TW202045677A - 黏著劑組成物、黏著帶、及電子零件之處理方法 - Google Patents
黏著劑組成物、黏著帶、及電子零件之處理方法 Download PDFInfo
- Publication number
- TW202045677A TW202045677A TW109109267A TW109109267A TW202045677A TW 202045677 A TW202045677 A TW 202045677A TW 109109267 A TW109109267 A TW 109109267A TW 109109267 A TW109109267 A TW 109109267A TW 202045677 A TW202045677 A TW 202045677A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- adhesive composition
- general formula
- reactive resin
- functional group
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 89
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 89
- 239000000203 mixture Substances 0.000 title claims abstract description 86
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 109
- 239000011347 resin Substances 0.000 claims abstract description 109
- 125000000524 functional group Chemical group 0.000 claims abstract description 91
- 150000001875 compounds Chemical class 0.000 claims abstract description 45
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 40
- 150000002222 fluorine compounds Chemical class 0.000 claims abstract description 24
- 239000012790 adhesive layer Substances 0.000 claims abstract description 7
- -1 polysiloxane Polymers 0.000 claims description 92
- 239000000178 monomer Substances 0.000 claims description 28
- 150000004985 diamines Chemical class 0.000 claims description 23
- 125000003118 aryl group Chemical group 0.000 claims description 22
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 16
- 125000001931 aliphatic group Chemical group 0.000 claims description 16
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims description 13
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 239000000539 dimer Substances 0.000 claims description 12
- 239000003999 initiator Substances 0.000 claims description 12
- 230000001678 irradiating effect Effects 0.000 claims description 12
- 238000003672 processing method Methods 0.000 claims description 7
- 150000008378 aryl ethers Chemical group 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 125000004122 cyclic group Chemical group 0.000 claims description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical group CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 5
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical group CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 claims description 5
- ZLPORNPZJNRGCO-UHFFFAOYSA-N 3-methylpyrrole-2,5-dione Chemical group CC1=CC(=O)NC1=O ZLPORNPZJNRGCO-UHFFFAOYSA-N 0.000 claims description 4
- 238000004132 cross linking Methods 0.000 claims description 3
- 125000004185 ester group Chemical group 0.000 claims description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 2
- 229920005591 polysilicon Polymers 0.000 claims 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 125000000879 imine group Chemical group 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 abstract description 11
- 239000004642 Polyimide Substances 0.000 abstract description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 72
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 48
- 238000005227 gel permeation chromatography Methods 0.000 description 22
- 238000003756 stirring Methods 0.000 description 19
- 239000011521 glass Substances 0.000 description 18
- 238000011156 evaluation Methods 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 16
- 239000000243 solution Substances 0.000 description 16
- 150000002466 imines Chemical group 0.000 description 15
- 239000002904 solvent Substances 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- 238000002360 preparation method Methods 0.000 description 14
- 150000003839 salts Chemical class 0.000 description 13
- 239000007789 gas Substances 0.000 description 12
- 239000004809 Teflon Substances 0.000 description 11
- 229920006362 Teflon® Polymers 0.000 description 11
- IZDROVVXIHRYMH-UHFFFAOYSA-N methanesulfonic anhydride Chemical compound CS(=O)(=O)OS(C)(=O)=O IZDROVVXIHRYMH-UHFFFAOYSA-N 0.000 description 11
- 239000003643 water by type Substances 0.000 description 11
- 239000003480 eluent Substances 0.000 description 10
- 238000001914 filtration Methods 0.000 description 10
- 239000000741 silica gel Substances 0.000 description 10
- 229910002027 silica gel Inorganic materials 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- 239000012535 impurity Substances 0.000 description 9
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 8
- 239000011541 reaction mixture Substances 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- UZKWTJUDCOPSNM-UHFFFAOYSA-N 1-ethenoxybutane Chemical group CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 6
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 150000008064 anhydrides Chemical class 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 150000002430 hydrocarbons Chemical group 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 239000012948 isocyanate Substances 0.000 description 5
- 150000002513 isocyanates Chemical class 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000003504 photosensitizing agent Substances 0.000 description 4
- 238000010992 reflux Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- UYBWIEGTWASWSR-UHFFFAOYSA-N 1,3-diaminopropan-2-ol Chemical compound NCC(O)CN UYBWIEGTWASWSR-UHFFFAOYSA-N 0.000 description 3
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical group C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 3
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- 230000001588 bifunctional effect Effects 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 125000001033 ether group Chemical group 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 2
- ZOJIBRUWYLWNRB-UHFFFAOYSA-N 2-(2-ethenoxyethoxymethyl)oxirane Chemical compound C=COCCOCC1CO1 ZOJIBRUWYLWNRB-UHFFFAOYSA-N 0.000 description 2
- LQTJDGFTPKMODO-UHFFFAOYSA-N 2-(4-ethenoxybutoxymethyl)oxirane Chemical compound C=COCCCCOCC1CO1 LQTJDGFTPKMODO-UHFFFAOYSA-N 0.000 description 2
- OKLKEYKZBLGNPG-UHFFFAOYSA-N 2-[2-ethenoxy-3-(oxiran-2-yl)propoxy]ethanol Chemical compound C(=C)OC(COCCO)CC1CO1 OKLKEYKZBLGNPG-UHFFFAOYSA-N 0.000 description 2
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical group C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 2
- UENRXLSRMCSUSN-UHFFFAOYSA-N 3,5-diaminobenzoic acid Chemical compound NC1=CC(N)=CC(C(O)=O)=C1 UENRXLSRMCSUSN-UHFFFAOYSA-N 0.000 description 2
- GWHLJVMSZRKEAQ-UHFFFAOYSA-N 3-(2,3-dicarboxyphenyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(C=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O GWHLJVMSZRKEAQ-UHFFFAOYSA-N 0.000 description 2
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 2
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 2
- KSMGAOMUPSQGTB-UHFFFAOYSA-N 9,10-dibutoxyanthracene Chemical compound C1=CC=C2C(OCCCC)=C(C=CC=C3)C3=C(OCCCC)C2=C1 KSMGAOMUPSQGTB-UHFFFAOYSA-N 0.000 description 2
- MWLNABSYIJNSCH-UHFFFAOYSA-N C=COCCCCCCOCC1CO1 Chemical compound C=COCCCCCCOCC1CO1 MWLNABSYIJNSCH-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 description 2
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- GCAIEATUVJFSMC-UHFFFAOYSA-N benzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1C(O)=O GCAIEATUVJFSMC-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- WDECIBYCCFPHNR-UHFFFAOYSA-N chrysene Chemical compound C1=CC=CC2=CC=C3C4=CC=CC=C4C=CC3=C21 WDECIBYCCFPHNR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000002170 ethers Chemical group 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- KJIFKLIQANRMOU-UHFFFAOYSA-N oxidanium;4-methylbenzenesulfonate Chemical compound O.CC1=CC=C(S(O)(=O)=O)C=C1 KJIFKLIQANRMOU-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- JRDBISOHUUQXHE-UHFFFAOYSA-N pyridine-2,3,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)N=C1C(O)=O JRDBISOHUUQXHE-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- FADNCTVVKDWKIX-UHFFFAOYSA-N (2,4-diaminophenyl)methanol Chemical compound NC1=CC=C(CO)C(N)=C1 FADNCTVVKDWKIX-UHFFFAOYSA-N 0.000 description 1
- CNQULYDFCRJTKV-UHFFFAOYSA-N (2,5-dioxopyrrol-1-yl) acetate Chemical compound CC(=O)ON1C(=O)C=CC1=O CNQULYDFCRJTKV-UHFFFAOYSA-N 0.000 description 1
- ZAMZCSIXTWIEDY-UHFFFAOYSA-N (2-propylphenyl)methanol Chemical compound CCCC1=CC=CC=C1CO ZAMZCSIXTWIEDY-UHFFFAOYSA-N 0.000 description 1
- RXCOGDYOZQGGMK-UHFFFAOYSA-N (3,4-diaminophenyl)-phenylmethanone Chemical compound C1=C(N)C(N)=CC=C1C(=O)C1=CC=CC=C1 RXCOGDYOZQGGMK-UHFFFAOYSA-N 0.000 description 1
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- KYPOHTVBFVELTG-UPHRSURJSA-N (z)-but-2-enedinitrile Chemical compound N#C\C=C/C#N KYPOHTVBFVELTG-UPHRSURJSA-N 0.000 description 1
- OPCJOXGBLDJWRM-UHFFFAOYSA-N 1,2-diamino-2-methylpropane Chemical compound CC(C)(N)CN OPCJOXGBLDJWRM-UHFFFAOYSA-N 0.000 description 1
- LRMDXTVKVHKWEK-UHFFFAOYSA-N 1,2-diaminoanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=C(N)C(N)=CC=C3C(=O)C2=C1 LRMDXTVKVHKWEK-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- UCBVELLBUAKUNE-UHFFFAOYSA-N 1,3-bis(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical group C=CCN1C(=O)NC(=O)N(CC=C)C1=O UCBVELLBUAKUNE-UHFFFAOYSA-N 0.000 description 1
- FBMQNRKSAWNXBT-UHFFFAOYSA-N 1,4-diaminoanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C(N)=CC=C2N FBMQNRKSAWNXBT-UHFFFAOYSA-N 0.000 description 1
- VWBVCOPVKXNMMZ-UHFFFAOYSA-N 1,5-diaminoanthracene-9,10-dione Chemical compound O=C1C2=C(N)C=CC=C2C(=O)C2=C1C=CC=C2N VWBVCOPVKXNMMZ-UHFFFAOYSA-N 0.000 description 1
- YFOOEYJGMMJJLS-UHFFFAOYSA-N 1,8-diaminonaphthalene Chemical compound C1=CC(N)=C2C(N)=CC=CC2=C1 YFOOEYJGMMJJLS-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- OQWWMUWGSBRNMA-UHFFFAOYSA-N 1-(2,4-diaminophenoxy)ethanol Chemical compound CC(O)OC1=CC=C(N)C=C1N OQWWMUWGSBRNMA-UHFFFAOYSA-N 0.000 description 1
- KPQGBJGTWFBKMW-UHFFFAOYSA-N 1-(3,5-diaminophenoxy)ethanol Chemical compound NC=1C=C(OC(C)O)C=C(C1)N KPQGBJGTWFBKMW-UHFFFAOYSA-N 0.000 description 1
- WCZNKVPCIFMXEQ-UHFFFAOYSA-N 2,3,5,6-tetramethylbenzene-1,4-diamine Chemical compound CC1=C(C)C(N)=C(C)C(C)=C1N WCZNKVPCIFMXEQ-UHFFFAOYSA-N 0.000 description 1
- PCAXITAPTVOLGL-UHFFFAOYSA-N 2,3-diaminophenol Chemical compound NC1=CC=CC(O)=C1N PCAXITAPTVOLGL-UHFFFAOYSA-N 0.000 description 1
- 229940113489 2,4-diaminophenoxyethanol Drugs 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- 229940075142 2,5-diaminotoluene Drugs 0.000 description 1
- QAYVHDDEMLNVMO-UHFFFAOYSA-N 2,5-dichlorobenzene-1,4-diamine Chemical compound NC1=CC(Cl)=C(N)C=C1Cl QAYVHDDEMLNVMO-UHFFFAOYSA-N 0.000 description 1
- BWAPJIHJXDYDPW-UHFFFAOYSA-N 2,5-dimethyl-p-phenylenediamine Chemical compound CC1=CC(N)=C(C)C=C1N BWAPJIHJXDYDPW-UHFFFAOYSA-N 0.000 description 1
- WQOWBWVMZPPPGX-UHFFFAOYSA-N 2,6-diaminoanthracene-9,10-dione Chemical compound NC1=CC=C2C(=O)C3=CC(N)=CC=C3C(=O)C2=C1 WQOWBWVMZPPPGX-UHFFFAOYSA-N 0.000 description 1
- RLYCRLGLCUXUPO-UHFFFAOYSA-N 2,6-diaminotoluene Chemical compound CC1=C(N)C=CC=C1N RLYCRLGLCUXUPO-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- PMAPIPPKZXGDFA-UHFFFAOYSA-N 2-[(2-carboxyanilino)methylamino]benzoic acid Chemical compound OC(=O)C1=CC=CC=C1NCNC1=CC=CC=C1C(O)=O PMAPIPPKZXGDFA-UHFFFAOYSA-N 0.000 description 1
- WCAWJGACRZDACF-UHFFFAOYSA-N 2-[1-(2-amino-3-chlorophenyl)ethyl]-6-chloroaniline Chemical compound C=1C=CC(Cl)=C(N)C=1C(C)C1=CC=CC(Cl)=C1N WCAWJGACRZDACF-UHFFFAOYSA-N 0.000 description 1
- HQTGKBNXVCVDOY-UHFFFAOYSA-N 2-[[10-(oxiran-2-ylmethoxy)anthracen-9-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C1=CC=CC=C11)=C2C=CC=CC2=C1OCC1CO1 HQTGKBNXVCVDOY-UHFFFAOYSA-N 0.000 description 1
- MSTZGVRUOMBULC-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C=C(N)C(O)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MSTZGVRUOMBULC-UHFFFAOYSA-N 0.000 description 1
- ZGDMDBHLKNQPSD-UHFFFAOYSA-N 2-amino-5-(4-amino-3-hydroxyphenyl)phenol Chemical group C1=C(O)C(N)=CC=C1C1=CC=C(N)C(O)=C1 ZGDMDBHLKNQPSD-UHFFFAOYSA-N 0.000 description 1
- MGLZGLAFFOMWPB-UHFFFAOYSA-N 2-chloro-1,4-phenylenediamine Chemical compound NC1=CC=C(N)C(Cl)=C1 MGLZGLAFFOMWPB-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- YRNDGUSDBCARGC-UHFFFAOYSA-N 2-methoxyacetophenone Chemical compound COCC(=O)C1=CC=CC=C1 YRNDGUSDBCARGC-UHFFFAOYSA-N 0.000 description 1
- OBCSAIDCZQSFQH-UHFFFAOYSA-N 2-methyl-1,4-phenylenediamine Chemical compound CC1=CC(N)=CC=C1N OBCSAIDCZQSFQH-UHFFFAOYSA-N 0.000 description 1
- UAIUNKRWKOVEES-UHFFFAOYSA-N 3,3',5,5'-tetramethylbenzidine Chemical compound CC1=C(N)C(C)=CC(C=2C=C(C)C(N)=C(C)C=2)=C1 UAIUNKRWKOVEES-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical group C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- WFNVGXBEWXBZPL-UHFFFAOYSA-N 3,5-diaminophenol Chemical compound NC1=CC(N)=CC(O)=C1 WFNVGXBEWXBZPL-UHFFFAOYSA-N 0.000 description 1
- NBAUUNCGSMAPFM-UHFFFAOYSA-N 3-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=CC(C(O)=O)=C1C(O)=O NBAUUNCGSMAPFM-UHFFFAOYSA-N 0.000 description 1
- NJCOLSAFYMXOGO-UHFFFAOYSA-N 3-(trifluoromethyl)benzene-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C(C(F)(F)F)=C1C(O)=O NJCOLSAFYMXOGO-UHFFFAOYSA-N 0.000 description 1
- TYKLCAKICHXQNE-UHFFFAOYSA-N 3-[(2,3-dicarboxyphenyl)methyl]phthalic acid Chemical compound OC(=O)C1=CC=CC(CC=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O TYKLCAKICHXQNE-UHFFFAOYSA-N 0.000 description 1
- UCFMKTNJZCYBBJ-UHFFFAOYSA-N 3-[1-(2,3-dicarboxyphenyl)ethyl]phthalic acid Chemical compound C=1C=CC(C(O)=O)=C(C(O)=O)C=1C(C)C1=CC=CC(C(O)=O)=C1C(O)=O UCFMKTNJZCYBBJ-UHFFFAOYSA-N 0.000 description 1
- PAHZZOIHRHCHTH-UHFFFAOYSA-N 3-[2-(2,3-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=CC(C(O)=O)=C(C(O)=O)C=1C(C)(C)C1=CC=CC(C(O)=O)=C1C(O)=O PAHZZOIHRHCHTH-UHFFFAOYSA-N 0.000 description 1
- AXNUJYHFQHQZBE-UHFFFAOYSA-N 3-methylbenzene-1,2-diamine Chemical compound CC1=CC=CC(N)=C1N AXNUJYHFQHQZBE-UHFFFAOYSA-N 0.000 description 1
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical class C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 1
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
- KUMOYHHELWKOCB-UHFFFAOYSA-N 4,6-diaminobenzene-1,3-diol;dihydrochloride Chemical compound Cl.Cl.NC1=CC(N)=C(O)C=C1O KUMOYHHELWKOCB-UHFFFAOYSA-N 0.000 description 1
- KOGSPLLRMRSADR-UHFFFAOYSA-N 4-(2-aminopropan-2-yl)-1-methylcyclohexan-1-amine Chemical compound CC(C)(N)C1CCC(C)(N)CC1 KOGSPLLRMRSADR-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- AIVVXPSKEVWKMY-UHFFFAOYSA-N 4-(3,4-dicarboxyphenoxy)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 AIVVXPSKEVWKMY-UHFFFAOYSA-N 0.000 description 1
- FWOLORXQTIGHFX-UHFFFAOYSA-N 4-(4-amino-2,3,5,6-tetrafluorophenyl)-2,3,5,6-tetrafluoroaniline Chemical group FC1=C(F)C(N)=C(F)C(F)=C1C1=C(F)C(F)=C(N)C(F)=C1F FWOLORXQTIGHFX-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- ZWUBBMDHSZDNTA-UHFFFAOYSA-N 4-Chloro-meta-phenylenediamine Chemical compound NC1=CC=C(Cl)C(N)=C1 ZWUBBMDHSZDNTA-UHFFFAOYSA-N 0.000 description 1
- IWXCYYWDGDDPAC-UHFFFAOYSA-N 4-[(3,4-dicarboxyphenyl)methyl]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C(C(O)=O)=C1 IWXCYYWDGDDPAC-UHFFFAOYSA-N 0.000 description 1
- NWIVYGKSHSJHEF-UHFFFAOYSA-N 4-[(4-amino-3,5-diethylphenyl)methyl]-2,6-diethylaniline Chemical compound CCC1=C(N)C(CC)=CC(CC=2C=C(CC)C(N)=C(CC)C=2)=C1 NWIVYGKSHSJHEF-UHFFFAOYSA-N 0.000 description 1
- OMHOXRVODFQGCA-UHFFFAOYSA-N 4-[(4-amino-3,5-dimethylphenyl)methyl]-2,6-dimethylaniline Chemical compound CC1=C(N)C(C)=CC(CC=2C=C(C)C(N)=C(C)C=2)=C1 OMHOXRVODFQGCA-UHFFFAOYSA-N 0.000 description 1
- CBEVWPCAHIAUOD-UHFFFAOYSA-N 4-[(4-amino-3-ethylphenyl)methyl]-2-ethylaniline Chemical compound C1=C(N)C(CC)=CC(CC=2C=C(CC)C(N)=CC=2)=C1 CBEVWPCAHIAUOD-UHFFFAOYSA-N 0.000 description 1
- IGSBHTZEJMPDSZ-UHFFFAOYSA-N 4-[(4-amino-3-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical compound C1CC(N)C(C)CC1CC1CC(C)C(N)CC1 IGSBHTZEJMPDSZ-UHFFFAOYSA-N 0.000 description 1
- IJJNNSUCZDJDLP-UHFFFAOYSA-N 4-[1-(3,4-dicarboxyphenyl)ethyl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 IJJNNSUCZDJDLP-UHFFFAOYSA-N 0.000 description 1
- GEYAGBVEAJGCFB-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 GEYAGBVEAJGCFB-UHFFFAOYSA-N 0.000 description 1
- BEKFRNOZJSYWKZ-UHFFFAOYSA-N 4-[2-(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]aniline Chemical compound C1=CC(N)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(N)C=C1 BEKFRNOZJSYWKZ-UHFFFAOYSA-N 0.000 description 1
- KWOIWTRRPFHBSI-UHFFFAOYSA-N 4-[2-[3-[2-(4-aminophenyl)propan-2-yl]phenyl]propan-2-yl]aniline Chemical compound C=1C=CC(C(C)(C)C=2C=CC(N)=CC=2)=CC=1C(C)(C)C1=CC=C(N)C=C1 KWOIWTRRPFHBSI-UHFFFAOYSA-N 0.000 description 1
- HESXPOICBNWMPI-UHFFFAOYSA-N 4-[2-[4-[2-(4-aminophenyl)propan-2-yl]phenyl]propan-2-yl]aniline Chemical compound C=1C=C(C(C)(C)C=2C=CC(N)=CC=2)C=CC=1C(C)(C)C1=CC=C(N)C=C1 HESXPOICBNWMPI-UHFFFAOYSA-N 0.000 description 1
- HPUJEBAZZTZOFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)-2,2-dimethylpropoxy]aniline Chemical compound C=1C=C(N)C=CC=1OCC(C)(C)COC1=CC=C(N)C=C1 HPUJEBAZZTZOFL-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- KWFFEQXPFFDJER-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)propoxy]aniline Chemical compound C1=CC(N)=CC=C1OCCCOC1=CC=C(N)C=C1 KWFFEQXPFFDJER-UHFFFAOYSA-N 0.000 description 1
- LAFZPVANKKJENB-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)butoxy]aniline Chemical compound C1=CC(N)=CC=C1OCCCCOC1=CC=C(N)C=C1 LAFZPVANKKJENB-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- MRTAEHMRKDVKMS-UHFFFAOYSA-N 4-[4-[4-(3,4-dicarboxyphenoxy)phenyl]sulfanylphenoxy]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1OC(C=C1)=CC=C1SC(C=C1)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 MRTAEHMRKDVKMS-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 1
- DGRGLKZMKWPMOH-UHFFFAOYSA-N 4-methylbenzene-1,2-diamine Chemical compound CC1=CC=C(N)C(N)=C1 DGRGLKZMKWPMOH-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- YKBKKHIVVTUNAN-UHFFFAOYSA-N C(C(C)(C)C)(=O)O.C(CCCCC)OOCCCCCC Chemical compound C(C(C)(C)C)(=O)O.C(CCCCC)OOCCCCCC YKBKKHIVVTUNAN-UHFFFAOYSA-N 0.000 description 1
- XGBCQJBLBIYQGF-UHFFFAOYSA-N C(C=C/C(=O)O)(=O)O.C(CCCCC)(=O)O Chemical compound C(C=C/C(=O)O)(=O)O.C(CCCCC)(=O)O XGBCQJBLBIYQGF-UHFFFAOYSA-N 0.000 description 1
- FQPBKVPAVRJCTO-UHFFFAOYSA-N COC(C(N)=C1)=CC(C=CC2=C3)=C1C2=CC=C3N Chemical compound COC(C(N)=C1)=CC(C=CC2=C3)=C1C2=CC=C3N FQPBKVPAVRJCTO-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- TWPSZSKBRLQBQJ-UHFFFAOYSA-N NC1=CC=CC(OC2=CC=C(C(C3)(C=CC4=C3C=CC3=C(C=CC=C5)C5=CC=C43)C(C=C3)=CC=C3OC3=CC(N)=CC=C3)C=C2)=C1 Chemical compound NC1=CC=CC(OC2=CC=C(C(C3)(C=CC4=C3C=CC3=C(C=CC=C5)C5=CC=C43)C(C=C3)=CC=C3OC3=CC(N)=CC=C3)C=C2)=C1 TWPSZSKBRLQBQJ-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000005700 Putrescine Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- UGACIEPFGXRWCH-UHFFFAOYSA-N [Si].[Ti] Chemical compound [Si].[Ti] UGACIEPFGXRWCH-UHFFFAOYSA-N 0.000 description 1
- 125000002015 acyclic group Chemical group 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- HXBPYFMVGFDZFT-UHFFFAOYSA-N allyl isocyanate Chemical group C=CCN=C=O HXBPYFMVGFDZFT-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- XIWMTQIUUWJNRP-UHFFFAOYSA-N amidol Chemical compound NC1=CC=C(O)C(N)=C1 XIWMTQIUUWJNRP-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 150000001540 azides Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- JQRRFDWXQOQICD-UHFFFAOYSA-N biphenylen-1-ylboronic acid Chemical compound C12=CC=CC=C2C2=C1C=CC=C2B(O)O JQRRFDWXQOQICD-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- MRUCFNWPEGEZSP-UHFFFAOYSA-N butanoic acid;pyrrole-2,5-dione Chemical compound CCCC(O)=O.O=C1NC(=O)C=C1 MRUCFNWPEGEZSP-UHFFFAOYSA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- SSJXIUAHEKJCMH-UHFFFAOYSA-N cyclohexane-1,2-diamine Chemical compound NC1CCCCC1N SSJXIUAHEKJCMH-UHFFFAOYSA-N 0.000 description 1
- NZNMSOFKMUBTKW-UHFFFAOYSA-N cyclohexanecarboxylic acid Chemical compound OC(=O)C1CCCCC1 NZNMSOFKMUBTKW-UHFFFAOYSA-N 0.000 description 1
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- RAABOESOVLLHRU-UHFFFAOYSA-N diazene Chemical compound N=N RAABOESOVLLHRU-UHFFFAOYSA-N 0.000 description 1
- 229910000071 diazene Inorganic materials 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- FDPIMTJIUBPUKL-UHFFFAOYSA-N dimethylacetone Natural products CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- IWBOPFCKHIJFMS-UHFFFAOYSA-N ethylene glycol bis(2-aminoethyl) ether Chemical compound NCCOCCOCCN IWBOPFCKHIJFMS-UHFFFAOYSA-N 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- CTRFEEQNDJFNNL-UHFFFAOYSA-N hexanoic acid;pyrrole-2,5-dione Chemical compound O=C1NC(=O)C=C1.CCCCCC(O)=O CTRFEEQNDJFNNL-UHFFFAOYSA-N 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- KMBPCQSCMCEPMU-UHFFFAOYSA-N n'-(3-aminopropyl)-n'-methylpropane-1,3-diamine Chemical compound NCCCN(C)CCCN KMBPCQSCMCEPMU-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- KADGVXXDDWDKBX-UHFFFAOYSA-N naphthalene-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C21 KADGVXXDDWDKBX-UHFFFAOYSA-N 0.000 description 1
- OBKARQMATMRWQZ-UHFFFAOYSA-N naphthalene-1,2,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 OBKARQMATMRWQZ-UHFFFAOYSA-N 0.000 description 1
- OLAPPGSPBNVTRF-UHFFFAOYSA-N naphthalene-1,4,5,8-tetracarboxylic acid Chemical compound C1=CC(C(O)=O)=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1C(O)=O OLAPPGSPBNVTRF-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
- XTBLDMQMUSHDEN-UHFFFAOYSA-N naphthalene-2,3-diamine Chemical compound C1=CC=C2C=C(N)C(N)=CC2=C1 XTBLDMQMUSHDEN-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- YJVFFLUZDVXJQI-UHFFFAOYSA-L palladium(ii) acetate Chemical compound [Pd+2].CC([O-])=O.CC([O-])=O YJVFFLUZDVXJQI-UHFFFAOYSA-L 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- WTSXICLFTPPDTL-UHFFFAOYSA-N pentane-1,3-diamine Chemical compound CCC(N)CCN WTSXICLFTPPDTL-UHFFFAOYSA-N 0.000 description 1
- FVDOBFPYBSDRKH-UHFFFAOYSA-N perylene-3,4,9,10-tetracarboxylic acid Chemical compound C=12C3=CC=C(C(O)=O)C2=C(C(O)=O)C=CC=1C1=CC=C(C(O)=O)C2=C1C3=CC=C2C(=O)O FVDOBFPYBSDRKH-UHFFFAOYSA-N 0.000 description 1
- JGGWKXMPICYBKC-UHFFFAOYSA-N phenanthrene-1,8,9,10-tetracarboxylic acid Chemical compound C1=CC=C(C(O)=O)C2=C(C(O)=O)C(C(O)=O)=C3C(C(=O)O)=CC=CC3=C21 JGGWKXMPICYBKC-UHFFFAOYSA-N 0.000 description 1
- VPRFQZSTJXHBHL-UHFFFAOYSA-N phenanthrene-9,10-diamine Chemical compound C1=CC=C2C(N)=C(N)C3=CC=CC=C3C2=C1 VPRFQZSTJXHBHL-UHFFFAOYSA-N 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- QGOKIEUFWNCGFO-UHFFFAOYSA-N propanoic acid;pyrrole-2,5-dione Chemical compound CCC(O)=O.O=C1NC(=O)C=C1 QGOKIEUFWNCGFO-UHFFFAOYSA-N 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000002296 pyrolytic carbon Substances 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- LPSXSORODABQKT-UHFFFAOYSA-N tetrahydrodicyclopentadiene Chemical compound C1C2CCC1C1C2CCC1 LPSXSORODABQKT-UHFFFAOYSA-N 0.000 description 1
- LUEGQDUCMILDOJ-UHFFFAOYSA-N thiophene-2,3,4,5-tetracarboxylic acid Chemical compound OC(=O)C=1SC(C(O)=O)=C(C(O)=O)C=1C(O)=O LUEGQDUCMILDOJ-UHFFFAOYSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000001132 ultrasonic dispersion Methods 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
- C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/121—Preparatory processes from unsaturated precursors and polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/125—Unsaturated polyimide precursors the unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen in the main chain
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C09J179/085—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
本發明之目的在於提供一種於固定被黏著體之狀態即便經過300℃以上之高溫加工處理之後,亦可藉由照射光而容易地剝離之黏著劑組成物、具有由該黏著劑組成物構成之黏著劑層之黏著帶及電子零件之處理方法。本發明係一種黏著劑組成物,其含有:主鏈具有聚醯亞胺骨架且側鏈或末端具有下述官能基的反應性樹脂、及聚矽氧化合物或氟化合物,該官能基具有雙鍵。
Description
本發明係關於一種黏著劑組成物、黏著帶及電子零件之處理方法。
於加工半導體等電子零件時,為了使電子零件之處理容易,或不破損,而經由黏著劑組成物將電子零件固定於支持板,或將黏著帶貼附於電子零件而進行保護。例如,於將自高純度之矽單晶等切下之厚膜晶圓研削至特定之厚度而製成薄膜晶圓之情形時,經由黏著劑組成物使厚膜晶圓接著於支持板。
對於此種電子零件中使用之黏著劑組成物或黏著帶,要求於加工步驟中儘可能地將電子零件緊固地固定之高接著性,並且步驟結束後可不損傷電子零件地剝離(以下亦稱為「高接著易剝離」)。
作為高接著易剝離之實現手段,例如專利文獻1中揭示有一種使用鍵結有多官能性單體或低聚物之黏著劑的黏著片,該多官能性單體或低聚物係聚合物之側鏈或主鏈具有輻射聚合性官能基者。藉由具有輻射聚合性官能基,使得聚合物會經紫外線照射而硬化,藉由利用該點於剝離時照射紫外線,使得黏著力降低,可無糊劑殘留地剝離。
先前技術文獻
專利文獻
專利文獻1:日本特開平5-32946號公報
[發明所欲解決之課題]
隨著近年來之電子零件之高性能化,逐漸進行對電子零件實施各種加工之步驟。例如於藉由濺鍍而於電子零件之表面形成金屬薄膜之步驟中,藉由於300〜350℃左右之高溫進行加工,可形成導電性更優異之金屬薄膜。然而,若對使用習知之黏著劑組成物或黏著帶加以保護之電子零件進行300℃以上之高溫加工處理,則存在引起接著亢進,使得剝離時黏著力未充分降低或產生糊劑殘留之情況。
鑒於上述現狀,本發明之目的在於提供一種於固定被黏著體之狀態即便經過300℃以上之高溫加工處理後,亦可藉由照射光而容易地剝離之黏著劑組成物、具有由該黏著劑組成物構成之黏著劑層的黏著帶及電子零件之處理方法。
[解決課題之技術手段]
本發明係一種黏著劑組成物,其含有:主鏈具有醯亞胺骨架且側鏈或末端具有下述官能基的反應性樹脂、及聚矽氧化合物或氟化合物,該官能基具有雙鍵。
以下詳細敘述本發明。
本發明之一實施態樣之黏著劑組成物含有:主鏈具有醯亞胺骨架且側鏈或末端具有下述官能基的反應性樹脂(以下亦簡稱為「反應性樹脂」),該官能基具有雙鍵。
上述反應性樹脂藉由主鏈具有醯亞胺骨架,而耐熱性極優異,即便經過300℃以上之高溫加工處理後亦不易引起主鏈之分解,可防止引起接著亢進,或可防止剝離時產生糊劑殘留。又,藉由上述反應性樹脂於側鏈或末端具有具備雙鍵之官能基,利用光之照射使得黏著劑組成物整體均勻且快速地聚合交聯,彈性模數上升,從而使得黏著力大為降低,可容易地剝離。
作為上述反應性樹脂之存在於側鏈或末端之具有雙鍵之官能基,例如可列舉:可被取代之馬來亞醯胺基、檸康醯亞胺基(citraconimide)、乙烯醚基、烯丙基、(甲基)丙烯醯基等。其中,就獲得更高的耐熱性之方面而言,較佳為可被取代之馬來亞醯胺基。
上述反應性樹脂較佳為具有雙鍵之官能基當量(重量平均分子量/具有雙鍵之官能基之個數)為4000以下。藉由上述官能基當量為4000以下,而黏著劑組成物可發揮更高的耐熱性。認為其原因在於,藉由反應性樹脂之分子中以一定以上之密度具有具備雙鍵之官能基,而使得交聯間距離變短,從而可進一步抑制由加熱導致之接著亢進。上述官能基當量更佳為3000以下,進而較佳為2000以下。上述官能基當量之下限並無特別限制,但實質上600左右為下限。
上述反應性樹脂較佳為重量平均分子量為5000以上。藉由上述反應性樹脂之重量平均分子量為5000以上,變得易成膜,並且獲得之膜發揮一定程度之柔軟性,故對具有凹凸之被黏著體可發揮高追隨性,可容易地自被黏著體剝離。上述反應性樹脂之重量平均分子量更佳為10000以上,進而較佳為20000以上。上述反應性樹脂之重量平均分子量之上限並無特別限定,但由於對溶劑之溶解度會變低,故例如為300000,尤其是100000。再者,上述反應性樹脂之重量平均分子量係利用凝膠滲透層析(GPC)法測定為聚苯乙烯換算分子量。作為管柱,例如可使用HR-MB-M(產品名、Waters公司製造)等。
上述具有雙鍵之官能基可位於上述反應性樹脂之側鏈或末端任一處。上述具有雙鍵之官能基較佳為存在於上述反應性樹脂之兩末端,更佳為除兩末端以外進而亦存在於側鏈。上述反應性樹脂之兩末端中之具有雙鍵之官能基其反應性高,可藉由光之照射而使黏著劑組成物更充分地硬化。其結果為,可進一步抑制接著亢進,黏著劑組成物可發揮更高的耐熱性。
進而,藉由上述反應性樹脂之側鏈存在具有雙鍵之官能基,黏著劑組成物可發揮更高的耐熱性。認為其原因在於,由於交聯間距離變短,故而可進一步抑制由加熱導致之接著亢進。又,藉由上述反應性樹脂之側鏈存在具有雙鍵之官能基,容易將重量平均分子量調整為5000以上,並將上述官能基當量調整為4000以下。藉此,黏著劑組成物具有充分之初始黏著力,並且耐熱性優異,即使進行300℃以上之高溫加工處理,接著亢進亦少,可藉由照射光而更容易地剝離。
作為上述反應性樹脂,具體而言,例如可列舉具有下述通式(1a)所表示之結構單元、下述通式(1b)所表示之結構單元及下述通式(1c)所表示之結構單元(其中s≧1、t≧0、u≧0),且兩末端分別由X1
及X2
所表示之反應性樹脂(1)。
上述通式(1a)〜(1c)中,P1
、P2
及P3
分別獨立地表示芳香族基,Q1
表示經取代或未經取代之直鏈狀、支鏈狀或環狀之脂肪族基,Q2
表示經取代或未經取代之具有芳香族結構之基,R表示經取代或未經取代之支鏈狀之脂肪族基或芳香族基。選自由X1
、X2
及X3
所組成之群中之至少1個表示具有雙鍵之官能基。
上述通式(1a)〜(1c)中,P1
、P2
、P3
較佳為碳數5〜50之芳香族基。藉由P1
、P2
、P3
為碳數5〜50之芳香族基,本發明之一實施態樣之黏著劑組成物可發揮尤其高的耐熱性。
上述通式(1a)中,Q1
較佳為經取代或未經取代之直鏈狀、支鏈狀或環狀之碳數2〜100之脂肪族基。藉由Q1
為經取代或未經取代之直鏈狀、支鏈狀或環狀之碳數2〜100之脂肪族基,使用本發明之一實施態樣之黏著劑組成物製造之黏著帶可發揮高柔軟性,對具有凹凸之被黏著體可發揮高追隨性,並且剝離性亦提昇。
又,Q1
較佳為後文中敍述之來自二胺化合物之脂肪族基。其中,就提高柔軟性之觀點及上述反應性樹脂(1)之與溶劑或其他成分之相容性提高並且容易製造黏著帶之觀點而言,Q1
較佳為來自二聚二胺之脂肪族基。
上述來自二聚二胺之脂肪族基並無特別限制,較佳為選自由下述通式(4-1)所表示之基、下述通式(4-2)所表示之基、下述通式(4-3)所表示之基及下述通式(4-4)所表示之基所表示之基所組成之群中之至少1個。其中,更佳為下述通式(4-2)所表示之基。
上述通式(4-1)〜(4-4)中,R1
〜R8
及R13
〜R20
分別獨立地表示直鏈狀或支鏈狀之烴基。再者,*表示鍵結鍵。即,*與上述通式(1a)〜(1c)中之N鍵結。
上述通式(4-1)〜(4-4)中,R1
〜R8
及R13
〜R20
所表示之烴基並無特別限制,可為飽和烴基,亦可為不飽和烴基。其中,較佳為R1
與R2
、R3
與R4
、R5
與R6
、R7
與R8
、R13
與R14
、R15
與R16
、R17
與R18
及R19
與R20
之碳數之合計為7以上且50以下。藉由上述碳數之合計為上述範圍內,使用本發明之一實施態樣之黏著劑組成物所製造之黏著帶可發揮更高的柔軟性,又,上述反應性樹脂(1)之與溶劑或其他成分之相容性亦進一步提高。上述碳數之合計更佳為9以上,進而較佳為12以上,進而更佳為14以上。上述碳數之合計更佳為35以下,進而較佳為25以下,進而更佳為18以下。
關於上述通式(4-1)所表示之基、上述通式(4-2)所表示之基、上述通式(4-3)所表示之基及上述通式(4-4)所表示之基,光學異構性並無特別限制,包含任一光學異構性。
上述通式(1b)中,Q2
較佳為經取代或未經取代之碳數5〜50之具有芳香族結構之基。藉由Q2
為經取代或未經取代之碳數5〜50之具有芳香族結構之基,本發明之一實施態樣之黏著劑組成物可發揮尤其高的耐熱性。
上述通式(1c)中,R較佳為經取代或未經取代之支鏈狀之碳數2〜100之脂肪族基或芳香族基。藉由R為經取代或未經取代之支鏈狀之碳數2〜100之脂肪族基或芳香族基,使用本發明之一實施態樣之黏著劑組成物所製造之黏著帶可發揮高柔軟性,對具有凹凸之被黏著體可發揮高追隨性,並且剝離性亦提昇。
上述通式(1c)中,R為具有芳香族酯基或芳香族醚基之芳香族基,R中之該芳香族酯基或該芳香族醚基較佳為與X3
鍵結。
此處,「芳香族酯基」意指酯基直接鍵結於芳香族環上之基,「芳香族醚基」意指醚基直接鍵結於芳香族環上之基。藉由以此方式將與酯基或醚基鍵結之部分設為芳香族基,而使黏著劑組成物可發揮高耐熱性。另一方面,X3
經由芳香族酯基或芳香族醚基而鍵結於R,藉此X3
中之雙鍵不會與R共軛,故不會妨礙照射光時之聚合交聯。
上述反應性樹脂(1)中,具有雙鍵之官能基(交聯性不飽和鍵)只要為選自由X1
、X2
及X3
所組成之群中之至少1個即可,但較佳為至少X3
為具有雙鍵之官能基。藉由至少X3
為具有雙鍵之官能基,而使黏著劑組成物可發揮更高的耐熱性。
於上述X1
、X2
及X3
之任一者為具有雙鍵之官能基以外之官能基(不具有雙鍵之官能基)時,作為該不具有雙鍵之官能基,分別獨立,例如可列舉:脂肪族基、脂環式基、芳香族基、酸酐、胺化合物等。具體而言,可列舉:成為上述反應性樹脂(1)之原料的酸酐、二胺化合物之單末端未反應物。
上述反應性樹脂(1)中,作為具有雙鍵之官能基,例如可列舉:可被取代之馬來亞醯胺基、檸康醯亞胺基、乙烯醚基、烯丙基、(甲基)丙烯醯基等。其中,就獲得更高的耐熱性之方面而言,較佳為可被取代之馬來亞醯胺基或烯丙基,就獲得尤其高的接著性之方面而言,更佳為具有1個以上烯丙基之三(異)氰酸酯基。
上述通式(1a)〜(1c)中,s為1以上,較佳為3以上,較佳為10以下,更佳為5以下。上述通式(1a)〜(1c)中,t為0以上,較佳為1以上,更佳為3以上,較佳為10以下,更佳為5以下。上述通式(1a)〜(1c)中,u為0以上,較佳為1以上,更佳為3以上,較佳為10以下,更佳為5以下。於上述通式(1a)〜(1c)中,若s、t及u為上述範圍內,則可藉由硬化而容易地剝離。
再者,上述反應性樹脂(1)中,上述通式(1a)所表示之結構單元、上述通式(1b)所表示之結構單元及上述通式(1c)所表示之結構單元可為由各結構單元連續排列而成之嵌段成分所構成之嵌段共聚物,亦可為各結構單元無規排列而成之無規共聚物。
上述反應性樹脂例如可藉由使二胺化合物與芳香族酸酐反應而製備醯亞胺化合物,進而使該醯亞胺化合物之官能基與具有可與該官能基反應之官能基及具有雙鍵之官能基的化合物(以下亦稱為含官能基之不飽和化合物)反應而獲得。
作為上述二胺化合物,可使用脂肪族二胺化合物或芳香族二胺化合物之任一者。
藉由使用脂肪族二胺化合物作為上述二胺化合物,使用本發明之一實施態樣之黏著劑組成物製造之黏著帶可發揮高柔軟性,對具有凹凸之被黏著體可發揮高追隨性,並且剝離性亦提昇。
藉由使用芳香族二胺化合物作為上述二胺化合物,本發明之一實施態樣之黏著劑組成物之耐熱性進一步提昇。
又,藉由使用具有官能基之二胺化合物作為上述二胺化合物,並使該官能基與上述含官能基之不飽和化合物反應,可製造側鏈具有下述官能基的反應性樹脂,該官能基具有雙鍵。
該等脂肪族二胺化合物、芳香族二胺化合物及具有官能基之二胺化合物可單獨使用,亦可併用2種以上。
作為上述脂肪族二胺化合物,例如可列舉:1,10-二胺基癸烷、1,12-二胺基十二烷、二聚二胺、1,2-二胺基-2-甲基丙烷、1,2-二胺基環己烷、1,2-二胺基丙烷、1,3-二胺基丙烷、1,4-二胺基丁烷、1,5-二胺基戊烷、1,7-二胺基庚烷、1,8-二胺基薄荷烷、1,8-二胺基辛烷、1,9-二胺基壬烷、3,3'-二胺基-N-甲基二丙基胺、二胺順丁烯二腈、1,3-二胺基戊烷、雙(4-胺基-3-甲基環己基)甲烷、1,2-雙(2-胺基乙氧基)乙烷、3(4),8(9)-雙(胺基甲基)三環(5.2.1.02,6)癸烷等。
作為上述芳香族二胺化合物,例如可列舉:9,10-二胺基菲、4,4'-二胺基八氟聯苯、3,7-二胺基-2-甲氧基茀、4,4'-二胺基二苯甲酮、3,4-二胺基二苯甲酮、3,4-二胺基甲苯、2,6-二胺基蒽醌、2,6-二胺基甲苯、2,3-二胺基甲苯、1,8-二胺基萘、2,4-二胺基甲苯、2,5-二胺基甲苯、1,4-二胺基蒽醌、1,5-二胺基蒽醌、1,5-二胺基萘、1,2-二胺基蒽醌、2,4-異丙苯二胺、1,3-雙胺基甲基苯、1,3-雙胺基甲基環己烷、2-氯-1,4-二胺基苯、1,4-二胺基-2,5-二氯苯、1,4-二胺基-2,5-二甲基苯、4,4'-二胺基-2,2'-雙三氟甲基聯苯、雙(胺基-3-氯苯基)乙烷、雙(4-胺基-3,5-二甲基苯基)甲烷、雙(4-胺基-3,5-二乙基苯基)甲烷、雙(4-胺基-3-乙基二胺基茀、2,3-二胺基萘、2,3-二胺基酚、-5-甲基苯基)甲烷、雙(4-胺基-3-甲基苯基)甲烷、雙(4-胺基-3-乙基苯基)甲烷、4,4'-二胺基苯基碸、3,3'-二胺基苯基碸、2,2-雙(4,(4胺基苯氧基)苯基)碸、2,2-雙(4-(3-胺基苯氧基)苯基)碸、4,4'-氧基二苯胺、4,4'-二胺基二苯基硫化物、3,4'-氧基二苯胺、2,2-雙(4-(4-胺基苯氧基)苯基)丙烷、1,3-雙(4-胺基苯氧基)苯、4,4'-雙(4-胺基苯氧基)聯苯、4,4'-二胺基-3,3'-二羥基聯苯、4,4'-二胺基-3,3'-二甲基聯苯、4,4'-二胺基-3,3'-二甲氧基聯苯、Bisaniline M、Bisaniline P、9,9-雙(4-胺基苯基)茀、鄰聯甲苯胺碸、亞甲基雙(鄰胺苯甲酸)、1,3-雙(4-胺基苯氧基)-2,2-二甲基丙烷、1,3-雙(4-胺基苯氧基)丙烷、1,4-雙(4-胺基苯氧基)丁烷、1,5-雙(4-胺基苯氧基)丁烷、2,3,5,6-四甲基-1,4-苯二胺、3,3',5,5'-四甲基聯苯胺、4,4'-二胺基苯甲醯苯胺、2,2-雙(4-胺基苯基)六氟丙烷、聚氧伸烷基二胺類(例如Huntsman之Jeffamine D-230、D400、D-2000及D-4000)、1,3-環己烷雙(甲基胺)、間苯二甲胺、對苯二甲胺等。
上述脂肪族二胺化合物之中,就提高柔軟性之觀點及上述反應性樹脂之與溶劑或其他成分之相容性提高而容易製造黏著帶之觀點而言,較佳為二聚二胺。
上述二聚二胺為將作為不飽和脂肪酸之二聚物而獲得之環式及非環式二聚酸還原並胺基化而獲得之二胺化合物,例如可列舉:直鏈型、單環型、多環型等之二聚二胺。上述二聚二胺可包含碳-碳不飽和雙鍵,亦可為氫加成之氫化物。作為上述二聚二胺,更具體而言,例如可列舉可構成上述通式(4-1)所表示之基、通式(4-2)所表示之基、通式(4-3)所表示之基及通式(4-4)所表示之基之二聚二胺等。
作為上述具有官能基之二胺化合物,例如可列舉:具有羥基之二胺化合物、具有羧基之二胺化合物、具有鹵基之二胺化合物等。
作為上述具有羥基之二胺化合物,例如可列舉:1,3-二胺基-2-丙醇、2,4-二胺基苯氧基乙醇、3,5-二胺基苯氧基乙醇、2,4-二胺基酚、3,5-二胺基酚、2,4-二胺基苄醇、4,6-二胺基間苯二酚二鹽酸鹽、2,2-雙(3-胺基-4-羥基苯基)六氟丙烷等。作為上述具有羧基之二胺化合物,例如可列舉:3,5-二胺基苯甲酸等。作為上述具有鹵基之二胺化合物,例如可列舉2,4-二胺基氯苯等。
作為上述芳香族酸酐,例如可列舉:焦蜜石酸、1,2,5,6-萘四羧酸、2,3,6,7-萘四羧酸、1,2,4,5-萘四羧酸、1,4,5,8-萘四羧酸、3,3',4,4'-二苯甲酮四羧酸、3,3',4,4'-聯苯醚四羧酸、3,3',4,4'-聯苯四羧酸、2,3,5,6-吡啶四羧酸、3,4,9,10-苝四羧酸、4,4'-磺醯基二鄰苯二甲酸、1-三氟甲基-2,3,5,6-苯四羧酸、2,2',3,3'-聯苯四羧酸、2,2-雙(3,4-二羧基苯基)丙烷、2,2-雙(2,3-二羧基苯基)丙烷、1,1-雙(2,3-二羧基苯基)乙烷、1,1-雙(3,4-二羧基苯基)乙烷、雙(2,3-二羧基苯基)甲烷、雙(3,4-二羧基苯基)甲烷、雙(3,4-二羧基苯基)碸、雙(3,4-二羧基苯基)醚、苯-1,2,3,4-四羧酸、2,3,2',3'-二苯甲酮四羧酸、2,3,3',4'-二苯甲酮四羧酸、菲-1,8,9,10-四羧酸、吡-2,3,5,6-四羧酸、噻吩-2,3,4,5-四羧酸、2,3,3',4'-聯苯四羧酸、3,4,3',4'-聯苯四羧酸、2,3,2',3'-聯苯四羧酸、4,4'-雙(3,4-二羧基苯氧基)二苯基硫化物、4,4'-(4,4'-亞異丙基二苯氧基)-雙(鄰苯二甲酸)等。
作為上述含官能基之不飽和化合物,根據上述醯亞胺化合物之末端或側鏈之官能基而選擇使用。
例如於上述醯亞胺化合物之末端或側鏈之官能基為羥基之情形時,可列舉具有羧基之馬來亞醯胺化合物。作為該具有羧基之馬來亞醯胺化合物,例如可列舉:乙酸馬來亞醯胺、馬來亞醯胺丙酸、馬來亞醯胺丁酸、馬來亞醯胺己酸、反-4-(N-馬來亞醯胺甲基)環己烷-1-羧酸、19-馬來亞醯胺-17-側氧基-4,7,10,13-四氧雜-16-氮雜十九酸等。進而可列舉:丁基乙烯醚等具有醚基之乙烯化合物、二烯丙基單縮水甘油基三聚異氰酸酯等具有縮水甘油基之烯丙基化合物、烯丙基縮水甘油醚、甘油二烯丙基單縮水甘油醚等具有縮水甘油基之烯丙基醚化合物等。進而可列舉:縮水甘油氧基乙基乙烯醚、縮水甘油氧基丁基乙烯醚、縮水甘油氧基己基乙烯醚、縮水甘油基二乙二醇乙烯醚、縮水甘油基環己烷二甲醇單乙烯醚等具有縮水甘油基之乙烯醚化合物等。進而可列舉:異氰酸烯丙基酯等具有異氰酸酯基之烯丙基系化合物、異氰酸2-(甲基)丙烯醯氧基乙酯等具有異氰酸酯基之(甲基)丙烯醯基化合物等。
又,例如於上述醯亞胺化合物之末端或側鏈之官能基為羧基之情形時,可列舉:三羥甲基丙烷二烯丙基醚、新戊四醇三烯丙基醚等具有羥基之烯丙基系化合物、二烯丙基單縮水甘油基三聚異氰酸酯等具有縮水甘油基之烯丙基系化合物等。進而可列舉:烯丙基縮水甘油醚、甘油二烯丙基單縮水甘油基醚等具有縮水甘油基之烯丙基醚化合物等。進而可列舉:縮水甘油氧基乙基乙烯醚、縮水甘油氧基丁基乙烯醚、縮水甘油氧基己基乙烯醚、縮水甘油基二乙二醇乙烯醚、縮水甘油基環己烷二甲醇單乙烯醚等具有縮水甘油基之乙烯醚化合物等。
本發明之一實施態樣之黏著劑組成物含有聚矽氧化合物或氟化合物。
聚矽氧化合物及氟化合物由於耐熱性優異,故即使經過300℃以上之高溫加工處理亦能防止黏著劑組成物燒焦,剝離時滲出至被黏著體界面,容易剝離。
上述聚矽氧化合物並無特別限制,例如可列舉:聚矽氧油、聚矽氧二丙烯酸酯、聚矽氧系接枝共聚物等。上述氟化合物並無特別限制,例如可列舉具有氟原子之烴化合物等。
上述聚矽氧化合物或氟化合物較佳為具有可與上述反應性樹脂交聯之官能基。藉由上述聚矽氧化合物或氟化合物具有可與上述反應性樹脂交聯之官能基,故而藉由剝離時之光照射等而上述聚矽氧化合物或氟化合物與上述反應性樹脂發生化學反應而進入上述反應性樹脂中,故可抑制上述聚矽氧化合物或氟化合物附著於被黏著體上而引起污染。
可與上述反應性樹脂交聯之官能基並無特別限制,例如可列舉:羧基、自由基聚合性之不飽和鍵(例如:乙烯基、(甲基)丙烯醯基、可被取代之馬來亞醯胺基)、羥基、醯胺基、異氰酸酯基、環氧基等。
其中,就環保、容易廢棄之觀點而言,較佳為具有可與上述反應性樹脂交聯之官能基之聚矽氧化合物。
作為具有可與上述反應性樹脂交聯之官能基的聚矽氧化合物,較佳為主鏈具有矽氧烷骨架且側鏈或末端具有具備雙鍵之官能基的聚矽氧化合物。
上述主鏈具有矽氧烷骨架且側鏈或末端具有具備雙鍵之官能基的聚矽氧化合物並無特別限制,但較佳為含有選自由下述通式(I)所表示之聚矽氧化合物、下述通式(II)所表示之聚矽氧化合物及下述通式(III)所表示之聚矽氧化合物所組成之群中之至少1個。該等聚矽氧化合物之耐熱性尤其高,極性高,故容易自黏著劑組成物滲出。
上述通式(I)、通式(II)、通式(III)中,X及Y分別獨立地表示0〜1200之整數,R表示具有雙鍵之官能基。
上述通式(I)、通式(II)、通式(III)中,作為R所表示之具有雙鍵之官能基,例如可列舉:可被取代之馬來亞醯胺基、檸康醯亞胺基、乙烯醚基、烯丙基、(甲基)丙烯醯基等。其中,就獲得更高的耐熱性之方面而言,較佳為可被取代之馬來亞醯胺基。再者,於上述通式(I)、通式(II)及通式(III)中,於存在複數個R之情形時,複數個R可相同,亦可不同。
關於上述通式(I)、通式(II)、通式(III)所表示之矽氧烷骨架具有(甲基)丙烯醯基之聚矽氧化合物中之市售者,例如可列舉:EBECRYL350、EBECRYL1360(均為Daicel-Cytec公司製造)等。進而可列舉BYK-UV3500(BYK-Chemie公司製造)、TEGO RAD2250(Evonik公司製造)(R均為丙烯醯基)等。
本發明之一實施態樣之黏著劑組成物中之上述矽酮化合物或氟化合物之含量並無特別限制,但相對於上述反應性樹脂100重量份,較佳之下限為0.1重量份,較佳之上限為20重量份。若上述聚矽氧化合物或氟化合物之含量為該範圍內,則黏著劑組成物可不污染被黏著體而發揮優異之剝離性。就抑制污染並且進一步提高剝離性之觀點而言,上述聚矽氧化合物或氟化合物之含量之更佳之下限為0.3重量份,更佳之上限為10重量份。
再者,本發明之一實施態樣之黏著劑組成物由於耐熱性優異,故即使使上述聚矽氧化合物或氟化合物之含量較少亦可發揮充分之效果。因此,可進一步降低由上述聚矽氧化合物或氟化合物導致之污染之可能性。
本發明之一實施態樣之黏著劑組成物較佳為進而含有分子內具有2個以上的具備雙鍵之官能基且分子量為5000以下之多官能單體或多官能低聚物(以下亦簡稱為「多官能單體或多官能低聚物」)。藉由含有此種多官能單體或多官能低聚物,黏著劑組成物藉由光之照射而效率更好地進行三維網狀化,可更容易地剝離。
作為上述多官能單體或多官能低聚物中之具有雙鍵之官能基,例如可列舉:可被取代之馬來亞醯胺基、檸康醯亞胺基、乙烯醚基、烯丙基、(甲基)丙烯醯基等。其中,就獲得更高的耐熱性之方面而言,較佳為可被取代之馬來亞醯胺基。
本發明之一實施態樣之黏著劑組成物中之上述多官能單體或多官能低聚物之含量並無特別限制,於上述反應性樹脂與上述多官能單體或多官能低聚物之合計100重量份中,所占之較佳之下限為5重量份,較佳之上限為100重量份。若上述多官能單體或多官能低聚物之含量為該範圍內,則黏著劑組成物可發揮尤其優異之剝離性。就進一步提高剝離性之觀點而言,上述多官能單體或多官能低聚物之含量之更佳之下限為10重量份,更佳之上限為50重量份。
本發明之一實施態樣之黏著劑組成物較佳為進而含有光聚合起始劑。
作為上述光聚合起始劑,例如可列舉藉由照射250〜800 nm波長之光而得以活性化者。
作為上述光聚合起始劑,例如可列舉:甲氧基苯乙酮等苯乙酮衍生物化合物、安息香丙醚、安息香異丁醚等安息香醚系化合物、苯偶醯二甲基縮酮、苯乙酮二乙基縮酮等縮酮衍生物化合物、氧化膦衍生物化合物等。進而可列舉:雙(η5-環戊二烯基)二茂鈦衍生物化合物、二苯甲酮、米其勒酮、氯9-氧硫𠮿(thioxanthone)、十二烷基9-氧硫𠮿、二甲基9-氧硫𠮿、二乙基9-氧硫𠮿、α-羥基環己基苯基酮、2-羥基甲基苯基丙烷等光自由基聚合起始劑。該等光聚合起始劑可單獨使用,亦可併用2種以上。
本發明之一實施態樣之黏著劑組成物中之上述光聚合起始劑之含量並無特別限制,但相對於上述反應性樹脂100重量份,較佳之下限為0.1重量份,較佳之上限為10重量份。若上述光聚合起始劑之含量為該範圍內,則藉由照射光,黏著劑組成物之整體會均勻且快速地聚合交聯,彈性模數上升,故而黏著力大為降低,可容易地剝離。上述光聚合起始劑之含量之更佳下限為0.3重量份,更佳上限為3重量份。
本發明之一實施態樣之黏著劑組成物可進而含有藉由照射光而產生氣體之氣體產生劑。藉由含有上述氣體產生劑,即使經過300℃以上之高溫加工處理之後,藉由照射光而產生之氣體亦被釋出至與被黏著體之界面,故可更容易且無糊劑殘留地剝離被黏著體。
作為上述氣體產生劑,例如可列舉:四唑化合物或其鹽、***化合物或其鹽、偶氮化合物、疊氮化物、𠮿酮乙酸、碳酸鹽等。該等氣體產生劑可單獨使用,亦可併用2種以上。其中,就耐熱性尤其優異之方面而言,較佳為四唑化合物或其鹽。
本發明之一實施態樣之黏著劑組成物中之上述氣體產生劑之含量並無特別限制,但相對於上述反應性樹脂100重量份,較佳之下限為5重量份,較佳之上限為50重量份。若上述氣體產生劑之含量為該範圍內,則黏著劑組成物可發揮尤其優異之剝離性。上述氣體產生劑之含量之更佳下限為8重量份,更佳上限為30重量份。
本發明之一實施態樣之黏著劑組成物例如可含有光敏劑、熱穩定劑、抗氧化劑、抗靜電劑、塑化劑、樹脂、界面活性劑、蠟、微粒子填充劑等公知之添加劑。
作為上述微粒子填充劑,可列舉由選自由矽、鈦、鋁、鈣、硼、鎂及氧化鋯之氧化物以及該等複合物所組成之群中之至少1種所構成之無機填充劑。其中,就具有與一般而言用作無機填充劑之二氧化矽(silica)類似之物性之方面而言,較佳為矽-鋁-硼複合氧化物、矽-鈦複合氧化物及二氧化矽-二氧化鈦複合氧化物。
上述無機填充劑之平均粒徑並無特別限制,較佳之下限為0.1 μm,較佳之上限為30 μm。
上述無機填充劑之含量並無特別限制,但相對於上述反應性樹脂100重量份,較佳之下限為30重量份,較佳之上限為150重量份。上述無機填充劑之含量之更佳下限為60重量份,更佳上限為120重量份。
製造本發明之一實施態樣之黏著劑組成物之方法並無特別限制,例如可列舉使用珠磨機、超音波分散、均質機、高輸出分散機、輥磨機等將上述反應性樹脂、聚矽氧化合物或氟化合物、及視需要摻合之添加劑加以混合之方法等。
具有由本發明之一實施態樣之黏著劑組成物所構成之黏著劑層之黏著帶亦為本發明之一。
本發明之一實施態樣之黏著帶可為於基材之一面或兩面上具有由本發明之一實施態樣之黏著劑組成物所構成之黏著劑層之支持膠帶,亦可為不具有基材之無支持膠帶。
作為上述基材,例如可列舉由丙烯酸、烯烴、聚碳酸酯、氯乙烯、ABS、聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、尼龍、胺酯(urethane)、聚醯亞胺等透明之樹脂所構成之片材。又,亦可使用具有網狀結構之片材、有開孔之片材等。
本發明之一實施態樣之黏著劑組成物及黏著帶具有初始黏著力,另一方面,耐熱性優異,即使進行300℃以上之高溫加工處理,接著亢進亦少,可藉由照射光而容易地剝離。本發明之一實施態樣之黏著劑組成物及黏著帶由於耐熱性尤其優異,故可較佳地用於進行300℃以上之高溫加工處理之被黏著體之保護、暫時固定。尤其可較佳地用於以下方面:於加工半導體等電子零件時,為了使電子零件容易處理,不破損等,而經由黏著劑組成物或黏著帶將電子零件固定於支持板上,或將黏著帶貼附於電子零件上而加以保護。
具體而言,例如可列舉下述之電子零件之處理方法,其包含:將電子零件暫時固定於本發明之一實施態樣之黏著帶上之步驟、對黏著帶照射光之步驟、對電子零件進行熱處理之步驟、及自電子零件剝離黏著帶之步驟。此種電子零件之處理方法亦為本發明之一。
上述對黏著帶照射光之步驟可於即將進行上述自電子零件剝離黏著帶之步驟之前進行,但較佳為於上述將電子零件暫時固定於黏著帶上之後且於上述對電子零件進行熱處理之步驟之前進行。藉由於上述對電子零件進行熱處理之步驟之前進行上述對黏著帶照射光之步驟,黏著帶可發揮更優異之耐熱性。
[發明之效果]
根據本發明,可提供一種於固定被黏著體之狀態即便經過300℃以上之高溫加工處理之後,亦可藉由照射光而更容易地剝離之黏著劑組成物、具有由該黏著劑組成物所構成之黏著劑層之黏著帶及電子零件之處理方法。
以下列舉實施例進一步詳細地說明本發明之態樣,但本發明並非僅限於該等實施例。
(反應性樹脂之製備)
(1)反應性樹脂1之製備
向放有鐵氟龍(註冊商標)攪拌器之500 mL之圓底燒瓶中投入250 mL之甲苯。其次,添加35 g(0.35莫耳)之三乙基胺及35 g(0.36莫耳)之甲磺酸酐進行攪拌,形成鹽。攪拌10分鐘後,依序添加56 g(0.1莫耳)之二聚二胺(Croda公司製造、Priamine 1075)及19.1 g(0.09莫耳)之焦蜜石酸酐。將迪安-斯塔克分離器(Dean-Stark trap)及冷凝器安裝於燒瓶,使混合物進行2小時回流,形成胺末端之二醯亞胺。使反應物冷卻至室溫以下之後,添加12.8 g(0.13莫耳)之順丁烯二酸酐,其次,添加5 g(0.05莫耳)之甲磺酸酐。使混合物進而進行12小時回流之後,冷卻至室溫,向燒瓶中添加300 mL之甲苯,藉由靜置而使雜質沈澱並去除。使獲得之溶液通過填充有二氧化矽凝膠之玻璃膠漏斗而過濾之後,真空去除溶劑,獲得琥珀色蠟狀之主鏈具有醯亞胺骨架、兩末端具有馬來亞醯胺基之下述式(1-1)所表示之反應性樹脂1。針對獲得之反應性樹脂1,藉由使用THF作為溶出液、使用HR-MB-M(產品名、Waters公司製造)作為管柱之凝膠滲透層析(GPC)法進行測定,結果重量平均分子量為5000。
(2)反應性樹脂2之製備
向放有鐵氟龍(註冊商標)攪拌器之500 mL之圓底燒瓶中投入250 mL之甲苯。其次,添加35 g(0.35莫耳)之三乙基胺及35 g(0.36莫耳)之甲磺酸酐並進行攪拌,形成鹽。攪拌10分鐘後,依序添加28 g(0.05莫耳)之二聚二胺(Croda公司製造、Priamine 1075)、4.5 g(0.05莫耳)之1,3-二胺基-2-丙醇及21.8 g(0.1莫耳)之焦蜜石酸酐。將迪安-斯塔克管及冷凝器安裝於燒瓶,使混合物進行2小時回流,合成含羥基之聚醯亞胺。使反應混合物冷卻至室溫之後,添加10.5 g(0.05莫耳)之馬來亞醯胺己酸(東京化成公司製造),進而進行12小時回流。冷卻至室溫,向燒瓶中添加300 mL之甲苯,藉由靜置而使雜質沈澱並去除。使獲得之溶液通過填充有二氧化矽凝膠之玻璃膠漏斗而過濾之後,真空去除溶劑,獲得琥珀色蠟狀之主鏈具有醯亞胺骨架、側鏈具有馬來亞醯胺基之下述式(1-2)所表示之反應性樹脂2。針對獲得之反應性樹脂2,藉由使用THF作為溶出液、使用HR-MB-M(產品名、Waters公司製造)作為管柱之凝膠滲透層析(GPC)法而進行測定,結果重量平均分子量為30000。
(3)反應性樹脂3之製備
向放有鐵氟龍(註冊商標)攪拌器之500 mL之圓底燒瓶中投入250 mL之甲苯。其次,添加35 g(0.35莫耳)之三乙基胺及35 g(0.36莫耳)之甲磺酸酐並進行攪拌,形成鹽。攪拌10分鐘後,依序添加28 g(0.05莫耳)之二聚二胺(Croda公司製造、Priamine 1075)、4.5 g(0.05莫耳)之1,3-二胺基-2-丙醇及21.8 g(0.1莫耳)之焦蜜石酸酐。將迪安-斯塔克管及冷凝器安裝於燒瓶,使混合物進行2小時回流,合成含羥基之聚醯亞胺。使反應混合物冷卻至室溫之後,將200 g之大量過剩之丁基乙烯醚(東京化成公司製造)及0.1 g之乙酸鈀啡啉錯合物添加於燒瓶,於60℃進行14小時回流。藉由蒸發器而蒸餾去除過剩之丁基乙烯醚。冷卻至室溫,向燒瓶中添加300 mL之甲苯,藉由靜置而使雜質沈澱並去除。使獲得之溶液通過填充有二氧化矽凝膠之玻璃膠漏斗而過濾之後,真空去除溶劑,獲得琥珀色蠟狀之主鏈具有醯亞胺骨架、側鏈具有乙烯醚基之下述式(1-3)所表示之反應性樹脂3。
針對獲得之反應性樹脂3,藉由使用THF作為溶出液、使用HR-MB-M(產品名、Waters公司製造)作為管柱之凝膠滲透層析(GPC)法而進行測定,結果重量平均分子量為30000。
(4)反應性樹脂4之製備
向放有鐵氟龍(註冊商標)攪拌器之500 mL之圓底燒瓶中投入250 mL之甲苯。其次,添加35 g(0.35莫耳)之三乙基胺及35 g(0.36莫耳)之甲磺酸酐並進行攪拌,形成鹽。攪拌10分鐘後,依序添加28 g(0.05莫耳)之二聚二胺(Croda公司製造、Priamine 1075)、7.6 g(0.05莫耳)之3,5-二胺基苯甲酸及21.8 g(0.1莫耳)之焦蜜石酸酐。將迪安-斯塔克管及冷凝器安裝於燒瓶,使混合物進行2小時回流,合成含羧酸之聚醯亞胺。使反應混合物冷卻至室溫之後、向燒瓶中添加300 mL之甲苯,藉由靜置而使雜質沈澱並去除。使獲得之溶液通過填充有二氧化矽凝膠之玻璃膠漏斗而過濾之後,添加13.3 g(0.05莫耳)之異三聚氰酸二烯丙基單縮水甘油基酯(四國化成製造)及3 g(0.3莫耳)之三乙基胺,進而加熱3小時。冷卻至室溫並真空去除溶劑,獲得琥珀色蠟狀之主鏈具有醯亞胺骨架、側鏈具有二烯丙基異三聚氰酸酯基之下述式(1-4)所表示之反應性樹脂4。
針對獲得之反應性樹脂4,藉由使用THF作為溶出液、使用HR-MB-M(產品名、Waters公司製造)作為管柱之凝膠滲透層析(GPC)法而進行測定,結果重量平均分子量為35000。
(5)反應性樹脂5之製備
向放有鐵氟龍(註冊商標)攪拌器之500 mL之圓底燒瓶中投入250 mL之甲苯。其次,添加35 g(0.35莫耳)之三乙基胺及35 g(0.36莫耳)之甲磺酸酐並進行攪拌,形成鹽。攪拌10分鐘後,依序添加47.8 g(0.09莫耳)之二聚二胺(Croda公司製造、Priamine 1075)、3.7 g(0.01莫耳)之Bis-AP-AF及21.8 g(0.1莫耳)之焦蜜石酸酐。將迪安-斯塔克管及冷凝器安裝於燒瓶,使混合物進行2小時回流,合成含羧酸之聚醯亞胺。使反應混合物冷卻至室溫之後,向燒瓶中添加300 mL之甲苯,藉由靜置而使雜質沈澱並去除。使獲得之溶液通過填充有二氧化矽凝膠之玻璃膠漏斗而過濾之後,添加4.2 g(0.02莫耳)之馬來亞醯胺己酸及3 g(0.3莫耳)之三乙基胺,進而加熱3小時。冷卻至室溫,並真空去除溶劑,獲得琥珀色蠟狀之主鏈具有醯亞胺骨架、側鏈具有馬來亞醯胺基之下述式(1-5)所表示之反應性樹脂5。
針對獲得之反應性樹脂5,藉由使用THF作為溶出液、使用HR-MB-M(產品名、Waters公司製造)作為管柱之凝膠滲透層析(GPC)法而進行測定,結果重量平均分子量為35000。
(6)反應性樹脂6之製備
向放有鐵氟龍(註冊商標)攪拌器之500 mL之圓底燒瓶中投入250 mL之甲苯。其次,添加35 g(0.35莫耳)之三乙基胺及35 g(0.36莫耳)之甲磺酸酐並進行攪拌,形成鹽。攪拌10分鐘後,依序添加31.9 g(0.06莫耳)之二聚二胺(Croda公司製造、Priamine 1075)、14.7 g(0.04莫耳)之Bis-AP-AF及21.8 g(0.1莫耳)之焦蜜石酸酐。將迪安-斯塔克管及冷凝器安裝於燒瓶,使混合物進行2小時回流,合成含羧酸之聚醯亞胺。使反應混合物冷卻至室溫之後,向燒瓶中添加300 mL之甲苯,藉由靜置而使雜質沈澱並去除。使獲得之溶液通過填充有二氧化矽凝膠之玻璃膠漏斗而過濾之後,添加16.9 g(0.08莫耳)之馬來亞醯胺己酸及3 g(0.3莫耳)之三乙基胺,進而加熱3小時。冷卻至室溫,並真空去除溶劑,獲得琥珀色蠟狀之主鏈具有醯亞胺骨架、側鏈具有馬來亞醯胺基之上述式(1-5)所表示之反應性樹脂6。
針對獲得之反應性樹脂6,藉由使用THF作為溶出液、使用HR-MB-M(產品名、Waters公司製造)作為管柱之凝膠滲透層析(GPC)法而進行測定,結果重量平均分子量為35000。
(7)反應性樹脂7之製備
向放有鐵氟龍(註冊商標)攪拌器之500 mL之圓底燒瓶中投入250 mL之甲苯。其次,添加35 g(0.35莫耳)之三乙基胺及35 g(0.36莫耳)之甲磺酸酐並進行攪拌,形成鹽。攪拌10分鐘後,依序添加42.5 g(0.08莫耳)之二聚二胺(Croda公司製造、Priamine 1075)、7.3 g(0.02莫耳)之Bis-AP-AF及21.8 g(0.1莫耳)之焦蜜石酸酐。將迪安-斯塔克管及冷凝器安裝於燒瓶,使混合物進行2小時回流,合成含羧酸之聚醯亞胺。使反應混合物冷卻至室溫之後,向燒瓶中添加300 mL之甲苯,藉由靜置而使雜質沈澱並去除。使獲得之溶液通過填充有二氧化矽凝膠之玻璃膠漏斗而過濾之後,添加8.6 g(0.04莫耳)之GO-BVE(縮水甘油醚氧基丁基乙烯醚、Nippon Carbide公司製造)及3 g(0.3莫耳)之三乙基胺,進而加熱3小時。冷卻至室溫,並真空去除溶劑,獲得琥珀色蠟狀之主鏈具有醯亞胺骨架、側鏈具有乙烯醚基之下述式(1-6)所表示之反應性樹脂7。針對獲得之反應性樹脂7,藉由使用THF作為溶出液、使用HR-MB-M(產品名、Waters公司製造)作為管柱之凝膠滲透層析(GPC)法而進行測定,結果重量平均分子量為35000。
(8)反應性樹脂8之製備
向放有鐵氟龍(註冊商標)攪拌器之500 mL之圓底燒瓶中投入250 mL之甲苯。其次,添加35 g(0.35莫耳)之三乙基胺及35 g(0.36莫耳)之甲磺酸酐並進行攪拌,形成鹽。攪拌10分鐘後,依序添加42.5 g(0.08莫耳)之二聚二胺(Croda公司製造、Priamine 1075)、7.3 g(0.02莫耳)之Bis-AP-AF及21.8 g(0.1莫耳)之焦蜜石酸酐。將迪安-斯塔克管及冷凝器安裝於燒瓶,使混合物進行2小時回流,合成含羧酸之聚醯亞胺。使反應混合物冷卻至室溫之後,向燒瓶中添加300 mL之甲苯,藉由靜置而使雜質沈澱並去除。使獲得之溶液通過填充有二氧化矽凝膠之玻璃膠漏斗而過濾之後,添加10.6 g(0.04莫耳)之DA-MGIC(異三聚氰酸二胺基單縮水甘油基酯、四國化成公司製造)及3 g(0.3莫耳)之三乙基胺,進而加熱3小時。冷卻至室溫,並真空去除溶劑,獲得琥珀色蠟狀之主鏈具有醯亞胺骨架、側鏈具有烯丙基之下述式(1-7)所表示之反應性樹脂8。
針對獲得之反應性樹脂8,藉由使用THF作為溶出液、使用HR-MB-M(產品名、Waters公司製造)作為管柱之凝膠滲透層析(GPC)法而進行測定,結果重量平均分子量為35000。
(9)反應性樹脂9之製備
向放有鐵氟龍(註冊商標)攪拌器之500 mL之圓底燒瓶中投入250 mL之甲苯。其次,添加35 g(0.35莫耳)之三乙基胺及35 g(0.36莫耳)之甲磺酸酐並進行攪拌,形成鹽。攪拌10分鐘後,依序添加21.2 g(0.04莫耳)之二聚二胺(Croda公司製造、Priamine 1075)、12.3 g(0.03莫耳)之2,2-雙[4-(4-胺基苯氧基)苯基]丙烷、11.0 g(0.03莫耳)之Bis-AP-AF及21.8 g(0.1莫耳)之焦蜜石酸酐。將迪安-斯塔克管及冷凝器安裝於燒瓶,使混合物進行2小時回流,合成含羧酸之聚醯亞胺。使反應混合物冷卻至室溫之後,向燒瓶中添加300 mL之甲苯,藉由靜置而使雜質沈澱並去除。使獲得之溶液通過填充有二氧化矽凝膠之玻璃膠漏斗而過濾之後,添加15.9 g(0.06莫耳)之DA-MGIC(異三聚氰酸二胺基單縮水甘油基酯、四國化成公司製造)及3 g(0.3莫耳)之三乙基胺,進而加熱3小時。冷卻至室溫,並真空去除溶劑,獲得琥珀色固形之主鏈具有醯亞胺骨架、側鏈具有烯丙基之下述式(1-8)所表示之反應性樹脂9。
針對獲得之反應性樹脂9,藉由使用THF作為溶出液、使用HR-MB-M(產品名、Waters公司製造)作為管柱之凝膠滲透層析(GPC)法而進行測定,結果重量平均分子量為35000。
(丙烯酸系反應性樹脂之製備)
準備具備溫度計、攪拌機、冷卻管之反應器,向該反應器內添加94重量份之作為(甲基)丙烯酸烷基酯之丙烯酸2-乙基己基酯、6重量份之作為含官能基之單體之甲基丙烯酸羥基乙基酯、0.01重量份之月桂硫醇及80重量份之乙酸乙酯之後,對反應器進行加熱,使回流開始。繼而,向上述反應器內添加0.01重量份之作為聚合起始劑之1,1-雙(過氧化第三己基)-3,3,5-三甲基環己烷,於回流下使聚合開始。其次,自聚合開始1小時後及2小時後皆每次添加0.01重量份之1,1-雙(過氧化第三己基)-3,3,5-三甲基環己烷,進而,自聚合開始4小時後添加0.05重量份之過氧化特戊酸第三己酯使聚合反應繼續。並且,自聚合開始8小時後,獲得固形物成分55重量%、重量平均分子量50萬之含官能基之(甲基)丙烯酸系聚合物之乙酸乙酯溶液。
相對於獲得之包含含官能基之(甲基)丙烯酸系聚合物之乙酸乙酯溶液之樹脂固形物成分100重量份,添加3.5重量份之作為含官能基之不飽和化合物之甲基丙烯酸2-異氰酸基乙酯使其反應,獲得丙烯酸系反應性樹脂。
針對獲得之丙烯酸系反應性樹脂,藉由使用THF作為溶出液、使用HR-MB-M(產品名、Waters公司製造)作為管柱之凝膠滲透層析(GPC)法而進行測定,結果重量平均分子量為55萬。
(多官能單體之製備)
(1)多官能單體1之製備
向放有鐵氟龍(註冊商標)攪拌器之500 mL之圓底燒瓶中投入250 mL之甲苯。添加56 g(0.1莫耳)之二聚二胺(Croda公司製造、Priamine 1075)及19.6 g(0.2莫耳)之馬來酸酐,其次,添加5 g之甲磺酸酐。使溶液進行12小時回流之後,冷卻至室溫,向燒瓶中添加300 mL之甲苯,藉由靜置而使鹽沈澱並去除。使獲得之溶液通過填充有二氧化矽凝膠之玻璃膠漏斗而過濾之後,真空去除溶劑,獲得棕色液狀之下述式(2-1)所表示之多官能單體1。
(2)多官能單體2之購買
購買下述式(2-2)所表示之3官能丙烯酸酯即SR-387(Arkema公司製造、異氰酸三(2-丙烯醯氧乙基)酯),並將其設為多官能單體2。
(聚矽氧雙馬來亞醯胺之製備)
向放有鐵氟龍(註冊商標)攪拌器之300 mL之圓底燒瓶中投入100 mL之甲苯,並添加10.5 g(0.05莫耳)之馬來亞醯胺己酸(東京化成公司製造、試劑)及25 g(0.025莫耳)之兩末端具有羥基之聚矽氧樹脂X-21-5841(信越化學公司製造)、1 g(莫耳)之對甲苯磺酸1水合物。其次,於100℃加熱攪拌3小時。冷卻至常溫之後,添加5 g之三乙基胺,並攪拌1小時,之後,於100 g之水中洗浄,使溶劑揮發,獲得下述式(3)所表示之聚矽氧雙馬來亞醯胺(m=11、n=5)。
(實施例1)
向150 mL之甲苯中添加100重量份之反應性樹脂1、0.3重量份之作為聚矽氧化合物之2官能聚矽氧丙烯酸酯(Daicel-allnex公司製造、EBECRYL350)、1重量份之作為光聚合起始劑之Irgacure 369(BASF公司製造),製成黏著劑組成物之甲苯溶液。利用刮刀以乾燥皮膜之厚度成為40 μm之方式將獲得之黏著劑組成物之甲苯溶液塗佈於單面經過電暈處理之厚25 μm之聚醯亞胺膜(Ube Industries Ltd製造、Kapton)之電暈處理面上,並於110℃加熱1分鐘使塗佈溶液乾燥。其後,於40℃進行3天靜置固化,獲得黏著帶。
(實施例2〜20、比較例1〜3)
使反應性樹脂、多官能單體、聚矽氧化合物或氟化合物、光聚合起始劑之種類及摻合量如表1、2般,除此以外,以與實施例1相同之方式獲得黏著劑組成物及黏著帶。
實施例8中,使用6官能聚矽氧丙烯酸酯(Daicel-allnex公司製造、EBECRYL1360)作為聚矽氧化合物。
實施例9、比較例1中,使用光反應性氟化合物(DIC公司製造、MEGAFAC RS-56)作為氟化合物。
實施例15中,使用5-苯基-1H四唑(增田化學公司製造)作為氣體產生劑,使用9,10-二縮水甘油氧基蒽(川崎化成公司製造)作為光敏劑。
(評價)
針對實施例及比較例中獲得之黏著帶,藉由以下方法進行評價。
將結果示於表1、2。
(1)剝離性之評價
將獲得之黏著帶剪切為1英吋之寬度之後,利用100℃之貼合機加熱層壓於1 mm厚之玻璃上。層壓後,使用超高壓水銀燈自玻璃側以20 mW/cm2
之強度照射150秒鐘365 nm之紫外線。紫外線照射後,自玻璃側利用300℃之加熱板加熱10分鐘。
對層壓後、紫外線照射後及300℃加熱後之試片,於25℃、拉伸速度30 mm/秒之條件下進行180°剝離試驗,測定接著強度(N/英吋)。
(2)300℃加熱後之黏著帶之外觀之評價
於上述剝離性之評價中,目視觀察300℃加熱後之黏著帶之外觀,藉由以下基準進行評價。
〇:未確認到自玻璃之剝離或發泡
△:於與玻璃之間確認到微細之氣泡
×:與玻璃之間一部分剝離
(3)300℃加熱、剝離後之剝離面之評價
於上述剝離性之評價中,於300℃進行加熱,其後目視觀察剝離黏著帶之後之玻璃之表面,藉由以下基準進行評價。
〇:未確認到糊劑殘留
△:雖然無糊劑殘留,但於剝離面中確認到污點
×:確認到糊劑殘留
[表1]
實施例 | ||||||||||||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 | ||||
黏著劑組成物(重量份) | 反應性樹脂 | 反應性樹脂1 (兩末端馬來亞醯胺、重量平均分子量5000) | 官能基當量2500 | 100 | - | - | 80 | 80 | 80 | 80 | 80 | 80 | 80 | - | - | - | - | 80 |
反應性樹脂2 (側鏈馬來亞醯胺、重量平均分子量30000) | 官能基當量1200 | - | - | - | - | - | - | - | - | - | - | 80 | 80 | - | - | - | ||
反應性樹脂3 (側鏈乙烯基醚、重量平均分子量30000) | 官能基當量1100 | - | 100 | - | - | - | - | - | - | - | - | - | - | 80 | - | - | ||
反應性樹脂4 (側鏈烯丙基、重量平均分子量35000) | 官能基當量1300 | - | - | 100 | - | - | - | - | - | - | - | - | - | - | 80 | - | ||
反應性樹脂5 (側鏈馬來亞醯胺、重量平均分子量35000) | 官能基當量3800 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
反應性樹脂6 (側鏈馬來亞醯胺、重量平均分子量35000) | 官能基當量1700 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
反應性樹脂7 (側鏈乙烯基醚、重量平均分子量35000) | 官能基當量2400 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
反應性樹脂8 (側鏈烯丙基、重量平均分子量35000) | 官能基當量2500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
反應性樹脂9 (側鏈烯丙基、重量平均分子量40000) | 官能基當量1850 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
丙烯酸系反應性樹脂 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
多官能單體 | 多官能單體1(雙馬來亞醯胺單體) | - | - | - | 20 | 20 | 20 | - | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | ||
多官能單體2(3官能丙烯酸酯單體) | - | - | - | - | - | - | 20 | - | - | - | - | - | - | - | - | |||
聚矽氧化合物或氟化合物 | EBECRYL350 (聚矽氧丙烯酸酯、2官能) | 0.3 | 0.3 | 0.3 | 0.3 | 5.0 | 10 | 0.3 | - | - | - | 0.3 | - | 0.3 | - | 0.3 | ||
EBECRYL 1360 (聚矽氧丙烯酸酯、6官能) | - | - | - | - | - | - | - | 0.3 | - | - | - | - | - | - | - | |||
MEGAFACRS-56 (反應性氟化合物) | - | - | - | - | - | - | - | - | 1 | - | - | - | - | - | - | |||
聚矽氧雙馬來亞醯胺 | - | - | - | - | - | - | - | - | - | 0.3 | - | 0.3 | - | 0.3 | - | |||
氣體產生劑 | 5-苯基-1H四唑 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10 | ||
光聚合起始劑 | Irgacure 369 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | ||
光敏劑 | 9,10-二丁氧基蒽 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 | ||
評價 | 剝離性評價 | 層壓後之接著強度(N/英吋) | 0.5 | 0.4 | 0.4 | 0.6 | 0.4 | 0.2 | 0.5 | 0.3 | 0.9 | 0.3 | 0.3 | 0.3 | 0.4 | 0.3 | 0.3 | |
紫外線照射後之接著強度(N/英吋) | 0.3 | 0.3 | 0.2 | 0.2 | 0.2 | 0.2 | 0.4 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | |||
300℃加熱後之接著強度(N/英吋) | 0.4 | 0.3 | 0.3 | 0.2 | 0.2 | 0.2 | 0.4 | 0.2 | 0.3 | 0.2 | 0.2 | 0.1 | 0.3 | 0.1 | 0.2 | |||
300℃加熱後之黏著帶之外觀之評價 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | |||
300℃加熱、剝離後之剝離面之評價 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 | 〇 |
[表2]
產業上之可利用性
實施例 | 比較例 | ||||||||||
16 | 17 | 18 | 19 | 20 | 1 | 2 | 3 | ||||
黏著劑組成物(重量份) | 反應性樹脂 | 反應性樹脂1 (兩末端馬來亞醯胺、重量平均分子量5000) | 官能基當量2500 | - | - | - | - | - | - | 100 | 80 |
反應性樹脂2 (側鏈馬來亞醯胺、重量平均分子量30000) | 官能基當量1200 | - | - | - | - | - | - | - | - | ||
反應性樹脂3 (側鏈乙烯基醚、重量平均分子量30000) | 官能基當量1100 | - | - | - | - | - | - | - | - | ||
反應性樹脂4 (側鏈烯丙基、重量平均分子量35000) | 官能基當量1300 | - | - | - | - | - | - | - | - | ||
反應性樹脂5 (側鏈馬來亞醯胺、重量平均分子量35000) | 官能基當量3800 | 80 | - | - | - | - | - | - | - | ||
反應性樹脂6 (側鏈馬來亞醯胺、重量平均分子量35000) | 官能基當量1700 | - | 80 | - | - | - | - | - | - | ||
反應性樹脂7 (側鏈乙烯基醚、重量平均分子量35000) | 官能基當量2400 | - | - | 80 | - | - | - | - | - | ||
反應性樹脂8 (側鏈烯丙基、重量平均分子量35000) | 官能基當量2500 | - | - | - | 80 | - | - | - | - | ||
反應性樹脂9 (側鏈烯丙基、重量平均分子量35000) | 官能基當量2100 | - | - | - | - | 80 | - | - | - | ||
丙烯酸系反應性樹脂 | - | - | - | - | - | - | 100 | - | - | ||
多官能單體 | 多官能單體1(雙馬來亞醯胺單體) | 20 | 20 | 20 | 20 | 20 | - | - | 20 | ||
多官能單體2(3官能丙烯酸酯單體) | - | - | - | - | - | - | - | - | |||
聚矽氧化合物或氟化合物 | EBECRYL350 (聚矽氧丙烯酸酯、2官能) | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | - | - | - | ||
EBECRYL 1360 (聚矽氧丙烯酸酯、6官能) | - | - | - | - | - | - | - | - | |||
MEGAFAC RS-56 (反應性氟化合物) | - | - | - | - | - | 0.5 | - | - | |||
聚矽氧雙馬來亞醯胺 | - | - | - | - | - | - | - | - | |||
氣體產生劑 | 5-苯基-1H四唑 | - | - | - | - | - | - | - | - | ||
光聚合起始劑 | Irgacure 369 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | ||
光敏劑 | 9,10-二丁氧基蒽 | - | - | - | - | - | - | - | - | ||
評價 | 剝離性評價 | 層壓後之接著強度(N/英吋) | 0.4 | 0.3 | 0.5 | 0.4 | 0.2 | 4.0 | 1.0 | 3.0 | |
紫外線照射後之接著強度(N/英吋) | 0.3 | 0.2 | 0.4 | 0.2 | 0.4 | 0.2 | 3 | 0.6 | |||
300℃加熱後之接著強度(N/英吋) | 0.2 | 0.2 | 0.3 | 0.2 | 0.1 | 1.4 | 5 | 0.8 | |||
300℃加熱後之黏著帶之外觀之評價 | 〇 | 〇 | 〇 | 〇 | 〇 | × | 〇 | 〇 | |||
300℃加熱、剝離後之剝離面之評價 | 〇 | 〇 | 〇 | 〇 | 〇 | × | 〇 | 〇 |
根據本發明,可提供一種於固定被黏著體之狀態即便經過300℃以上之高溫加工處理之後,亦可藉由照射光而容易地剝離之黏著劑組成物、具有由該黏著劑組成物所構成之黏著劑層之黏著帶及電子零件之處理方法。
無
無
Claims (17)
- 一種黏著劑組成物,其含有:主鏈具有醯亞胺骨架且側鏈或末端具有下述官能基的反應性樹脂、及聚矽氧化合物或氟化合物,該官能基具有雙鍵。
- 如請求項1之黏著劑組成物,其中,上述聚矽氧化合物或氟化合物具有能與上述反應性樹脂交聯之官能基。
- 如請求項1或2之黏著劑組成物,其中,上述具有雙鍵之官能基為可被取代之馬來亞醯胺基、檸康醯亞胺基(citraconimide)、乙烯醚基、烯丙基或(甲基)丙烯醯基。
- 如請求項1至3中任一項之黏著劑組成物,其中,上述具有雙鍵之官能基位於上述反應性樹脂之側鏈。
- 如請求項1至4中任一項之黏著劑組成物,其中,上述反應性樹脂的具有雙鍵之官能基當量(重量平均分子量/具有雙鍵之官能基之個數)為4000以下。
- 如請求項1至5中任一項之黏著劑組成物,其中,上述反應性樹脂之重量平均分子量為5000以上。
- 如請求項7之黏著劑組成物,其中,於上述通式(1a)〜(1c)中,P1 、P2 及P3 分別獨立地為碳數5〜50之芳香族基,Q1 為經取代或未經取代之直鏈狀、支鏈狀或環狀之碳數2〜100之脂肪族基,Q2 為經取代或未經取代之碳數5〜50之具有芳香族結構之基,R為經取代或未經取代之支鏈狀之碳數2〜100之脂肪族基或芳香族基。
- 如請求項7或8之黏著劑組成物,其中,於上述通式(1c)中,X3 為具有雙鍵之官能基。
- 如請求項7至9中任一項之黏著劑組成物,其中,於上述通式(1c)中,R為具有芳香族酯基或芳香族醚基之芳香族基,並且R中之上述芳香族酯基或上述芳香族醚基與X3 鍵結。
- 如請求項1至12中任一項之黏著劑組成物,其進而含有:分子內具有2個以上的具有雙鍵之官能基且分子量為5000以下之多官能單體或多官能低聚物。
- 如請求項1至13中任一項之黏著劑組成物,其進而含有光聚合起始劑。
- 如請求項1至14中任一項之黏著劑組成物,其進而含有藉由照射光而產生氣體之氣體產生劑。
- 一種黏著帶,其具有由請求項1至15中任一項之黏著劑組成物所構成之黏著劑層。
- 一種電子零件之處理方法,其包含:將電子零件暫時固定於請求項16之黏著帶上之步驟、對黏著帶照射光之步驟、對電子零件進行熱處理之步驟、及自電子零件剝離黏著帶之步驟。
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019053280 | 2019-03-20 | ||
JPJP2019-053279 | 2019-03-20 | ||
JPJP2019-053280 | 2019-03-20 | ||
JP2019053278 | 2019-03-20 | ||
JPJP2019-053278 | 2019-03-20 | ||
JP2019053279 | 2019-03-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202045677A true TW202045677A (zh) | 2020-12-16 |
Family
ID=72520259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109109267A TW202045677A (zh) | 2019-03-20 | 2020-03-19 | 黏著劑組成物、黏著帶、及電子零件之處理方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220162480A1 (zh) |
JP (2) | JP7433228B2 (zh) |
KR (1) | KR20210144654A (zh) |
CN (1) | CN113574083A (zh) |
TW (1) | TW202045677A (zh) |
WO (1) | WO2020189764A1 (zh) |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2601956B2 (ja) | 1991-07-31 | 1997-04-23 | リンテック株式会社 | 再剥離型粘着性ポリマー |
US8008419B2 (en) * | 2008-08-13 | 2011-08-30 | Designer Molecules, Inc. | Siloxane monomers and methods for use thereof |
KR20120057467A (ko) * | 2010-11-26 | 2012-06-05 | 삼성전자주식회사 | 실리콘 변성 그룹을 갖는 감광성 폴리이미드, 이를 포함하는 접착 조성물 및 반도체 패키지 |
JP2013077521A (ja) | 2011-09-30 | 2013-04-25 | Dainippon Printing Co Ltd | 電磁波剥離性フレキシブルデバイス用基板およびそれを用いた電子素子の製造方法 |
JPWO2013105582A1 (ja) * | 2012-01-12 | 2015-05-11 | 積水化学工業株式会社 | 粘着剤組成物、粘着テープ、及び、ウエハの処理方法 |
JP5929419B2 (ja) * | 2012-03-29 | 2016-06-08 | 日立化成株式会社 | 粘着剤組成物、フィルム状粘着剤及び被着体の剥離方法 |
JP5998762B2 (ja) * | 2012-09-03 | 2016-09-28 | 大日本印刷株式会社 | 粘着剤組成物及び粘着テープ |
TW201420709A (zh) * | 2012-10-11 | 2014-06-01 | Hitachi Chemical Co Ltd | 黏著劑組成物及其用途、積層體以及剝離方法 |
JP6221252B2 (ja) | 2013-02-21 | 2017-11-01 | 東レ株式会社 | ポリイミド樹脂、これを含有する樹脂組成物、これを用いた積層フィルムおよび積層体 |
WO2015035156A1 (en) * | 2013-09-05 | 2015-03-12 | The University Of Akron | Synthesis of cross-linked plant-oil based polymers using bismaleimides as crosslinkers |
JP2015199794A (ja) * | 2014-04-04 | 2015-11-12 | 日立化成株式会社 | 剥離方法 |
KR101884256B1 (ko) * | 2014-05-30 | 2018-08-01 | 후지필름 가부시키가이샤 | 가접착막, 적층체, 가접착용 조성물, 디바이스의 제조 방법 및 키트 |
JP2016132736A (ja) * | 2015-01-20 | 2016-07-25 | 日立化成株式会社 | ポリイミド樹脂組成物及び粘着シート |
JP2017122157A (ja) * | 2016-01-06 | 2017-07-13 | 日立化成株式会社 | 耐熱粘着樹脂、耐熱粘着組成物及びそれらを用いた粘着剤、積層体、接着方法 |
US20210301133A1 (en) * | 2017-06-24 | 2021-09-30 | Designer Molecules, Inc. | Curable polyimides |
JP6693487B2 (ja) * | 2017-08-24 | 2020-05-13 | 大日本印刷株式会社 | 保護シートおよび保護シート付積層体 |
JP7323314B2 (ja) * | 2018-03-28 | 2023-08-08 | 積水化学工業株式会社 | 樹脂材料、積層フィルム及び多層プリント配線板 |
-
2020
- 2020-03-19 WO PCT/JP2020/012354 patent/WO2020189764A1/ja active Application Filing
- 2020-03-19 JP JP2020529778A patent/JP7433228B2/ja active Active
- 2020-03-19 TW TW109109267A patent/TW202045677A/zh unknown
- 2020-03-19 CN CN202080020403.6A patent/CN113574083A/zh active Pending
- 2020-03-19 KR KR1020217017753A patent/KR20210144654A/ko not_active Application Discontinuation
- 2020-03-19 US US17/439,576 patent/US20220162480A1/en active Pending
-
2024
- 2024-02-06 JP JP2024016391A patent/JP2024036541A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JP7433228B2 (ja) | 2024-02-19 |
CN113574083A (zh) | 2021-10-29 |
JP2024036541A (ja) | 2024-03-15 |
JPWO2020189764A1 (zh) | 2020-09-24 |
US20220162480A1 (en) | 2022-05-26 |
KR20210144654A (ko) | 2021-11-30 |
WO2020189764A1 (ja) | 2020-09-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7194313B2 (ja) | 硬化性樹脂組成物、仮固定材、及び、電子部品の製造方法 | |
JP2004327801A (ja) | ダイシング・ダイボンド用接着テープ | |
TW200918626A (en) | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | |
KR20150071015A (ko) | 점착제 조성물, 적층체 및 박리 방법 | |
JP2023104983A (ja) | 仮固定材、及び、電子部品の製造方法 | |
WO2021225163A1 (ja) | 粘着剤組成物、粘着テープ、及び、電子部品の処理方法 | |
JP2023121157A (ja) | ポリイミド樹脂、硬化性樹脂組成物、仮固定材、及び、電子部品の製造方法 | |
TW202045677A (zh) | 黏著劑組成物、黏著帶、及電子零件之處理方法 | |
KR20220081951A (ko) | 점착제 조성물, 점착 테이프, 및, 전자 부품의 제조 방법 | |
JP2017122157A (ja) | 耐熱粘着樹脂、耐熱粘着組成物及びそれらを用いた粘着剤、積層体、接着方法 | |
JP2023138418A (ja) | 電子部品の製造方法 | |
JP2023145379A (ja) | 半導体装置の製造方法 | |
JP2024045085A (ja) | 接着性フィルム、及び、電子部品の製造方法 | |
JP2023109307A (ja) | 硬化性樹脂組成物、仮固定材、及び、電子部品の製造方法 | |
JP2023145374A (ja) | 積層体、積層体の製造方法、及び、半導体装置の製造方法 | |
JP2024045084A (ja) | 仮固定材、及び、電子部品の製造方法 | |
JP2024045086A (ja) | セパレータ付き仮固定材及び巻回体 | |
WO2024063112A1 (ja) | 樹脂組成物、仮固定材、及び、電子部品の製造方法 | |
JP2024044715A (ja) | 電子部品の製造方法 |