FI20085121A0 - Menetelmä metallikalvojohteeseen muodostettavan sähköisen liitoksen sähkönjohtokyvyn ja adheesion parantamiseksi, sekä komponentinkiinnitysliima, sähköisesti johtava pasta ja sähköisesti johtava pinnoite - Google Patents

Menetelmä metallikalvojohteeseen muodostettavan sähköisen liitoksen sähkönjohtokyvyn ja adheesion parantamiseksi, sekä komponentinkiinnitysliima, sähköisesti johtava pasta ja sähköisesti johtava pinnoite

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Publication number
FI20085121A0
FI20085121A0 FI20085121A FI20085121A FI20085121A0 FI 20085121 A0 FI20085121 A0 FI 20085121A0 FI 20085121 A FI20085121 A FI 20085121A FI 20085121 A FI20085121 A FI 20085121A FI 20085121 A0 FI20085121 A0 FI 20085121A0
Authority
FI
Finland
Prior art keywords
electrically conductive
adhesion
improving
well
metal film
Prior art date
Application number
FI20085121A
Other languages
English (en)
Swedish (sv)
Inventor
Lauri Huhtasalo
Juha-Pekka Alho
Elina Sippola
Olli-Pekka Viitanen
Original Assignee
Intune Circuits Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intune Circuits Oy filed Critical Intune Circuits Oy
Priority to FI20085121A priority Critical patent/FI20085121A0/fi
Publication of FI20085121A0 publication Critical patent/FI20085121A0/fi
Priority to PCT/FI2009/050101 priority patent/WO2009101249A1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
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    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/30—Structure, shape, material or disposition of the layer connectors prior to the connecting process of a plurality of layer connectors
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    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
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    • C09J2400/166—Metal in the pretreated surface to be joined
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
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    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
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    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
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    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Treatment Of Metals (AREA)
FI20085121A 2008-02-11 2008-02-11 Menetelmä metallikalvojohteeseen muodostettavan sähköisen liitoksen sähkönjohtokyvyn ja adheesion parantamiseksi, sekä komponentinkiinnitysliima, sähköisesti johtava pasta ja sähköisesti johtava pinnoite FI20085121A0 (fi)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20085121A FI20085121A0 (fi) 2008-02-11 2008-02-11 Menetelmä metallikalvojohteeseen muodostettavan sähköisen liitoksen sähkönjohtokyvyn ja adheesion parantamiseksi, sekä komponentinkiinnitysliima, sähköisesti johtava pasta ja sähköisesti johtava pinnoite
PCT/FI2009/050101 WO2009101249A1 (en) 2008-02-11 2009-02-10 A method for improving electrical conductivity and adhesion of an electrical coupling formed in a metal foil conductor, a component binding adhesive, an electrically conductive paste and an electrically conductive coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20085121A FI20085121A0 (fi) 2008-02-11 2008-02-11 Menetelmä metallikalvojohteeseen muodostettavan sähköisen liitoksen sähkönjohtokyvyn ja adheesion parantamiseksi, sekä komponentinkiinnitysliima, sähköisesti johtava pasta ja sähköisesti johtava pinnoite

Publications (1)

Publication Number Publication Date
FI20085121A0 true FI20085121A0 (fi) 2008-02-11

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FI20085121A FI20085121A0 (fi) 2008-02-11 2008-02-11 Menetelmä metallikalvojohteeseen muodostettavan sähköisen liitoksen sähkönjohtokyvyn ja adheesion parantamiseksi, sekä komponentinkiinnitysliima, sähköisesti johtava pasta ja sähköisesti johtava pinnoite

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FI (1) FI20085121A0 (fi)
WO (1) WO2009101249A1 (fi)

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US8786510B2 (en) 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
US9231290B2 (en) * 2010-06-14 2016-01-05 Avery Dennison Corporation Method for making short run radio frequency identification tags and labels
CN107384229B (zh) * 2017-07-13 2021-12-17 东南大学 一种柔性器件与皮肤表面高度贴合方法

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