能占用宝贵的工厂房屋空间。
因此,需要有效的***和方法用于制造传导性材料中的复杂图案而不具有与传统的切割设备相关的前述缺陷。
发明内容
下面描述的本发明实施方式不意欲是穷尽性的或将本发明限于在下面详细描述中公开的精确形式。而是,选择并且描述实施方式以使本领域技术人员可认识到并且理解本发明的原理和实践。
本发明涉及利用激光器在传导性层中切割一个或多个图案,从而产生随后可以改进用于多种应用的结构,例如射频识别设备(RFID)。适用于本发明的示例性的激光器包括镱激光器,其在大约48kHz和大约1024nm的波长产生脉冲。理想地,激光器能量不从基底表面显现。这意味着使用激光器不会造成模具撞击(diestrike)、变色、或任何表面粗糙。
在本发明中,为了确定在形成传导性结构中使用的对齐标记的放置或位置,可以结合粘合剂图案或粘合剂层利用光学增亮剂、或其他对齐标记、或引发剂(统称为对齐标记)。
在本发明的示例性实施例中,提供了用于图案化多个对齐标记和同时在预先图案化的粘合剂层上使传导性层图案化的方法。通过激光器检测对齐标记。一旦检测到,触发切割机构——其在传导性层切割图案或多个图案,从而形成传导性结构诸如天线。在前述的可选实施方式中,对齐标记可以用于放置微处理器芯片,然后在定位区域时激光切割器又可以使用对齐标记形成天线图案。
在仍进一步的实施方式中,可以通过冷箔工艺或冲切形成第一图案,随后通过激光切割更多的复杂图案,从而提供最终的图案。
在本发明的一个实施例中,提供传导性中间组件,其包括具有第一面和第二面的基底。粘合剂的图案提供在基底的第一面上。诸如金属箔的传导性层应用在粘合剂图案上。传导性层具有在层中形成的至少第一图案,其中至少第一图案对应于粘合剂的图案。
结合本发明实践使用的图案可以通过激光切割形成。激光切割器受计算机控制,以及除了上述之外,计算机驱动***可以用于产生市场或广告标记,例如符号、名称、商标、标识语、制造信息、其他复杂图案等。***还可以用于控制印刷或成像压印,例如喷墨或激光打印机,从而提供额外的标记给其上已经形成传导性结构的基底。因此,提供具有相对小的轨迹的完备***以产生小批量或少量定制材料,例如吊牌、票、签条等。
在另一个实施例中,提供具有第一部件和第二部件的基底,其中通过激光切割形成的传导性图案提供在第一部件中,诸如零售商标识语或名称的标记提供在第二部件中。标记由激光冲切提供。基底可以装备有第一部分和第二部分,其中第一部分和第二部分彼此折叠在一起形成吊牌、票、或标签。
从下列详细描述,本发明的其他特征和优势对于本领域的技术人员来说是清楚的。不过,应当理解,虽然指出了本发明优选的和其他实施方式,但是通过说明而非限制的方式给出各种实施方式和具体实例的详细描述。可以在不偏离本发明精神的情况下,做出在本发明范围内的许多变化和修改,并且本发明包括所有这样的修改。
附图说明
结合附图,通过参考本发明当前优选示例性实施方式的下面更详细描述,可以更加全面理解和了解本发明的这些目标和优势以及其他目标和优势,其中:
图1描述了在图案化之前本发明的幅材(web)的横截面;
图1A示出了根据本发明生产的示例性的传导性结构;
图2描述了在通过具有多个布置在幅材表面上的传导性层压片的切割机构进行图案化之后幅材的部分选择;
图3示出了形成本发明的传导性结构的方法;
图4是示出了用于形成图1中描述的幅材的过程的示意图;
图5描述了用于制造根据本发明方面的标准传导性结构的卷到卷工艺(roll-to-rollprocess);以及
图6提供根据本发明生产的基底。
发明详述
现在通过下面代表目前最好的已知的执行本发明的方式的详细说明更详细地示出本发明。然而,应当理解,该描述不是用于限制本发明,而是为了示出本发明的一般特征的目的提供该描述。
本发明涉及用于生产中间组件的独特和有效方法,中间组件可以用于制造复杂地形成的电路、天线、光伏模块、和其他专用传导性结构。本发明提供这样的方法:其中为了激光切割器和图案的对准目的利用对齐标记用于可以在传导性材料中形成至少一个传导性结构。本发明还公开了光学增亮剂作为对齐标记的用途或除了对齐标记之外指示传导性结构的布置的用途。
对齐标记的印刷和粘合剂的涂敷还可以同时、基本同时、或顺序地进行,以便能够快速和有效地生产根据本发明的传导性结构。
本发明还可以或在可选的实施例中使用对齐标记用于在开始激光烧蚀或切割之前布置微处理器芯片(参考图1A)。在这个实施例中,激光器可以利用芯片作为对齐标记,引导激光器在箔层中切割传导性图案。
图1示出了本发明的幅材10的横截面图。具有第一面13和第二面15的基底11具有提供在基底11的第一面13的至少一部分上的粘合剂层20。粘合剂层20在一个实施方式中提供在将对应于传导性结构的形状的图案中,其中传导性结构的图案将在箔或传导性层压片中形成(参考图1A)。然后,传导性层120提供在粘合剂层20上。传导或箔层120仅粘附至提供在图案中的那些粘合剂区域。也就是说,箔层的部分将不附接至基底,而其他部分由于粘合剂的图案化将粘附到基底。可以看到例如粘合剂图案在图1中的线17终止,因此箔120的一部分不粘附至基底11,由非粘附剂区域121指示。图1A中示出了示例性的传导性图案50。传导性图案50具有可以用于附接微处理器芯片或系住(strap)所形成结构的区域55。
本文中使用的术语“传导性层”可以包括箔层或与一个或多个额外层,例如增强层、载体层、粘合剂、覆盖层等结合的箔。
基底11可以由允许基底11为柔性的任何材料或材料的组合制造,以便于利于将基底11制造为可以缠绕成卷形式用于在卷到卷工艺中的连续幅材(参考图4和图5)。这些基底材料的实例包括但不限于,聚酯膜、聚对苯二甲酸乙二酯膜、聚酰亚胺膜、织物(机织的、非机织的、合成的、天然的)、布料、或纸质材料(卡板纸、证券纸、再生纸等)。
应当理解,尽管将本发明描述为利用幅材的卷对卷布置,但是本发明可以在片材输入构造中实施,其中片材的堆叠用作原始材料的供给。
传导性层120可以由任何适合的传导性材料制造,例如铝、铜、银、金属合金等。可以使用传导性材料的组合。此外,通过印刷传导性油墨、蚀刻、或其他合适的过程可以制造传导性材料。
粘合剂层可以是通用的永久压敏粘合剂、压力激活粘合剂、或其他合适的粘合剂。粘合剂层可以通过图案涂敷或印刷施加到基底上,例如利用喷墨、柔性版印刷、完全涂布(fullcoating)、或其他合适的方法。
现在参考图2,其示出了在通过切割机构诸如激光器进行图案化之后本发明的幅材10。提供的幅材10具有许多设置在幅材10的上表面12上的传导性结构22,一旦剩余余材,就剥离传导性箔的未连接部分。为了形成传导性结构22,幅材10装备有沿着粘合剂(未示出)上面的幅材10的第一纵向延伸侧边缘16和第二纵向延伸侧边缘18的一系列印刷的对齐标记14。应当理解,可以沿着基底的两个侧面或边缘或在基底的其他位置提供对齐标记。
在一个实施方式中,只要使用粘合剂的透明涂层,就可以在将粘合剂涂到基底11的第一面13之前在基底11的第一面13上提供对齐标记14,从而允许检测对齐标记14。也就是说,如果透明涂层施加在标记上,那么将使得通过涂层可看见标记,例如通过机器视觉***扫描。对齐标记14有助于对齐传导性结构22,通过打印机图案化对齐标记14。通常,以纵向提供对齐标记14,也就是幅材或片材穿过机器的方向。为了利于检测标记,对齐标记可以提供有光学增亮剂。
图3提供了用于通过应用多个对齐标记14和至少一个传导性图案24在本发明的幅材10上制造多个传导性结构22的示例性方法的方框图。在步骤300中,提供的基底11具有第一面和第二面。粘合剂层20(为了图示,以幻影示出并且未被传导性层22覆盖)提供在基底11的第一面13上。粘合剂层以对应于要形成的结构的模式或可选地溢流涂布(floodcoated)的模式提供在基底11的第一面13上。一系列对齐标记也印刷在基底第一面上。传导性层120(参考图1)提供在粘合剂层20上。
在一个粘合剂溢流涂布在基底上并且未提供具体图案的实施方式中,在未形成传导性结构的步骤310中,使对应于要形成的图案的粘合剂区域失粘(deaden)。在步骤310中,通过UV源或亮油(未示出)“失粘”粘合剂层的某些区域。因此,粘合剂层20将具有指示为“无效的(dead)”和“有效的(active)”的单独区域。粘合剂的有效区域将保持其粘着性和允许传导性层或箔层粘附至粘合剂,而失粘区域失去其粘着性,箔或传导性层将不会粘附至粘合剂。通过失粘,粘合剂层20的某些区域,即,在由粘合剂层20的有效区域形成的传导性结构22的位置周围的那些区域21,将由失粘的粘合剂充分包围。切割工具用于在传导性结构22的传导性层120中切割图案24。在优选的实施例中,切割机构是激光器。然而,应当理解,可以通过利用其他切割设备完成切割图案24,其可以预先切割一部分图案,然后再通过激光器切割更复杂的图案。
在步骤320中,传导性层层压或粘附至粘合剂仍保持粘性的那些部分。在步骤330中,在粘合剂层中切割多种图案,从而形成多种传导性结构。
通过从粘合剂层20的失粘区域的传导性层120中剥离剩下的余材,移除粘合剂层20的失粘区域上提供的传导性层120的过量材料。应当指出,余材,特别是如果使用金属箔的话,是100%可回收的。在另一个实施例中,粘合剂可以图案化到在基底11的第一面13上,这意味着多种几何形状被图案化到基底的第一面上,或用粘合剂覆盖基底的第一面的指定部分,其中基底的第一面的其他部分不覆盖粘合剂。通过将粘合剂图案化到基底11的第一面13上,利用UV源或亮油使粘合剂的某些区域失粘是不必要的。
在本发明的实施例中,利用光学增亮剂23配合对齐标记,从而触发切割机构在传导性结构22的传导性层120中切割至少一个图案24。光学增亮剂23可以提供在对齐标记14区域中或在其周围,也就是沿着边缘或侧面区域触发激光器开始切割传导性基底。在一个实施例中,光学增亮剂23可以混合在粘合剂层20的图案中。在另一个实施例中,光学增亮剂23的图案也可以印刷在粘合剂层20的图案上面,而不是混合在粘合剂层20本体中。在另一个实施例中,光学增亮剂23的具体图案可以印刷在基底11的第一面13上,然后将粘合剂层20提供在基底11的第一面13上,然后清澈粘合剂或至少一部分透明粘合剂施加在基底上,以便通过粘合剂层20可以看到光学增亮剂23,和可以识别切割装置。
额外的光学增亮剂23还可以以特定形状提供或提供在待形成传导性结构22的区域周围,以便可以进行补充激光切割,例如形成芯片连接或放置部分的区域的切割。
光学增亮剂23可以以具体图案提供,例如某些几何形状的列和/或行,从而触发切割机构在传导性结构22的传导性层120中的光学增亮剂对齐标记的每个位置切割图案。当传导性层120在粘合剂层20上时,传导性层120不覆盖对齐标记14和/或光学增亮剂23占据的区域,以便于允许切割机构检测对齐标记,从而使多个传导性结构与对齐标记对准。当光学增亮剂23用作对齐标记14时,可以同时图案化粘合剂20和对齐标记14,因而通过减少构建传导性结构所需的步骤数提供更有效的方法。
利用多种油墨可以将对齐标记14印刷在单独的光学增亮剂23上面。在可选的实施例中,也可以从传导性层部分或箔层压片部分形成本发明的对齐标记14,其定位在待被切割设备检测的特定区域。
在示例性的实施例中,光学增亮剂23是粘合剂图案总重量的大约1%的荧光粉,更优选地荧光粉占粘合剂总重量的0.5%。可以从相同的印刷板和垫(blanket)形成光学增亮剂23和粘合剂层20,从而同时产生光学增亮剂23和粘合剂20的图案。在本发明的其他实施例中,光学增亮剂23可以是荧光粉的所选颜色或可以包括UV可检测元素。
传导性层120具有对应于粘合剂层20至少一部分的至少一个图案24。本发明考虑多个图案的可能性,也就是在单个通道(lane)或多个通道中产生的图案。切割机构可以用于产生用于连接集成电路的额外区域,和完成额外图案的切割,从而将某些变化性增加至该设计中。关于芯片的放置,条带可以放置在箔上,从而利于与芯片对齐,因此可以更容易地连接附着点。附着图案24是大约100微米宽。
在另一个实施例中,可以在传导性层的另一个区域中产生进一步的图案,从而形成条形码、公司标识语、或一些其他可变数据或标记。
现在指向图4,其提供了产生图1中所示的幅材10的可能示意图。诸如纸、塑料、布料或织物的材料的幅材从辊30上展开。印刷机32可以用于将对齐标记应用于幅材,用于随后通过粘合涂层和切割装置进行扫描。粘合剂涂布机34施加粘合剂层——其可以具有将对应于传导性结构的不同粘合剂图案20,或粘合剂可以作为幅材的完全涂层(fullcoat)施加。接着,在作为完全涂层或溢流涂布应用粘合剂层的地方,UV源36指向粘合剂,从而使粘合剂的所选区域失粘,对应于要在传导性层中产生的图案的区域外部的那些区域,留下将形成传导性结构22的有效区域。辊40层压传导性层38,例如从开卷(unwind)37源输送至涂有粘合剂的幅材10的有效区域的箔。在传导性层中通过激光切割器42切割图案24。应当注意,来自激光器的能量不会刻划或标记下面的基底幅材。
在可选的实施例中,可以在箔层中产生第一切割图案,例如通过旋转模切机或通过冷箔工艺。本文中使用的示例性冷箔工艺是指将粘合剂或其他可固化图案印刷在基底上,然后将箔层施加在图案上,将箔层压到图案,以便箔粘住图案,然后剥离掉箔,使得图案留在箔层覆盖的基底上。可以在激光切割器进行最终切割之前或其之后进行冷箔工艺。
一旦图案24切入传导性层或箔38中,那么通过剥离器44或重绕(rewound)46剥离掉未接触粘合剂层的有效区域的传导性层的剩余部分。收集的材料,例如箔,是100%可回收的,因为箔还未因粘合剂受到污染,因为粘合剂在施加之前已经失粘或如果使用有图案的粘合剂则不施加粘合剂。然后,在48缠绕幅材10。在形成单独的传导性结构或箔层压片22之后可以通过切割器(未示出)发送幅材10,从而使得单独的传导性结构或箔层压片彼此分离,或可以收集幅材并在稍后的时间进行切割。幅材10还可以经历第二或第三或更多次切割,这取决于由传导性结构构成的特定最终用途。
激光切割器42也可以将标记切入箔中,例如商标、商品名称、标识语或单独区域中的其他信息,以便于将一些变形和个性化增加至幅材,本文中将进行描述。
图5中示出了可以用于产生传导性结构22的幅材10的卷到卷工艺的示意图。通过开卷机95从幅材辊100分配幅材90,并且输送至第一切割站,例如激光器、旋转切割机、或冷箔辊或冲模100,如果该站是冲模切割单元或冷箔单元,其具有旋转模具150。第一切割器可以用于从要形成的传导性结构上移除大段材料。幅材90离开第一切割器110,被输送至激光切割器175。将激光切割路径215编入计算机177,计算机177控制激光切割器175。计算机控制的激光切割器可以执行必需的所有切割或可以可选地预定用于切割更复杂的图案或用于任何完工的切割。
继续参考图5,幅材155离开激光切割器175,如果需要的话输送至剥离器180。当提供剥离器时,剥离器180从形成的传导性结构22分离余材幅材或剩余传导性材料或箔190,从而产生传导性结构幅材185。传导性结构幅材185具有布置在载体层185上的一连串结构22。传导性结构幅材185通过第一重绕机200缠绕到辊195中,同时余材幅材190通过第二重绕机205缠绕到余材辊210中。
现在参考图6,其包括具有第一部件410和第二部件420的基底400。第一部件410装备有传导性结构430,例如RFID天线/设备,第二部件420装备有标记440,例如零售商名称、标识语、或其他信息,例如商标、商品名称、设计、图案等等。通过激光切割产生传导性结构430和标记的每一个。
基底400还可以分别包括第一部分440和第二部分450。第一部分440分别由第一部件410和第二部件420构成,第二部分450可沿着折叠线455折叠到第一部分440上,从而形成吊牌、票、标签等中的一个。第二部分450还可以装备有标记460,标记460可以涉及消费品——作为诸如吊牌的基底附接至其。
因此,根据本发明可见,已经提供了用于制造传导性基底的高度有利的方法。尽管已经结合目前认为最实际和优选的实施例描述了本发明,但是对于本领域的普通技术人员显而易见的是,本发明并不限于所公开的实施例,在本发明的保护范围内可以进行许多改进和等同布置,其保护范围与所附权利要求的最宽广的解释一致,以便于涵盖所有等同结构和产品。
因而,本发明人陈述其意图依赖于等同原则确定和评估发明的公平合理范围,因为本发明属于实质上不偏离但是超出权利要求中阐述的本发明的字面范围的任何装置、***、方法、或物品。
Claims (21)
1.制造传导性结构的幅材的方法:
提供具有第一面和第二面的基底;
在所述基底的第一面上提供粘合剂层;
使所述粘合剂层的区域失粘,从而形成粘合剂有粘性的有效区域和所述粘合剂无粘性的失粘区域;
将传导性层层压在所述粘合剂层上,以便于所述传导性层粘附至对应于所述粘合剂层的有效区域的区域中的所述粘合剂层;以及
将多个对齐标记图案化在所述粘合剂层上,和检测所述对齐标记;以及
切割所述传导性层,从而形成多个传导性结构。
2.根据权利要求1所述的方法,其中所述粘合剂层包括多个光学增亮剂。
3.根据权利要求1所述的方法,其中所述对齐标记包括光学增亮剂。
4.根据权利要求1所述的方法,包括进一步的步骤:在所述传导性层中形成可变的或个性化的图案。
5.根据权利要求1所述的方法,其中通过激光切割器或冷箔工艺中的一个形成所述传导性结构。
6.生产具有多个RFID天线的幅材的方法:
提供具有第一面和第二面的基底;
施加粘合剂层;
将至少一个包括光学增亮剂的区域印刷在所述基底的第一面的至少一部分上;
提供切割机构;
将传导性层放置在所述粘合剂层上;
将所述传导性层层压在所述粘合剂层上,以便所述传导性层粘附至所述粘合剂层的有效区域且不粘附至所述粘合剂层的失粘区域;
检测所述光学增亮剂;以及
在所述传导性层中形成传导性结构的至少一个图案。
7.根据权利要求6所述的方法,其中通过激光切割、冲切、或冷箔工艺中的一个完成所述形成。
8.根据权利要求6所述的方法,其中所述光学增亮剂包含在所述粘合剂层中。
9.根据权利要求6所述的方法,其中所述光学增亮剂是UV可检测的。
10.根据权利要求6所述的方法,其中沿着所述基底的边缘将多个对齐标记印刷在所述第一面和第二面的一个上。
11.根据权利要求6所述的方法,其中增强层提供在所述粘合剂层上。
12.根据权利要求11所述的方法,其中第二粘合剂层提供在所述增强层上。
13.根据权利要求6所述的方法,包括进一步的步骤:移除所述传导性层未粘附至所述基底的部分。
14.根据权利要求6所述的方法,包括进一步的步骤:在所述传导性层中形成可变的或个性化的图案。
15.传导性结构的幅材,包括:
具有第一面和第二面的基底;
粘合剂层,其具有有效区域和失粘区域,所述粘合剂层提供在基底第一面上;
至少一个对齐标记在所述粘合剂层内,其中所述至少一个对齐标记提供有至少一种光学增亮剂;
提供在所述粘合剂层的所述有效区域上的传导性层;
通过激光切割所述传导性层形成的至少一个传导性结构;以及
其中所述至少一个传导性结构与所述至少一个对齐标记对准。
16.根据权利要求15所述的幅材,包括通过在所述传导性层中激光切割图案形成的可变的或个性化的图案。
17.根据权利要求15所述的幅材,其中所述光学增亮剂提供在所述粘合剂层的上面。
18.根据权利要求15所述的幅材,其中所述传导性结构是天线。
19.根据权利要求16所述的幅材,其中所述可变的或个性化信息的图案与所述传导性结构分离。
20.具有传导性结构的基底,包括:
具有第一部件和第二部件及第一面和第二面的基底;
提供在所述基底的所述第一面上的多个图案化的对齐标记,所述多个对齐标记每个提供有光学增亮剂;
在所述第一面的第一部件的至少一部分上面的透明粘合剂层;
在所述透明粘合剂层上面的传导性层;
提供在所述第一部件中的传导性图案,所述传导性图案通过激光冲切的所述传导性层形成;以及
提供在所述第一面的所述第二部件中的标记,所述标记通过激光冲切形成;
其中所述传导性图案和所述标记通过参考多个图案化的对齐标记对准。
21.根据权利要求20所述的基底,其中所述基底包括第一部分和第二部分,所述第一部分具有标记和传导性图案,所述第二部分包括空白区域用于折叠在所述第一部分上以形成吊牌、票、或标签中的一个。
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