TWI457183B - Substrate processing device - Google Patents

Substrate processing device Download PDF

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Publication number
TWI457183B
TWI457183B TW099141274A TW99141274A TWI457183B TW I457183 B TWI457183 B TW I457183B TW 099141274 A TW099141274 A TW 099141274A TW 99141274 A TW99141274 A TW 99141274A TW I457183 B TWI457183 B TW I457183B
Authority
TW
Taiwan
Prior art keywords
substrate
drying
unit
coating
conveying
Prior art date
Application number
TW099141274A
Other languages
English (en)
Chinese (zh)
Other versions
TW201130572A (en
Inventor
Fumito Fukuhara
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW201130572A publication Critical patent/TW201130572A/zh
Application granted granted Critical
Publication of TWI457183B publication Critical patent/TWI457183B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60—Substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Drying Of Solid Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW099141274A 2010-01-08 2010-11-29 Substrate processing device TWI457183B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010002547A JP5417186B2 (ja) 2010-01-08 2010-01-08 基板処理装置

Publications (2)

Publication Number Publication Date
TW201130572A TW201130572A (en) 2011-09-16
TWI457183B true TWI457183B (zh) 2014-10-21

Family

ID=44457885

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099141274A TWI457183B (zh) 2010-01-08 2010-11-29 Substrate processing device

Country Status (4)

Country Link
JP (1) JP5417186B2 (ja)
KR (1) KR101216321B1 (ja)
CN (1) CN102166559B (ja)
TW (1) TWI457183B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5578377B2 (ja) * 2011-07-29 2014-08-27 セメス株式会社 基板処理装置及び方法
KR101255638B1 (ko) * 2011-09-22 2013-04-16 씨앤에스엔지니어링 주식회사 평판패널의 세정장치 및 세정방법
KR101827364B1 (ko) * 2011-10-13 2018-03-22 세메스 주식회사 기판 처리 장치 및 방법
CN103286049B (zh) * 2012-03-02 2016-03-16 上海展辰涂料有限公司 紫外光固化涂料实木百叶窗表面施工方法
KR20140065851A (ko) * 2012-11-22 2014-05-30 신화일렉트론 주식회사 다단식 글라스 건조장치
KR20140148282A (ko) * 2013-06-21 2014-12-31 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP6286239B2 (ja) * 2014-03-11 2018-02-28 東京応化工業株式会社 塗布装置、基板処理装置、塗布方法及び基板処理方法
KR102535550B1 (ko) * 2015-09-30 2023-05-22 스미토모 긴조쿠 고잔 가부시키가이샤 유기 피막 제조방법, 도전성 기판 제조방법 및 유기 피막 제조장치
DE112016006798B4 (de) * 2016-04-26 2024-02-22 Toshiba Mitsubishi-Electric Industrial Systems Corporation Schichtaufbringungsvorrichtung
KR102121418B1 (ko) 2018-07-30 2020-06-10 (주)에스티아이 기판 지지 장치 및 그 제어 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06339658A (ja) * 1993-05-31 1994-12-13 Hirata Kiko Kk 流体塗布装置
JP2005142372A (ja) * 2003-11-06 2005-06-02 Tokyo Electron Ltd 基板処理装置及び基板処理方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2919925B2 (ja) * 1990-07-26 1999-07-19 東京エレクトロン株式会社 処理装置
JP2949547B2 (ja) * 1993-02-08 1999-09-13 東京エレクトロン株式会社 処理装置及び処理方法
JPH081065A (ja) * 1994-06-23 1996-01-09 Dainippon Screen Mfg Co Ltd 表面処理装置
JPH0883745A (ja) * 1994-09-09 1996-03-26 Mitsubishi Electric Corp 処理装置
JP3273031B2 (ja) * 1999-01-08 2002-04-08 東京エレクトロン株式会社 基板処理装置
JP3920638B2 (ja) * 2001-12-26 2007-05-30 東京エレクトロン株式会社 減圧乾燥装置
JP4363046B2 (ja) * 2003-01-24 2009-11-11 東レ株式会社 塗布装置および塗布方法並びにディスプレイ用部材の製造方法
JP4490797B2 (ja) * 2004-01-23 2010-06-30 大日本スクリーン製造株式会社 基板処理装置
KR100625087B1 (ko) * 2004-08-16 2006-09-20 (주)이노포스 다단계 자동 스핀코팅 시스템
JP2006100722A (ja) * 2004-09-30 2006-04-13 Tokyo Electron Ltd 基板処理システム
JP4451385B2 (ja) * 2005-12-20 2010-04-14 東京エレクトロン株式会社 塗布処理装置及び塗布処理方法
JP4969138B2 (ja) * 2006-04-17 2012-07-04 大日本スクリーン製造株式会社 基板処理装置
JP5149513B2 (ja) * 2007-02-15 2013-02-20 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5028195B2 (ja) * 2007-09-10 2012-09-19 大日本スクリーン製造株式会社 基板処理装置および基板処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06339658A (ja) * 1993-05-31 1994-12-13 Hirata Kiko Kk 流体塗布装置
JP2005142372A (ja) * 2003-11-06 2005-06-02 Tokyo Electron Ltd 基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
KR101216321B1 (ko) 2012-12-27
TW201130572A (en) 2011-09-16
CN102166559A (zh) 2011-08-31
CN102166559B (zh) 2013-08-21
JP2011142237A (ja) 2011-07-21
KR20110081752A (ko) 2011-07-14
JP5417186B2 (ja) 2014-02-12

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MM4A Annulment or lapse of patent due to non-payment of fees