KR20200049595A - 부가 경화형 실리콘 수지 조성물, 그의 경화물 및 광반도체 장치 - Google Patents

부가 경화형 실리콘 수지 조성물, 그의 경화물 및 광반도체 장치 Download PDF

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Publication number: KR20200049595A
Authority: KR; South Korea
Prior art keywords: sio; addition; group; curable silicone; silicone resin
Prior art date: 2018-10-30

Application number

KR1020190133381A

Other languages

English (en)

Korean (ko)

Inventor

유키토 고바야시

도시유키 오자이

마사나리 모테키

Original Assignee

신에쓰 가가꾸 고교 가부시끼가이샤

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2018-10-30

Filing date

2019-10-25

Publication date

2020-05-08

2019-10-25 Application filed by 신에쓰 가가꾸 고교 가부시끼가이샤 filed Critical 신에쓰 가가꾸 고교 가부시끼가이샤

2020-05-08 Publication of KR20200049595A publication Critical patent/KR20200049595A/ko

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229920002050 silicone resin Polymers 0.000 title claims abstract description 21
239000011342 resin composition Substances 0.000 title claims abstract description 20
239000004065 semiconductor Substances 0.000 title claims description 24
230000003287 optical effect Effects 0.000 title claims description 23
229920001296 polysiloxane Polymers 0.000 claims abstract description 53
125000003342 alkenyl group Chemical group 0.000 claims abstract description 26
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 16
125000001183 hydrocarbyl group Chemical group 0.000 claims abstract description 11
239000003054 catalyst Substances 0.000 claims abstract description 10
229910052751 metal Inorganic materials 0.000 claims abstract description 8
229920006136 organohydrogenpolysiloxane Polymers 0.000 claims abstract description 8
239000002184 metal Substances 0.000 claims abstract description 7
239000000203 mixture Substances 0.000 claims description 51
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 15
229910052710 silicon Inorganic materials 0.000 claims description 13
125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 9
229910004283 SiO 4 Inorganic materials 0.000 claims description 8
125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 8
-1 chloropropyl groups Chemical group 0.000 description 36
239000000047 product Substances 0.000 description 25
239000000463 material Substances 0.000 description 20
238000000034 method Methods 0.000 description 16
238000001816 cooling Methods 0.000 description 12
230000015572 biosynthetic process Effects 0.000 description 9
229920001577 copolymer Polymers 0.000 description 9
238000003786 synthesis reaction Methods 0.000 description 9
KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 8
AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 8
UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 8
230000000052 comparative effect Effects 0.000 description 8
150000001875 compounds Chemical class 0.000 description 8
239000002683 reaction inhibitor Substances 0.000 description 8
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
229920001843 polymethylhydrosiloxane Polymers 0.000 description 7
125000004432 carbon atom Chemical group C* 0.000 description 6
238000013329 compounding Methods 0.000 description 6
239000000758 substrate Substances 0.000 description 6
125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 6
125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 5
BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 5
239000000945 filler Substances 0.000 description 5
238000002156 mixing Methods 0.000 description 5
229920005989 resin Polymers 0.000 description 5
239000011347 resin Substances 0.000 description 5
238000003756 stirring Methods 0.000 description 5
LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
239000002253 acid Substances 0.000 description 4
125000005370 alkoxysilyl group Chemical group 0.000 description 4
125000000217 alkyl group Chemical group 0.000 description 4
125000000524 functional group Chemical group 0.000 description 4
239000004615 ingredient Substances 0.000 description 4
229940098779 methanesulfonic acid Drugs 0.000 description 4
238000006386 neutralization reaction Methods 0.000 description 4
229910052697 platinum Inorganic materials 0.000 description 4
229910000030 sodium bicarbonate Inorganic materials 0.000 description 4
235000017557 sodium bicarbonate Nutrition 0.000 description 4
238000005406 washing Methods 0.000 description 4
239000000853 adhesive Substances 0.000 description 3
230000001070 adhesive effect Effects 0.000 description 3
238000006243 chemical reaction Methods 0.000 description 3
239000003795 chemical substances by application Substances 0.000 description 3
238000004132 cross linking Methods 0.000 description 3
125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 3
238000006459 hydrosilylation reaction Methods 0.000 description 3
150000002894 organic compounds Chemical class 0.000 description 3
150000001451 organic peroxides Chemical class 0.000 description 3
125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
239000004215 Carbon black (E152) Substances 0.000 description 2
RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical group CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
229910004298 SiO 2 Inorganic materials 0.000 description 2
239000007983 Tris buffer Substances 0.000 description 2
238000007259 addition reaction Methods 0.000 description 2
230000000903 blocking effect Effects 0.000 description 2
125000004122 cyclic group Chemical group 0.000 description 2
239000004205 dimethyl polysiloxane Substances 0.000 description 2
235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
230000000694 effects Effects 0.000 description 2
125000003700 epoxy group Chemical group 0.000 description 2
238000005227 gel permeation chromatography Methods 0.000 description 2
229930195733 hydrocarbon Natural products 0.000 description 2
150000002430 hydrocarbons Chemical class 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
150000003961 organosilicon compounds Chemical class 0.000 description 2
NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical group [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
239000000843 powder Substances 0.000 description 2
150000003376 silicon Chemical class 0.000 description 2
239000010703 silicon Substances 0.000 description 2
238000012546 transfer Methods 0.000 description 2
RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
ZICNIEOYWVIEQJ-UHFFFAOYSA-N (2-methylbenzoyl) 2-methylbenzenecarboperoxoate Chemical compound CC1=CC=CC=C1C(=O)OOC(=O)C1=CC=CC=C1C ZICNIEOYWVIEQJ-UHFFFAOYSA-N 0.000 description 1
AGKBXKFWMQLFGZ-UHFFFAOYSA-N (4-methylbenzoyl) 4-methylbenzenecarboperoxoate Chemical compound C1=CC(C)=CC=C1C(=O)OOC(=O)C1=CC=C(C)C=C1 AGKBXKFWMQLFGZ-UHFFFAOYSA-N 0.000 description 1
KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 1
KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 description 1
XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
239000004342 Benzoyl peroxide Substances 0.000 description 1
OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
OJYKBUHBVFPYSX-UHFFFAOYSA-N Cc1ccc(cc1)C(=O)OOOC(=O)OCCCCCCOC(=O)OOOC(=O)c1ccc(C)cc1 Chemical compound Cc1ccc(cc1)C(=O)OOOC(=O)OCCCCCCOC(=O)OOOC(=O)c1ccc(C)cc1 OJYKBUHBVFPYSX-UHFFFAOYSA-N 0.000 description 1
ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
239000004954 Polyphthalamide Substances 0.000 description 1
239000004793 Polystyrene Substances 0.000 description 1
239000006087 Silane Coupling Agent Substances 0.000 description 1
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
230000006750 UV protection Effects 0.000 description 1
150000001336 alkenes Chemical class 0.000 description 1
125000002947 alkylene group Chemical group 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
229940045985 antineoplastic platinum compound Drugs 0.000 description 1
125000003710 aryl alkyl group Chemical group 0.000 description 1
125000003118 aryl group Chemical group 0.000 description 1
QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
239000012964 benzotriazole Substances 0.000 description 1
235000019400 benzoyl peroxide Nutrition 0.000 description 1
125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
229910052799 carbon Inorganic materials 0.000 description 1
239000007809 chemical reaction catalyst Substances 0.000 description 1
239000007795 chemical reaction product Substances 0.000 description 1
239000000460 chlorine Substances 0.000 description 1
229910052801 chlorine Inorganic materials 0.000 description 1
125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
239000003431 cross linking reagent Substances 0.000 description 1
229910002026 crystalline silica Inorganic materials 0.000 description 1
125000000753 cycloalkyl group Chemical group 0.000 description 1
125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
230000006866 deterioration Effects 0.000 description 1
238000011161 development Methods 0.000 description 1
238000007865 diluting Methods 0.000 description 1
238000002845 discoloration Methods 0.000 description 1
KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
239000003623 enhancer Substances 0.000 description 1
150000002148 esters Chemical group 0.000 description 1
NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
238000011156 evaluation Methods 0.000 description 1
150000008282 halocarbons Chemical group 0.000 description 1
230000020169 heat generation Effects 0.000 description 1
125000001867 hydroperoxy group Chemical group [*]OO[H] 0.000 description 1
NYMPGSQKHIOWIO-UHFFFAOYSA-N hydroxy(diphenyl)silicon Chemical class C=1C=CC=CC=1[Si](O)C1=CC=CC=C1 NYMPGSQKHIOWIO-UHFFFAOYSA-N 0.000 description 1
239000012535 impurity Substances 0.000 description 1
230000002401 inhibitory effect Effects 0.000 description 1
239000011256 inorganic filler Substances 0.000 description 1
229910003475 inorganic filler Inorganic materials 0.000 description 1
238000002955 isolation Methods 0.000 description 1
150000002688 maleic acid derivatives Chemical class 0.000 description 1
238000005259 measurement Methods 0.000 description 1
150000002736 metal compounds Chemical class 0.000 description 1
UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical compound [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 description 1
QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
125000000962 organic group Chemical group 0.000 description 1
229910052763 palladium Inorganic materials 0.000 description 1
125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical compound [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 description 1
229910052698 phosphorus Inorganic materials 0.000 description 1
239000011574 phosphorus Substances 0.000 description 1
150000003058 platinum compounds Chemical class 0.000 description 1
CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
229920006375 polyphtalamide Polymers 0.000 description 1
229920002223 polystyrene Polymers 0.000 description 1
230000001737 promoting effect Effects 0.000 description 1
125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
230000003014 reinforcing effect Effects 0.000 description 1
229910052703 rhodium Inorganic materials 0.000 description 1
239000010948 rhodium Substances 0.000 description 1
MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
QBERHIJABFXGRZ-UHFFFAOYSA-M rhodium;triphenylphosphane;chloride Chemical compound [Cl-].[Rh].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QBERHIJABFXGRZ-UHFFFAOYSA-M 0.000 description 1
238000007142 ring opening reaction Methods 0.000 description 1
239000003566 sealing material Substances 0.000 description 1
150000004756 silanes Chemical class 0.000 description 1
150000003377 silicon compounds Chemical class 0.000 description 1
235000012239 silicon dioxide Nutrition 0.000 description 1
229920002379 silicone rubber Polymers 0.000 description 1
239000004945 silicone rubber Substances 0.000 description 1
125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1
239000007787 solid Substances 0.000 description 1
239000000126 substance Substances 0.000 description 1
229910052717 sulfur Inorganic materials 0.000 description 1
239000011593 sulfur Substances 0.000 description 1
GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
150000003609 titanium compounds Chemical class 0.000 description 1
125000003944 tolyl group Chemical group 0.000 description 1
IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
229920002554 vinyl polymer Polymers 0.000 description 1
125000005023 xylyl group Chemical group 0.000 description 1
150000003755 zirconium compounds Chemical class 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

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Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Microelectronics & Electronic Packaging (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Power Engineering (AREA)
Compositions Of Macromolecular Compounds (AREA)
Adhesives Or Adhesive Processes (AREA)
Led Device Packages (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

KR1020190133381A 2018-10-30 2019-10-25 부가 경화형 실리콘 수지 조성물, 그의 경화물 및 광반도체 장치 KR20200049595A (ko)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JPJP-P-2018-203987		2018-10-30
JP2018203987A JP7021049B2 (ja)	2018-10-30	2018-10-30	付加硬化型シリコーン樹脂組成物、その硬化物、及び光半導体装置

Publications (1)

Publication Number	Publication Date
KR20200049595A true KR20200049595A (ko)	2020-05-08

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KR1020190133381A KR20200049595A (ko)	2018-10-30	2019-10-25	부가 경화형 실리콘 수지 조성물, 그의 경화물 및 광반도체 장치

Country Status (4)

Country	Link
JP (1)	JP7021049B2 (ja)
KR (1)	KR20200049595A (ja)
CN (1)	CN111117256B (ja)
TW (1)	TWI798500B (ja)

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* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6966411B2 (ja) *	2018-11-02	2021-11-17	信越化学工業株式会社	付加硬化型シリコーン樹脂組成物、その硬化物、及び光半導体装置

Citations (2)

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Publication number	Priority date	Publication date	Assignee	Title
JP2006342200A (ja)	2005-06-07	2006-12-21	Shin Etsu Chem Co Ltd	ダイボンディング用シリコーン樹脂組成物
JP2010285571A (ja)	2009-06-15	2010-12-24	Shin-Etsu Chemical Co Ltd	ダイボンディング用シリコーン樹脂組成物

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB2287033B (en) *	1994-03-04	1998-05-13	Gen Electric	Addition curable silicone psa
JP5392805B2 (ja) *	2005-06-28	2014-01-22	東レ・ダウコーニング株式会社	硬化性オルガノポリシロキサン樹脂組成物および光学部材
JP2009256400A (ja) *	2008-04-11	2009-11-05	Shin Etsu Chem Co Ltd	半導体素子用シリコーン接着剤
JP5553018B2 (ja) *	2010-12-16	2014-07-16	信越化学工業株式会社	硬化性オルガノポリシロキサン組成物、光学素子封止材及び光学素子
JP5805883B2 (ja)	2011-11-25	2015-11-10	エルジー・ケム・リミテッド	硬化性組成物
JP5575820B2 (ja) *	2012-01-31	2014-08-20	信越化学工業株式会社	硬化性オルガノポリシロキサン組成物、光学素子封止材および光学素子
JP2013159671A (ja) *	2012-02-02	2013-08-19	Dow Corning Toray Co Ltd	硬化性シリコーン組成物、その硬化物、および光半導体装置
JP2014031394A (ja) *	2012-08-01	2014-02-20	Shin Etsu Chem Co Ltd	付加硬化型シリコーン組成物、及び該組成物の硬化物により半導体素子が被覆された半導体装置
CN107779091B (zh) *	2013-03-28	2020-05-19	美国陶氏有机硅公司	有机硅氧烷组合物和涂层、制成品、方法及用途
KR101591167B1 (ko)	2013-04-04	2016-02-02	주식회사 엘지화학	경화성 조성물
CN105492539B (zh)	2013-08-29	2019-05-07	美国陶氏有机硅公司	可固化有机硅组合物、其固化产物及光学半导体器件
CN106414611B (zh) *	2014-05-19	2020-03-17	信越化学工业株式会社	加成固化性液态硅橡胶组合物
WO2015178475A1 (ja) *	2014-05-23	2015-11-26	株式会社ダイセル	分岐鎖状ポリオルガノシロキシシルアルキレン、その製造方法、硬化性樹脂組成物、及び半導体装置
EP3184589B1 (en) *	2015-12-22	2019-05-01	Shin-Etsu Chemical Co., Ltd.	Addition-curable silicone resin composition and a semiconductor device
JPWO2017122712A1 (ja)	2016-01-15	2018-11-01	株式会社ダイセル	硬化性樹脂組成物、硬化物、封止材、及び半導体装置
US10947384B2 (en) *	2016-09-07	2021-03-16	Daicel Corporation	Curable resin composition, cured product thereof, and semiconductor device
JP6702233B2 (ja) *	2017-03-09	2020-05-27	信越化学工業株式会社	付加硬化型オルガノポリシロキサン樹脂組成物、該組成物の硬化物及び該硬化物を有する半導体装置
JP6981939B2 (ja) *	2018-08-28	2021-12-17	信越化学工業株式会社	付加硬化型シリコーン組成物及び半導体装置

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- 2018-10-30 JP JP2018203987A patent/JP7021049B2/ja active Active
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- 2019-10-25 KR KR1020190133381A patent/KR20200049595A/ko active Search and Examination
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Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2006342200A (ja)	2005-06-07	2006-12-21	Shin Etsu Chem Co Ltd	ダイボンディング用シリコーン樹脂組成物
JP2010285571A (ja)	2009-06-15	2010-12-24	Shin-Etsu Chemical Co Ltd	ダイボンディング用シリコーン樹脂組成物

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