CN113574083A - 粘合剂组合物、粘合带及电子部件的处理方法 - Google Patents
粘合剂组合物、粘合带及电子部件的处理方法 Download PDFInfo
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- CN113574083A CN113574083A CN202080020403.6A CN202080020403A CN113574083A CN 113574083 A CN113574083 A CN 113574083A CN 202080020403 A CN202080020403 A CN 202080020403A CN 113574083 A CN113574083 A CN 113574083A
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- QGOKIEUFWNCGFO-UHFFFAOYSA-N propanoic acid;pyrrole-2,5-dione Chemical compound CCC(O)=O.O=C1NC(=O)C=C1 QGOKIEUFWNCGFO-UHFFFAOYSA-N 0.000 description 1
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- JRDBISOHUUQXHE-UHFFFAOYSA-N pyridine-2,3,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)N=C1C(O)=O JRDBISOHUUQXHE-UHFFFAOYSA-N 0.000 description 1
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- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- 239000004094 surface-active agent Substances 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- LUEGQDUCMILDOJ-UHFFFAOYSA-N thiophene-2,3,4,5-tetracarboxylic acid Chemical compound OC(=O)C=1SC(C(O)=O)=C(C(O)=O)C=1C(O)=O LUEGQDUCMILDOJ-UHFFFAOYSA-N 0.000 description 1
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- 239000010936 titanium Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 238000001132 ultrasonic dispersion Methods 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
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Abstract
本发明的目的在于提供:即使在固定了被粘物的状态下经过300℃以上的高温加工处理后,也能够通过照射光而容易地剥离的粘合剂组合物;具有由该粘合剂组合物形成的粘合剂层的粘合带;以及电子部件的处理方法。本发明粘合剂组合物包含在主链具有聚酰亚胺骨架、且在侧链或末端具有包含双键的官能团的反应性树脂以及硅酮化合物或氟化合物。
Description
技术领域
本发明涉及粘合剂组合物、粘合带及电子部件的处理方法。
背景技术
在半导体等电子部件的加工时,为了使电子部件的处理变得容易、不发生破损,而借助粘合剂组合物将电子部件固定于支撑板、或者将粘合带贴附于电子部件来进行保护。例如,在将从高纯度的单晶硅等切出的厚膜晶片磨削至规定的厚度而制成薄膜晶片的情况下,借助粘合剂组合物将厚膜晶片粘接于支撑板。
对于这样用于电子部件的粘合剂组合物、粘合带,要求在加工工序中能够牢固地固定电子部件的高粘接性,并且要求在工序结束后能够在不损伤电子部件的情况下进行剥离(以下,也称为“高粘接易剥离”。)。
作为高粘接易剥离的实现手段,例如专利文献1中公开了一种粘合片,其使用了在聚合物的侧链或主链上键合有具有放射线聚合性官能团的多官能性单体或低聚物的粘合剂。通过具有放射线聚合性官能团,从而聚合物通过紫外线照射而固化,利用这一点,通过在剥离时照射紫外线从而粘合力降低,能够无残胶地进行剥离。
现有技术文献
专利文献
专利文献1:日本特开平5-32946号公报
发明内容
发明要解决的课题
伴随着近年来的电子部件的高性能化,已进行对电子部件实施各种加工的工序。例如,在通过溅射而在电子部件的表面形成金属薄膜的工序中,通过在300~350℃左右的高温下进行加工,能够形成导电性更优异的金属薄膜。然而,如果对使用以往的粘合剂组合物、粘合带进行了保护的电子部件进行300℃以上的高温加工处理,则有时引起粘接亢进(日文:亢進),在剥离时粘合力没有充分降低、或者产生残胶。
鉴于上述现状,本发明的目的在于提供:即使在固定了被粘物的状态下经过300℃以上的高温加工处理后,也能够通过照射光而容易地剥离的粘合剂组合物;具有包含该粘合剂组合物的粘合剂层的粘合带;以及电子部件的处理方法。
用于解决课题的手段
本发明的粘合剂组合物包含反应性树脂、以及硅酮化合物或氟化合物,所述反应性树脂在主链具有酰亚胺骨架、且在侧链或末端具有包含双键的官能团。
以下,详细说明本发明。
作为本发明的一个实施方式的粘合剂组合物包含:在主链具有酰亚胺骨架、且在侧链或末端具有包含双键的官能团的反应性树脂(以下,也简称为“反应性树脂”。)。
上述反应性树脂通过在主链中具有酰亚胺骨架,从而耐热性极其优异,即使在经过300℃以上的高温加工处理后,也不易发生主链的分解,能够防止发生粘接亢进、或者在剥离时产生残胶。另外,通过使上述反应性树脂在侧链或末端具有包含双键的官能团,从而能够通过光的照射使粘合剂组合物的整体均匀且迅速地聚合交联,弹性模量上升,由此粘合力大幅降低,能够容易地剥离。
作为存在于上述反应性树脂的侧链或末端的包含双键的官能团,例如可举出:可以被取代的马来酰亚胺基、柠康酰亚胺基、乙烯基醚基、烯丙基、(甲基)丙烯酰基等。其中,从得到更高的耐热性的方面出发,优选可以被取代的马来酰亚胺基。
上述反应性树脂优选包含双键的官能团当量(重均分子量/包含双键的官能团的数量)为4000以下。通过使上述官能团当量为4000以下,粘合剂组合物能够发挥更高的耐热性。认为这是因为:通过在反应性树脂的分子中以一定以上的密度具有包含双键的官能团,交联间距离变短,由此进一步抑制了由加热引起的粘接亢进。上述官能团当量更优选为3000以下,进一步优选为2000以下。上述官能团当量的下限没有特别限定,实质上,下限为600左右。
上述反应性树脂的重均分子量优选为5000以上。通过使上述反应性树脂的重均分子量为5000以上,从而成膜变得容易,并且所得到的膜发挥一定程度的柔软性,因此能够对具有凹凸的被粘物发挥高追随性,能够容易地从被粘物剥离。上述反应性树脂的重均分子量更优选为10000以上,进一步优选为20000以上。上述反应性树脂的重均分子量的上限没有特别限定,但由于在溶剂中的溶解度降低,因此例如为300000,特别是100000。
需要说明的是,上述反应性树脂的重均分子量通过凝胶渗透色谱(GPC)法以聚苯乙烯换算分子量的形式进行测定。作为柱,例如可以使用HR-MB-M(品名,Waters公司制)等。
上述包含双键的官能团可以位于上述反应性树脂的侧链或末端中的任一位置。上述包含双键的官能团优选存在于上述反应性树脂的两末端,更优选除了两末端以外还进一步存在于侧链。上述反应性树脂的两末端的包含双键的官能团的反应性高,可以通过光的照射使粘合剂组合物充分固化。其结果是,能够进一步抑制粘接亢进,粘合剂组合物能够发挥更高的耐热性。
此外,通过使上述反应性树脂的侧链具有包含双键的官能团,粘合剂组合物能够发挥更高的耐热性。认为这是因为:通过使交联间距离变短,能够进一步抑制由加热引起的粘接亢进。另外,通过使上述反应性树脂的侧链具有包含双键的官能团,从而容易在使重均分子量为5000以上的同时将上述官能团当量调整为4000以下。由此,粘合剂组合物具有充分的初始粘合力,同时耐热性优异,即使进行300℃以上的高温加工处理粘接亢进也少,通过照射光而能够更容易地剥离。
作为上述反应性树脂,具体而言,例如可举出:具有下述通式(1a)所示的结构单元、下述通式(1b)所示的结构单元和下述通式(1c)所示的结构单元(其中,s≥1,t≥0,u≥0)、且两末端分别由X1和X2表示的反应性树脂(1)。
[化学式1]
上述通式(1a)~(1c)中,P1、P2和P3各自独立地表示芳香族基团,Q1表示取代或未取代的直链状、支链状或环状的脂肪族基团,Q2表示取代或未取代的具有芳香族结构的基团,R表示取代或未取代的支链状的脂肪族基团或芳香族基团。选自由X1、X2和X3组成的组中的至少1个表示包含双键的官能团。
上述通式(1a)~(1c)中,P1、P2、P3优选为碳原子数5~50的芳香族基团。通过使P1、P2、P3为碳原子数5~50的芳香族基团,从而作为本发明的一个实施方式的粘合剂组合物能够发挥特别高的耐热性。
上述通式(1a)中,Q1优选为取代或未取代的直链状、支链状或环状的碳原子数2~100的脂肪族基团。通过使Q1为取代或未取代的直链状、支链状或环状的碳原子数2~100的脂肪族基团,从而使用作为本发明的一个实施方式的粘合剂组合物而制造的粘合带能够发挥高柔软性,能够对具有凹凸的被粘物发挥高追随性,并且剥离性也提高。
另外,Q1优选为来自于后述那样的二胺化合物的脂肪族基团。其中,从提高柔软性的观点、以及与上述反应性树脂(1)的溶剂、其他成分的相容性增加而粘合带的制造变得容易的观点出发,Q1优选为来自于二聚物二胺的脂肪族基团。
上述来自于二聚物二胺的脂肪族基团没有特别限定,优选为选自由下述通式(4-1)所示的基团、下述通式(4-2)所示的基团、下述通式(4-3)所示的基团和下述通式(4-4)所示的基团组成的组中的至少1个。其中,更优选下述通式(4-2)所示的基团。
[化学式2]
上述通式(4-1)~(4-4)中,R1~R8和R13~R20各自独立地表示直链状或支链状的烃基。需要说明的是,*表示键合键。即,*与上述通式(1a)~(1c)中的N键合。
上述通式(4-1)~(4-4)中,R1~R8和R13~R20所示的烃基没有特别限定,可以为饱和烃基,也可以为不饱和烃基。其中,R1与R2、R3与R4、R5与R6、R7与R8、R13与R14、R15与R16、R17与R18、以及R19与R20的碳原子数的合计优选为7以上且50以下。通过使上述碳原子数的合计为上述范围内,从而使用作为本发明的一个实施方式的粘合剂组合物而制造的粘合带能够发挥更高的柔软性,另外,上述反应性树脂(1)与溶剂、其他成分的相容性也进一步增加。上述碳原子数的合计更优选为9以上,进一步优选为12以上,更进一步优选为14以上。上述碳原子数的合计更优选为35以下,进一步优选为25以下,更进一步优选为18以下。
上述通式(4-1)所示的基团、上述通式(4-2)所示的团、上述通式(4-3)所示的团以及上述通式(4-4)所示的基团中,光学异构没有特别限定,也包含任意光学异构。
上述通式(1b)中,Q2优选为取代或未取代的具有碳原子数5~50的芳香族结构的基团。通过使Q2为取代或未取代的具有碳原子数5~50的芳香族结构的基团,从而作为本发明的一个实施方式的粘合剂组合物能够发挥特别高的耐热性。
上述通式(1c)中,R优选为取代或未取代的支链状的碳原子数2~100的脂肪族基团或芳香族基团。通过使R为取代或未取代的支链状的碳原子数2~100的脂肪族基团或芳香族基团,从而使用作为本发明的一个实施方式的粘合剂组合物而制造的粘合带能够发挥高柔软性,能够对具有凹凸的被粘物发挥高追随性,并且剥离性也提高。
上述通式(1c)中,R为具有芳香族酯基或芳香族醚基的芳香族基团,R中的该芳香族酯基或该芳香族醚基优选与X3键合。
在此,“芳香族酯基”是指在芳香族环上直接键合有酯基的基团,“芳香族醚基”是指在芳香族环上直接键合有醚基的基团。通过像这样使与酯基、醚基键合的部分为芳香族基团,从而粘合剂组合物能够发挥高耐热性。另一方面,X3借由芳香族酯基或芳香族醚基与R键合,由此X3中的双键不会与R共轭,因此不会妨碍照射光时的聚合交联。
上述反应性树脂(1)中,包含双键的官能团(交联性不饱和键)为选自X1、X2和X3中的至少1个即可,优选至少X3为包含双键的官能团。通过至少使X3为包含双键的官能团,从而粘合剂组合物能够发挥更高的耐热性。
在上述X1、X2和X3中的任意者为包含双键的官能团以外的官能团(不具有双键的官能团)的情况下,作为该不具有双键的官能团,各自独立地可举出例如脂肪族基团、脂环式基团、芳香族基团、酸酐、胺化合物等。具体而言,可举出:成为上述反应性树脂(1)的原料的酸酐、二胺化合物的单末端未反应物。
上述反应性树脂(1)中,作为包含双键的官能团,例如可举出:可以被取代的马来酰亚胺基、柠康酰亚胺基、乙烯基醚基、烯丙基、(甲基)丙烯酰基等。其中,从得到更高的耐热性的方面出发,优选为可以被取代的马来酰亚胺基或烯丙基,特别是从得到高粘接性的方面出发,更优选为具有1个以上烯丙基的三(异)氰脲酸酯基。
上述通式(1a)~(1c)中,s为1以上,优选为3以上,优选为10以下,更优选为5以下。上述通式(1a)~(1c)中,t为0以上,优选为1以上,更优选为3以上,优选为10以下,更优选为5以下。上述通式(1a)~(1c)中,u为0以上,优选为1以上,更优选为3以上,优选为10以下,更优选为5以下。在上述通式(1a)~(1c)中,如果s、t和u为上述范围内,则能够通过固化容易地剥离。
需要说明的是,上述反应性树脂(1)中,上述通式(1a)所示的结构单元、上述通式(1b)所示的结构单元和上述通式(1c)所示的结构单元可以是包含各自的结构单元连续排列而成的嵌段成分的嵌段共聚物,也可以是各自的结构单元随机排列而得的无规共聚物。
上述反应性树脂例如可以通过使二胺化合物与芳香族酸酐反应而制备酰亚胺化合物,进一步使该酰亚胺化合物的官能团、与具有与该官能团反应的官能团和包含双键的官能团的化合物(以下,称为含官能团的不饱和化合物。)反应而得到。
作为上述二胺化合物,可以使用脂肪族二胺化合物或芳香族二胺化合物中的任一种。
通过使用脂肪族二胺化合物作为上述二胺化合物,从而使用作为本发明的一个实施方式的粘合剂组合物而制造的粘合带能够发挥高柔软性,能够对具有凹凸的被粘物发挥高追随性,并且剥离性也提高。
通过使用芳香族二胺化合物作为上述二胺化合物,从而作为本发明的一个实施方式的粘合剂组合物的耐热性进一步提高。
另外,通过使用具有官能团的二胺化合物作为上述二胺化合物,使该官能团与上述含官能团的不饱和化合物反应,从而能够制造在侧链具有包含双键的官能团的反应性树脂。
这些脂肪族二胺化合物、芳香族二胺化合物和具有官能团的二胺化合物可以单独使用,也可以并用2种以上。
作为上述脂肪族二胺化合物,例如可举出:1,10-二氨基癸烷、1,12-二氨基十二烷、二聚物二胺、1,2-二氨基-2-甲基丙烷、1,2-二氨基环己烷、1,2-二氨基丙烷、1,3-二氨基丙烷、1,4-二氨基丁烷、1,5-二氨基戊烷、1,7-二氨基庚烷、1,8-二氨基薄荷烷、1,8-二氨基辛烷、1,9-二氨基壬烷、3,3’-二氨基-N-甲基二丙胺、二氨基马来腈、1,3-二氨基戊烷、双(4-氨基-3-甲基环己基)甲烷、1,2-双(2-氨基乙氧基)乙烷、3(4),8(9)-双(氨基甲基)三环(5.2.1.02,6)癸烷等。
作为上述芳香族二胺化合物,例如可举出:9,10-二氨基菲、4,4’-二氨基八氟联苯、3,7-二氨基-2-甲氧基芴、4,4’-二氨基二苯甲酮、3,4-二氨基二苯甲酮、3,4-二氨基甲苯、2,6-二氨基蒽醌、2,6-二氨基甲苯、2,3-二氨基甲苯、1,8-二氨基萘、2,4-二氨基甲苯、2,5-二氨基甲苯、1,4-二氨基蒽醌、1,5-二氨基蒽醌、1,5-二氨基萘、1,2-二氨基蒽醌、2,4-异丙苯二胺、1,3-双氨基甲苯、1,3-双氨基甲基环己烷、2-氯-1,4-二氨基苯、1,4-二氨基-2,5-二氯苯、1,4-二氨基-2,5-二甲基苯、4,4’-二氨基-2,2’-双(三氟甲基)联苯、双(氨基-3-氯苯基)乙烷、双(4-氨基-3,5-二甲基苯基)甲烷、双(4-氨基-3,5-二乙基苯基)甲烷、双(4-氨基-3-乙基二氨基芴、2,3-二氨基萘、2,3-二氨基苯酚、-5-甲基苯基)甲烷、双(4-氨基-3-甲基苯基)甲烷、双(4-氨基-3-乙基苯基)甲烷、4,4’-二氨基苯基砜、3,3’-二氨基苯基砜、2,2-双(4,(4氨基苯氧基)苯基)砜、2,2-双(4-(3-氨基苯氧基)苯基)砜、4,4’-氧基二苯胺、4,4’-二氨基二苯基硫醚、3,4’-氧基二苯胺、2,2-双(4-(4-氨基苯氧基)苯基)丙烷、1,3-双(4-氨基苯氧基)苯、4,4’-双(4-氨基苯氧基)联苯、4,4’-二氨基-3,3’-二羟基联苯、4,4’-二氨基-3,3’-二甲基联苯、4,4’-二氨基-3,3’-二甲氧基联苯、Bisaniline M、Bisaniline P、9,9-双(4-氨基苯基)芴、邻联甲苯胺砜、亚甲基双(邻氨基苯甲酸)、1,3-双(4-氨基苯氧基)-2,2-二甲基丙烷、1,3-双(4-氨基苯氧基)丙烷、1,4-双(4-氨基苯氧基)丁烷、1,5-双(4-氨基苯氧基)丁烷、2,3,5,6-四甲基-1,4-苯二胺、3,3’,5,5’-四甲基联苯胺、4,4’-二氨基苯甲酰苯胺、2,2-双(4-氨基苯基)六氟丙烷、聚氧化烯二胺类(例如Huntsman的Jeffamine D-230、D400、D-2000和D-4000)、1,3-环己烷双(甲胺)、间苯二甲胺、对苯二甲胺等。
上述脂肪族二胺化合物中,从提高柔软性的观点、以及上述反应性树脂与溶剂、其他成分的相容性增加从而粘合带的制造变得容易的观点出发,优选二聚物二胺。
上述二聚物二胺是指,将作为不饱和脂肪酸的二聚体而得到的环式和非环式二聚酸还原并氨基化而得到的二胺化合物,例如可举出直链型、单环型、多环型等二聚物二胺。上述二聚物二胺可以包含碳-碳不饱和双键,也可以为加成了氢的氢化物。作为上述二聚物二胺,更具体而言,例如可举出:能够构成上述的通式(4-1)所示的基团、通式(4-2)所示的基团、通式(4-3)所示的基团和通式(4-4)所示的基团的二聚物二胺等。
作为具有上述官能团的二胺化合物,例如可举出具有羟基的二胺化合物、具有羧基的二胺化合物、具有卤素基团的二胺化合物等。
作为上述具有羟基的二胺化合物,例如可举出:1,3-二氨基-2-丙醇、2,4-二氨基苯氧基乙醇、3,5-二氨基苯氧基乙醇、2,4-二氨基苯酚、3,5-二氨基苯酚、2,4-二氨基苄醇、4,6-二氨基间苯二酚二盐酸盐、2,2-双(3-氨基-4-羟基苯基)六氟丙烷等。作为上述具有羧基的二胺化合物,例如可举出3,5-二氨基苯甲酸等。作为上述具有卤素基团的二胺化合物,例如可举出2,4-二氨基氯苯等。
作为上述芳香族酸酐,例如可举出:均苯四酸、1,2,5,6-萘四甲酸、2,3,6,7-萘四甲酸、1,2,4,5-萘四甲酸、1,4,5,8-萘四甲酸、3,3’,4,4’-二苯甲酮四甲酸、3,3’,4,4’-联苯醚四甲酸、3,3’,4,4’-联苯四甲酸、2,3,5,6-吡啶四甲酸、3,4,9,10-苝四甲酸、4,4’-磺酰基二邻苯二甲酸、1-三氟甲基-2,3,5,6-苯四甲酸、2,2’,3,3’-联苯四甲酸、2,2-双(3,4-二羧基苯基)丙烷、2,2-双(2,3-二羧基苯基)丙烷、1,1-双(2,3-二羧基苯基)乙烷、1,1-双(3,4-二羧基苯基)乙烷、双(2,3-二羧基苯基)甲烷、双(3,4-二羧基苯基)甲烷、双(3,4-二羧基苯基)砜、双(3,4-二羧基苯基)醚、苯-1,2,3,4-四甲酸、2,3,2’,3’-二苯甲酮四甲酸、2,3,3’,4’-二苯甲酮四甲酸、菲-1,8,9,10-四甲酸、吡嗪-2,3,5,6-四甲酸、噻吩-2,3,4,5-四甲酸、2,3,3’,4’-联苯四甲酸、3,4,3’,4’-联苯四甲酸、2,3,2’,3’-联苯四甲酸、4,4’-双(3,4-二羧基苯氧基)二苯基硫醚、4,4’-(4,4’-异亚丙基二苯氧基)-双(邻苯二甲酸)等。
作为上述含官能团的不饱和化合物,根据上述酰亚胺化合物的末端或侧链的官能团来选择使用。
例如,在上述酰亚胺化合物的末端或侧链的官能团为羟基的情况下,可举出具有羧基的马来酰亚胺化合物。作为该具有羧基的马来酰亚胺化合物,例如可举出:乙酸马来酰亚胺、马来酰亚胺丙酸、马来酰亚胺丁酸、马来酰亚胺己酸、反式-4-(N-马来酰亚胺甲基)环己烷-1-甲酸、19-马来酰亚胺-17-氧代-4,7,10,13-四氧杂-16-氮杂十九烷酸等。此外,可举出:丁基乙烯基醚等具有醚基的乙烯基化合物、二烯丙基单缩水甘油基异氰脲酸酯等具有缩水甘油基的烯丙基化合物、烯丙基缩水甘油醚、甘油二烯丙基单缩水甘油醚等具有缩水甘油基的烯丙基醚化合物等。此外,可举出:缩水甘油氧基乙基乙烯基醚、缩水甘油氧基丁基乙烯基醚、缩水甘油氧基己基乙烯基醚、缩水甘油基二乙二醇乙烯基醚、缩水甘油基环己烷二甲醇单乙烯基醚等具有缩水甘油基的乙烯基醚化合物等。此外,可举出:烯丙基异氰酸酯等具有异氰酸酯基的烯丙基化合物、2-(甲基)丙烯酰氧基乙基异氰酸酯等具有异氰酸酯基的(甲基)丙烯酰基化合物等。
另外,例如,在上述酰亚胺化合物的末端或侧链的官能团为羧基的情况下,可举出:三羟甲基丙烷二烯丙基醚、季戊四醇三烯丙基醚等具有羟基的烯丙基化合物、二烯丙基单缩水甘油基异氰脲酸酯等具有缩水甘油基的烯丙基化合物等。此外,可举出:烯丙基缩水甘油醚、甘油二烯丙基单缩水甘油醚等具有缩水甘油基的烯丙基醚化合物等。此外,可举出:缩水甘油氧基乙基乙烯基醚、缩水甘油氧基丁基乙烯基醚、缩水甘油氧基己基乙烯基醚、缩水甘油基二乙二醇乙烯基醚、缩水甘油基环己烷二甲醇单乙烯基醚等具有缩水甘油基的乙烯基醚化合物等。
作为本发明的一个实施方式的粘合剂组合物包含硅酮化合物或氟化合物。
硅酮化合物和氟化合物的耐热性优异,因此即使经过300℃以上的高温加工工艺也能够防止粘合剂组合物的烧焦,在剥离时渗出至被粘物界面,使剥离变得容易。
上述硅酮化合物没有特别限定,例如可举出硅油、硅酮二丙烯酸酯、硅酮系接枝共聚物等。上述氟化合物没有特别限定,例如可举出具有氟原子的烃化合物等。
上述硅酮化合物或氟化合物优选具有能够与上述反应性树脂交联的官能团。通过使上述硅酮化合物或氟化合物具有能够与上述反应性树脂交联的官能团,从而通过剥离时的光照射等,上述硅酮化合物或氟化合物与上述反应性树脂发生化学反应而进入到上述反应性树脂中,因此能够抑制上述硅酮化合物或氟化合物附着于被粘物而发生污染的情形。
能够与上述反应性树脂交联的官能团没有特别限定,例如可举出:羧基、自由基聚合性的不饱和键(例如乙烯基、(甲基)丙烯酰基、可以被取代的马来酰亚胺基)、羟基、酰胺基、异氰酸酯基、环氧基等。
其中,从对环境友好、废弃较容易的观点出发,优选为具有能够与上述反应性树脂交联的官能团的硅酮化合物。
作为具有能够与上述反应性树脂交联的官能团的硅酮化合物,优选为在主链具有硅氧烷骨架、且在侧链或末端具有包含双键的官能团的硅酮化合物。
上述在主链具有硅氧烷骨架、且在侧链或末端具有包含双键的官能团的硅酮化合物没有特别限定,优选含有选自下述通式(I)所示的硅酮化合物、下述通式(II)所示的硅酮化合物以及下述通式(III)所示的硅酮化合物中的至少1种。这些硅酮化合物的耐热性特别高,极性高,因此容易从粘合剂组合物渗出。
[化学式3]
上述通式(I)、通式(II)、通式(III)中,X和Y各自独立地表示0~1200的整数,R表示包含双键的官能团。
上述通式(I)、通式(II)、通式(III)中,作为R所示的包含双键的官能团,例如可举出:可以被取代的马来酰亚胺基、柠康酰亚胺基、乙烯基醚基、烯丙基、(甲基)丙烯酰基等。其中,从得到更高的耐热性的方面出发,优选可以被取代的马来酰亚胺基。需要说明的是,上述通式(I)、通式(II)和通式(III)中,在存在多个R的情况下,多个R可以相同也可以不同。
上述通式(I)、通式(II)、通式(III)所示的在硅氧烷骨架上具有(甲基)丙烯酰基的硅酮化合物中的市售品例如可举出EBECRYL 350、EBECRYL 1360(均为Daicel-Cytec公司制)等。此外,可举出BYK-UV3500(BYK-Chemie公司制)、TEGO RAD2250(Evonik公司制)(R均为丙烯酰基)等。
作为本发明的一个实施方式的粘合剂组合物中的上述硅酮化合物或氟化合物的含量没有特别限定,相对于上述反应性树脂100重量份的优选的下限为0.1重量份,优选的上限为20重量份。如果上述硅酮化合物或氟化合物的含量为该范围内,则粘合剂组合物能够在不污染被粘物的情况下发挥优异的剥离性。从在抑制污染的同时进一步提高剥离性的观点出发,上述硅酮化合物或氟化合物的含量的更优选的下限为0.3重量份,更优选的上限为10重量份。
需要说明的是,作为本发明的一个实施方式的粘合剂组合物的耐热性优异,因此,即使使上述硅酮化合物或氟化合物的含量较少,也能够发挥充分的效果。因此,能够进一步减少由上述硅酮化合物或氟化合物导致的污染的可能性。
作为本发明的一个实施方式的粘合剂组合物优选还包含:具有两个以上在分子内包含双键的官能团、且分子量为5000以下的多官能单体或多官能低聚物(以下,也简称为“多官能单体或多官能低聚物”。)。通过包含这样的多官能单体或多官能低聚物,从而粘合剂组合物更高效地进行基于光照射的三维网状化,能够更容易地剥离。
作为上述多官能单体或多官能低聚物中的包含双键的官能团,例如可举出可以被取代的马来酰亚胺基、柠康酰亚胺基、乙烯基醚基、烯丙基、(甲基)丙烯酰基等。其中,从得到更高的耐热性的方面出发,优选可以被取代的马来酰亚胺基。
作为本发明的一个实施方式的粘合剂组合物中的上述多官能单体或多官能低聚物的含量没有特别限定,在上述反应性树脂和上述多官能单体或多官能低聚物的合计100重量份中所占的优选的下限为5重量份,优选的上限为100重量份。如果上述多官能单体或多官能低聚物的含量为该范围内,则粘合剂组合物能够发挥特别优异的剥离性。从进一步提高剥离性的观点出发,上述多官能单体或多官能低聚物的含量的更优选的下限为10重量份,更优选的上限为50重量份。
作为本发明的一个实施方式的粘合剂组合物,优选还包含光聚合引发剂。
作为上述光聚合引发剂,例如可举出通过照射250~800nm的波长的光而被活化的光聚合引发剂。
作为上述光聚合引发剂,例如可举出:甲氧基苯乙酮等苯乙酮衍生物化合物、苯偶姻丙醚、苯偶姻异丁醚等苯偶姻醚系化合物、苯偶酰二甲基缩酮、苯乙酮二乙基缩酮等缩酮衍生物化合物、氧化膦衍生物化合物等。此外,可举出:双(η5-环戊二烯基)二茂钛衍生物化合物、二苯甲酮、米蚩酮、氯噻吨酮、十二烷基噻吨酮、二甲基噻吨酮、二乙基噻吨酮、α-羟基环己基苯基酮、2-羟基甲基苯基丙烷等光自由基聚合引发剂。这些光聚合引发剂可以单独使用,也可以并用2种以上。
作为本发明的一个实施方式的粘合剂组合物中的上述光聚合引发剂的含量没有特别限定,相对于上述反应性树脂100重量份的优选的下限为0.1重量份,优选的上限为10重量份。如果上述光聚合引发剂的含量为该范围内,则通过照射光,从而粘合剂组合物的整体均匀且迅速地聚合交联,弹性模量上升,由此粘合力大幅降低,能够容易地剥离。上述光聚合引发剂的含量的更优选的下限为0.3重量份,更优选的上限为3重量份。
作为本发明的一个实施方式的粘合剂组合物可以还包含通过照射光而产生气体的气体产生剂。通过含有上述气体产生剂,从而即使在经过300℃以上的高温加工处理后,通过照射光而产生的气体也被释放至与被粘物的界面,因此能够更容易且无残胶地剥离被粘物。
作为上述气体产生剂,例如可举出四唑化合物或其盐、***化合物或其盐、偶氮化合物、叠氮化合物、呫吨酮乙酸、碳酸盐等。这些气体产生剂可以单独使用,也可以并用2种以上。其中,从耐热性特别优异的方面出发,优选四唑化合物或其盐。
作为本发明的一个实施方式的粘合剂组合物中的上述气体产生剂的含量没有特别限定,相对于上述反应性树脂100重量份的优选的下限为5重量份,优选的上限为50重量份。如果上述气体产生剂的含量为该范围内,则粘合剂组合物能够发挥特别优异的剥离性。上述气体产生剂的含量的更优选的下限为8重量份,更优选的上限为30重量份。
作为本发明的一个实施方式的粘合剂组合物例如可以包含光敏剂、热稳定剂、抗氧化剂、抗静电剂、增塑剂、树脂、表面活性剂、蜡、微粒填充剂等公知的添加剂。
作为上述微粒填充剂,可举出:包含选自硅、钛、铝、钙、硼、镁和氧化锆的氧化物、以及它们的复合物中的至少1种的无机填充剂。其中,由于具有与通常作为无机填充剂使用的二氧化硅类似的物性,所以优选硅-铝-硼复合氧化物、硅-钛复合氧化物和二氧化硅-二氧化钛复合氧化物。
上述无机填充剂的平均粒径没有特别限定,优选的下限为0.1μm,优选的上限为30μm。
上述无机填充剂的含量没有特别限定,相对于上述反应性树脂100重量份,优选的下限为30重量份,优选的上限为150重量份。上述无机填充剂的含量的更优选的下限为60重量份,更优选的上限为120重量份。
制造作为本发明的一个实施方式的粘合剂组合物的方法没有特别限定,例如可举出:使用珠磨机、超声波分散、均质机、高输出分散器、辊磨机等将上述反应性树脂、硅酮化合物或氟化合物、根据需要配合的添加剂混合的方法等。
具有由作为本发明的一个实施方式的粘合剂组合物形成的粘合剂层的粘合带也是本发明之一。
作为本发明的一个实施方式的粘合带可以是在基材的一个或两个面上具有由作为本发明的一个实施方式的粘合剂组合物形成粘合剂层的支承带,也可以是不具有基材的非支承带。
作为上述基材,例如可举出:亚克力(日文:アクリル)、烯烃、聚碳酸酯、氯乙烯、ABS、聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、尼龙、氨基甲酸酯、聚酰亚胺等透明树脂所形成的片材。另外,也可以使用具有网眼状的结构的片材、开有孔的片材等。
作为本发明的一个实施方式的粘合剂组合物和粘合带具有初始粘合力,另一方面,耐热性优异,即使进行300℃以上的高温加工处理,粘接亢进也少,可以通过照射光而容易地剥离。作为本发明的一个实施方式的粘合剂组合物和粘合带的耐热性特别优异,因此可以适合用于:进行300℃以上的高温加工处理的被粘物的保护、临时固定。特别是,在半导体等电子部件的加工时,为了使电子部件的处理容易、不发生破损,可以适合用于:借助粘合剂组合物或粘合带将电子部件固定于支撑板、或者将粘合带贴附于电子部件来进行保护。
具体而言,例如可举出一种电子部件的处理方法,其包括:在作为本发明的一个实施方式的粘合带上临时固定电子部件的工序、对粘合带照射光的工序、对电子部件进行热处理的工序、以及从电子部件剥离粘合带的工序。这样的电子部件的处理方法也是本发明之一。
对上述粘合带照射光的工序可以在即将进行从上述电子部件剥离粘合带的工序之前进行,但优选在将电子部件临时固定于上述粘合带上的工序之后、且对上述电子部件进行热处理的工序之前进行。通过在对上述电子部件进行热处理的工序之前进行对上述粘合带照射光的工序,从而粘合带能够发挥更优异的耐热性。
发明的效果
根据本发明,能够提供:即使在固定了被粘物的状态下经过300℃以上的高温加工处理后,也能够通过照射光而容易地剥离的粘合剂组合物;具有由该粘合剂组合物形成的粘合剂层的粘合带;以及电子部件的处理方法。
具体实施方式
以下,列举实施例更详细地说明本发明的方式,但本发明并不仅限定于这些实施例。
(反应性树脂的制备)
(1)反应性树脂1的制备
向放入了特氟龙(注册商标)搅拌子的500mL的圆底烧瓶中投入250mL的甲苯。接下来,加入三乙胺35g(0.35摩尔)和甲磺酸酐35g(0.36摩尔)并搅拌,形成盐。搅拌10分钟后,依次加入二聚物二胺(Croda公司制,Priamine 1075)56g(0.1摩尔)和均苯四甲酸酐19.1g(0.09摩尔)。将Dean-Stark分离器和冷凝器安装于烧瓶,并将混合物回流2小时,形成胺封端(日文:アミン末端)的二酰亚胺。将反应产物冷却至室温以下后,加入马来酸酐12.8g(0.13摩尔),接下来,加入甲磺酸酐5g(0.05摩尔)。将混合物进一步回流12小时后,冷却至室温,将甲苯300mL加入到烧瓶中,通过静置使杂质沉淀并除去。将所得到的溶液通过填充有硅胶的玻璃料漏斗进行过滤后,真空除去溶剂,得到琥珀色蜡状的、主链具有酰亚胺骨架且两末端具有马来酰亚胺基的下述式(1-1)所示的反应性树脂1。
对于所得到的反应性树脂1,通过使用THF作为洗脱液、使用HR-MB-M(品名,Waters公司制)作为柱的凝胶渗透色谱(GPC)法进行测定,结果重均分子量为5000。
[化学式4]
(2)反应性树脂2的制备
向放入了特氟龙(注册商标)搅拌子的500mL的圆底烧瓶中投入250mL的甲苯。接下来,加入三乙胺35g(0.35摩尔)和甲磺酸酐35g(0.36摩尔)并搅拌,形成盐。搅拌10分钟后,依次加入二聚物二胺(Croda公司制,Priamine 1075)28g(0.05摩尔)、1,3-二氨基-2-丙醇4.5g(0.05摩尔)和均苯四甲酸酐21.8g(0.1摩尔)。将Dean-Stark管和冷凝器安装于烧瓶,将混合物回流2小时,合成含羟基的聚酰亚胺。将反应混合物冷却至室温后,加入马来酰亚胺己酸(东京化成公司制)10.5g(0.05摩尔),进一步回流12小时。冷却至室温,向烧瓶中加入甲苯300mL,通过静置使杂质沉淀、除去。将所得到的溶液通过填充有硅胶的玻璃料漏斗进行过滤后,真空除去溶剂,得到琥珀色蜡状的、主链具有酰亚胺骨架且侧链具有马来酰亚胺基的下述式(1-2)所示的反应性树脂2。
对于所得到的反应性树脂2,通过使用THF作为洗脱液、使用HR-MB-M(品名,Waters公司制)作为柱的凝胶渗透色谱(GPC)法进行测定,结果重均分子量为30000。
[化学式5]
(3)反应性树脂3的制备
向放入了特氟龙(注册商标)搅拌子的500mL的圆底烧瓶中投入250mL的甲苯。接下来,加入三乙胺35g(0.35摩尔)和甲磺酸酐35g(0.36摩尔)并搅拌,形成盐。搅拌10分钟后,依次加入二聚物二胺(Croda公司制,Priamine 1075)28g(0.05摩尔)、1,3-二氨基-2-丙醇4.5g(0.05摩尔)和均苯四甲酸酐21.8g(0.1摩尔)。将Dean-Stark管和冷凝器安装于烧瓶,将混合物回流2小时,合成含羟基的聚酰亚胺。将反应混合物冷却至室温后,将大大过量的丁基乙烯基醚(东京化成公司制)200g和乙酸钯菲咯啉络合物0.1g加入到烧瓶中,在60℃下回流14小时。通过蒸发器蒸馏除去过量的丁基乙烯基醚。冷却至室温,向烧瓶中加入甲苯300mL,通过静置使杂质沉淀、除去。将所得到的溶液通过填充有硅胶的玻璃料漏斗进行过滤后,真空除去溶剂,得到琥珀色蜡状的、主链具有酰亚胺骨架且侧链具有乙烯基醚基的下述式(1-3)所示的反应性树脂3。
对于所得到的反应性树脂3,通过使用THF作为洗脱液、使用HR-MB-M(品名,Waters公司制)作为柱的凝胶渗透色谱(GPC)法进行测定,结果重均分子量为30000。
[化学式6]
(4)反应性树脂4的制备
向放入了特氟龙(注册商标)搅拌子的500mL的圆底烧瓶中投入250mL的甲苯。接下来,加入三乙胺35g(0.35摩尔)和甲磺酸酐35g(0.36摩尔)并搅拌,形成盐。搅拌10分钟后,依次加入二聚物二胺(Croda公司制,Priamine 1075)28g(0.05摩尔)、3,5-二氨基苯甲酸7.6g(0.05摩尔)和均苯四甲酸酐21.8g(0.1摩尔)。将Dean-Stark管和冷凝器安装于烧瓶,将混合物回流2小时,合成含羧酸的聚酰亚胺。将反应混合物冷却至室温后,向烧瓶中加入甲苯300mL,通过静置使杂质沉淀、除去。将所得到的溶液通过填充有硅胶的玻璃料漏斗进行过滤后,加入二烯丙基单缩水甘油基异氰脲酸酯(四国化成制)13.3g(0.05摩尔)和三乙胺3g(0.3摩尔),进一步加热3小时。冷却至室温,真空除去溶剂,得到琥珀色蜡状的、主链具有酰亚胺骨架且侧链具有二烯丙基异氰脲酸酯基的下述式(1-4)所示的反应性树脂4。
对于所得到的反应性树脂4,通过使用THF作为洗脱液、使用HR-MB-M(品名,Waters公司制)作为柱的凝胶渗透色谱(GPC)法进行测定,结果重均分子量为35000。
[化学式7]
(5)反应性树脂5的制备
向放入了特氟龙(注册商标)搅拌子的500mL的圆底烧瓶中投入250mL的甲苯。接下来,加入三乙胺35g(0.35摩尔)和甲磺酸酐35g(0.36摩尔)并搅拌,形成盐。搅拌10分钟后,依次加入二聚物二胺(Croda公司制,Priamine 1075)47.8g(0.09摩尔)、Bis-AP-AF 3.7g(0.01摩尔)和均苯四甲酸酐21.8g(0.1摩尔)。将Dean-Stark管和冷凝器安装于烧瓶,将混合物回流2小时,合成含羧酸的聚酰亚胺。将反应混合物冷却至室温后,向烧瓶中加入甲苯300mL,通过静置使杂质沉淀、除去。将所得到的溶液通过填充有硅胶的玻璃料漏斗进行过滤后,加入马来酰亚胺己酸4.2g(0.02摩尔)和三乙胺3g(0.3摩尔),进一步加热3小时。冷却至室温,真空除去溶剂,得到琥珀色蜡状的、主链具有酰亚胺骨架且侧链具有马来酰亚胺基的下述式(1-5)所示的反应性树脂5。
对于所得到的反应性树脂5,通过使用THF作为洗脱液、使用HR-MB-M(品名,Waters公司制)作为柱的凝胶渗透色谱(GPC)法进行测定,结果重均分子量为35000。
[化学式8]
(6)反应性树脂6的制备
向放入了特氟龙(注册商标)搅拌子的500mL的圆底烧瓶中投入250mL的甲苯。接下来,加入三乙胺35g(0.35摩尔)和甲磺酸酐35g(0.36摩尔)并搅拌,形成盐。搅拌10分钟后,依次加入二聚物二胺(Croda公司制,Priamine 1075)31.9g(0.06摩尔)、14.7g(0.04摩尔)的Bis-AP-AF和均苯四甲酸酐21.8g(0.1摩尔)。将Dean-Stark管和冷凝器安装于烧瓶,将混合物回流2小时,合成含羧酸的聚酰亚胺。将反应混合物冷却至室温后,向烧瓶中加入甲苯300mL,通过静置使杂质沉淀、除去。将所得到的溶液通过填充有硅胶的玻璃料漏斗进行过滤后,加入马来酰亚胺己酸16.9g(0.08摩尔)和三乙胺3g(0.3摩尔),进一步加热3小时。冷却至室温,真空除去溶剂,得到琥珀色蜡状的、主链具有酰亚胺骨架且侧链具有马来酰亚胺基的上述式(1-5)所示的反应性树脂6。
对于所得到的反应性树脂6,通过使用THF作为洗脱液、使用HR-MB-M(品名,Waters公司制)作为柱的凝胶渗透色谱(GPC)法进行测定,结果重均分子量为35000。
(7)反应性树脂7的制备
向放入了特氟龙(注册商标)搅拌子的500mL的圆底烧瓶中投入250mL的甲苯。接下来,加入三乙胺35g(0.35摩尔)和甲磺酸酐35g(0.36摩尔)并搅拌,形成盐。搅拌10分钟后,依次加入二聚物二胺(Croda公司制,Priamine 1075)42.5g(0.08摩尔)、7.3g(0.02摩尔)的Bis-AP-AF和均苯四甲酸酐21.8g(0.1摩尔)。将Dean-Stark管和冷凝器安装于烧瓶,将混合物回流2小时,合成含羧酸的聚酰亚胺。将反应混合物冷却至室温后,向烧瓶中加入甲苯300mL,通过静置使杂质沉淀、除去。将所得到的溶液通过填充有硅胶的玻璃料漏斗进行过滤后,加入GO-BVE(缩水甘油氧基丁基乙烯基醚,NIPPON CARBIDE公司制)8.6g(0.04摩尔)和三乙胺3g(0.3摩尔),进一步加热3小时。冷却至室温,真空除去溶剂,得到琥珀色蜡状的、主链具有酰亚胺骨架且侧链具有乙烯基醚基的下述式(1-6)所示的反应性树脂7。
对于所得到的反应性树脂7,通过使用THF作为洗脱液、使用HR-MB-M(品名,Waters公司制)作为柱的凝胶渗透色谱(GPC)法进行测定,结果重均分子量为35000。
[化学式9]
(8)反应性树脂8的制备
向放入了特氟龙(注册商标)搅拌子的500mL的圆底烧瓶中投入250mL的甲苯。接下来,加入三乙胺35g(0.35摩尔)和甲磺酸酐35g(0.36摩尔)并搅拌,形成盐。搅拌10分钟后,依次加入二聚物二胺(Croda公司制,Priamine 1075)42.5g(0.08摩尔)、7.3g(0.02摩尔)的Bis-AP-AF和均苯四甲酸酐21.8g(0.1摩尔)。将Dean-Stark管和冷凝器安装于烧瓶,将混合物回流2小时,合成含羧酸的聚酰亚胺。将反应混合物冷却至室温后,向烧瓶中加入甲苯300mL,通过静置使杂质沉淀、除去。将所得到的溶液通过填充有硅胶的玻璃料漏斗进行过滤后,加入DA-MGIC(二氨基单缩水甘油基异氰脲酸酯,四国化成公司制)10.6g(0.04摩尔)和三乙胺3g(0.3摩尔),进一步加热3小时。冷却至室温,真空除去溶剂,得到琥珀色蜡状的、主链具有酰亚胺骨架且侧链具有烯丙基的下述式(1-7)所示的反应性树脂8。
对于所得到的反应性树脂8,通过使用THF作为洗脱液、使用HR-MB-M(品名,Waters公司制)作为柱的凝胶渗透色谱(GPC)法进行测定,结果重均分子量为35000。
[化学式10]
(9)反应性树脂9的制备
向放入了特氟龙(注册商标)搅拌子的500mL的圆底烧瓶中投入250mL的甲苯。接下来,加入三乙胺35g(0.35摩尔)和甲磺酸酐35g(0.36摩尔)并搅拌,形成盐。搅拌10分钟后,依次加入二聚物二胺(Croda公司制,Priamine 1075)21.2g(0.04摩尔)、2,2-双[4-(4-氨基苯氧基)苯基]丙烷12.3g(0.03摩尔)、11.0g(0.03摩尔)的Bis-AP-AF和均苯四甲酸酐21.8g(0.1摩尔)。将Dean-Stark管和冷凝器安装于烧瓶,将混合物回流2小时,合成含羧酸的聚酰亚胺。将反应混合物冷却至室温后,向烧瓶中加入甲苯300mL,通过静置使杂质沉淀、除去。将所得到的溶液通过填充有硅胶的玻璃料漏斗进行过滤后,加入DA-MGIC(二氨基单缩水甘油基异氰脲酸酯,四国化成公司制)15.9g(0.06摩尔)和三乙胺3g(0.3摩尔),进一步加热3小时。冷却至室温,真空除去溶剂,得到琥珀色固体的、主链具有酰亚胺骨架且侧链具有烯丙基的下述式(1-8)所示的反应性树脂9。
对于所得到的反应性树脂9,通过使用THF作为洗脱液、使用HR-MB-M(品名,Waters公司制)作为柱的凝胶渗透色谱(GPC)法进行测定,结果重均分子量为35000。
[化学式11]
(丙烯酸系反应性树脂的制备)
准备具备温度计、搅拌机、冷凝管的反应器,向该反应器内加入作为(甲基)丙烯酸烷基酯的丙烯酸2-乙基己酯94重量份、作为含官能团的单体的甲基丙烯酸羟基乙酯6重量份、月桂硫醇0.01重量份和乙酸乙酯80重量份后,将反应器加热而开始回流。接下来,向上述反应器内添加作为聚合引发剂的1,1-双(叔己基过氧化)-3,3,5-三甲基环己烷0.01重量份,在回流下引发聚合。接下来,从聚合开始起1小时后和2小时后,也分别添加1,1-双(叔己基过氧化)-3,3,5-三甲基环己烷0.01重量份,此外,从聚合开始起4小时后添加0.05重量份过氧化特戊酸叔己酯,继续进行聚合反应。然后,从聚合开始起8小时后,得到固体成分55重量%、重均分子量50万的含官能团的(甲基)丙烯酸系聚合物的乙酸乙酯溶液。
相对于所得到的包含含官能团的(甲基)丙烯酸系聚合物的乙酸乙酯溶液的树脂固体成分100重量份,加入作为含官能团的不饱和化合物的甲基丙烯酸2-异氰酸根合乙酯3.5重量份,使其反应而得到丙烯酸系反应性树脂。
对于所得到的丙烯酸系反应性树脂,通过使用THF作为洗脱液、使用HR-MB-M(品名,Waters公司制)作为柱的凝胶渗透色谱(GPC)法进行测定,结果重均分子量为55万。
(多官能单体的制备)
(1)多官能单体1的制备
向放入了特氟龙(注册商标)搅拌子的500mL的圆底烧瓶中投入250mL的甲苯。加入二聚物二胺(Croda公司制,Priamine 1075)56g(0.1摩尔)和马来酸酐19.6g(0.2摩尔),接下来,加入甲磺酸酐5g。将溶液回流12小时后,冷却至室温,向烧瓶中加入甲苯300mL,通过静置使盐沉淀并除去。将所得到的溶液通过填充有硅胶的玻璃料漏斗进行过滤后,真空除去溶剂,得到茶色液状、由下述式(2-1)表示的多官能单体1。
[化学式12]
(2)多官能单体2的购入
购入下述式(2-2)所示的3官能丙烯酸酯即SR-387(Arkema公司制,Tris(2-acryloxyethyl)Isocyanulate:三(2-丙烯酰氧基乙基)异氰酸酯),将其作为多官能单体2。
[化学式13]
(硅酮双马来酰亚胺的制备)
向放入了特氟龙(注册商标)搅拌子的300mL的圆底烧瓶中投入100mL的甲苯,加入马来酰亚胺己酸(东京化成公司制,试剂)10.5g(0.05摩尔)和在两末端具有羟基的硅酮树脂X-21-5841(信越化学公司制)25g(0.025摩尔)、对甲苯磺酸1水合物1g(摩尔)。接下来,在100℃下加热搅拌3小时。冷却至常温后,加入三乙胺5g搅拌1小时后,用100g的水清洗,使溶剂挥发,得到下述式(3)所示的硅酮双马来酰亚胺(m=11,n=5)。
[化学式14]
(实施例1)
向甲苯150mL中加入100重量份的反应性树脂1、作为硅酮化合物的2官能硅酮丙烯酸酯(DAICEL-ALLNEX公司制,EBECRYL350)0.3重量份、作为光聚合引发剂的Irgacure369(BASF公司制)1重量份,制备粘合剂组合物的甲苯溶液。
用刮刀将所得到的粘合剂组合物的甲苯溶液以干燥被膜的厚度成为40μm的方式涂覆于对单面实施了电晕处理的厚度25μm的聚酰亚胺膜(宇部兴产公司制,Kapton)的电晕处理面上,在110℃下加热1分钟,使涂覆溶液干燥。然后,在40℃进行3天静置养护,得到粘合带。
(实施例2~20、比较例1~3)
使反应性树脂、多官能单体、硅酮化合物或氟化合物、光聚合引发剂的种类和配合量如表1、表2所示,除此以外,与实施例1同样地操作,得到粘合剂组合物和粘合带。
在实施例8中,作为硅酮化合物,使用6官能硅酮丙烯酸酯(DAICEL-ALLNEX公司制,EBECRYL 1360)。
在实施例9、比较例1中,作为氟化合物,使用光反应性氟化合物(DIC公司制,MEGAFACE RS-56)。
在实施例15中,使用5-苯基-1H四唑(增田化学公司制)作为气体产生剂,使用9,10-二缩水甘油氧基蒽(川崎化成公司制)作为光敏剂。
(评价)
对于实施例和比较例中得到的粘合带,通过以下的方法进行评价。
将结果示于表1、表2。
(1)剥离性的评价
将所得到的粘合带切割成1英寸的宽度后,利用100℃的层压机将其加热层压于1mm厚的玻璃。层压后,使用超高压汞灯,从玻璃侧以20mW/cm2的强度照射365nm的紫外线150秒钟。紫外线照射后,从玻璃侧用300℃的热板加热10分钟。
对于层压后、紫外线照射后和在300℃下加热后的试验片,在25℃、拉伸速度30mm/秒的条件下进行180°剥离试验,测定粘接强度(N/英寸)。
(2)300℃加热后的粘合带的外观的评价
在上述剥离性的评价中,目视观察在300℃下加热后的粘合带的外观,按照以下的基准进行评价。
〇:未确认到自玻璃的剥离、发泡
△:在与玻璃之间确认到微细的气泡
×:与玻璃之间部分剥离
(3)300℃加热、剥离后的剥离面的评价
在上述剥离性的评价中,以300℃进行加热,然后目视观察剥离粘合带后的玻璃的表面,按照以下的基准进行评价。
〇:未确认到残胶
△:虽然没有残胶,但在剥离面确认到模糊
×:确认到残胶
[表1]
[表2]
产业上的可利用性
根据本发明,能够提供:即使在固定了被粘物的状态下经过300℃以上的高温加工处理后,也能够通过照射光而容易地剥离的粘合剂组合物;具有由该粘合剂组合物形成的粘合剂层的粘合带;以及电子部件的处理方法。
Claims (17)
1.一种粘合剂组合物,其包含反应性树脂、以及硅酮化合物或氟化合物,所述反应性树脂在主链具有酰亚胺骨架,且在侧链或末端具有包含双键的官能团。
2.根据权利要求1所述的粘合剂组合物,其中,所述硅酮化合物或氟化合物具有能够与所述反应性树脂交联的官能团。
3.根据权利要求1或2所述的粘合剂组合物,其中,所述包含双键的官能团为任选被取代的马来酰亚胺基、柠康酰亚胺基、乙烯基醚基、烯丙基、或(甲基)丙烯酰基。
4.根据权利要求1~3中任一项所述的粘合剂组合物,其中,所述包含双键的官能团位于所述反应性树脂的侧链。
5.根据权利要求1~4中任一项所述的粘合剂组合物,其中,所述反应性树脂的包含双键的官能团当量、即重均分子量/包含双键的官能团的数量为4000以下。
6.根据权利要求1~5中任一项所述的粘合剂组合物,其中,所述反应性树脂的重均分子量为5000以上。
8.根据权利要求7所述的粘合剂组合物,其中,所述通式(1a)~(1c)中,P1、P2和P3各自独立地为碳原子数5~50的芳香族基团,Q1为取代或未取代的直链状、支链状或环状的碳原子数2~100的脂肪族基团,Q2为取代或未取代的碳原子数5~50的具有芳香族结构的基团,R为取代或未取代的支链状的碳原子数2~100的脂肪族基团或芳香族基团。
9.根据权利要求7或8所述的粘合剂组合物,其中,所述通式(1c)中,X3为包含双键的官能团。
10.根据权利要求7~9中任一项所述的粘合剂组合物,其中,所述通式(1c)中,R为具有芳香族酯基或芳香族醚基的芳香族基团,R中的所述芳香族酯基或所述芳香族醚基与X3键合。
13.根据权利要求1~12中任一项所述的粘合剂组合物,其还包含多官能单体或多官能低聚物,所述多官能单体或多官能低聚物在分子内具有两个以上的包含双键的官能团,且分子量为5000以下。
14.根据权利要求1~13中任一项所述的粘合剂组合物,其还包含光聚合引发剂。
15.根据权利要求1~14中任一项所述的粘合剂组合物,其还包含通过照射光而产生气体的气体产生剂。
16.一种粘合带,其具有由权利要求1~15中任一项所述的粘合剂组合物形成的粘合剂层。
17.一种电子部件的处理方法,其包括在权利要求16所述的粘合带上临时固定电子部件的工序、对粘合带照射光的工序、对电子部件进行热处理的工序、以及从电子部件剥离粘合带的工序。
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