TW559584B - Method and device for adjusting position of hand - Google Patents

Method and device for adjusting position of hand Download PDF

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Publication number
TW559584B
TW559584B TW091117654A TW91117654A TW559584B TW 559584 B TW559584 B TW 559584B TW 091117654 A TW091117654 A TW 091117654A TW 91117654 A TW91117654 A TW 91117654A TW 559584 B TW559584 B TW 559584B
Authority
TW
Taiwan
Prior art keywords
workpiece
robot hand
edge
robot
sensor
Prior art date
Application number
TW091117654A
Other languages
English (en)
Chinese (zh)
Inventor
Takayuki Yazawa
Seiji Karaki
Yoshihisa Masuzawa
Original Assignee
Sankyo Seiki Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sankyo Seiki Seisakusho Kk filed Critical Sankyo Seiki Seisakusho Kk
Application granted granted Critical
Publication of TW559584B publication Critical patent/TW559584B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
TW091117654A 2001-08-07 2002-08-06 Method and device for adjusting position of hand TW559584B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001239166 2001-08-07
JP2002177148A JP3955499B2 (ja) 2001-08-07 2002-06-18 ハンドの位置合わせ方法およびその装置

Publications (1)

Publication Number Publication Date
TW559584B true TW559584B (en) 2003-11-01

Family

ID=26620097

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091117654A TW559584B (en) 2001-08-07 2002-08-06 Method and device for adjusting position of hand

Country Status (4)

Country Link
JP (1) JP3955499B2 (ko)
KR (1) KR100503013B1 (ko)
CN (1) CN1283427C (ko)
TW (1) TW559584B (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI382903B (zh) * 2007-11-23 2013-01-21 Hon Hai Prec Ind Co Ltd 機械手
TWI644389B (zh) * 2016-09-20 2018-12-11 圓益Ｉｐｓ股份有限公司 基板移送裝置及其控制方法
TWI717860B (zh) * 2018-10-28 2021-02-01 台灣積體電路製造股份有限公司 退火設備與方法

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100716301B1 (ko) 2006-02-06 2007-05-09 삼성전자주식회사 패널반송로봇
JP4688739B2 (ja) * 2006-05-02 2011-05-25 株式会社ソニー・コンピュータエンタテインメント 情報表示装置
KR101239821B1 (ko) * 2006-06-30 2013-03-06 엘지디스플레이 주식회사 기판이송로봇 및 이의 정렬방법
JP5491731B2 (ja) * 2008-12-25 2014-05-14 川崎重工業株式会社 ロボット、及びロボットの教示位置の直進開始位置の較正方法
CN101491403B (zh) * 2009-02-18 2011-06-15 苏州艾隆科技有限公司 自动化药房的快速盘点方法
JP4837116B2 (ja) * 2010-03-05 2011-12-14 ファナック株式会社 視覚センサを備えたロボットシステム
WO2012008321A1 (ja) * 2010-07-14 2012-01-19 日本電産サンキョー株式会社 産業用ロボット、産業用ロボットの制御方法および産業用ロボットの教示方法
JP5578973B2 (ja) * 2010-07-16 2014-08-27 日本電産サンキョー株式会社 産業用ロボット
JP5665417B2 (ja) * 2010-08-20 2015-02-04 日本電産サンキョー株式会社 産業用ロボット
US8768513B2 (en) * 2011-08-08 2014-07-01 Applied Materials, Inc. Systems having multi-linkage robots and methods to correct positional and rotational alignment in multi-linkage robots
KR101337563B1 (ko) * 2012-03-30 2013-12-06 한국생산기술연구원 감지유닛을 이용하여 매니퓰레이터의 위치를 조절하는 이송장치
JP2014008578A (ja) * 2012-06-29 2014-01-20 Daihen Corp 基板搬送装置
JP6035063B2 (ja) * 2012-06-29 2016-11-30 株式会社ダイヘン 基板搬送装置
CN103552083A (zh) * 2013-10-30 2014-02-05 上海华力微电子有限公司 调整机械臂位置的方法
JP6499826B2 (ja) * 2014-01-29 2019-04-10 日本電産サンキョー株式会社 産業用ロボット
CN105590878B (zh) * 2014-10-23 2019-02-19 北京北方华创微电子装备有限公司 一种机械手偏移监测***
CN105417066B (zh) * 2015-11-09 2017-12-01 合肥欣奕华智能机器有限公司 基板位置偏移检测及校正装置和基板搬运***
CN105329642B (zh) * 2015-11-09 2017-11-21 合肥欣奕华智能机器有限公司 基板位置偏移检测及校正方法和基板搬运***的控制方法
KR102066044B1 (ko) * 2016-06-30 2020-02-11 세메스 주식회사 기판 처리 장치, 인덱스 로봇 및 기판 이송 방법
CN106956290B (zh) * 2017-04-17 2019-09-10 京东方科技集团股份有限公司 机械臂及其操作方法、机械臂装置及显示面板生产设备
CN109877822A (zh) * 2017-12-06 2019-06-14 沈阳新松机器人自动化股份有限公司 一种双取纠偏双臂机器人及其纠偏方法
CN109877824A (zh) * 2017-12-06 2019-06-14 沈阳新松机器人自动化股份有限公司 一种单取纠偏机器人及其纠偏方法
CN109877823A (zh) * 2017-12-06 2019-06-14 沈阳新松机器人自动化股份有限公司 一种双放纠偏双臂机器人及其纠偏方法
CN109523580B (zh) * 2018-12-13 2021-01-26 法兰泰克重工股份有限公司 一种图像采集模块的计算方法、图像采集模块及分拣***
JP7219106B2 (ja) * 2019-02-12 2023-02-07 日本電産サンキョー株式会社 基板搬送システムおよび基板搬送システムの制御方法
JP7303686B2 (ja) * 2019-07-26 2023-07-05 ニデックインスツルメンツ株式会社 ロボットにおけるワーク位置検出方法
JP7443141B2 (ja) 2020-04-10 2024-03-05 ニデックインスツルメンツ株式会社 産業用ロボットおよび産業用ロボットの制御方法
JP7443142B2 (ja) 2020-04-10 2024-03-05 ニデックインスツルメンツ株式会社 産業用ロボットおよび産業用ロボットの制御方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09162257A (ja) * 1995-12-05 1997-06-20 Metsukusu:Kk 薄型基板の搬送装置
JPH10277986A (ja) * 1997-04-01 1998-10-20 Mecs:Kk 薄型基板のアライメント装置
JPH10335420A (ja) * 1997-06-04 1998-12-18 Mecs:Kk ワークのアライメント装置
JP2000040735A (ja) * 1998-07-24 2000-02-08 Mecs Corp 基板搬送装置
JP2000071187A (ja) * 1998-08-27 2000-03-07 Komatsu Ltd ワーク搬送ロボット
JP2001144165A (ja) * 1999-11-16 2001-05-25 Assist Japan Kk ガラス基板用非接触アライメント装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI382903B (zh) * 2007-11-23 2013-01-21 Hon Hai Prec Ind Co Ltd 機械手
TWI644389B (zh) * 2016-09-20 2018-12-11 圓益Ｉｐｓ股份有限公司 基板移送裝置及其控制方法
TWI717860B (zh) * 2018-10-28 2021-02-01 台灣積體電路製造股份有限公司 退火設備與方法
US11587807B2 (en) 2018-10-28 2023-02-21 Taiwan Semiconductor Manufacturing Co., Ltd. Annealing apparatus and method thereof

Also Published As

Publication number Publication date
KR100503013B1 (ko) 2005-07-25
JP2003117862A (ja) 2003-04-23
CN1283427C (zh) 2006-11-08
CN1401461A (zh) 2003-03-12
KR20030013250A (ko) 2003-02-14
JP3955499B2 (ja) 2007-08-08

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