CN1283427C - 机器手的定位装置 - Google Patents

机器手的定位装置 Download PDF

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Publication number
CN1283427C
CN1283427C CNB021298092A CN02129809A CN1283427C CN 1283427 C CN1283427 C CN 1283427C CN B021298092 A CNB021298092 A CN B021298092A CN 02129809 A CN02129809 A CN 02129809A CN 1283427 C CN1283427 C CN 1283427C
Authority
CN
China
Prior art keywords
workpiece
mechanical hand
sensor
edge
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB021298092A
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English (en)
Chinese (zh)
Other versions
CN1401461A (zh
Inventor
矢泽隆之
唐木征二
增泽佳久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Sankyo Zhejiang Corp
Nidec Instruments Corp
Original Assignee
Sankyo Seiki Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sankyo Seiki Manufacturing Co Ltd filed Critical Sankyo Seiki Manufacturing Co Ltd
Publication of CN1401461A publication Critical patent/CN1401461A/zh
Application granted granted Critical
Publication of CN1283427C publication Critical patent/CN1283427C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
CNB021298092A 2001-08-07 2002-08-06 机器手的定位装置 Expired - Fee Related CN1283427C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001239166 2001-08-07
JP2001239166 2001-08-07
JP2002177148A JP3955499B2 (ja) 2001-08-07 2002-06-18 ハンドの位置合わせ方法およびその装置
JP2002177148 2002-06-18

Publications (2)

Publication Number Publication Date
CN1401461A CN1401461A (zh) 2003-03-12
CN1283427C true CN1283427C (zh) 2006-11-08

Family

ID=26620097

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB021298092A Expired - Fee Related CN1283427C (zh) 2001-08-07 2002-08-06 机器手的定位装置

Country Status (4)

Country Link
JP (1) JP3955499B2 (ko)
KR (1) KR100503013B1 (ko)
CN (1) CN1283427C (ko)
TW (1) TW559584B (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105417066A (zh) * 2015-11-09 2016-03-23 合肥欣奕华智能机器有限公司 基板位置偏移检测及校正装置和基板搬运***
CN106956290A (zh) * 2017-04-17 2017-07-18 京东方科技集团股份有限公司 机械臂及其操作方法、机械臂装置及显示面板生产设备

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100716301B1 (ko) 2006-02-06 2007-05-09 삼성전자주식회사 패널반송로봇
JP4688739B2 (ja) * 2006-05-02 2011-05-25 株式会社ソニー・コンピュータエンタテインメント 情報表示装置
KR101239821B1 (ko) * 2006-06-30 2013-03-06 엘지디스플레이 주식회사 기판이송로봇 및 이의 정렬방법
TWI382903B (zh) * 2007-11-23 2013-01-21 Hon Hai Prec Ind Co Ltd 機械手
JP5491731B2 (ja) * 2008-12-25 2014-05-14 川崎重工業株式会社 ロボット、及びロボットの教示位置の直進開始位置の較正方法
CN101491403B (zh) * 2009-02-18 2011-06-15 苏州艾隆科技有限公司 自动化药房的快速盘点方法
JP4837116B2 (ja) * 2010-03-05 2011-12-14 ファナック株式会社 視覚センサを備えたロボットシステム
WO2012008321A1 (ja) * 2010-07-14 2012-01-19 日本電産サンキョー株式会社 産業用ロボット、産業用ロボットの制御方法および産業用ロボットの教示方法
JP5578973B2 (ja) * 2010-07-16 2014-08-27 日本電産サンキョー株式会社 産業用ロボット
JP5665417B2 (ja) * 2010-08-20 2015-02-04 日本電産サンキョー株式会社 産業用ロボット
US8768513B2 (en) * 2011-08-08 2014-07-01 Applied Materials, Inc. Systems having multi-linkage robots and methods to correct positional and rotational alignment in multi-linkage robots
KR101337563B1 (ko) * 2012-03-30 2013-12-06 한국생산기술연구원 감지유닛을 이용하여 매니퓰레이터의 위치를 조절하는 이송장치
JP2014008578A (ja) * 2012-06-29 2014-01-20 Daihen Corp 基板搬送装置
JP6035063B2 (ja) * 2012-06-29 2016-11-30 株式会社ダイヘン 基板搬送装置
CN103552083A (zh) * 2013-10-30 2014-02-05 上海华力微电子有限公司 调整机械臂位置的方法
JP6499826B2 (ja) * 2014-01-29 2019-04-10 日本電産サンキョー株式会社 産業用ロボット
CN105590878B (zh) * 2014-10-23 2019-02-19 北京北方华创微电子装备有限公司 一种机械手偏移监测***
CN105329642B (zh) * 2015-11-09 2017-11-21 合肥欣奕华智能机器有限公司 基板位置偏移检测及校正方法和基板搬运***的控制方法
KR102066044B1 (ko) * 2016-06-30 2020-02-11 세메스 주식회사 기판 처리 장치, 인덱스 로봇 및 기판 이송 방법
KR102181121B1 (ko) * 2016-09-20 2020-11-20 주식회사 원익아이피에스 기판 이송 장치 및 기판 이송 장치의 제어 방법
CN109877822A (zh) * 2017-12-06 2019-06-14 沈阳新松机器人自动化股份有限公司 一种双取纠偏双臂机器人及其纠偏方法
CN109877824A (zh) * 2017-12-06 2019-06-14 沈阳新松机器人自动化股份有限公司 一种单取纠偏机器人及其纠偏方法
CN109877823A (zh) * 2017-12-06 2019-06-14 沈阳新松机器人自动化股份有限公司 一种双放纠偏双臂机器人及其纠偏方法
US11587807B2 (en) 2018-10-28 2023-02-21 Taiwan Semiconductor Manufacturing Co., Ltd. Annealing apparatus and method thereof
CN109523580B (zh) * 2018-12-13 2021-01-26 法兰泰克重工股份有限公司 一种图像采集模块的计算方法、图像采集模块及分拣***
JP7219106B2 (ja) * 2019-02-12 2023-02-07 日本電産サンキョー株式会社 基板搬送システムおよび基板搬送システムの制御方法
JP7303686B2 (ja) * 2019-07-26 2023-07-05 ニデックインスツルメンツ株式会社 ロボットにおけるワーク位置検出方法
JP7443141B2 (ja) 2020-04-10 2024-03-05 ニデックインスツルメンツ株式会社 産業用ロボットおよび産業用ロボットの制御方法
JP7443142B2 (ja) 2020-04-10 2024-03-05 ニデックインスツルメンツ株式会社 産業用ロボットおよび産業用ロボットの制御方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09162257A (ja) * 1995-12-05 1997-06-20 Metsukusu:Kk 薄型基板の搬送装置
JPH10277986A (ja) * 1997-04-01 1998-10-20 Mecs:Kk 薄型基板のアライメント装置
JPH10335420A (ja) * 1997-06-04 1998-12-18 Mecs:Kk ワークのアライメント装置
JP2000040735A (ja) * 1998-07-24 2000-02-08 Mecs Corp 基板搬送装置
JP2000071187A (ja) * 1998-08-27 2000-03-07 Komatsu Ltd ワーク搬送ロボット
JP2001144165A (ja) * 1999-11-16 2001-05-25 Assist Japan Kk ガラス基板用非接触アライメント装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105417066A (zh) * 2015-11-09 2016-03-23 合肥欣奕华智能机器有限公司 基板位置偏移检测及校正装置和基板搬运***
CN106956290A (zh) * 2017-04-17 2017-07-18 京东方科技集团股份有限公司 机械臂及其操作方法、机械臂装置及显示面板生产设备

Also Published As

Publication number Publication date
KR100503013B1 (ko) 2005-07-25
TW559584B (en) 2003-11-01
JP2003117862A (ja) 2003-04-23
CN1401461A (zh) 2003-03-12
KR20030013250A (ko) 2003-02-14
JP3955499B2 (ja) 2007-08-08

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C06 Publication
PB01 Publication
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GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20170323

Address after: No. two Xingping Road, Pinghu Economic Development Zone, Zhejiang, China, No. 888

Patentee after: NIDEC SANKYO (ZHEJIANG) Corp.

Patentee after: NIDEC SANKYO Corp.

Address before: Nagano

Patentee before: NIDEC SANKYO Corp.

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20061108

Termination date: 20210806

CF01 Termination of patent right due to non-payment of annual fee