KR970010272B1 - Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion and method for assembling the same - Google Patents
Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion and method for assembling the same Download PDFInfo
- Publication number
- KR970010272B1 KR970010272B1 KR94001505A KR19940001505A KR970010272B1 KR 970010272 B1 KR970010272 B1 KR 970010272B1 KR 94001505 A KR94001505 A KR 94001505A KR 19940001505 A KR19940001505 A KR 19940001505A KR 970010272 B1 KR970010272 B1 KR 970010272B1
- Authority
- KR
- South Korea
- Prior art keywords
- assembling
- panel
- peripheral portion
- device including
- same
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
- G02F1/136272—Auxiliary lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5011728A JP2911082B2 (ja) | 1993-01-27 | 1993-01-27 | パネルの実装構造および実装方法 |
JP5020295A JP2865968B2 (ja) | 1993-02-08 | 1993-02-08 | パネルの実装構造および実装方法 |
JP19641693A JP3285168B2 (ja) | 1993-08-06 | 1993-08-06 | 表示装置の実装構造及び実装方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970010272B1 true KR970010272B1 (en) | 1997-06-23 |
Family
ID=27279545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR94001505A KR970010272B1 (en) | 1993-01-27 | 1994-01-27 | Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion and method for assembling the same |
Country Status (4)
Country | Link |
---|---|
US (2) | US5592199A (ko) |
EP (2) | EP1221717A3 (ko) |
KR (1) | KR970010272B1 (ko) |
DE (1) | DE69431265T2 (ko) |
Cited By (3)
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US7492433B2 (en) | 2003-03-20 | 2009-02-17 | Hitachi Displays, Ltd. | Display device having a board for mounting a connector for inputting of video data and a board for mounting a display control circuit and manufacturing method thereof |
KR100949494B1 (ko) * | 2003-06-25 | 2010-03-24 | 엘지디스플레이 주식회사 | 라인 온 글래스형 액정 표시 장치 |
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SG63572A1 (en) * | 1993-11-12 | 1999-03-30 | Seiko Epson Corp | Structure and method for mounting semiconductor devices and liquid crystal display |
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CN100565280C (zh) * | 2001-05-31 | 2009-12-02 | 夏普株式会社 | 液晶显示设备 |
JP2003046212A (ja) * | 2001-07-27 | 2003-02-14 | Seiko Epson Corp | 電子デバイス並びにその製造方法及びその設計方法、回路基板並びに電子機器 |
KR100768182B1 (ko) * | 2001-10-26 | 2007-10-17 | 삼성에스디아이 주식회사 | 유기 전자 발광 소자와 그 제조방법 |
JP2003216057A (ja) * | 2001-11-14 | 2003-07-30 | Canon Inc | 画像表示装置 |
JP2003197103A (ja) | 2001-12-27 | 2003-07-11 | Toshiba Corp | 平面型表示装置の製造方法 |
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JP3927840B2 (ja) * | 2002-02-28 | 2007-06-13 | セイコープレシジョン株式会社 | Elシート |
US7061178B2 (en) * | 2002-03-14 | 2006-06-13 | Matsushita Electric Industrial Co., Ltd. | Plasma display |
JP2003295836A (ja) * | 2002-03-29 | 2003-10-15 | Fujitsu Display Technologies Corp | 液晶表示装置及びそのドライバ |
JP3938367B2 (ja) * | 2002-09-03 | 2007-06-27 | シャープ株式会社 | 電子モジュールおよびそれに用いる駆動回路基板 |
AU2003259397A1 (en) * | 2002-09-20 | 2004-04-08 | Koninklijke Philips Electronics N.V. | Electrical device, a method for manufacturing an electrical device, test structure, a method for manufacturing such a test structure and a method for testing a display panel |
JP4059750B2 (ja) * | 2002-10-28 | 2008-03-12 | シャープ株式会社 | 電子モジュールおよびその製造方法 |
JP4126610B2 (ja) * | 2002-12-26 | 2008-07-30 | エルジー ディスプレイ カンパニー リミテッド | 液晶表示装置 |
KR100917008B1 (ko) * | 2003-06-10 | 2009-09-10 | 삼성전자주식회사 | 액정표시장치 |
TW594323B (en) * | 2003-10-21 | 2004-06-21 | Hannstar Display Corp | Liquid crystal system conductive line structure |
KR101066473B1 (ko) * | 2003-11-21 | 2011-09-21 | 엘지디스플레이 주식회사 | 액정표시장치 |
US20050253511A1 (en) * | 2004-05-11 | 2005-11-17 | World Properties, Inc. | Flexible EL lamp with reinforced leads |
KR101075599B1 (ko) * | 2004-06-23 | 2011-10-20 | 삼성전자주식회사 | 표시장치 |
JP4085281B2 (ja) * | 2004-11-18 | 2008-05-14 | セイコーエプソン株式会社 | 電子部品の製造方法 |
KR101106557B1 (ko) * | 2004-12-28 | 2012-01-19 | 엘지디스플레이 주식회사 | 횡전계방식 액정표시장치 |
WO2006136984A2 (en) * | 2005-06-21 | 2006-12-28 | Koninklijke Philips Electronics N.V. | Thin film circuit connections |
JP5022576B2 (ja) * | 2005-07-08 | 2012-09-12 | 株式会社ジャパンディスプレイイースト | 表示パネルおよび表示装置 |
JP4736614B2 (ja) * | 2005-08-12 | 2011-07-27 | セイコーエプソン株式会社 | 信号伝送回路及び電気光学装置並びに電子機器 |
EP1764770A3 (en) * | 2005-09-16 | 2012-03-14 | Semiconductor Energy Laboratory Co., Ltd. | Display device and driving method of display device |
WO2007063787A1 (en) * | 2005-12-02 | 2007-06-07 | Semiconductor Energy Laboratory Co., Ltd. | Display module and electronic device using the same |
KR101266506B1 (ko) * | 2005-12-08 | 2013-05-23 | 삼성디스플레이 주식회사 | 표시장치용 보호커버 및 이를 갖는 표시장치 |
KR101199250B1 (ko) * | 2005-12-12 | 2012-11-09 | 삼성디스플레이 주식회사 | 연성회로필름 및 이를 갖는 표시패널 어셈블리 |
KR101217083B1 (ko) * | 2006-01-13 | 2012-12-31 | 삼성디스플레이 주식회사 | 연성회로기판과, 이를 갖는 디스플레이 유닛 및 표시장치 |
US8395746B2 (en) * | 2006-01-31 | 2013-03-12 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
KR20070095029A (ko) * | 2006-03-20 | 2007-09-28 | 삼성전자주식회사 | 표시 장치 및 그의 제조 방법 |
US20090066679A1 (en) * | 2006-07-04 | 2009-03-12 | Yoshikazu Kanazawa | Plasma display device |
JP4224086B2 (ja) * | 2006-07-06 | 2009-02-12 | 三井金属鉱業株式会社 | 耐折性に優れた配線基板および半導体装置 |
KR100765261B1 (ko) * | 2006-07-11 | 2007-10-09 | 삼성전자주식회사 | 표시장치 |
KR20080014260A (ko) * | 2006-08-10 | 2008-02-14 | 삼성전자주식회사 | 유기 발광 표시 장치 |
JP2008078205A (ja) * | 2006-09-19 | 2008-04-03 | Fujitsu Ltd | 基板組立体及びその製造方法、電子部品組立体及びその製造方法、電子装置 |
JP2008112869A (ja) * | 2006-10-30 | 2008-05-15 | Fujitsu Ltd | 組立体モジュールの製造方法および組立体モジュール並びに電子機器 |
KR100943946B1 (ko) * | 2006-11-08 | 2010-02-26 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
CN101287329B (zh) * | 2007-04-13 | 2011-04-20 | 群康科技(深圳)有限公司 | 显示装置 |
TWM329818U (en) * | 2007-10-17 | 2008-04-01 | Universal Scient Ind Co Ltd | Portable electronic device with anisotropic conductive unit |
JP4980960B2 (ja) * | 2008-03-14 | 2012-07-18 | ラピスセミコンダクタ株式会社 | テープ配線基板及び半導体チップパッケージ |
JP2009288709A (ja) * | 2008-05-30 | 2009-12-10 | Hitachi Displays Ltd | 表示装置 |
WO2010018759A1 (ja) * | 2008-08-11 | 2010-02-18 | シャープ株式会社 | フレキシブル基板および電気回路構造体 |
US8384634B2 (en) * | 2008-09-24 | 2013-02-26 | Apple Inc. | Display with reduced parasitic effects |
KR20100041165A (ko) * | 2008-10-13 | 2010-04-22 | 삼성전자주식회사 | 표시 장치 및 그를 포함하는 멀티 표시 장치 |
JP4543115B1 (ja) * | 2009-03-06 | 2010-09-15 | 株式会社東芝 | 電子機器及びフレキシブルプリント配線板 |
JP2012226058A (ja) * | 2011-04-18 | 2012-11-15 | Japan Display East Co Ltd | 表示装置 |
US8711570B2 (en) | 2011-06-21 | 2014-04-29 | Apple Inc. | Flexible circuit routing |
US10261370B2 (en) | 2011-10-05 | 2019-04-16 | Apple Inc. | Displays with minimized border regions having an apertured TFT layer for signal conductors |
US9286826B2 (en) | 2011-10-28 | 2016-03-15 | Apple Inc. | Display with vias for concealed printed circuit and component attachment |
US8665407B2 (en) * | 2011-11-16 | 2014-03-04 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Chip-on-film structure for liquid crystal panel |
CN105094447B (zh) * | 2011-11-27 | 2018-01-16 | 宸鸿科技(厦门)有限公司 | 触控感测装置及其制造方法 |
US9226347B2 (en) | 2012-06-25 | 2015-12-29 | Apple Inc. | Displays with vias |
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US9454025B2 (en) | 2012-08-31 | 2016-09-27 | Apple Inc. | Displays with reduced driver circuit ledges |
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US9601557B2 (en) | 2012-11-16 | 2017-03-21 | Apple Inc. | Flexible display |
US9226408B2 (en) * | 2013-02-27 | 2015-12-29 | Lg Display Co., Ltd. | Display device |
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US9600112B2 (en) * | 2014-10-10 | 2017-03-21 | Apple Inc. | Signal trace patterns for flexible substrates |
US9589521B2 (en) * | 2014-11-20 | 2017-03-07 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Liquid crystal display apparatus having wire-on-array structure |
US10881387B2 (en) * | 2015-06-03 | 2021-01-05 | Obp Medical Corporation | Retractor |
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US20190363103A1 (en) * | 2018-05-22 | 2019-11-28 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Irregular shape display panel |
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JP7147412B2 (ja) | 2018-09-25 | 2022-10-05 | ブラザー工業株式会社 | 液体吐出装置及び配線部材 |
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CN110928078B (zh) * | 2019-12-12 | 2022-07-12 | 厦门天马微电子有限公司 | 一种显示面板及其制备方法、显示装置 |
CN113644181B (zh) * | 2020-05-11 | 2024-04-16 | 京东方科技集团股份有限公司 | 发光基板及其制造方法、显示装置 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60149079A (ja) * | 1984-01-13 | 1985-08-06 | シャープ株式会社 | 表示体ユニツト接続装置 |
US5476970A (en) * | 1984-02-16 | 1995-12-19 | Velsicol Chemical Corporation | Method for preparing aryl ketones |
JPS61114226A (ja) * | 1984-11-09 | 1986-05-31 | Hitachi Ltd | 液晶表示素子 |
JPS61121078A (ja) * | 1984-11-16 | 1986-06-09 | 松下電器産業株式会社 | 平板型デバイスの電極接続構造体 |
US4766426A (en) * | 1985-02-14 | 1988-08-23 | Matsushita Electric Industrial Co., Ltd. | Display panel assembly having a plurality of film carrier tapes on each of which a semiconductor divice is mounted |
JP2559702B2 (ja) * | 1986-04-09 | 1996-12-04 | 三菱電機株式会社 | 表示装置 |
JPS63126292A (ja) * | 1986-11-14 | 1988-05-30 | シャープ株式会社 | 印刷配線基板の接続構造 |
JPS63205074A (ja) * | 1987-02-19 | 1988-08-24 | シャープ株式会社 | テ−プキャリアデバイスの実装構造 |
JPS649284A (en) * | 1987-06-30 | 1989-01-12 | Toshiba Corp | Cadmium tungstate single-crystal phosphor |
DE3731787C2 (de) * | 1987-09-22 | 2000-11-16 | Aeg Ges Moderne Inf Sys Mbh | Anordnung von mehreren IC's auf einem Bandstreifen aus Isoliermaterial |
US4934045A (en) * | 1988-02-05 | 1990-06-19 | Semiconductor Energy Laboratory Co., Ltd. | Method of producing electric circuit patterns |
JPH0225974A (ja) * | 1988-07-14 | 1990-01-29 | Nec Corp | データベース更新検索方式 |
JPH0227785A (ja) * | 1988-07-15 | 1990-01-30 | Matsushita Electric Ind Co Ltd | 集積回路素子およびその製造方法 |
JPH02127621A (ja) * | 1988-11-08 | 1990-05-16 | Aichi Electric Co Ltd | 液晶表示装置の製造方法 |
JPH07122714B2 (ja) * | 1989-03-22 | 1995-12-25 | 松下電器産業株式会社 | 液晶表示装置 |
JPH02259728A (ja) * | 1989-03-31 | 1990-10-22 | Citizen Watch Co Ltd | 液晶表示装置 |
DE3910963A1 (de) * | 1989-04-05 | 1990-10-11 | Licentia Gmbh | Schaltungsanordnung |
EP0398628A3 (en) * | 1989-05-15 | 1991-09-25 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
US5072075A (en) * | 1989-06-28 | 1991-12-10 | Digital Equipment Corporation | Double-sided hybrid high density circuit board and method of making same |
US5200847A (en) * | 1990-05-01 | 1993-04-06 | Casio Computer Co., Ltd. | Liquid crystal display device having driving circuit forming on a heat-resistant sub-substrate |
JPH04115228A (ja) * | 1990-09-05 | 1992-04-16 | Ricoh Co Ltd | 液晶表示装置 |
JP2820168B2 (ja) * | 1991-03-18 | 1998-11-05 | 三菱電機株式会社 | 液晶表示装置 |
JPH04304427A (ja) * | 1991-04-02 | 1992-10-27 | Fujitsu Ltd | 液晶表示装置 |
TW232065B (ko) * | 1992-04-16 | 1994-10-11 | Sharp Kk | |
JP2801487B2 (ja) * | 1992-04-30 | 1998-09-21 | シャープ株式会社 | パネルの実装構造および実装方法並びに樹脂供給硬化方法 |
-
1994
- 1994-01-25 US US08/186,455 patent/US5592199A/en not_active Expired - Lifetime
- 1994-01-27 EP EP02076246A patent/EP1221717A3/en not_active Withdrawn
- 1994-01-27 KR KR94001505A patent/KR970010272B1/ko not_active IP Right Cessation
- 1994-01-27 EP EP94300593A patent/EP0609074B1/en not_active Expired - Lifetime
- 1994-01-27 DE DE69431265T patent/DE69431265T2/de not_active Expired - Lifetime
-
1996
- 1996-10-11 US US08/730,665 patent/US5670994A/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100774896B1 (ko) * | 2001-05-31 | 2007-11-08 | 샤프 가부시키가이샤 | 액정 패널과 직접 접속된 유연성 기판 상에 탑재된 구동ic를 구비한 액정 표시 장치 |
US7492433B2 (en) | 2003-03-20 | 2009-02-17 | Hitachi Displays, Ltd. | Display device having a board for mounting a connector for inputting of video data and a board for mounting a display control circuit and manufacturing method thereof |
US7561241B2 (en) | 2003-03-20 | 2009-07-14 | Hitachi Displays, Ltd. | Display device with bundle of cables adhesive on the back of frame |
US7911574B2 (en) | 2003-03-20 | 2011-03-22 | Hitachi Displays, Ltd. | Display device having a board for a connector for inputting of video data and a board for mounting a display control circuit and manufacturing method thereof |
KR100949494B1 (ko) * | 2003-06-25 | 2010-03-24 | 엘지디스플레이 주식회사 | 라인 온 글래스형 액정 표시 장치 |
Also Published As
Publication number | Publication date |
---|---|
EP1221717A3 (en) | 2004-05-12 |
EP1221717A2 (en) | 2002-07-10 |
EP0609074B1 (en) | 2002-09-04 |
EP0609074A3 (en) | 1994-11-23 |
EP0609074A2 (en) | 1994-08-03 |
DE69431265D1 (de) | 2002-10-10 |
US5670994A (en) | 1997-09-23 |
US5592199A (en) | 1997-01-07 |
DE69431265T2 (de) | 2003-05-15 |
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