KR101216321B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR101216321B1
KR101216321B1 KR1020100110388A KR20100110388A KR101216321B1 KR 101216321 B1 KR101216321 B1 KR 101216321B1 KR 1020100110388 A KR1020100110388 A KR 1020100110388A KR 20100110388 A KR20100110388 A KR 20100110388A KR 101216321 B1 KR101216321 B1 KR 101216321B1
Authority
KR
South Korea
Prior art keywords
substrate
drying
board
coating
unit
Prior art date
Application number
KR1020100110388A
Other languages
English (en)
Korean (ko)
Other versions
KR20110081752A (ko
Inventor
후미토 후쿠하라
Original Assignee
다이니폰 스크린 세이조우 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이니폰 스크린 세이조우 가부시키가이샤 filed Critical 다이니폰 스크린 세이조우 가부시키가이샤
Publication of KR20110081752A publication Critical patent/KR20110081752A/ko
Application granted granted Critical
Publication of KR101216321B1 publication Critical patent/KR101216321B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60—Substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Drying Of Solid Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020100110388A 2010-01-08 2010-11-08 기판 처리 장치 KR101216321B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010002547A JP5417186B2 (ja) 2010-01-08 2010-01-08 基板処理装置
JPJP-P-2010-002547 2010-01-08

Publications (2)

Publication Number Publication Date
KR20110081752A KR20110081752A (ko) 2011-07-14
KR101216321B1 true KR101216321B1 (ko) 2012-12-27

Family

ID=44457885

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100110388A KR101216321B1 (ko) 2010-01-08 2010-11-08 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP5417186B2 (ja)
KR (1) KR101216321B1 (ja)
CN (1) CN102166559B (ja)
TW (1) TWI457183B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200013528A (ko) 2018-07-30 2020-02-07 (주)에스티아이 기판 지지 장치 및 그 제어 방법

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5578377B2 (ja) * 2011-07-29 2014-08-27 セメス株式会社 基板処理装置及び方法
KR101255638B1 (ko) * 2011-09-22 2013-04-16 씨앤에스엔지니어링 주식회사 평판패널의 세정장치 및 세정방법
KR101827364B1 (ko) * 2011-10-13 2018-03-22 세메스 주식회사 기판 처리 장치 및 방법
CN103286049B (zh) * 2012-03-02 2016-03-16 上海展辰涂料有限公司 紫外光固化涂料实木百叶窗表面施工方法
KR20140065851A (ko) * 2012-11-22 2014-05-30 신화일렉트론 주식회사 다단식 글라스 건조장치
KR20140148282A (ko) * 2013-06-21 2014-12-31 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP6286239B2 (ja) * 2014-03-11 2018-02-28 東京応化工業株式会社 塗布装置、基板処理装置、塗布方法及び基板処理方法
KR102535550B1 (ko) * 2015-09-30 2023-05-22 스미토모 긴조쿠 고잔 가부시키가이샤 유기 피막 제조방법, 도전성 기판 제조방법 및 유기 피막 제조장치
DE112016006798B4 (de) * 2016-04-26 2024-02-22 Toshiba Mitsubishi-Electric Industrial Systems Corporation Schichtaufbringungsvorrichtung

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2919925B2 (ja) * 1990-07-26 1999-07-19 東京エレクトロン株式会社 処理装置
JP2949547B2 (ja) * 1993-02-08 1999-09-13 東京エレクトロン株式会社 処理装置及び処理方法
JP3236703B2 (ja) * 1993-05-31 2001-12-10 平田機工株式会社 流体塗布装置
JPH081065A (ja) * 1994-06-23 1996-01-09 Dainippon Screen Mfg Co Ltd 表面処理装置
JPH0883745A (ja) * 1994-09-09 1996-03-26 Mitsubishi Electric Corp 処理装置
JP3273031B2 (ja) * 1999-01-08 2002-04-08 東京エレクトロン株式会社 基板処理装置
JP3920638B2 (ja) * 2001-12-26 2007-05-30 東京エレクトロン株式会社 減圧乾燥装置
JP4363046B2 (ja) * 2003-01-24 2009-11-11 東レ株式会社 塗布装置および塗布方法並びにディスプレイ用部材の製造方法
JP2005142372A (ja) * 2003-11-06 2005-06-02 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP4490797B2 (ja) * 2004-01-23 2010-06-30 大日本スクリーン製造株式会社 基板処理装置
KR100625087B1 (ko) * 2004-08-16 2006-09-20 (주)이노포스 다단계 자동 스핀코팅 시스템
JP2006100722A (ja) * 2004-09-30 2006-04-13 Tokyo Electron Ltd 基板処理システム
JP4451385B2 (ja) * 2005-12-20 2010-04-14 東京エレクトロン株式会社 塗布処理装置及び塗布処理方法
JP4969138B2 (ja) * 2006-04-17 2012-07-04 大日本スクリーン製造株式会社 基板処理装置
JP5149513B2 (ja) * 2007-02-15 2013-02-20 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5028195B2 (ja) * 2007-09-10 2012-09-19 大日本スクリーン製造株式会社 基板処理装置および基板処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200013528A (ko) 2018-07-30 2020-02-07 (주)에스티아이 기판 지지 장치 및 그 제어 방법

Also Published As

Publication number Publication date
TW201130572A (en) 2011-09-16
CN102166559A (zh) 2011-08-31
CN102166559B (zh) 2013-08-21
JP2011142237A (ja) 2011-07-21
TWI457183B (zh) 2014-10-21
KR20110081752A (ko) 2011-07-14
JP5417186B2 (ja) 2014-02-12

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